ST3215SB32768C0HPWBB Spec Datasheet by Kyocera International Inc. Electronic Components

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Sgecifications
KYOCERA Crystal Device Corporation KBS-5079D
Specifications
Drawing No. USY1N-H1-13168-00 1 / 7
Issued Date.
Jul,5,2013
Messrs: Digi-Key
Note: In case of specification change, KYOCERA Part Number also will be changed.
Product Name Tuning Fork Crystal
Product Model ST3215SB
Frequency 32.768 kHz
Customer Part Number -
Customer Specification Number -
KYOCERA Part Number ST3215SB32768C0HPWBB
Remarks Pb-Free, RoHS Compliant, MSL 1
Customer Acceptance
Accept Signature Approved Date
Department
Person in charge
Seller
KYOCERA Corporation
6 Takeda Tobadono-cho, Fushimi-ku, Kyoto
612-8501 Japan
TEL. No. 075-604-3500
FAX. No. 075-604-3501
Manufacturer
KYOCERA Crystal Device Corporation
(Crystal Units Division)
5850, Higashine-koh, Higashine-shi, Yamagata
999-3701 Japan
TEL. No. 0237-43-5611
FAX. No. 0237-43-5615
Design Department
Quality Assurance
Approved by Checked by Issued by
KYOCERA Crystal Device Corporation
Crystal Unit Application Engineering Section
Crystal Units Division
F.Mukae T.Soda A.Muraoka Y.Nozaki
Drawing No.
USY1N-H1-13168-00 2 / 7
KYOCERA Crystal Device Corporation KBS-5079D
Revision History
Description of revise
Date Approved by Checked by Issued by
0 First Edition Jul,5,2013 T.Soda A.Muraoka Y.Nozaki
ST321SSB32768COHPWBB
Drawing No.
USY1N-H1-13168-00 3 / 7
KYOCERA Crystal Device Corporation KBS-5079D
1. APPLICATION
This specification sheet is applied to tuning fork crystal ST3215SB”.
2. PART NUMBER
ST3215SB32768C0HPWBB
3. RATINGS
Items SYMB. Rating Unit
Operating Temperature Topr -40~+85 deg. C
Storage Temperature range Tstg -55~+125 deg. C
4. CHARACTERISTICS
4-1 ELECTRICAL CHARACTERISTICS
Item Symbol Electrical Specification
Condition Min Typ. Max Unit
Nominal Frequency fo Ta = 25 deg. C 32.768 kHz
Frequency Tolerance df/fo Ta = 25 deg.C -20 20 ppm
Load Capacitance CL 7.0 pF
Equivalent series resistance R1 70 k
Q-Value Q 13000
Motional capacitance C1 3.0 4.4 fF
Shunt capacitance Co 0.6 1.2 pF
Turning point Tp 20 30 deg. C
Secondary temperature
Coefficient K -4.0 10-8/degC2
Aging df/F Ta = 25 deg. C -3 3 ppm/year
Drive level DL 0.1 0.5 µW
Insulation resistance
(between electrodes) IR 500 M
4-2 MOISTURE SENSITIVITY LEVEL
Level 1
UNIT:mm \\\\\ \\\\\ \ Rik UNIT:mm
Drawing No.
USY1N-H1-13168-00 4 / 7
KYOCERA Crystal Device Corporation KBS-5079D
5. APPEARANCES, PHYSICAL DIMENSION
OUTLINE DIMENSION CONNECTION (TOP VIEW)
MARKING
*The font of marking above is for reference purpose.
6. RECOMMENDED LAND PATTERN
1
Identification
K
2
Date Code(3 Digits)
Last 1 digit of year and week Code.
3
Load Capacitance
(Example) 7pF C
4 Management Code Alphabet or Number 1digit.
UNIT : mm
1.0
1.6
1.0
3.6
1.55
(1)
(2)
(3)
(4)
K925CA
1.5± 0.1
4-(0.25)
3.2±0.10
0.8± 0.1
6-(0.1)
1.70
UNIT : mm
C0.25
4-(R0.15)
mumm min sealed Empty mm W me tape Top manage any Omomfiomoi WIDE -D D
Drawing No.
USY1N-H1-13168-00 5 / 7
KYOCERA Crystal Device Corporation KBS-5079D
7. TAPING
7.1 TAPING
Maximum quantity per 1 reel is Max 3,000pcs(φ180 Reel) and oriented part in 1 direction
1.Material of the carrier tape shall be polystyrene or A-PET (ESD).
2. Material of the seal tape shall be polyester (ESD).
3. The seal tape shall not cover the sprocket holes and not protrude from the carrier tape.
4. The R of the corner without designation is 0.2R MAX.
5. Misalignment between centers of the cavity and a sprocket hole shall be 0.05mm or less.
6. Cumulative pitch tolerance of “G” shall be ±0.2mm at 10 pitches.
7. The directivity of printing in an embossing tape shall be unified as shown in the
above-mentioned figure.
8. Peeling force of the seal tape is in the range of 0.1 to 0.7N.
Tape strength
Cover tape
165 to 180˚
Feeding direction Enboss tape
Bending radius (50mm)
Tape strength
END
START
Leader
Empty compartment
100mm min. sealed with
top cover tape
SMD parts taped area
Empty compartment
350mm min.
160mm min.
Ending
Leader and ending tape
Top cover tape only
Feeding direction
K925CA
Direction (View from cover tape)
K925CA
K925CA
K925CA
Drawing No.
USY1N-H1-13168-00 6 / 7
KYOCERA Crystal Device Corporation KBS-5079D
7-2 Emboss Taping specifications
symbol A B D E F G
Dimension 1.8±0.1 3.6±0.1 12.0±0.3 5.5±0.1 1.75±0.1 4.0±0.1
Symbol H J K L W T
Dimension 4.0±0.1 2.0±0.1 1.5+0.1/-0 1.0+0.1/-0 1.0±0.1 0.3±0.05
(Unit: mm)
7-3 Reel specifications
Symbol A B C
Dimension φ180 +0/-1.5 φ60 +1.0/-0 φ13±0.2
Symbol D E W
Dimension φ21±0.8 2.0±0.5 13.0 +1.0/-0
(Unit: mm)
E
H
J
G
L K
B F
D
W
T
A
A
C
D
E
B
W
Nut 5‘ aha Fm reference only , 7 _ lamp (-0) Peak 155- 250 C Av auemmpevamre gradientm preheatmg 2 E'CGEL 25D Max 20D rS'Cfs 150 217'0 aver BEI sen Max 230'0 Ewen SCI sen Max ZSU'C mien 5U 1U 39L Mm 100 4—btlme (sec) PEflDW PmfilE-3
Drawing No.
USY1N-H1-13168-00 7 / 7
KYOCERA Crystal Device Corporation KBS-5079D
8. RELIABILITY
Frequency Stability and ESR, Stability after stressing.
TEST ITEM Frequency Stability
(ppm)
ESR Stability
(%)
Remarks
8.1 Low temp. use/storage ± 5
± 30 Ta=25 deg. C
8.2 High temp. use/storage ± 5
8.3 Shock ± 20
8.4 Vibration ± 5
8.5 Soldering iron resistance ± 5
8.6 Manual hot gas resistance ± 10
8.7 High temp. With humidity ± 5
8.8 Temperature cycle ± 5
9. REFLOW PROFILE
Pb-free reflow requirements for soldering heat resistance

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