BDxxGA5WEFJ Datasheet by Rohm Semiconductor

View All Related Products | Download PDF Datasheet
ssmKuNuucTnR r ROHm L ‘ fl ’Frlglg 1525s WMMWW nrcmcmrm l Built-in Tnermar Shut Down circmt (TSD) I Zero “A shutdown mode .Key Specification I Input Power Suppry Voltage range: 4.5V to 14.0V l Output Voltage range(Variable type): 1.5Vto 13.0V l Output vortage(Frxed type): 1.5V/1.aV/2.5V/3.0V/3.3V 5.0V/6.0V/7.0V/8.0V/9.0V/1[JV/12V I Output current: 0.5A(Max.) I Shutdown current: OuA(Typ.) l Operatrng temperature range: -25°C to +85%: .Typical Application Circuit J. _T_ l R‘ l l E R2 rli— rli— OPrcduci structure Silicon manolithic rntegraied circuit OThis product is not designed www.mhnmom ©2013 ROHM (2a., Ltd. Au lights reserved. 1/19 T522211! '14'001 rli— rli’
Product structureSilicon monolithic integrated circuit This product is not designed protection against radioactive rays.
1/19 TSZ02201-0R6R0A600190-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211114001 7.Feb.2013 Rev.002
Datashee
t
500mA Variable / Fixed Output
LDO Regulators
BDxxGA5WEFJ
General Description
BDxxGA5WEFJ series devices are LDO regulators with an output current of 0.5A. The output accuracy is ±1% of the output
voltage. Both fixed and variable output voltage devices are available. The output voltage of the variable output voltage
device can be varied from 1.5 to 13.0V using external resistors. Various fixed output voltage devices that do not use
external resistors are also available. It can be used for a wide range of digital appliance applications. It has a small package
type: HTSOP-J8 (4.90mm x 6.00mm x 1.00mm). These devices have built in over current protection to protect the device
when output is shorted, 0µA shutdown mode and thermal shutdown circuit to protect the device during over load conditions.
These LDO regulators are usable with ceramic capacitors that enable a smaller layout and longer life.
Features
+/-1% output voltage accuracy
Built-in Over Current Protection circuit (OCP)
Built-in Thermal Shut Down circuit (TSD)
Zero µA shutdown mode
Key Specification
Input Power Supply Voltage range: 4.5V to 14.0V
Output voltage range(Variable type): 1.5V to 13.0V
Output voltage(Fixed type): 1.5V/1.8V/2.5V/3.0V/3.3V
5.0V/6.0V/7.0V/8.0V/9.0V/10V/12V
Output current: 0.5A(Max.)
Shutdown current: 0μA(Typ.)
Operating temperature range: -25 to +85
Package (Typ.) (Typ.) (Max.)
HTSOP-J8 4.90mm x 6.00mm x 1.00mm
Typical Application Circuit
HTSOP-J8
VO VCC
EN
GND FIN
VO_S COUT
CIN
CIN,COUT : Ceramic Capacitor
R1
VO VCC
EN
GND FIN R2
FB
COUT
CIN
CIN,COUT : Ceramic Capacitor
Variable output voltage type Fixed output voltage type
2/19
BDxxGA5WEFJ Datasheet
TSZ02201-0R6R0A600190-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001 7.Feb.2013 Rev.002
Ordering Information
B D x x G A 5 W E F J - E 2
Part
Number
Output
voltage
00:Variable
15:1.5V
18:1.8V
25:2.5V
30:3.0V
33:3.3V
50:5.0V
60:6.0V
70:7.0V
80:8.0V
90:9.0V
J0:10.0V
J2:12.0V
Input
voltage
range
G:15V
Output
Current
A5:0.5A
Shutdown
mode
“W”:included
Package
EFJ:HTSOP-J8
Packaging and forming specification
E2:Emboss tape reel
GND Coop n+ ”H7 FB EN TSD .Fin Configuration TOP VIEW V" FE! GND N C HTSUP’JE .Fin Description Pin No. Pin name 1 V0 Output pin 2 FB Feedback p 3 GND GND pin 4 N.C. No Connect 5 EN Enable pin 6 N.C. No Connect 7 N.C. No Connect 8 Vcc Input pin Reverse FIN Substrate(C www rohm.com © 2013 ROHM Co.‘ Ltd. Ail lights reserved. TSZzzm-IS-nm
3/19
BDxxGA5WEFJ Datasheet
TSZ02201-0R6R0A600190-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001 7.Feb.2013 Rev.002
Block Diagram
BD00GA5WEFJ(Variable output voltage type)
Pin Configuration
Pin Description
Pin No. Pin name Pin Function
1 VO Output pin
2 FB Feedback pin
3 GND GND pin
4 N.C. No Connect (Connect to GND or leave OPEN)
5 EN Enable pin
6 N.C. No Connect (Connect to GND or leave OPEN)
7 N.C. No Connect (Connect to GND or leave OPEN)
8 VCC Input pin
Reverse FIN Substrate(Connect to GND)
Fig.1 Block Diagram
TOP VIEW
VO
FB
GND
N.C.
