BGM1034N7 Datasheet by Infineon Technologies

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@169
RF & Protection Devices
Data Sheet
Revision 3.0, 2011-07-18
BGM1034N7
GPS and GLONASS Front-End Module
Edition 2011-07-18
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2011 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
@neon,
BGM1034N7
GPS and GLONASS Front-End Module
Data Sheet 3 Revision 3.0, 2011-07-18
Trademarks of Infineon Technologies AG
AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, EconoPACK™, CoolMOS™, CoolSET™,
CORECONTROL™, CROSSAVE™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPIM™,
EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™, ISOFACE™, IsoPACK™, MIPAQ™,
ModSTACK™, my-d™, NovalithIC™, OptiMOS™, ORIGA™, PRIMARION™, PrimePACK™, PrimeSTACK™,
PRO-SIL™, PROFET™, RASIC™, ReverSave™, SatRIC™, SIEGET™, SINDRION™, SIPMOS™,
SmartLEWIS™, SOLID FLASH™, TEMPFET™, thinQ!™, TRENCHSTOP™, TriCore™.
Other Trademarks
Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™,
PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR
development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™,
FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG.
FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of
Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data
Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of
MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics
Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™
of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc.,
OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc.
RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc.
SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden
Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA.
UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™
of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of
Diodes Zetex Limited.
Last Trademarks Update 2011-02-24
BGM1034N7 GPS and GLONASS Front-End Module
Revision History: 2011-07-18, Revision 3.0
Previous Revision: 2011-05-10, Preliminary V2.0
Page Subjects (major changes since last revision)
5Package drawing updated
5Marking defined
7Maximum voltage at Pin AI to GND changed
8Maximum value of ESD contact discharge capability of RF Input pin changed
8ESD capability HBM for pins 3 and 4 added
9Updated value for Out-of-band 3rd Order Intercept Point
11 Parts list changed (description for inductor L1)
12 Pin description for pin 7 changed
13 Cross-section view updated
16 Updated carrier tape drawing
0/. Inflneon
BGM1034N7
GPS and GLONASS Front-End Module
Table of Contents
Data Sheet 4 Revision 3.0, 2011-07-18
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2 ESD Integrity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3 RF Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3 Application Circuit and Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1 Application Circuit Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.2 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.3 Application Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.1 Package Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.2 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.3 Product Marking Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
5 Packing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table of Contents
(ifileon
Product Name Package Marking
BGM1034N7 TSNP-7-10 M34
GPS and GLONASS Front-End Module
BGM1034N7
Data Sheet 5 Revision 3.0, 2011-07-18
1Features
Main features:
Operating frequencies: 1575.42 MHz and 1598.06-1605.38 MHz
High Gain: 17.0 dB
Low Noise Figure (GPS): 1.7 dB
Low current consumption: 3.9 mA
Out-of-band rejection in cellular bands: > 43 dBc
Input compression point in cellular bands: 22 dBm
Supply voltage: 1.5 V to 3.6 V
Tiny TSNP-7-10 leadless package (2.3 x 1.7 x 0.73 mm3)
RF output internally matched to 50 Ω
IEC ESD contact discharge of RF input pin: 6 kV
Only 3 external SMD parts
RoHS compliant package (Pb-free)
Description
The BGM1034N7 is a combination of a low-insertion-loss pre-filter with Infineon’s high performance low noise
amplifier (LNA) for Global Positioning System (GPS) and Globalnaya Navigatsionnaya Sputnikovaya Sistema
(GLONASS) applications. Both, GPS and GLONASS frequency bands, can be used at the same time. Through
the low insertion loss of the filter, the BGM1034N7 provides 17.0 dB gain, 1.7 dB noise figure and high linearity
performance. In addition BGM1034N7 provides very high out-of-band attenuation in conjunction with a high input
compression point. It can withstand IEC ESD contact discharge at the RF input as high as 6 kV. Its current
consumption is as low as 3.9 mA. It operates over the 1.5 V to 3.6 V supply voltage range.
0/. @Ineon 05 888 '7
BGM1034N7
GPS and GLONASS Front-End Module
Features
Data Sheet 6 Revision 3.0, 2011-07-18
Figure 1 Block Diagram with Main External Components
BGM1034_Blockdiagram_with_externals.vsd
BIAS
RFIN
PON
RFOUT
VCC
AISO
GND
BGM1034N7
Pre-Filter
LNA
@neon,
BGM1034N7
GPS and GLONASS Front-End Module
Electrical Characteristics
Data Sheet 7 Revision 3.0, 2011-07-18
2 Electrical Characteristics
2.1 Absolute Maximum Ratings
Attention: Stresses above the max. values listed here may cause permanent damage to the device.
