TXB0104 Datasheet by Adafruit Industries LLC

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w TEXAS INSTRUMENTS :l :l :I [m3 Em: E—CEZI—Zl Em: C E E
14
13
12
11
10
9
8
1
2
3
4
5
6
7OE
D OR PW PACKAGE
(TOP VIEW)
GND
NC
A4
A3
A2
VCCA
NC
B4
B3
B2
B1
VCCB
A1
RGY PACKAGE
Exposed
Center
Pad
(TOP VIEW)
1 14
7 8
2
3
4
5
6
13
12
11
10
9
B1
B2
B3
B4
NC
A1
A2
A3
A4
NC
OE VCCB
GND VCCA
VCCB
B1
B2
B3
RUT PACKAGE
(TOP VIEW)
3
2
6
10
1
48
9
11
12
A2
A3
VCCA
A1
OE
GND
B4
57
A4
GXU/ZXU PACKAGE
(TOP VIEW)
4
3
2
1
A B C
TXB0104
www.ti.com
SCES650F APRIL 2006REVISED MAY 2012
4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR
WITH AUTOMATIC DIRECTION SENSING AND ±15-kV ESD PROTECTION
Check for Samples: TXB0104
1FEATURES
2 1.2 V to 3.6 V on A Port and 1.65 V to 5.5 V on Latch-Up Performance Exceeds 100 mA Per
B Port (VCCA VCCB) JESD 78, Class II
• VCC Isolation Feature – If Either VCC Input Is at ESD Protection Exceeds JESD 22
GND, All Outputs Are in the High-Impedance A Port
State 2500-V Human-Body Model (A114-B)
OE Input Circuit Referenced to VCCA 1500-V Charged-Device Model (C101)
Low Power Consumption, 5-μA Max ICC B Port
• Ioff Supports Partial-Power-Down Mode ±15-kV Human-Body Model (A114-B)
Operation 1500-V Charged-Device Model (C101)
TERMINAL ASSIGNMENTS
(GXU/ZXU Package)
ABC
4A4 GND B4
3A3 OE B3
2A2 VCCA B2
1A1 VCCB B1
A. N.C. No internal connection
B. For RGY, if the exposed center pad is used, it must only be connected as a secondary ground or left electrically open.
C. Pull up resistors are not required on both sides for Logic I/O.
D. If pull up or pull down resistors are needed, the resistor value must be over 50 kΩ.
E. 50 kΩis a safe recommended value, if the customer can accept higher Vol or lower Voh, smaller pull up or pull down
resistor is allowed, the draft estimation is Vol = Vccout × 4.5k/(4.5k + Rpu) and Voh = Vccout × Rdw/(4.5k + Rdw).
F. If pull up resistors are needed, please refer to the TXS0104 or contact TI.
G. For detailed information, please refer to application note SCEA043.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date. Copyright © 2006–2012, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
l TEXAS INSTRUMENTS Am
YZT PACKAGE
(TOP VIEW)
D
C
B
A
321
TXB0104
SCES650F APRIL 2006REVISED MAY 2012
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
TERMINAL ASSIGNMENTS
(YZT Package)
321
DA4 GND B4
CA3 OE B3
BA2 VCCA B2
AA1 VCCB B1
DESCRIPTION/ORDERING INFORMATION
This 4-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to
track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB
accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation
between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCA should not exceed VCCB.
When the output-enable (OE) input is low, all outputs are placed in the high-impedance state. To ensure the
high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor;
the minimum value of the resistor is determined by the current-sourcing capability of the driver.
The TXB0104 is designed so that the OE input circuit is supplied by VCCA.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION(1)
TAPACKAGE(2) ORDERABLE PART NUMBER TOP-SIDE MARKING(3)
NanoFree™ — WCSP (DSBGA)
0.23-mm Large Bump – YZT Reel of 3000 TXB0104YZTR _ _ _ 2 K _
(Pb-free) 0.625-mm max height
UFBGA – GXU Reel of 2500 TXB0104GXUR YE04
UFBGA – ZXU (Pb-Free) Reel of 2500 TXB0104ZXUR YE04
TXB0104RGYR
QFN – RGY Reel of 1000 YE04
TXB0104RGYRG4
–40°C to 85°C uQFN – RUT Reel of 3000 TXB0104RUTR 2KR
TXB0104D
Tube of 50 TXB0104DG4
SOIC – D TXB0104
TXB0104DR
Reel of 2500 TXB0104DRG4
TXB0104PWR
TSSOP – PW Reel of 2000 YE04
TXB0104PWRG4
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) YZT: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
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SCES650F APRIL 2006REVISED MAY 2012
PIN DESCRIPTION
PIN NO. BALL NO.
NAME FUNCTION
D, PW, GXU/
RUT YZT
OR RGY ZXU
1 1 B2 B2 VCCA A-port supply voltage 1.2 V VCCA 3.6 V and VCCA VCCB.
2 2 A1 A3 A1 Input/output 1. Referenced to VCCA.
3 3 A2 B3 A2 Input/output 2. Referenced to VCCA.
4 4 A3 C3 A3 Input/output 3. Referenced to VCCA.
