DB2440200L Datasheet by Panasonic Electronic Components

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Doc No. TT47EA714121 Revision. 2 Panasonic 4H; JEITA SC»110A Code — Parameter Symbol Ratrng Unn Reverse vo‘lage VR 40 V Maxrmum peak reverse vo‘lage VRM 40 V 2 Forward currenl ‘ IF 2,0 A y—\ Nonrrepemive peak forward surge currenl ‘2 IFSM 30 A Junchon Iemperalure ‘ Ti 150 “C Operalmg ambrenllemperalure Topr -40 m +85 °C Slorage Iemperalure Ts‘g -55 m +150 “C 1—1 Established : 2012703702 Revised : 2013704719
Product Standards
Schottky Barrier Diode
DB2440200L
Absolute Maximum Ratings Ta = 25 C
Note: *1 Tl = 80 °C
*2 50 Hz sine wave 1 cycle (Non-repetitive peak current)
Page
V
°C
V
30 A
+85
Non-repetitive peak forward surge current *2 IFSM
2.0
Maximum peak reverse voltage VRM 40
Reverse voltage VR 40
Forward current *1 IF
42
Packaging
Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)
Code
1. Cathode
Panasonic TMiniP2-F2-B
JEITA SC-110A
DB2440200L
Silicon epitaxial planar type
For rectification
Features
2. Anode
Forward current (Average) IF(AV) = 2 A rectification is possible
Low forward voltage VF
Halogen-free / RoHS compliant
(EU RoHS / UL-94 V-0 / MSL:Level 1 compliant)
Marking Symbol:
1of4
Unit: mm
Internal Connection
A
Junction temperature *1 Tj 150 °C
UnitParameter Symbol Rating
Storage temperature Tstg
-40 toToprOperating ambient temperature
°C-55 to +150
1
2
4.7
2.4
0.85
3.8
1.75
0.15
2
1
Doc No.
TT4-EA-14121
Revision.
2
Established
:
2012-03-02
Revised
:
2013-04-19
Doc No. TT47EA714121 Revision. 2 Panasonic Parameter Symbol Condifions Min Typ Max Unn Forward vo‘lage VF \F = 2.0 A 0.47 V Reverse currenl IR VR = 40 V 250 “A Termma‘ capacrlance CI VR =10 V. l= 1 MHz 50 pF Reverse recovery Irme ‘ m F = IR = 100 mA‘ \rr =10 mA 15 n5 1 r 1 r h \ l 0% ram 1 Established : 2012703702 Revised : 2013704719
Product Standards
Schottky Barrier Diode
DB2440200L
Electrical Characteristics Ta = 25 C 3 C
Note
)
1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 Measuring methods for Diodes.
2. This product is sensitive to electric shock (static electricity, etc.). Due attention must be paid on
the charge of a human body and the leakage of current from the operating equipment.
3. *1 trr test circuit
Page
Parameter Symbol Conditions UnitMaxMin Typ
0.47
Reverse recovery time *1 trr IF = IR = 100 mA, Irr = 10 mA
2
ns
of 4
15
V
Reverse current IR VR = 40 V
Forward voltage VF IF = 2.0 A
μA250
pFTerminal capacitance Ct VR = 10 V, f = 1 MHz 50
Bias Application Unit (N-50BU)
90%
Pulse Generator
(PG-10N)
R
s
= 50 Ω
Wave Form Analyzer
(SAS-8130)
R
i
= 50 Ω
t
p
= 2 μs
t
r
= 0.35 ns
δ = 0.05
I
F
= 100 mA
I
R
= 100 mA
10%
I
rr
= 10 mA
t
r
t
p
t
rr
V
R
I
F
t
t
A
Input Pulse Output Pulse
Doc No.
TT4-EA-14121
Revision.
2
Established
:
2012-03-02
Revised
:
2013-04-19
Doc No. TT47EAV 14121 Revision. 2 Panasonic 1.E+01 1.E+00 rln o 5 Forward currenl IF (A) m m m o o o 0; N ‘ Technical Data 1 reference ) 0.0 0.1 0.2 03 0, Forward vollage VF Ct-VR 250 E 3200 — 7 6 8 § 150 ,5 m n g 100 E .E E 50 a) ,_ 0 0 5 10 15 20 25 Reverse vollage VR ( |F(AV)-TI 2.5 1 n E > 2 r $0.8 7 § DC 1 : tiJ ,3 ”2 VR:20V ;» | . g 1.5 T]:|25”C ; 0.6 I e. g I > . . - - - - - - - - a , s z E 1 1 70-4 / E ”4 SmeWave g / E 0.5 E02 1? E 0 0 0 25 50 75 100 125 150 175 Lead temperature TI (’6) Established : 2012703702 Revised :2013704719
Product Standards
Schottky Barrier Diode
DB2440200L
Technical Data ( reference )
Page 3 of 4
IF - VF
1.E-05
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
0.0 0.1 0.2 0.3 0.4 0.5 0.6
Forward voltage VF (V)
Forward current IF (A)
Ta = 125 °C
-40 °C
25 °C
85 °C
IR - VR
1.E-08
1.E-07
1.E-06
1.E-05
1.E-04
1.E-03
1.E-02
1.E-01
0 5 10 15 20 25 30 35 40
Reverse voltage VR (V)
Reverse current IR (A)
85 °C
25 °C
-40 °C
Ta = 125 °C
Ct - VR
0
50
100
150
200
250
0 5 10 15 20 25 30 35 40
Reverse voltage VR (V)
Terminal capacitance Ct (pF)
Ta = 25 °C
f = 1 MHz
Rth - t
1
10
100
1000
0.001 0.01 0.1 1 10 100 1000
Time t (s)
Thermal resistance Rth (°C/W)
(1)
Rth(j-l) = 9 °C/W
(1) Non-heat sink
(2) Mounted on glass epoxy print board.
