HV5812 Datasheet by Microchip Technology

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2016 Microchip Technology Inc. DS20005629A-page 1
HV5812
Features
•HVCMOS
® Technology for High Performance
Operating Voltage of up to 80V
High-speed Source Driver
5V CMOS Logic Circuitry
Up to 5 MHz Data Input Rate
Excellent Noise Immunity
Flexible High-voltage Supplies
Applications
Display Driver
General Description
The HV5812 is a 20-channel serial-input vacuum
fluorescent display driver. It combines a 20-bit CMOS
shift register, data latches and control circuitry with
high-voltage MOSFET outputs. The HV5812 is
primarily designed for vacuum fluorescent displays.
The CMOS shift register and latches allow direct
interfacing with microprocessor-based systems. Data
input rates are typically over 5 MHz with 5V logic
supply. Especially useful for interdigit blanking, the
blanking input disables the output source drives and
turns on the sink drivers. Using with TTL may require
external pull-up resistors to ensure an input logic high.
Package Type
28-lead PDIP
(Top view)
See Table 2-1 for pin information.
28
1
1 28
4 26
1 28
28-lead PLCC
(Top view)
28-lead SOW
(Top view)
s
20-Channel Serial-Input Vacuum Fluorescent Display Driver for Anode or Grid
H TTTTT
BL
STROBE
DATA IN
CLK
DATA OUT
20-bit
Shift
Register
20-bit
Latch
VPP
HV
OUT
1
HV
OUT
2
HV
OUT
3
HV
OUT
20
GND
VDD
HV5812
DS20005629A-page 2 2016 Microchip Technology Inc.
Functional Block Diagram
0 VDD VDUT VDD Vw VDD VDD w VDD VDD
2016 Microchip Technology Inc. DS20005629A-page 3
HV5812
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings†
Supply Voltage, VDD................................................................................................................................ –0.5V to +7.5V
Supply Voltage, VPP ..................................................................................................................................–0.5V to +90V
Logic Input Levels ............................................................................................................................ –0.3V to VDD +0.3V
Maximum Operating Junction Temperature .........................................................................................................+125°C
Storage Temperature ............................................................................................................................–55°C to +150°C
Power Dissipation:
28-lead PDIP ......................................................................................................................................... 2000 mW
28-lead PLCC........................................................................................................................................ 1900 mW
28-Lead SOW........................................................................................................................................ 1700 mW
Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only, and functional operation of the device at those or any other conditions above those
indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for
extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
Parameter Sym. Min. Typ. Max. Unit Conditions
Supply Voltage VDD 4.5 5.5 V
Supply Voltage VPP 20 80 V
Operating Junction Temperature TJ–40 +125 °C
DC ELECTRICAL CHARACTERISTICS
Electrical Specifications: Over recommended operating conditions; TA = 25°C unless otherwise indicated.
Parameter Sym. Min. Typ. Max. Unit Conditions
Output Leakage Current IDSS –5 –15 µA VOUT = 0V, TA = +70°C
High-level Output VOH
HVOUT
78 78.5
V
IOUT = –25 mA, VPP = 80V,
TJ = +25°C
77 78 IOUT = –25 mA, VPP = 80V,
TJ = +125°C
DATA
OUT 4.5 4.7 V IOUT = –200 µA, VDD = 5V
Low-level Output VOL
HVOUT
1.5 3
V
IOUT = 1 mA, TJ = +25°C, VDD = 5V
2.3 4IOUT = 1 mA, TJ = +125°C,
VDD = 5V
DATA
OUT 200 250 V IOUT = +200 µA, VDD = 5V
Output Pull-down Current ISINK 23.5 mA VOUT = 5V to VPP
, VDD = 5V
High-level Logic Input Voltage VIH 3.5 5.3 V VDD = 5V
Low-level Logic Input Voltage VIL –0.3 0.8 V
High-level Logic Input Current IIH 0.05 0.5 µA VIN = VDD, VDD = 5V
Low-level Logic Input Current IIL –0.05 –0.5 µA VIN = 0.8V, VDD = 5V
Quiescent VDD Supply
Current IDDQ
100 300 µA All outputs high, VDD = 5V
100 300 All outputs low, VDD = 5V
Quiescent VPP Supply Current IPPQ
10 100 µA All outputs high, no load
10 100 All outputs low, no load
AC ELECTRICAL CHARACTERISTICS
Electrical Specifications: Over recommended operating conditions; TA = 25°C unless otherwise indicated.