5 5 A4 D3 A4 Input/output 4. Referenced to VCCA.
6 NC No connection. Not internally connected.
7 6 B4 D2 GND Ground
3-state output-mode enable. Pull OE low to place all outputs in 3-state mode.
8 12 B3 C2 OE Referenced to VCCA.
9 NC No connection. Not internally connected.
10 7 C4 D1 B4 Input/output 4. Referenced to VCCB.
11 8 C3 C1 B3 Input/output 3. Referenced to VCCB.
12 9 C2 B1 B2 Input/output 2. Referenced to VCCB.
13 10 C1 A1 B1 Input/output 1. Referenced to VCCB.
14 11 B1 A2 VCCB B-port supply voltage 1.65 V VCCB 5.5 V.
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCCA –0.5 4.6
Supply voltage range V
VCCB –0.5 6.5
A port –0.5 4.6
VIInput voltage range V
B port –0.5 6.5
A port –0.5 4.6
Voltage range applied to any output in the high-impedance or
VOV
power-off state B port -0.5 6.5
A port –0.5 VCCA + 0.5
VOVoltage range applied to any output in the high or low state(2) V
B port –0.5 VCCB + 0.5
IIK Input clamp current VI< 0 –50 mA
IOK Output clamp current VO< 0 –50 mA
IOContinuous output current ±50 mA
Continuous current through VCCA, VCCB, or GND ±100 mA
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The value of VCCA and VCCB are provided in the recommended operating conditions table.
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SCES650F APRIL 2006REVISED MAY 2012
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THERMAL IMPEDANCE RATINGS
UNIT
D package(1) 86
GXU/ZXU package(1) 129
PW package(1) 113
θJA Package thermal impedance °C/W
RGY package(2) 47
RUT package TBD
YZT package 90
(1) The package thermal impedance is calculated in accordance with JESD 51-7.
(2) The package thermal impedance is calculated in accordance with JESD 51-5.
RECOMMENDED OPERATING CONDITIONS(1) (2)
VCCA VCCB MIN MAX UNIT
VCCA 1.2 3.6
Supply voltage V
VCCB 1.65 5.5
Data inputs 1.2 V to 3.6 V 1.65 V to 5.5 V VCCI × 0.65(3) VCCI
VIH High-level input voltage V
OE 1.2 V to 3.6 V 1.65 V to 5.5 V VCCA × 0.65 5.5
Data inputs 1.2 V to 5.5 V 1.65 V to 5.5 V 0 VCCI × 0.35(3)
VIL Low-level input voltage V
OE 1.2 V to 3.6 V 1.65 V to 5.5 V 0 VCCA × 0.35
Voltage range applied to any A-port 0 3.6
VOoutput in the high-impedance 1.2 V to 3.6 V 1.65 V to 5.5 V V
B-port 0 5.5
or power-off state
A-port inputs 1.2 V to 3.6 V 1.65 V to 5.5 V 40
Input transition
Δt/Δv 1.65 V to 3.6 V 40 ns/V
rise or fall rate B-port inputs 1.2 V to 3.6 V 4.5 V to 5.5 V 30
TAOperating free-air temperature –40 85 °C
(1) The A and B sides of an unused data I/O pair must be held in the same state, i.e., both at VCCI or both at GND.
(2) VCCA must be less than or equal to VCCB and must not exceed 3.6 V.
(3) VCCI is the supply voltage associated with the input port.
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ELECTRICAL CHARACTERISTICS(1) (2)
over recommended operating free-air temperature range (unless otherwise noted)
TA= 25°C –40°C to 85°C
PARAMETER TEST CONDITIONS VCCA VCCB UNIT
MIN TYP MAX MIN MAX
1.2 V 1.1
VOHA IOH = –20 μA V
1.4 V to 3.6 V VCCA – 0.4
1.2 V 0.9
VOLA IOL = 20 μA V
1.4 V to 3.6 V 0.4
VOHB IOH = –20 μA 1.65 V to 5.5 V VCCB – 0.4 V
VOLB IOL = 20 μA 1.65 V to 5.5 V 0.4 V
IIOE VI= VCCI or GND 1.2 V to 3.6 V 1.65 V to 5.5 V ±1 ±2 μA
A port VIor VO= 0 to 3.6 V 0 V 0 V to 5.5 V ±1 ±2
Ioff μA
B port VIor VO= 0 to 5.5 V 0 V to 3.6 V 0 V ±1 ±2
IOZ A or B port OE = GND 1.2 V to 3.6 V 1.65 V to 5.5 V ±1 ±2 μA
1.2 V 1.65 V to 5.5 V 0.06
1.4 V to 3.6 V 1.65 V to 5.5 V 5
VI= VCCI or GND,
ICCA μA
IO= 0 3.6 V 0 V 2
0 V 5.5 V –2
1.2 V 1.65 V to 5.5 V 3.4
1.4 V to 3.6 V 1.65 V to 5.5 V 5
VI= VCCI or GND,
ICCB μA
IO= 0 3.6 V 0 V 2
0 V 5.5 V 2
1.2 V 1.65 V to 5.5 V 3.5
VI= VCCI or GND,
ICCA + ICCB μA
IO= 0 1.4 V to 3.6 V 1.65 V to 5.5 V 10
VI= VCCI or GND, 1.2 V 1.65 V to 5.5 V 0.05
ICCZA IO= 0, μA
1.4 V to 3.6 V 1.65 V to 5.5 V 5
OE = GND
VI= VCCI or GND, 1.2 V 1.65 V to 5.5 V 3.3
ICCZB IO= 0, μA
1.4 V to 3.6 V 1.65 V to 5.5 V 5
OE = GND
CiOE 1.2 V to 3.6 V 1.65 V to 5.5 V 3 4 pF
A port 5 6
Cio 1.2 V to 3.6 V 1.65 V to 5.5 V pF
B port 11 14
(1) VCCI is the supply voltage associated with the input port.