N.C.
N.C.
EN
VCC
VO
VCC
SOFT
START
C in Configuration TOP VIEW V0 VCC V075 N.C. GND N.C. N.C. EN HTSOP’JB .Fin Description Pin No. Pm name Pm Function 1 V0 Oulpul pm 2 V075 Oulpul vollage momtur pin 3 GND GND pm 4 N C No Connecl (Connecl to GND or leave OPE 5 EN Enable pm 6 N C No Connecl (Connecl to GND or leave OPE 7 N C No Connecl (Connecl to GND or leave OPE 8 Vet: lnpul pm Reverse FIN Subslrale(Connecl lo GND) www mhm.com © 2013 ROHM Co.‘ Ltd. All ngms reserved. 4/19 T822211! '15'001
4/19
BDxxGA5WEFJ Datasheet
TSZ02201-0R6R0A600190-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001 7.Feb.2013 Rev.002
Block Diagram
BDxxGA5WEFJ(Fixed output voltage type)
Pin Configuration
Pin Description
Pin No. Pin name Pin Function
1 VO Output pin
2 VO_S Output voltage monitor pin
3 GND GND pin
4 N.C. No Connect (Connect to GND or leave OPEN)
5 EN Enable pin
6 N.C. No Connect (Connect to GND or leave OPEN)
7 N.C. No Connect (Connect to GND or leave OPEN)
8 VCC Input pin
Reverse FIN Substrate(Connect to GND)
TOP VIEW
VO
VO_S
GND
N.C.
N.C.
N.C.
EN
VCC
GND
EN
TSD
OCP
SOFT
START VO
VCC
VO_S
Fig.2 Block Diagram
5/19
BDxxGA5WEFJ Datasheet
TSZ02201-0R6R0A600190-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001 7.Feb.2013 Rev.002
Absolute Maximum Ratings (Ta=25)
Parameter Symbol Ratings Unit
Power supply voltage VCC 15.0 *1 V
EN voltage VEN 15.0 V
Power dissipation HTSOP-J8 Pd*2 2110
*2 mW
Operating Temperature Range Topr -25 to +85
Storage Temperature Range Tstg -55 to +150
Junction Temperature Tjmax +150
*1 Not to exceed Pd
*2 Reduced by 16.9mW/ for each increase in Ta of 1 over 25. (when mounted on a board 70mm×70mm×1.6mm glass-epoxy board, two layer)
Recommended Operating Ratings (Ta=25)
Ratings
Parameter Symbol
Min. Max.
Unit
Input power supply voltage VCC 4.5 14.0 V
EN voltage VEN 0.0 14.0 V
Output voltage setting range VO 1.5 13.0 V
Output current IO 0.0 0.5 A
Electrical Characteristics (Unless otherwise noted, Ta=25, EN=3V, VCC=6V, R1=43kΩ, R2=8.2kΩ)
Limits
Parameter Symbol
Min. Typ. Max.