Parameter Sym. Min. Typ. Max. Unit Conditions
Blanking to Output Delay tPHL 2000 ns CL = 30 pF, 50% to 50%, VDD=5V
tPLH 1000
Output Fall Time tr1450 ns CL = 30 pF, 90% to 10%, VDD = 5V
Output Rise Time tf650 ns CL = 30 pF, 10% to 90%, VDD = 5V
Data Set-up Time tSU 75 — — ns See Timing Waveforms.
Data Hold Time tH75 — — ns See Timing Waveforms.
Minimum Data Pulse Width tPWD 150 — — ns See Timing Waveforms.
Minimum Clock Pulse Width tPWCLK 150 — — ns See Timing Waveforms.
Minimum Time between Clock
Activation and Strobe tCKS 300 — — ns See Timing Waveforms.
Minimum Strobe Pulse Width tPWS 100 — — ns SeeTiming Waveforms.
Typical Time between Strobe
Activation and Output
Transition
tSTO 500 ns See Timing Waveforms.
Maximum Clock Frequency fCLK
8 MHz TJ = +25°C, VDD = 5V
— 5 — TJ = +125°C, VDD = 5V
TEMPERATURE SPECIFICATIONS
Parameter Sym. Min. Typ. Max. Unit Conditions
TEMPERATURE RANGE
Operating Junction Temperature TJ–40 +125 °C
Storage Temperature TS–55 +150 °C
PACKAGE THERMAL RESISTANCE
28-lead PDIP JA 43 °C/W
28-lead PLCC JA 48 °C/W
28-lead SOW JA 55 °C/W
HV5812
DS20005629A-page 4 2016 Microchip Technology Inc.
% 751:7?
2016 Microchip Technology Inc. DS20005629A-page 5
HV5812
Timing Waveforms
CLK
DATA IN
STROBE
BL
HV
OUT
t
PWCLK
t
PWS
t
PHL
t
f
t
r
t
PLH
t
SU
50%
90%
10%
50%
10%
t
h
t
PWD
t
CKS
t
STO
90%
50% 50%
50% 50%
50% 50%
VIH
VIL
VIH
VIL
VIH
VIL
VIH
VIL
VOH
VOL
50%
50%
HV5812
DS20005629A-page 6 2016 Microchip Technology Inc.
2.0 PIN DESCRIPTION
The details on the pins of HV5812 28-lead PDIP,
28-lead PLCC and 28-lead SOW are listed on
Table 2-1. Refer to Package Types for the location of
pins.
TABLE 2-1: PIN FUNCTION TABLE
Pin Number Pin Name Description
1VPP High-voltage power rail
2Data Out Serial data output. Data output for cascading to the data input of the next device.
3HVOUT20 High-voltage output
4HVOUT19 High-voltage output
5HVOUT18 High-voltage output
6HVOUT17 High-voltage output
7HVOUT16 High-voltage output
8HVOUT15 High-voltage output
9HVOUT14 High-voltage output
10 HVOUT13 High-voltage output
11 HVOUT12 High-voltage output
12 HVOUT11 High-voltage output
13 BLANKING Blank
14 GND Logic and high-voltage ground
15 CLOCK Data shift register clock
16 STROBE Strobe
17 HVOUT10 High-voltage output
18 HVOUT9High-voltage output
19 HVOUT8High-voltage output
20 HVOUT7High-voltage output
21 HVOUT6High-voltage output
22 HVOUT5High-voltage output
23 HVOUT4High-voltage output
24 HVOUT3High-voltage output
25 HVOUT2High-voltage output
26 HVOUT1High-voltage output
27 Data In Serial data input
28 VDD Low-voltage logic power rail
1 Connec: ground. 1 Remove Vpp DD PP £1 TTT TTT TTT "T" L99 TTTTW
2016 Microchip Technology Inc. DS20005629A-page 7
HV5812
3.0 FUNCTIONAL DESCRIPTION
Follow the steps below to power up and power down
the HV5812:
POWER-UP AND POWER-DOWN SEQUENCE
Power-up Power-down
Step Description Step Description
1Connect ground. 1Remove VPP
.