(2) VCCO is the supply voltage associated with the output port.
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TXB0104
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TIMING REQUIREMENTS
TA= 25°C, VCCA = 1.2 V
VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V VCCB = 5 V UNIT
TYP TYP TYP TYP
Data rate 20 20 20 20 Mbps
twPulse duration Data inputs 50 50 50 50 ns
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted)
VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V VCCB = 5 V
± 0.15 V ± 0.2 V ± 0.3 V ± 0.5 V UNIT
MIN MAX MIN MAX MIN MAX MIN MAX
Data rate 40 40 40 40 Mbps
twPulse duration Data inputs 25 25 25 25 ns
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V VCCB = 5 V
± 0.15 V ± 0.2 V ± 0.3 V ± 0.5 V UNIT
MIN MAX MIN MAX MIN MAX MIN MAX
Data rate 60 60 60 60 Mbps
twPulse duration Data inputs 17 17 17 17 ns
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
VCCB = 2.5 V VCCB = 3.3 V VCCB = 5 V
± 0.2 V ± 0.3 V ± 0.5 V UNIT
MIN MAX MIN MAX MIN MAX
Data rate 100 100 100 Mbps
twPulse duration Data inputs 10 10 10 ns
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
VCCB = 3.3 V VCCB = 5 V
± 0.3 V ± 0.5 V UNIT
MIN MAX MIN MAX
Data rate 100 100 Mbps
twPulse duration Data inputs 10 10 ns
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SCES650F APRIL 2006REVISED MAY 2012
SWITCHING CHARACTERISTICS
TA= 25°C, VCCA = 1.2 V
VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V VCCB = 5 V
FROM TO
PARAMETER UNIT
(INPUT) (OUTPUT) TYP TYP TYP TYP
A B 6.9 5.7 5.3 5.5
tpd ns
B A 7.4 6.4 6 5.8
A 1 1 1 1
ten OE μs
B 1 1 1 1
A 18 15 14 14
tdis OE ns
B 20 17 16 16
trA, tfA A-port rise and fall times 4.2 4.2 4.2 4.2 ns
trB, tfB B-port rise and fall times 2.1 1.5 1.2 1.1 ns
tSK(O) Channel-to-channel skew 0.4 0.5 0.5 1.4 ns
Max data rate 20 20 20 20 Mbps
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted)
VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V VCCB = 5 V
FROM TO ± 0.15 V ± 0.2 V ± 0.3 V ± 0.5 V
PARAMETER UNIT
(INPUT) (OUTPUT) MIN MAX MIN MAX MIN MAX MIN MAX
A B 1.4 12.9 1.2 10.1 1.1 10 0.8 9.9
tpd ns
B A 0.9 14.2 0.7 12 0.4 11.7 0.3 13.7
A 1111
ten OE μs
B 1111
A 5.9 31 5.7 25.9 5.6 23 5.7 22.4
tdis OE ns
B 5.4 30.3 4.9 22.8 4.8 20 4.9 19.5
trA, tfA A-port rise and fall times 1.4 5.1 1.4 5.1 1.4 5.1 1.4 5.1 ns
trB, tfB B-port rise and fall times 0.9 4.5 0.6 3.2 0.5 2.8 0.4 2.7 ns
tSK(O) Channel-to-channel skew 0.5 0.5 0.5 0.5 ns
Max data rate 40 40 40 40 Mbps
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V VCCB = 5 V
FROM TO ± 0.15 V ± 0.2 V ± 0.3 V ± 0.5 V
PARAMETER UNIT
(INPUT) (OUTPUT) MIN MAX MIN MAX MIN MAX MIN MAX
A B 1.6 11 1.4 7.7 1.3 6.8 1.2 6.5
tpd ns
B A 1.5 12 1.3 8.4 1 7.6 0.9 7.1
A 1111
ten OE μs
B 1111
A 5.9 31 5.1 21.3 5 19.3 5 17.4
tdis OE ns
B 5.4 30.3 4.4 20.8 4.2 17.9 4.3 16.3
trA, tfA A-port rise and fall times 1 4.2 1.1 4.1 1.1 4.1 1.1 4.1 ns
trB, tfB B-port rise and fall times 0.9 3.8 0.6 3.2 0.5 2.8 0.4 2.7 ns
tSK(O) Channel-to-channel skew 0.5 0.5 0.5 0.5 ns
Max data rate 60 60 60 60 Mbps
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TXB0104
SCES650F APRIL 2006REVISED MAY 2012
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SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
VCCB = 2.5 V VCCB = 3.3 V VCCB = 5 V
FROM TO ± 0.2 V ± 0.3 V ± 0.5 V
PARAMETER UNIT
(INPUT) (OUTPUT) MIN MAX MIN MAX MIN MAX
A B 1.1 6.3 1 5.2 0.9 4.7
tpd ns
B A 1.2 6.6 1.1 5.1 0.9 4.4
A 1 1 1
ten OE μs
B 1 1 1
A 5.1 21.3 4.6 15.2 4.6 13.2
tdis OE ns
B 4.4 20.8 3.8 16 3.9 13.9
trA, tfA A-port rise and fall times 0.8 3 0.8 3 0.8 3 ns
trB, tfB B-port rise and fall times 0.7 2.6 0.5 2.8 0.4 2.7 ns
