MT1403-RG-A Specification Datasheet by Marktech Optoelectronics

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OMarktech O/JLUL/UUU UIHUS EROHS E M
SPECIFICATION
PART NO. : MT5*A
.0mm ROUND LED LAMP
OBSERVE PRECAUTION
FOR HANDLING
ELECTRO STATIC
SENSITIVE
DEVICES
ATTENTION
3Northway Lane North Latham,New York 12110.
Tollfree:1.800.984.5337
Phone:1.518.956.2980
Fax:1.518.785.4725
Http://www.marktechopto.com
@Marktech CLL/1,L'L'LIL
0T5*$ 3.0mm ROUND
LED LAMP
VER.: 01 Date: 2007/01/18 Page: 1/
Description
This red lamp is made with GaP/GaP chip and red clear epoxy resin.
AK
3.0
2.54 0.1
5.1
0.5 MAX.
1.0
24.0 MIN.
1.5 TYP. 4.1
Notes:
1. All dimensions are in mm.
2. Tolerance is± 0.25mm unless otherwise noted.
Description
LED Chip
Part No.
Material Emitting Color
Lens color
0T5*$ GaP/GaP Red Red clear
@Marktfih
VER.: 01 Date: 2007/01/18 Page: 2/
Absolute Maximum Ratings at Ta=25
Parameter Symbol Rating Unit
Power Dissipation PD 90 mW
Reverse Voltage VR 5 V
D.C. Forward Current If 30 mA
Reverse (Leakage) Current Ir 100
μA
Peak Current(1/10Duty Cycle,0.1ms Pulse Width.) If(Peak) 100 mA
Operating Temperature Range Topr. -25 to +85
Storage Temperature Range Tstg. -40 to +100
Soldering Temperature(1.6mm from body) Tsol. Dip Soldering : 260 for 5 sec.
Hand Soldering : 350 for 3 sec.
Electrical and Optical Characteristics:
Parameter Symbol Condition Min. Typ. Max. Unit
Luminous Intensity IV If=20mA 2.0 5.0 mcd
Forward Voltage Vf If=20mA 2.1 3.0 V
Peak Wavelength λp If=20mA 700 nm
Dominant Wavelength λd If=20mA 650 nm
Reverse (Leakage) Current Ir Vr=5V 100 µA
Viewing Angle 2θ1/2 If=20mA 35 deg
Spectrum Line Halfwidth λ If=20mA 100 nm
Notes:1. The datas tested by IS tester.
2. Customers special requirements are also welcome.
0T5*$ 3.0mm ROUND
LED LAMP
@Marktech Dpiqu ‘ [ILL IO 0 20.0 30 (l FORWARD CURRENT VS. LuMnous 1N thSl'l‘Y 20 40 60 80 [U ‘ FORWARD CL RRENT V s. AMBIENT 'EMPERATURE
VER.: 01 Date: 2007/01/18 Page: 3
Typical Electrical / Optical Characteristics Curves :
Applied Voltage (V)
FORWARD CURRENT VS.APPLIED VOLTAGE
Forward Current IF(mA)
10
20
40
30
50
1.21.62.02.42.83.2
20.0
Forward Current (mA)
FORWARD CURRENT VS. LUMINOUS INTENSITY
Relative Luminous Intensity
10.0
0
1
2
4
3
5
30.0
0.0
Temperature(C)
0 204060 10080
Forward Current IF(mA)
10
20
40
30
50
FORWARD CURRENT VS. AMBIENT TEMPERATURE RADIATION DIAGRAM
0.1 0.4 0.6
0.3
0.5 0.2
90°
70°
80°
60°
50°
40°
10° 20°
30°
0.7
0.8
1.0
0.9
0T5*$ 3.0mm ROUND
LED LAMP
@Marktech Opiqu"; L'U ‘K / m;
VER.: 01 Date: 2007/01/18 Page: 4/
Precautions:
TAKE NOTE OF THE FOLLOWING IN USE OF LED
1. Temperature in use
Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with
high light transparency is used; therefore, additives to improve the heat resistance or moisture
resistance (silica gel , etc) which are used for semiconductor products such as transistors
cannot be added to the resin.
Consequently, the heat resistant ability of the resin used for LED is usually low; therefore,
please be careful on the following during use.
Avoid applying external force, stress, and excessive vibration to the resins and terminals at
high temperature. The glass transition temperature of epoxy resin used for the LED is
approximately 120-130.
At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or
more compared to that at normal temperature and the resin is softened.
If external force or stress is applied at that time, it may cause a wire rupture.
2. Soldering
Please be careful on the following at soldering.
After soldering, avoided applying external force, stress, and excessive vibration until the
products go to cooling process (normal temperature), <Same for products with terminal leads>
(1) Soldering measurements:
Distance between melted solder side to bottom of resin shall be 1.6mm or longer.
(2) Dip soldering :
Pre-heat: 90 max. (Backside of PCB), Within 60 seconds.
Solder bath: 260±5 (Solder temperature), Within 5 seconds.
(3) Hand soldering: 350 max. (Temperature of soldering iron tip), Within 3 seconds.
3. Insertion
Pitch of the LED leads and pitch of mounting holes need to be same
4. Others
Since the heat resistant ability of the LED resin is low, SMD components are used on the same
PCB, please mount the LED after adhesive baking process for SMD components. In case
adhesive baking is done after LED lamp insertion due to a production process reason, make
sure not to apply external force, stress, and excessive vibration to the LED and follow the
conditions below.
Baking temperature: 120 max. Baking time: Within 60 seconds
If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down
the LED to normal temperature.
0T5*$ 3.0mm ROUND
LED LAMP

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