ECMF04-4HSWM10 Datasheet by STMicroelectronics

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‘ ’l hie.ougmemed uQFN-10L 2.60 x135 mm E “E |:l l_| { o n H
This is information on a product in full production.
January 2018 DocID026032 Rev 2 1/13
ECMF04-4HSWM10
Common-mode filter with ESD protection
Datasheet - production data
Figure 1. Pin configuration (top view)
Features
Very large differential bandwidth to comply with
HDMI 2.0, USB3.0, MIPI, DisplayPort and
other high speed serial interfaces
High common mode attenuation on WLAN
frequencies:
28 dB at 2.4 GHz and -16 dB at 5.0 GHz
Very good attenuation at LTE, GSM and GPS
frequencies
Large bandwidth: 4.2GHz
Very low PCB space consumption
Thin package: 0.55 mm max.
Lead-free package
High reduction of parasitic elements through
integration
Complies with the following standards:
IEC 61000-4-2 level 4:
±15 kV (air discharge)
±8 kV (contact discharge)
Applications
Set top box
Game console
Portable devices
Description
The ECMF04-4HSWM10 is a highly integrated
common-mode filter designed to suppress
EMI/RFI common mode noise on high-speed
differential serial buses like HDMI 2.0, USB3.0,
Ethernet, MIPI, DisplayPort and other high-speed
serial interfaces. The device has a very large
differential bandwidth to comply with these
standards and can also protect and filter 2
differential lanes.
µQFN-10L 2.60 x 1.35 mm
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Contents ECMF04-4HSWM10
2/13 DocID026032 Rev 2
Contents
1 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3 PCB layout recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
(Tamb
DocID026032 Rev 2 3/13
ECMF04-4HSWM10 Characteristics
13
1 Characteristics
Figure 2. Electrical characteristics (definitions)
Table 1. Absolute maximum ratings (Tamb = 25 °C)
Symbol Parameter Value Unit
VPP Peak pulse voltage
IEC 61000-4-2
Contact discharge (connector side)
Air discharge (connector side)
8
15
kV
IRMS Maximum RMS current 100 mA
Top Operating temperature range -55 to +125 °C
TjMaximum junction temperature 125 °C
Tstg Storage temperature range -55 to +150 °C
Symbol Parameter
V = Breakdown voltage
BR
I = Leakage current @ V
RM RM
V = Stand-off voltage
RM
I = Breakdown current
R
I
V
IRM
IR
VRM
VBR
Table 2. Electrical characteristics (Tamb = 25 °C)
Symbol Test conditions Min. Typ. Max. Unit
VBR IR = 1 mA 4.5 5.5 V
IRM VRM = 3 V per line 100 nA
RDC DC serial resistance 5
FC -3dB differential mode cut-off frequency 4.2 GHz
Characteristics ECMF04-4HSWM10
4/13 DocID026032 Rev 2
Figure 3. Differential attenuation versus frequency (Z0 diff = 100 )
Table 3. Pin description
Pin number Description Pin number Description
1 D1+ to connector 6 D2- to IC
2 D1- to connector 7 D2+ to IC
3 GND 8 GND
4 D2+ to connector 9 D1- to IC
5 D2- to connector 10 D1+ to IC
SDD21 (dB)
10M 30M 100M 300M 1G 3G
-5
-4
-3
-2
-1
0
F/Hz
Lane #1 Lane #2
0 com omur L x ‘ x ‘ )mux m maxim) m v ¢ mmcz, p: MWICZ) m v M 1 v « , H mm; 1 ‘ v ¢ rsm Pa mm \mzhase mm Jan
DocID026032 Rev 2 5/13
ECMF04-4HSWM10 Characteristics
13
Figure 4. Common mode attenuation versus frequency (Z0 com = 50 )
Figure 5. ESD response to IEC61000-4-2 (+8 kV contact discharge)
SCC21 (dB)
10M 30M 100M 300M 1G 3G
-40
-35
-30
-25
-20
-15
-10
-5
0
Lane #1 Lane #2
F/Hz
20 V/di v
72.1 V
13.1 V 11.2 V 7.1 V
1
24
V : ESD peak voltage
PP
V :clamping voltage @ 30 ns
CL
V :clamping voltage @ 60 ns
CL
V :clamping voltage @ 100 ns
CL
1
2
3
4
3
un- [ye nhrnm mu,
Characteristics ECMF04-4HSWM10
6/13 DocID026032 Rev 2
Figure 6. ESD response to IEC61000-4-2 (-8 kV contact discharge)