tSK(O) Channel-to-channel skew 0.5 0.5 0.5 ns
Max data rate 100 100 100 Mbps
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
VCCB = 3.3 V VCCB = 5 V
FROM TO ± 0.3 V ± 0.5 V
PARAMETER UNIT
(INPUT) (OUTPUT) MIN MAX MIN MAX
A B 0.9 4.7 0.8 4
tpd ns
B A 1 4.9 0.9 3.8
A 1 1
ten OE μs
B 1 1
A 4.6 15.2 4.3 12.1
tdis OE ns
B 3.8 16 3.4 13.2
trA, tfA A-port rise and fall times 0.7 2.5 0.7 2.5 ns
trB, tfB B-port rise and fall times 0.5 2.1 0.4 2.7 ns
tSK(O) Channel-to-channel skew 0.5 0.5 ns
Max data rate 100 100 Mbps
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SCES650F APRIL 2006REVISED MAY 2012
OPERATING CHARACTERISTICS
TA= 25°C
VCCA
1.2 V 1.2 V 1.5 V 1.8 V 2.5 V 2.5 V 3.3 V
VCCB
PARAMETER TEST CONDITIONS UNIT
3.3 V
5 V 1.8 V 1.8 V 1.8 V 2.5 V 5 V to
5 V
TYP TYP TYP TYP TYP TYP TYP
A-port input, B-port output 7.8 10 9 8 8 8 9
CL= 0, f = 10 MHz,
CpdA B-port input, A-port output 12 11 11 11 11 11 11
tr= tf= 1 ns, pF
OE = VCCA
A-port input, B-port output 38.1 28 28 28 29 29 29
CpdB (outputs enabled)
B-port input, A-port output 25.4 19 18 18 19 21 22
A-port input, B-port output 0.01 0.01 0.01 0.01 0.01 0.01 0.01
CL= 0, f = 10 MHz,
CpdA B-port input, A-port output 0.01 0.01 0.01 0.01 0.01 0.01 0.01
tr= tf= 1 ns, pF
OE = GND
A-port input, B-port output 0.01 0.01 0.01 0.01 0.01 0.01 0.03
CpdB (outputs disabled)
B-port input, A-port output 0.01 0.01 0.01 0.01 0.01 0.01 0.04
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{L} TEXAS INSTRUMENTS E Shot }
4k
4k
A B
VCCA VCCB
One
Shot
One
Shot
One
Shot
One
Shot
T1
T2
T3
T4
TXB0104
SCES650F APRIL 2006REVISED MAY 2012
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PRINCIPLES OF OPERATION
Applications
The TXB0104 can be used in level-translation applications for interfacing devices or systems operating at
different interface voltages with one another.
Architecture
The TXB0104 architecture (see Figure 1) does not require a direction-control signal to control the direction of
data flow from A to B or from B to A. In a dc state, the output drivers of the TXB0104 can maintain a high or low,
but are designed to be weak, so that they can be overdriven by an external driver when data on the bus starts
flowing the opposite direction.
The output one shots detect rising or falling edges on the A or B ports. During a rising edge, the one shot turns
on the PMOS transistors (T1, T3) for a short duration, which speeds up the low-to-high transition. Similarly,
during a falling edge, the one shot turns on the NMOS transistors (T2, T4) for a short duration, which speeds up
the high-to-low transition. The typical output impedance during output transition is 70 at VCCO = 1.2 V to 1.8 V,
50 at VCCO = 1.8 V to 3.3 V, and 40 at VCCO = 3.3 V to 5 V.
Figure 1. Architecture of TXB0104 I/O Cell
Input Driver Requirements
Typical IIN vs VIN characteristics of the TXB0104 are shown in Figure 2. For proper operation, the device driving
the data I/Os of the TXB0104 must have drive strength of at least ±2 mA.
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IIN
VIN
VT/4 kW
–(VD – VT)/4 kW
A. VT is the input threshold voltage of the TXB0104 (typically VCCI/2).
B. VD is the supply voltage of the external driver.
TXB0104
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SCES650F APRIL 2006REVISED MAY 2012
Figure 2. Typical IIN vs VIN Curve
Power Up
During operation, ensure that VCCA VCCB at all times. During power-up sequencing, VCCA VCCB does not
damage the device, so any power supply can be ramped up first. The TXB0104 has circuitry that disables all
output ports when either VCC is switched off (VCCA/B = 0 V).