Exposure to absolute maximum rating conditions for extended periods may affect device
reliability. Maximum ratings are absolute ratings; exceeding only one of these values may
cause irreversible damage to the integrated circuit.
Table 1 Absolute Maximum Ratings
Parameter Symbol Values Unit Note / Test Condition
Min. Typ. Max.
Voltage at pin PON to GND VPON -0.3 3.6 V –
Voltage at pin VCC to GND VCC -0.3 3.6 V –
Voltage at pin RFIN to GND VRFIN -3 – 3 V
Voltage at pin SO to GND VBO -3 – 3 V
Voltage at pin AI to GND VAI -0.3 0.75 V –
Voltage at pin RFOUT to GND VRFOUT -0.3 VCC+0.3 V –
Current into pin VCC IVCC ––25 mA
RF input power inband PIN ––0dBm Continuous wave signal
f = 1575.42 MHz
50 Ω source and load
impedances
RF input power out of band PIN,OBB ––25 dBm Continuous wave signal
f = 50 - 1460 MHz and
1710 - 4000 MHz
50 Ω source and load
impedances
Total power dissipation Ptot ––90 mW
Junction temperature Tj––150 °C
Ambient temperature range TA-40 85 °C
Storage temperature range Tstg -65 150 °C
@neon,
BGM1034N7
GPS and GLONASS Front-End Module
Electrical Characteristics
Data Sheet 8 Revision 3.0, 2011-07-18
2.2 ESD Integrity
Table 2 ESD Integrity
Parameter Symbol Values Unit Note / Test Condition
Min. Typ. Max.
ESD capability HBM of pins
1, 2, 5 and 6
VESD1 ––2kV According to JESD22-A114
ESD capability HBM of pins 3
and 4
VESD2 ––300 VAccording to JESD22-A114
ESD contact discharge
capability of RF input pin 3
VESD3 ––6kV According to IEC61000-4-2
ESD capability MM of RF input
pin 3 and pre-filter output pin 4
VESD4 ––50 VAccording to JESD22-A115
@neon,
BGM1034N7
GPS and GLONASS Front-End Module
Electrical Characteristics
Data Sheet 9 Revision 3.0, 2011-07-18
2.3 RF Characteristics
Table 3 Typical Characteristics: TA = 25 °C, VCC = 1.8 V, VPON,ON = 1.8 V, VPON,OFF = 0 V1)
Parameter Symbol Values Unit Note / Test Condition
Min. Typ. Max.
Supply Voltage VCC 1.5 1.8 3.6 V –
Supply Current ICC 3.9 mA ON-Mode
0.2 3μAOFF-Mode
Power On Control Voltage VPON 1.0 Vcc VON-Mode
0 – 0.4 VOFF-Mode
Power On Control Current IPON –5–μAON-Mode
––1μAOFF-Mode
Power Gain Settling Time2) tS–5–μsOFF- to ON-Mode
–5–μsON- to OFF-mode
Passband Parameters @
f = 1575.42, 1598.06-
1605.38 MHz
– – – –
Insertion Power Gain |S21|217.0 dB
Noise Figure GPS3) NF 1.7 2.2 dB ZS = 50 Ω
f = 1575.42 MHz
Noise Figure GLONASS3) NF 2.0 2.5 dB ZS = 50 Ω
f = 1598.06-1605.38 MHz
Group Delay Ripple
Τ
G–8–ns f = 1575 MHz,
1598 - 1605 MHz
Input Return Loss RLIN 12 dB
Output Return Loss RLOUT 12 dB
Reverse Isolation 1/|S12|240 dB
Inband Input 3rd Order
Intercept Point
IIP3-10 dBm f1 = 1575.42 MHz
f2 = f1 + 1 MHz
Inband Input 1 dB
Compression Point
IP1dB -15 dBm f1 = 1575.42 MHz
Out-of-band 3rd Order
Intercept Point4) IIP3OOB 55 dBm f1 = 1712.7 MHz
f2 = 1850 MHz
Out-of-band Input 1 dB
Compression Point5) IP1dB_900M 22 dBm f1 = 900 MHz
Out-of-band Input 1 dB
Compression Point5) IP1dB_1710M 26 dBm f1 = 1710 MHz
Stopband Parameters – – – –
Rejection6) Rej900M 55 dBc f = 806 MHz - 928 MHz
Rejection6) Rej1800M 43 dBc f = 1710 MHz - 1980 MHz
Rejection6) Rej2400M 56 dBc f = 2400 MHz - 2500 MHz
Stability k>1 f = 20 MHz - 20 GHz
0/. Inflneon
BGM1034N7
GPS and GLONASS Front-End Module
Electrical Characteristics
