Micro SD,TFR Reader Header Prod Spec Datasheet by Molex

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Micro SD/TFR Reader Header 001
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
MICRO SD/TFR HEADER
SHEET No.
F
EC No:
SH2013
SH2013SH2013
SH2013-
--
-0296
02960296
0296
1
of
5
DATE:
201
201201
2013
33
3/0
00
03
33
3/27
2727
27
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
PS
-
47
309
-
001
Dixon
DixonDixon
Dixon
Li
LiLi
Li
Nicolas Zhang
Nicolas ZhangNicolas Zhang
Nicolas Zhang
Anson Yin
Anson YinAnson Yin
Anson Yin
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
Micro SD/TFR Reader Header
1.0 SCOPE
This specification covers the Micro SD/TFR Connector 47309-****, 105188-****, 47571-****
47579-****, 105126-****
2.0 PRODUCT DESCRIPTION
2.1 PRODUCT NAME AND NUMBER
PRODUCT NAME PRODUCT NUMBER
MICRO SD/TFR HEADER 47309-****/105188-****/105126-****
2.3H MICRO SD/TFR HEADER 47571-****
2.45H MICRO SD/TFR HEADER 47579-****
2.2 DIMENSIONS, MATERIALS, PLATINGS AND MARKINGS
See Sales Drawing (SD-47309-***/SD-105188-***/SD-47571-***/SD-47579-***/SD-105126-***) for
information on dimensions, materials, plating and markings.
2.3 This connector assembly consists of 1 plastic housing, 8 pcs signal contacts, 2 pcs detect pins
and 1 metal shell. Solder components shall meet Lead-free soldering requirements.
3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS
Please refer to the Sales Drawings SD-47309-***/SD-105188-***/SD-47571-***/SD-47579-***/SD-105126-***
and other sections of this Specification for specific references to applicable documents and specifications. In
cases where the Product Specification differs from the Sales Drawings, the Sales Drawing will take
precedence.
4.0 RATINGS
4.1 Rated Current (per contact) 0.5 Amp 30°C Max. T over ambient.
4.2 Rated Voltage (per contact) 5 VDC (maximum)
4.3 Durability 10,000 mating/unmating cycles
4.4 Operating temperature range -40°C to +85°C
4.5 Storage temperature range -40°C to +100°C
4.6 Dielectric Withstanding Voltage 500 V DC
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
MICRO SD/TFR HEADER
SHEET No.
F
EC No:
SH2013
SH2013SH2013
SH2013-
--
-0296
02960296
0296
2
of
5
DATE:
201
201201
2013
33
3/0
00
03
33
3/27
2727
27
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
PS
-
47
309
-
001
Dixon
DixonDixon
Dixon
Li
LiLi
Li
Nicolas Zhang
Nicolas ZhangNicolas Zhang
Nicolas Zhang
Anson Yin
Anson YinAnson Yin
Anson Yin
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
5.0 ELECTRICAL PERFORMANCE
6.0 MECHANICAL PERFORMANCE
Test
Ref. Item Test Condition Requirements
6.1 Durability
Insertion and withdrawal are repeated 10,000
cycles with card at the speed rate of 400~600
cycles/hour.
The specified measurement shall be
performed the following cycles.
Per EIA-364-09
Appearance: no damage
Contact Resistance:
=10 milliohm Max
6.2 Vibration
Mate card and subjected to the following
vibration conditions, for a period of 2 hours
in each of 3 mutually
perpendicular axes, with passing DC 1Ma
during the test.
Amplitude : 1.52mm P-P or 19.6m/s2{2G}
Frequency : 10-55-10Hz
shall be traversed in 1 minute.
Per EIA-364-28
Appearance: no damage
<1 ms discontinuity
: =30 milliohm Max
Test
Ref. Item Test Condition Requirements
5.1 Contact resistance
Mate connectors: apply a maximum voltage
of 20mV and a current of 10mA.
Per EIA-364-23
40 milliohm Max.
5.2 Insulation resistance
Measurement shall be performed after 60
second from voltage application 500VDC
between the contact
Per EIA-364-21
100 million ohm Min.
5.3 Dielectric
withstanding voltage
500Vac(RMS) for 1 minute, 50Hz. Voltage
application as above indicated.
Per EIA-364-20
No voltage breakdown
5.4 Temperature Rise
Mate card and measure the temperature rise
of contact, when rated current is passed.
Per EIA-364-70 method 1
30ºC Max.
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
MICRO SD/TFR HEADER
SHEET No.
F
EC No:
SH2013
SH2013SH2013
SH2013-
--
-0296
02960296
0296
3
of
5
DATE:
201
201201
2013
33
3/0
00
03
33
3/27
2727
27
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
PS
-
47
309
-
001
Dixon
DixonDixon
Dixon
Li
LiLi
Li
Nicolas Zhang
Nicolas ZhangNicolas Zhang
Nicolas Zhang
Anson Yin
Anson YinAnson Yin
Anson Yin
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
6.3 Mechanical Shock
Mate card and subjected to the following
shock conditions.
3 mutually perpendicular axis, passing
DC 1mA current during the test.