Enable and Disable
The TXB0104 has an OE input that is used to disable the device by setting OE = low, which places all I/Os in the
high-impedance (Hi-Z) state. The disable time (tdis) indicates the delay between when OE goes low and when the
outputs acutally get disabled (Hi-Z). The enable time (ten) indicates the amount of time the user must allow for the
one-shot circuitry to become operational after OE is taken high.
Pullup or Pulldown Resistors on I/O Lines
The TXB0104 is designed to drive capacitive loads of up to 70 pF. The output drivers of the TXB0104 have low
dc drive strength. If pullup or pulldown resistors are connected externally to the data I/Os, their values must be
kept higher than 50 kto ensure that they do not contend with the output drivers of the TXB0104.
For the same reason, the TXB0104 should not be used in applications such as I2C or 1-Wire where an open-
drain driver is connected on the bidirectional data I/O. For these applications, use a device from the TI TXS01xx
series of level translators.
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l TEXAS INSTRUMENTS 2 x O 51 O From Output From ompm Under Test Under Test I I LOAD CIRCUIT FOR ENABLE/DISABLE TIME MEASUREMENT VOLTAGE WAVEFORMS PROPAGATION DELAV TIMES c:L Inc‘udes pmbe and Hg capacnance, AH Input puIses are supphed by generamrs hawng me Iouowmg charamensncs, P The outputs are measured me at a mme wuh one Iransmcm per measuremem 1pm and (M are me same as [W vcc‘ I5 me VCC assocuated mm me mpm pun. VCCO IS The vac assacxaIed with me Output pun. AH parameters and wavelorms are net apphcame In an dewces, Cnnnunm)
From Output
Under Test
LOAD CIRCUIT FOR
ENABLE/DISABLE
TIME MEASUREMENT
S1
2 × VCCO
Open
50 kW
VCCI
0 V
VCCI/2 VCCI/2
tw
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
Input
tPZL/tPLZ
tPHZ/tPZH
2 × VCCO
Open
TEST S1
A. CL includes probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, ZO = 50 , dv/dt 1 V/ns.
C. The outputs are measured one at a time, with one transition per measurement.
D. tPLH and tPHL are the same as tpd.
E. VCCI is the VCC associated with the input port.
F. VCCO is the VCC associated with the output port.
G. All parameters and waveforms are not applicable to all devices.
50 kW
From Output
Under Test
1 MW
15 pF 15 pF
LOAD CIRCUIT FOR MAX DATA RATE,
PULSE DURATION PROPAGATION
DELAY OUTPUT RISE AND FALL TIME
MEASUREMENT
tPLH tPHL
0 V
VCCO/2
VCCI/2 VCCI/2
0.9 y VCCO
VCCO/2
tr
0.1 y VCCO
tf
VCCI
Input
Output VOH
VOL
TXB0104
SCES650F APRIL 2006REVISED MAY 2012
www.ti.com
PARAMETER MEASUREMENT INFORMATION
Figure 3. Load Circuits and Voltage Waveforms
12 Submit Documentation Feedback Copyright © 2006–2012, Texas Instruments Incorporated
Product Folder Links: TXB0104
l TEXAS INSTRUMENTS
TXB0104
www.ti.com
SCES650F APRIL 2006REVISED MAY 2012
REVISION HISTORY
Changes from Revision E (February 2010) to Revision F Page
Added notes to pin out graphics. .......................................................................................................................................... 1
Copyright © 2006–2012, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Links: TXB0104
I TEXAS INSTRUMENTS Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples
PACKAGE OPTION ADDENDUM
www.ti.com 26-Oct-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TXB0104D ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 TXB0104
TXB0104DG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 TXB0104
TXB0104DR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 TXB0104
TXB0104DRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 TXB0104
TXB0104GXUR ACTIVE BGA
MICROSTAR
JUNIOR
GXU 12 2500 TBD SNPB Level-1-240C-UNLIM -40 to 85 YE04
TXB0104PWR ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 YE04
TXB0104PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 YE04
TXB0104RGYR ACTIVE VQFN RGY 14 3000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 YE04
TXB0104RGYRG4 ACTIVE VQFN RGY 14 3000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 85 YE04