Data Sheet 10 Revision 3.0, 2011-07-18
1) Measured on application board including PCB losses (unless noted otherwise)
2) To be within 1 dB of the final gain OFF- to ON-mode; to be within 3 dB of the final gain ON- to OFF-mode
3) PCB and connector losses subtracted, verified on AQL base
4) Input power = +10 dBm for each tone
5) Guaranteed by device design, not measured in production
6) Rejection = |(1/|S21|2 at stopband frequency)| + |(1/|S21|2 at 1575.42 MHz)|
@fineon , BGM1034N7
BGM1034N7
GPS and GLONASS Front-End Module
Application Circuit and Block Diagram
Data Sheet 11 Revision 3.0, 2011-07-18
3Application Circuit and Block Diagram
3.1 Application Circuit Schematic
Figure 2 Application Circuit with Chip Outline (top view)
Table 4 Parts List
Part Number Part Type Manufacturer Size Comment
C1 Chip capacitor Various 0402 Supply filtering
L1 Chip inductor muRata LQW15A 0402 Matching + ESD
protection inductor
L2 Chip inductor muRata LQW15A 0402 Input Matching
N1 BGM1034N7 Infineon TSNP-7-10 GPS FE-Module
BGM1034_Application_circuit_with_externals.vsd
BGM1034N7
(Topview)
RFOUT
SO
L2
8.2nH
AI
7 GND
1
2
3
6
5
4
VCC
C1
1μF
PON
L1
8.2nH
RFIN
@neon,
BGM1034N7
GPS and GLONASS Front-End Module
Application Circuit and Block Diagram
Data Sheet 12 Revision 3.0, 2011-07-18
3.2 Pin Description
Table 5 Pin Definition and Function
Pin No. Name Pin
Type
Buffer
Type
Function
1VCC Power Supply
2PON Power On/Off
3RFIN RF Input
4SO Pre-Filter Output
5AI LNA Input
6RFOUT RF Output
7 GND DC and RF ground
infineon BGMIOSA Appanvd Cvuss Se: Figure 4 Cross-Section view of Application Board Data Sheet 13
BGM1034N7
GPS and GLONASS Front-End Module
Application Circuit and Block Diagram
Data Sheet 13 Revision 3.0, 2011-07-18
3.3 Application Board
Figure 3 Top view of Application Board
Figure 4 Cross-Section view of Application Board
BGM1034_AppBoard_Layout_top.vsd
BGM1034_AppBoard_Cross_Section.vsd
Copper
35µm
Vias Vias
Rogers RO4003C, 0.2mm
FR4, 0.8mm
TSNP77710: Boordpuds & Apertures SMD new . § a: ,SS, SHE, SE. ,, ,SE a 5m a 575 .vias top to first inner \uyer .stencH apertures so‘der musk I copper NSMD EN ,
BGM1034N7
GPS and GLONASS Front-End Module
Package Information
Data Sheet 14 Revision 3.0, 2011-07-18
4 Package Information
4.1 Package Footprint
Figure 5 Recommended PCB Footprint for the TSNP-7-10 Package (subject to be changed)
(Ififi1eorl, ~ ‘71”5 o 73 353:3 , #7 7 7 , + 7 ’D \ I \ g I S E I Z 3 a § ” 777+7777wg 5 V ILHEMSD ‘7 i 6 5 4 E] E] E] TYPE a V3 /— PIN 1 MARKING 7 : I < '="" (lasered)="" \="" _______="" j="" i—="" |—_|="" |—_|="" lj="" lj="" lj="" 1="" 2="" 3="">
BGM1034N7
GPS and GLONASS Front-End Module
Package Information
Data Sheet 15 Revision 3.0, 2011-07-18
4.2 Package Dimensions
Figure 6 TSNP-7-10 Package Outline (bottom and side views)
4.3 Product Marking Pattern
Figure 7 Marking Pattern (top view)
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BGM1034N7
GPS and GLONASS Front-End Module
Packing Information
Data Sheet 16 Revision 3.0, 2011-07-18
5 Packing Information
Figure 8 TSNP-7-10 Carrier tape
Figure 9 TSNP-7-10 Pin 1 orientation in tape
Published by Infineon Technologies AG
www.infineon.com

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