(3) Mounted on alumina print board.
Board size : 50 mm × 50 mm x 0.8 mm
Solder in : 2 mm x 2 mm
(2)
(3)
IF(AV) - Tl
0
0.5
1
1.5
2
2.5
0 25 50 75 100 125 150 175
Lead temperature Tl (°C)
Forward current (Average) IF(AV) (A)
DC
1/4
tp/T
1/2
Sine Wave
VR = 20 V
Tj = 125 °C
tp
T
IF
PF(AV) - IF(AV)
0
0.2
0.4
0.6
0.8
1
0 0.5 1 1.5 2 2.5
Forward current (Average) IF(AV) (A)
Forward power dissipation (Average) PF(AV) (W)
DC
1/4
1/2
Sine Wave
tp
T
IF
Doc No.
TT4-EA-14121
Revision.
2
Established
:
2012-03-02
Revised
:
2013-04-19
Doc No. TT47EA714121 Revision. 2 Schottky Barrier Diode Panasonic DB2440200L Unit: mm 0. 1510.05 L o to 0.03 V \ w Established : 2012703702 Revised : 2013704719
Product Standards
Schottky Barrier Diode
DB2440200L
Unit: mm
Page
TMiniP2-F2-B
4
4of
Land Pattern (Reference) (Unit: mm)
0.15
±0.05
4.7
±0.1
0.85
±0.05
3.8
±0.1
2.4
±0.1
1.75
±0.10
0 to 0.4
0 to 0.03 0.45
±0.10
(5°)
(5°)
1
2
1.4
2.1
4.4
1.4
Doc No.
TT4-EA-14121
Revision.
2
Established
:
2012-03-02
Revised
:
2013-04-19
Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents. the laws and regulations of the exporting country. espeCially. those With regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore. no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information de-scribed in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment. communications equipment. measuring instruments and household appliances), or for specific applications as expressly stated in this book. Please consult with our sales staff in advance for information on the following applications. moreover please exchange documents separately on terms of use etc,: Special applications (such as for in-vehicle equipment. airplanes. aerospace. automotive equipment. traffic signaling equipment. combustion equipment. medical equipment and safety devices) in which exceptional quality and reliability are required. or if the failure or malfunction of the products may directly jeopardize life or harm the human body. Unless exchanging documents on terms of use etc. in advance. it is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application. (4) The products and product speCifications described in this book are subject to change wtthout notice for modification and/or improvement, At the final stage of your design. purchasing. or use of the products, therefore. ask for the most up- to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially. please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode»switching. Other- wtse. we Will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design. arresting the spread of tire or preventing glitch are recommended in order to prevent physical injury. fire. somal damages. for example. by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD. EOS. thermal stress and mechanical stress) at the time of handling. mounting or at customer's process. We do not guarantee quality for disassembled products or the product re-mounted after removing from the mounting board. When using products for which damp-proof packing is required. satisfy the conditions. such as shelf life and the elapsed time since first opening the packages. (7) When reselling products described in this book to other companies without our permission and receiving any claim of request from the resale destination. please understand that customers will bear the burden. (B) This book may be not reprinted or reproduced whether wholly or partially. without the prior written permission of our company.
Request for your special attention and precautions
in using the technical information and semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the
laws and regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit
examples of the products. No license is granted in and to any intellectual property right or other right owned by
Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the
infringement upon any such right owned by any other company which may arise as a result of the use of technical
information de-scribed in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment,
communications equipment, measuring instruments and household appliances), or for specific applications as expressly
stated in this book.
Please consult with our sales staff in advance for information on the following applications, moreover please exchange
documents separately on terms of use etc.: Special applications (such as for in-vehicle equipment, airplanes, aerospace,
automotive equipment, traffic signaling equipment, combustion equipment, medical equipment and safety devices) in
which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly
jeopardize life or harm the human body.
Unless exchanging documents on terms of use etc. in advance, it is to be understood that our company shall not be held
responsible for any damage incurred as a result of or in connection with your using the products described in this book
for any special application.
(4) The products and product specifications described in this book are subject to change without notice for modification
and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-
to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating
conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed
the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Other-
wise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down
and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design,
arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages,
for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors
(ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. We do
not guarantee quality for disassembled products or the product re-mounted after removing from the mounting board.
When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed
time since first opening the packages.
(7) When reselling products described in this book to other companies without our permission and receiving any claim of
request from the resale destination, please understand that customers will bear the burden.
(8) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our
company.
No.010618

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