TXB0104RUTR ACTIVE UQFN RUT 12 3000 Green (RoHS
& no Sb/Br)
CU NIPDAUAG Level-1-260C-UNLIM -40 to 85 2KR
TXB0104YZTR ACTIVE DSBGA YZT 12 3000 Green (RoHS
& no Sb/Br)
SNAGCU Level-1-260C-UNLIM -40 to 85 (2K ~ 2K7)
TXB0104ZXUR ACTIVE BGA
MICROSTAR
JUNIOR
ZXU 12 2500 Green (RoHS
& no Sb/Br)
SNAGCU Level-1-260C-UNLIM -40 to 85 YE04
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
I TEXAS INSTRUMENTS
PACKAGE OPTION ADDENDUM
www.ti.com 26-Oct-2013
Addendum-Page 2
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TXB0104 :
Automotive: TXB0104-Q1
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
I TEXAS INSTRUMENTS REEL DIMENSIONS TAPE DIMENSIONS 7 “KO '«Pt» Reel Dlameter A0 Dimension designed to accommodate the component Width Bo Dimension designed to accommodate the component tengtn K0 Dimension designed to accommodate the component thickness 7 w Overau Wiotn ot the carrier tape i P1 Pitch between successive cawty centers f T Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE a O O D O O D D SprocketHotes ,,,,,,,,,,, ‘ User Direcllon 0' Feed Pockel Quadrants
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TXB0104DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
TXB0104GXUR BGA MI
CROSTA
R JUNI
OR
GXU 12 2500 330.0 8.4 2.3 2.8 1.0 4.0 8.0 Q2
TXB0104PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
TXB0104RGYR VQFN RGY 14 3000 330.0 12.4 3.75 3.75 1.15 8.0 12.0 Q1
TXB0104RUTR UQFN RUT 12 3000 180.0 8.4 1.95 2.3 0.75 4.0 8.0 Q1
TXB0104YZTR DSBGA YZT 12 3000 180.0 8.4 1.49 1.99 0.75 4.0 8.0 Q2
TXB0104ZXUR BGA MI
CROSTA
R JUNI
OR
ZXU 12 2500 330.0 8.4 2.3 2.8 1.0 4.0 8.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Nov-2013
Pack Materials-Page 1
I TEXAS INSTRUMENTS TAPE AND REEL BOX DIMENSIONS
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TXB0104DR SOIC D 14 2500 367.0 367.0 38.0
TXB0104GXUR BGA MICROSTAR
JUNIOR GXU 12 2500 338.1 338.1 20.6
TXB0104PWR TSSOP PW 14 2000 367.0 367.0 35.0
TXB0104RGYR VQFN RGY 14 3000 367.0 367.0 35.0
TXB0104RUTR UQFN RUT 12 3000 202.0 201.0 28.0
TXB0104YZTR DSBGA YZT 12 3000 182.0 182.0 17.0
TXB0104ZXUR BGA MICROSTAR
JUNIOR ZXU 12 2500 338.1 338.1 20.6
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Nov-2013
Pack Materials-Page 2
MECHANICAL DATA GXU (S—PBGA—N12) PLASTIC BALL GRID ARRAY 2,5 2,4 % 3' ma WP A i A V 00 010 V T_ \ 1 2 ‘ 3 4 A1 Comer a0 200mm \denmccton pm wnhaut so‘der Cb CD (:5 C Hoflom View (MD?) 0320 $ T 4 H35; C51 MAX J i Semwg Pmne _ 0,25 0 0,08 4ZU7OOB/B 06/05 \C‘TFS A AH wear dwmenswms are m NHWHSH: 3 Ms dmqu 5 subject m charge mom Ponce ‘5‘ TEXAS INSTRUMENTS www.(i.com
MECHANICAL DATA ZXU (S—PBGA—N12) PLASTIC BALL GRID ARRAY N N 5 O (f 97 Q2 0 Q O O (I) C I? WP A Q 010 V <2 1="" \="" 1="" 2="" ‘="" 3="" 4="" a1="" comer="" wu="" 200mm="" \denhhccton="" pm="" wnhaut="" so‘der="" hoflom="" view="" 01320="" 3.61="" max="" 4207009/b="" 06/05="" voits="" a="" a‘="" hnear="" gwshsw’vs="" are="" m="" mmmetevs="" a="" tm="" amwg="" ‘5="" 5mm="" m="" charge="" whom="" rohce="" c.="" tm:="" puckcgc="" ‘5="" u="" \cuc4'ct="" 50‘de="" buh="" design.="" fl!="" exas="" instruments="" www.li.com="">
MECHANICAL DATA D U1 4)} 0 (3'4) DLASHC SMALL 0U ¥N¥ 4040047 5/M 06/1‘ NO'ES, A AH Hnec' dimensmrs c'e m 'mc'ves ['nflhmeter5> B Th5 drawer ‘5 subje», ,0 change mm: Home, A Body \cngth docs rm mac mod Hoar, p'omswons, (xv gmc bms Mom mm warmers, or gm buns sha‘ nm exceed 3005 (015) eam swce @ Body mm does 101 meme 11mm fish. E Rdererce JEDEC MS 012 mam AB, nter‘ec: flash sfu‘ not exceed 0017 (043) each swde {If TEXAS INSTRUMENTS www.1i.com