20 V/di v
20 ns/di v
-65.4 V
-10.3 V -9.2 V
-3.0 V
1
2
4
3
V : ESD peak voltage
PP
V :clamping voltage @ 30 ns
CL
V :clamping voltage @ 60 ns
CL
V :clamping voltage @ 100 ns
CL
1
2
3
4
Figure 7. HDMI2.0 5.94 Gbps eye diagram
without ECMF04-4HSWM10 (evaluation board
with SMA connector)
Figure 8. HDMI2.0 5.94 Gbps eye diagram with
ECMF04-4HSWM10 (evaluation board with SMA
connector)
z(Q) Before campensaficn Aflggcompensanon see Figurehl) 70 00 OL‘EO Z' 6'30 Z— 6921* G'EV Z
DocID026032 Rev 2 7/13
ECMF04-4HSWM10 Characteristics
13
Figure 11. TDR
Figure 9. HDMI1.4 3.35 Gbps eye diagram
without ECMF04-4HSWM10 Figure 10. HDMI1.4 3.35 Gbps eye diagram with
ECMF04-4HSWM10
49.8ps/div
250mV/div
250mV/div
49.8ps/div
Application information ECMF04-4HSWM10
8/13 DocID026032 Rev 2
2 Application information
Figure 12. HDMI schematic
Figure 13. USB3.0 application
HDMI2C1-6C1
D2
Clock
ECMF04
D0
D1
ECMF04
HDMI connector
HDMI ASIC
HDP_IC
SDA_IC
CEC_IC
SCL_IC
FAULT
SCL
GND
CEC
VDD_CEC
SDA
GND
VDD_IC
VDD_CFC_IC
VDD_5V
5V_OUT
HEAC-
HEAC+
UTILITY
HPD
USB 3.0
transceiver
Connector ECMF02-4CMX8
ECMF04-4HSWM10
Programmable
OCP
Vbus
D+
D-
ID
GND
Txp
Txn
Rxp
Rxn
USB2.0
USB3.0
DocID026032 Rev 2 9/13
ECMF04-4HSWM10 PCB layout recommendations
13
3 PCB layout recommendations
Figure 14. PCB layout recommendations
Figure 15. PCB stack dimensions
40 µm
105 µm
r= 4.28
ε
Top View D Idex m. I | . | ___fi____ mmmn —
Package information ECMF04-4HSWM10
10/13 DocID026032 Rev 2
4 Package information
Epoxy meets UL94, V0
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 16. µQFN-10L dimension definitions
Table 4. µQFN-10L dimension values
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.45 0.50 0.55 0.018 0.020 0.022
A1 0.00 0.02 0.05 0.00 0.0008 0.002
b 0.15 0.20 0.25 0.006 0.008 0.010
D 2.55 2.60 2.65 0.1 0.102 0.104
E 1.30 1.35 1.40 0.051 0.053 0.055
e 0.50 0.020
L 0.40 0.50 0.60 0.016 0.020 0.024
D
Idex area
Top view
Side view
Bottom view
E
A
e
L
b
A1
PIN # 1 ID
1
10
5
6
Ex: 8 3mm , A|vi|l \lwll/IL ,I/!|\ H \ H o jll
DocID026032 Rev 2 11/13
ECMF04-4HSWM10 Package information
13
Note: Product marking may be rotated by multiples of 90° for assembly plant differentiation. In no
case should this product marking be used to orient the component for its placement on a
PCB. Only pin 1 mark is to be used for this purpose.
Figure 19. Tape and reel specifications
Figure 17. Footprint Figure 18. Marking
0.20
0.50
0. 07
1.75
KW
Dot identifying Pin A1 location
User direction of unreeling
All dimensions are typical values in mm
4.0±0.1
4.0
2.0±0.05
8.0 +0.3 / -0.1
1.75±0.1
3.5±0.05
Ø 1.55±0.05
0.65±0.05
1.55±0.05
0.20±0.05
2.8±0.05
¥ Number of ESD prolec‘ed Imes Version WLAN 2 4 GHZ Package
Ordering information ECMF04-4HSWM10
12/13 DocID026032 Rev 2
5 Ordering information
Figure 20. Ordering information scheme
6 Revision history
ECMF 04 – 4 HS W M10
Function
Common mode filter with ESD protection
Number if lines
04 = 4 filtered lines
Number of ESD protected lines
4 lines with ESD protection
Version
HS = High Speed
Application
WLAN 2.4 GHz
Package
M10: µQFN-10L
Table 5. Ordering information
Order code Marking(1) Package Weight Base qty Delivery mode
ECMF04-4HSWM10 KW µQFN-10L 5.00 mg 3000 Tape and reel
1. The marking can be rotated by multiples of 90° to differentiate assembly location
Table 6. Document revision history
Date Revision Changes
10-Jun-2014 1 Initial release.
08-Jan-2018 2 Updated Table 1.
DocID026032 Rev 2 13/13
ECMF04-4HSWM10
13
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