2Apply VDD. 2 Remove all inputs.
3Set all inputs (Data, CLK, etc.) to a known state 3Remove VDD.
4Apply VPP
. (Note 1) 4 Disconnect ground.
Note 1: The VPP should not drop below VDD during operation.
FUNCTION TABLE (Note 1)
Serial
Data
Input
Clock
Input
Shift Register Contents Serial
Data
Output
Strobe
Input
Latch Contents
Blanking
Output Contents
I1I2I3... IN-1 INI1I2I3... IN-1 INI1I2I3... IN-1 IN
HL to H H R1R2...RN–2 RN–1 RN–1 — — — — —
LL to H L R1R2...RN–2 RN–1 RN–1 — — — — —
XH to L R1R2R3...RN–1 RNRN — — — — —
X X X...X X X L R1R2R3...RN–1 RN — —
— P1P2P3...PN–1 PNPNH P1P2P3...PN–1 PNL P1P2P3...PN–1 PN
— — X X X...X X H L L L...L L
Note 1: L = Low logic level
H = High logic level
X = Irrelevant
P = Present state
R = Previous state
,
VDD
INPUT
GND
VPP
L/T
GND
HV
OUT
Logic Inputs
GND
Data Out
Logic Data Output High Voltage Outputs
VDD
FIGURE 3-1: IO Circuits.
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HV5812
DS20005629A-page 8 2016 Microchip Technology Inc.
4.0 PACKAGE MARKING INFORMATION
4.1 Packaging Information
28-lead PDIP Example
HV5812P
e3
1625859
XXXXXX
e3
YYWWNNN
Legend: XX...X Product Code or Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for product code or customer-specific information. Package may or
not include the corporate logo.
3
e
3
e
28-lead PLCC Example
XXXXXXXXX
YYWWNNN
e3
HV5812PJ
1611231
e3
nmmmmmr—Hmnnflnnm + / Tuuuuuu‘uuuuuuj
28-Lead PDIP (.600in Row Spacing) Package Outline (P)
1.565x.580in body, .250in height (max), .100in pitch
Note 1
(Index Area)
28
1
D
LA1
AA2
Seating
Plane
e
E1
D1
D1
E
A
A
Side View
Top View
View A - A
eA
eB
b
b1
View B
View B
Note:
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DSULQWHGLQGLFDWRU
Symbol A A1 A2 b b1 D D1 E E1 e eA eB L
Dimension
(inches)
MIN .140* .015 .125 .014 .030 1.380 .065
.590
.485
.100
BSC
.600
BSC
.600* .115
NOM------ - -- --
MAX .250 .055* .195 .023
.070 1.565 .085* .625 .580 .700 .200
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Drawings not to scale.
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
2016 Microchip Technology Inc. DS20005629A-page 9
HV5812
\\mmflhfiflfi Horizontal Side View Vertical Side View / \ / +H+ \ ’ \ \ i ,‘ ‘x Lu“ ViewA
28-Lead PLCC Package Outline (PJ)
.453x.453in. body, .180in. height (max), .050in. pitch
Symbol A A1 A2 b b1 D D1 E E1 e R
Dimension
(inches)
MIN .165 .090 .062 .013 .026 .485 .450 .485 .450
.050
BSC
.025
NOM .172 .105 - - - .490 .453 .490 .453 .035
MAX .180 .120 .083 .021 .032 .495 .456 .495 .456 .045
JEDEC Registration MS-018, Variation AB, Issue A, June, 1993.
Drawings not to scale.
.150 MAX
.048/.042
x 45O
1
075 MAX
426
D
D1
E1 E
Top View
View A
AA2
A1
Seating
Plane
e
Note 1
(Index Area)
.056/.042
x 45O
Base
Plane
.020 MIN
28
b
View A
b1
Horizontal Side View
Vertical Side View
Note 2
.020max
(3 Places)
R
Notes:
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a printed indicator.
2. $FWXDOVKDSHRIWKLVIHDWXUHPD\YDU\
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
HV5812
DS20005629A-page 10 2016 Microchip Technology Inc.