LAND PATTERN DATA D (R7PDSOmGl4) PLASTlC SMALL OUTLINE Example Board Layout Sterlazlogpeulyngs (Mole c) —— <—14x0,55 -hhheb&&t="" tmedddifi§n%="" 5.40="" 5,40="" @eeeeeej="" rfihfl§eflhj="" —=""> ——l 2x1,27 Example Non Soldermask Delined Pad Example Pad Geometry (See Note c) F Example l / Solder Mask Opening 7 0 07 f (See Note E) All Armlnd ,/ tzllmss/E oa/lz NOTES: A. All linear dimensions are in millimeters. a, Tnis drawan is subject to cnonae wl'lhuul notice. c. Publlcutl’on chs7351 is recommended tor alternate desl’gns. D. Laser ctming apertures w‘lth trapezoidal walls and also roundlng comers wlll otter better paste release. Customers should contact their board assembly site for stencil design recommendations, Reter tc ch—7525 lor otner stencil recommendations. E. Customers snoola contact their ooard looricotion site lor solder musk tolerances between ond oroond signol oods. {I} Tums INSTRUMENTS www.li.com
MECHANICAL DATA "7’7 : 3‘ AST‘C SMAH CJ’ N7 HHHHHHH . . ‘7,4’ 44*, A f;—‘ NO'ES' A AH Hnec' dimensmrs c'e m m'\\me(ers Dwmens'amnq cnd tu‘erc'vcmg per ASME w 5M 1994, Tm drawer ‘5 subje», ,o "hangs wnrau: Home, Budy \evvgih ‘ues m W" Le mom Hush, pyuws‘m Ur guts Ms M exceed 0,15 each m & Rudy wde does NM Wands \Mer end flair \Mefiead 'Wclsh shaH um exceed 0‘75 each S‘de E Fa‘s WM" JEDEC M07153 MUM "\u>h, main: bus, 01 guie buns shuH {if TEXAS INSTRUMENTS www.ci.com
PW (R—PDSO—Gi4) LAND PATTERN DATA PLASTIC SMALL OUTLINE Example Board Layout (Note C) <—i,2x0 65="" hhhhhelel="" example="" non="" soldermask="" defined="" pad="" _»="" l._="" 0,07="" stencil="" openings="" (note="" d)="" —=""> <—14x0,30 :llllllilll="" 5,60="" hhh'hlelll‘lli="" example="" pad="" geometry="" (see="" note="" c)="" example="" solder="" mask="" opening="" (see="" note="" e)="" —="">|‘ ‘,<—12><0 65="" 42l128472/f="" 12/i2="" notes:="" all="" linear="" dimensions="" are="" in="" millimeters,="" inis="" drawing="" is="" subject="" to="" cnange="" without="" notice.="" publication="" lpc="" 735i="" is="" recommended="" lar="" alternate="" designs.="" a="" e="" c.="" ‘="" ‘="" i="" d="" laser="" culling="" apertures="" with="" lrapeloidul="" walls="" and="" also="" rounding="" corners="" will="" offer="" better="" paste="" release="" customers="" should="" ‘="" contact="" their="" board="" assembly="" site="" for="" stencil="" design="" recommendations.="" rater="" to="" ipc="" 7525="" lor="" other="" stencil="" recommendations="" e="" customers="" should="" contact="" their="" board="" fabrication="" site="" for="" solder="" mask="" tolerances="" between="" and="" around="" signal="" pads.="" iii="" texas="" instruments="" www.1i.com="">
MECHANICAL DATA ROY :3 ESPN MA) PLASUC QJ/‘D :L/fP/NCK V07 w » 42035397Zfl US/ZUM Home urchun m drawmq ‘5 sumo o N (am He (puck No Lcuujp 0 change We AH \mecr mmensws are m m hmeters mmensnmnq and tu‘erc'mmg per Aw: mswwgga Tre pucmge Mermm pc: must be smcerec m the Board for them: and memumcm perfurmunce See 'he uddihonu‘ rm 8 m the Pmdnct Data Sheet rm detm‘s reguvdmg (he expused 012va pud {saunas and dimenswuns [3 Package Carma: m JF‘IFC M07941 vermin RA A B C D E & P'w 1 \derh‘we's are \ocuted ur bo:h top and bckkorr of :he package 0er wkhv‘ the zone 'nmcutec We Pm 1 'demmers are ewiher u ma‘ded, marked‘ or msid feature, ‘5’ hams INSI'RUMENT‘S www.1i.com
THERMAL PAD MECHANICAL DATA RGY (87PVQFN7N14) PLASTlC QUAD FLATPACK NOiLEAD THERMAL lNFORMATlON This package incorporates an exposed thermal pad that is designed to be attached directly to an external heatsink. The thermal pad must be soldered directly to the printed circuit board (PCB). After soldering, the PCB can be used as a heatsink. In addition, through the use of thermal vias, the thermal pad can be attached directly to the appropriate copper plane shown in the electrical Schematic for the device, or alternatively, can be attached to a special heatsink structure designed into the PCB, This design optimizes the heat transfer from the integrated circuit (IC). For iniormatlon on the Quad Flatpack No—Lead (QFN) package and its advantages. reier to Application Report. OFN/SON PCB Attachment. Texas instruments Literature No. SLUA271. This document is available at wwwti‘cam, The exposed thermal pad dimensions for this package are shown in the following illustration. —Exposed Thermal Pad UUU s U T 13 ‘t/C7 2,05i0,i0 -l- l i4 U Q i3 9 2,05i0,i0 Bottom View Exposed Thermal Pad Dimensions 4206353—2/P 03/14 NOTE: All linear dimensions are in millimeters ”I. "-216 ‘5 INSTRUMENTS www.li.com