(Total of 18 shocks)
Test pulse : Half Sine
Peak value : 490m/s2 Duration : 11ms
Per EIA-364-27
Appearance: no damage
<1ms discontinuity
: =30 milliohm Max
6.4 Terminal retention
force Pull out the terminal in un-mating direction. 2 N Min
6.5 Card Insertion force After reflow, insert the card in mating
direction. 30N Max
6.6 Card withdraw force Pulling out the card in un-mating direction 1N Min, 30 N Max
6.7 Contact normal force
per contact Press the contact to the housing 0.1mm 0.4N Min
6.8 Card reverse insert Insert TFR/Micro SD card inversely into the
connector and push with a force of 19.6N. Appearance: no damage
6.9 Peeling force
Test peeling force in three direction including
front/ back/side direction
30 N Min
7.0 ENVIRONMENTAL PERFORMANCE
Test
Ref. Item Test Condition Requirements
7.1 High Relative
Humidity Exposure
The card shall be mated and exposed to the
condition of +60±2°C @ 90~95% Humidity for 96
hours.
Recovery time 1~2 hours
Per EIA-364-31
Appearance: no
damage
Contact Resistance:
=30 milliohm Max
_m.mz We Mm
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
MICRO SD/TFR HEADER
SHEET No.
F
EC No:
SH2013
SH2013SH2013
SH2013-
--
-0296
02960296
0296
4
of
5
DATE:
201
201201
2013
33
3/0
00
03
33
3/27
2727
27
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
PS
-
47
309
-
001
Dixon
DixonDixon
Dixon
Li
LiLi
Li
Nicolas Zhang
Nicolas ZhangNicolas Zhang
Nicolas Zhang
Anson Yin
Anson YinAnson Yin
Anson Yin
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
7.2 Low Temperature
Exposure
The card shall be mated and exposed to the
condition of -40±3°C for 96 hours.
Recovery time 1~2 hours
Appearance: no
damage
Contact resistance:
=30 milliohm Max
7.3 High Temperature
Exposure
The card shall be mated and exposed to the
condition of +85±2°C for 96 hours, less than 25%
relative humidity.
Recovery time 1~2 hours
Appearance: no
damage
Contact resistance:
=30 milliohm Max
7.4 Thermal Shock
The card shall be mated and exposed to the
following condition for 25 cycles.
1 cycle: a) -40±3°C for 30 minutes
b) +85±2°C for 30 minutes
Transit time shall be within 3 minutes,
Recovery time 1~2 hours
Per EIA-364-32
Appearance: no
damage
Contact resistance:
=30 milliohm Max
7.5 Salt Spray Test
The card shall be mated and exposed to the
following salt mist conditions. At the completion
of the exposure period, salt deposits shall be
removed by a gentle wash or dip in running water.
NaCl solution:
Concentration : 5±1% Spray time : 48h
Temperature : 35±2°C
Per EIA-364-26 condition A
Appearance: no
damage
Contact resistance:
=30 milliohm Max
7.6 Solderability
Dip solder tails into the molten solder
(held at 250±5°C) up to 0.5mm from
the tip of tails for 3±0.5 seconds.
Contact solder Pad
shall have a Min. 95%
solder coverage
7.7
Resistance to
Soldering reflow
Heat
Infrared re flow condition
TEMPERATURE CONDITION GRAPH
(TEMPERATURE ON BOARD PATTERN
SIDE)
No damage After 2
times of reflow
8.0 PACKAGING
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
MICRO SD/TFR HEADER
SHEET No.
F
EC No:
SH2013
SH2013SH2013
SH2013-
--
-0296
02960296
0296
5
of
5
DATE:
201
201201
2013
33
3/0
00
03
33
3/27
2727
27
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
PS
-
47
309
-
001
Dixon
DixonDixon
Dixon
Li
LiLi
Li
Nicolas Zhang
Nicolas ZhangNicolas Zhang
Nicolas Zhang
Anson Yin
Anson YinAnson Yin
Anson Yin
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
See packaging specification and package assembly drawing. Parts shall be packaged to protect against damage
during handing, transit and storage.
9.0 Test Sequences : ( Sample Group Size: 5pcs)
10.0 Others:
There is a possibility that the card may become stuck in the connector due to the card finish being rough
or due to the card become worn after consecutive cycling. When this occurs, if the changing of the
position of the card, and/or the pushing of the card in again dislodges the card, it will be judged that the
connector has no problem.
Group Number 1 2 3 4 5 6 7 8 9 10 11
Contact resistance 2,8 2,7 2,4 2,9
Insulation resistance 3 3
Dielectric withstanding voltage 4 2
Temperature Rise 1
Durability 5 3
Vibration 6
Mechanical Shock 5
Terminal retention force 1
Card Insertion force 3,6 8 3,7
Card withdraw force 4,7 9 4,8
Contact normal force 2,4
Card reverse insert 2
Peeling force 2
High Relative Humidity Exposure 5
Low Temperature Exposure 5
High Temperature Exposure 6
Thermal Shock 4
Salt Spray Test 3
Solderability 1
Resistance to Soldering reflow
Heat 1 1 1 1 1 1 1 1

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