HHHHHHHHHHHHHH + HHHHHHHHHHHHHH
28-Lead SOW (Wide Body) Package Outline (WG)
17.90x7.50mm body, 2.65mm height (max), 1.27mm pitch
Symbol A A1 A2 b D E E1 e h L L1 L2 șș
Dimension
(mm)
MIN 2.15* 0.10 2.05 0.31 17.70* 9.97* 7.40*
1.27
BSC
0.25 0.40
1.40
REF
0.25
BSC
0O5O
NOM - - - - 17.90 10.30 7.50 - - - -
MAX 2.65 0.30 2.55* 0.51 18.10* 10.63* 7.60* 0.75 1.27 8O15O
JEDEC Registration MS-013, Variation AE, Issue E, Sep. 2005.
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Drawings are not to scale.
S#S 28SO G 0 1309
D
Seating
Plane
Gauge
Plane
L
L1
L2
Top View
Side View
View B
View
B
θ1
θ
E1 E
AA2
A1
A
A
Seating
Plane
eb
h
h
28
1
Note 1
Note 1
(Index Area
0.25D x 0.75E1)
View A - A
Note:
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a printed indicator.
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
2016 Microchip Technology Inc. DS20005629A-page 11
HV5812
HV5812
DS20005629A-page 12 2016 Microchip Technology Inc.
NOTES:
2016 Microchip Technology Inc. DS20005629A-page 13
HV5812
APPENDIX A: REVISION HISTORY
Revision A (October 2016)
Converted Supertex Doc# DSFP-HV5812 to
Microchip DS20005629A
Changed the packaging quantity of 28-lead PLCC
(PJ M904) from 500/Reel to 750/Reel and
28-lead SOW (WG) from 1000/Reel to 1600/Reel
Made minor text changes throughout the docu-
ment
PART NO. f v 1“ a Env \><>
HV5812
DS20005629A-page 14 2016 Microchip Technology Inc.
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
a) HV5812P-G: 20-Channel Serial-Input Vacuum
Fluorescent Display Driver for
Anode or Grid, 28-lead PDIP,
13/Tube
b) HV5812PJ-G: 20-Channel Serial-Input Vacuum
Fluorescent Display Driver for
Anode or Grid, 28-lead PLCC,
38/Tube
c) HV5812PJ-G-M904: 20-Channel Serial-Input Vacuum
Fluorescent Display Driver for
Anode or Grid, 28-lead PLCC,
750/Reel
d) HV5812WG-G: 20-Channel Serial-Input Vacuum
Fluorescent Display Driver for
Anode or Grid, 28-lead SOW,
1600/Reel
PART NO.
Device
Device: HV5812 = 20-Channel Serial-Input Vacuum
Fluorescent Display Driver for Anode or
Grid
Packages: P = 28-lead PDIP
PJ = 28-lead PLCC
WG = 28-lead SOW
Environmental: G = Lead (Pb)-free/RoHS-compliant Package
Media Types: (blank) = 13/Tube for a P Package
= 38/Tube for a PJ Package
= 1600/Reel f or a WG Package
M904 = 750/Reel for a PJ Package
XX
Package
-
X - X
Environmental
Media Type
Options
YSTEM
2016 Microchip Technology Inc. DS20005629A-page 15
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate,
dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq,
KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST,
MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo,
RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O
are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
ClockWorks, The Embedded Control Solutions Company,
ETHERSYNCH, Hyper Speed Control, HyperLight Load,
IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut,
BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, Dynamic Average Matching, DAM, ECAN,
EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip
Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker,
Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2016, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0999-1
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITYMANAGEMENTS
YSTEM
CERTIFIEDBYDNV
== ISO/TS16949==
6‘ ‘MICROCHIP AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE
DS20005629A-page 16 2016 Microchip Technology Inc.
AMERICAS
Corporate Office
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Chandler, AZ 85224-6199
Tel: 480-792-7200
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Technical Support:
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Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
ASIA/PACIFIC
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
EUROPE
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Dusseldorf
Tel: 49-2129-3766400
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Venice
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Poland - Warsaw
Tel: 48-22-3325737
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Worldwide Sales and Service
06/23/16

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