LAND PATTERN DATA PLASTIC QUAD FLATPACK NO—LEAD RGY (s—PVQFN—Ni 4) Example Stencil Design 0‘125mm stencil ihichness Example Eaard Lawut (Note E) <—4,3o—» us="" h="" u="" u="" u="" note="" d="" h="" u="" u="" u="" l="" —d="" (:l="" 7:2,.="" «f="" t:l="" £50="" ledf="" 2.05’="" "25="" 7551—="" 82="" t="" 1,50="" 7="" 7="" use="" _="" _="" 1:)="" z'i="" ~;l="" l:)="" -°—l="" 7="" ‘-="" 0.50="" x="" h="" pl="" non="" solder="" mask="" .e="" du="" 4="" e="" 54%="" solder="" coverage="" by="" printed="" area="" on="" center="" thermal="" pad="" example="" ma="" layout="" design="" may="" vary="" depending="" on="" constraints="" defined="" pad="" ..’="" .....="" example="" \="" (note="" a.="" f)="" l="" ‘\="" solder="" mask="" opening="" w,="" (note="" f)="" o="" l="" ,="" +="" 4397="" l‘="" '="" “="" o="" l="" \l\="" example="" 6x¢0,3="" ‘.\="" 7="" pad="" geometry="" .‘="" 0'07="" (note="" c)="" all="" around="" \\="" ‘\="" \_\="">. Customers should Laser cutting apertures with trapezoidal walls and also rounding carriers will orler better paste release. Reler to we 7525 tor stencil design considerations. contact their board ossemoly site tar stencil design recommendations, Customers should contact their board fabrication site for minimum solder mask wea tolerances between signal pods. TEXAS INSTRUMENTS www.ti.com til!
MECHANICAL DATA RUT (R—PUQFN—NWZ) PLAST‘C QUAD FLATPACK NO—LEAD 21o , ' 1,90 IE '1 1 , 1 ‘ , w 12 N 5 1,60 Pin 1 Max Area / Tap and Bottom , ¢ 0.13 Nomina1 M 0,5 Lead Frame F45 i :L M w 0700 Seatmg Height Sealing Plane l—I 1,60 0.40 7 (E 10X 045 I 5 | | 0.15 —T I2 ’ i i g 1* 5 025 2X M 2x '— 0 45 0.15 i W i i - H 7 w » 4710X 0'15 0,o7® c AIBI $ 0,05® 0 Bottom Wew 4210550/0 05/12 NOTES: 3. This drawing 13 subjecl Io change without notice, 0, QFN (Quad Ftatpack NoiLead) package comigummn. A. AH \ineur dimens'tons are In mileeIers. Dimensicning and (olerancing per ASME YM.5M—1994, {9 TEXAS INSTRUMENTS wwwxi .com
LAND PATTERN DATA RUT (R—PUQFN—NiZ) PLASTIC QUAD FLATPACK NO—LEAD Land Pattern Stencil Pattern 8X 040—‘4—D‘ 8X 0.40 LSD mm 1 eiyiilm —u| L—iOXDZD *i Llox 0,20 Exampie Pad Geometry 0,05 All Around 1 I Contact your PCE vendor (or f i uliuwuhie Solder Mask Lieurunce (Nate l.) Example Nm—Snidemlnsk cpemng smut/o uo/u NOTES: A. All linear dimensions are in millimeters. a, This drawing is subject to change without notice, 5, Publication ch—nsi is recommended tor alternate designs. D. Customers should contact their board fabrication site tor minimum solder mash weto tolerances between signal pads, E. Maximum slencii thickness OJOiG mm (4 mils)‘ Ail linear dimension: are in rniilinletevs. F. Laser cutting apertures with trapezoidal walls and also rounding corners will otter better paste release Customers should contact their board assemoly site tor stencil design recommendations, Reier to PC 7525 lor stencil design considerations 6. Oversprinting land tor larger area ratio is not advised due to land width and bridging potential. Exersixe extreme caution, H. Suggest stencils cut with lasers such as Fiber toser that produce the greatest positional accuracy. I Component placement iaroe should be rni mized to prevent excessive paste binck deiormation. fl! TEXAS INSTRUMENTS
MECHANICAL DATA YZT (R7XBGA7N12) (CUSTOM) DIEisizE BALL GRID ARRAY 4— E E 17 D E13 7' ‘ 0.50 A \Buli A3 Index Area 5 tt m Wew a a 12x xzsfi -_IIE ”alum i i— ;u u of 77777 T m .15 izusiiars/H 05/13 NOTES: A, An linear dimensions are in miiiimeters. Dimensianing and iaiarancing per ASME wismiesi. B. This drawing is subject to change without notice, 0. NannFreeW package configuration. NanaFlee is a Ilidemark 0' Texas Inslmmems fl”! TEXAS INSTRUMENTS www.1i.com
D: Max =
E: Max =
1.89 mm, Min =
1.39 mm, Min =
1.83 mm
1.33 mm
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