Unit Conditions
Circuit current at shutdown mode ISD - 0 5 µA VEN=0V, OFF mode
Bias current ICC - 600 900 µA
Line regulation Reg.I -1 - 1 % VCC=( VO+0.9V )14.0V
Load regulation Reg IO -1.5 - 1.5 % IO=00.5A
Minimum dropout voltage1 VCO1 - 0.24 0.36 V VCC=5V, IO=200mA
Minimum dropout voltage2 VCO2 - 0.36 0.54 V VCC=5V, IO=300mA
Minimum dropout voltage3 VCO3 - 0.48 0.72 V VCC=5V, IO=400mA
Minimum dropout voltage4 VCO4 - 0.60 0.90 V VCC=5V, IO=500mA
Output reference voltage(Variable type) VFB 0.792 0.800 0.808 V IO=0A
Output voltage(Fixed type) VO V
O×0.99 VO V
O×1.01 V IO=0A
EN Low voltage VEN (Low) 0 - 0.8 V
EN High voltage VEN (High) 2.4 - 14.0 V
EN Bias current IEN 1 3 9 µA
SDmVldIv j/NM 50mVIdIv U 5Ndlv / U SNdiV ' museum» Zflflueecldlv * ZV/dlv ’ ZWdlv 1 ——-— SVM'V ) M 5VImv [ “ > v” ! 5VIdIv \ v 5VIdw (I , 1""59'5‘div 4UmSECMIV 6/19
6/19
BDxxGA5WEFJ Datasheet
TSZ02201-0R6R0A600190-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001 7.Feb.2013 Rev.002
Typical Performance Curves
(Unless otherwise noted, Ta=25, EN=3V, VCC=6V, R1=43kΩ, R2=8.2kΩ)
Fig.4
Transient Response
(0.50A)
Co=1µF
Fig.5
Input sequence 1
Co=1µF
Fig.6
OFF sequence 1
Co=1µF
Fig.3
Transient Response
(00.5A)
Co=1µF
VEN
VEN
VO VO
IO IO
VCC
VCC
VO
VO
zwuw "_“““' zwmv ’ m 5V1d|v , fivfdw , SWdIv ‘Vl awuw \K‘
7/19
BDxxGA5WEFJ Datasheet
TSZ02201-0R6R0A600190-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001 7.Feb.2013 Rev.002
Fig.9
Ta-VO (IO=0mA)
Fig.7
Input sequence 2
Co=1µF
Fig.8
OFF sequence 2
Co=1µF
VEN VEN
Fig.10
Ta-Icc
VCC
VCC
VO VO
ICC[µA]
Ta[] Ta[]
VO[V]
WU DE 15 J11 DZ DU 52 51 SU 49 as 75 35 D1 D2 03 D4 05 ED EEI 1D 2D EIEI 50 AD 3D 2.0 1D DD _a- 53 75 35 10 12 M
8/19
BDxxGA5WEFJ Datasheet
TSZ02201-0R6R0A600190-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001 7.Feb.2013 Rev.002
Fig.13
IO-VO
Fig.14
VCC-ISD
(VEN=0V)
Fig.12
Ta-IEN
IEN[µA]
Fig.11
Ta-ISD
(VEN=0V)
ISD [µA]
VCC [V]
ISD[µA]
Ta[] Ta[]
VO[V]
I
O[A]
WED ! 140 123 ED AU 20 1CD DU 12 14 1D DB D2 12 US 06 [)3 VS 35 5] 726
9/19
BDxxGA5WEFJ Datasheet
TSZ02201-0R6R0A600190-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001 7.Feb.2013 Rev.002
Fig.17
OCP Fig.18
Minimum dropout Voltage1
VCC=5VIO=-0.5A
Fig.15
VCC-VO (IO=0mA) Fig.16
TSD (IO=0mA)
Vo[V]
IO[A]
VO[V]
VO[V]
VO[V]
VCC[V]
Ta[]
Ta[]
ESR [Q] 1UVUD 1m: Safely Ay/ EMU l1lJ1 lDfl 8|] \ 3 PSRRldB] :2 2D D .l 1 ID 100 FrequencleH z]
10/19
BDxxGA5WEFJ Datasheet
TSZ02201-0R6R0A600190-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001 7.Feb.2013 Rev.002
Fig.22
Minimum dropout Voltage 2
VCC=4.5VTa=25℃)
Fig.21
PSRR (IO=0mA)
Fig.19
ESR condencer
Fig.20
IO-ICC
400
500
600
700
800
900
ICC [µA]
IO [A]
0 0.1 0.2 0.3 0.4 0.5
Vdrop[V]
IO[A]
P
S
RR
[d
B
]
I
O[A]
05 05 04 03 02 01 DB 05 DA 03 02 0.1 06 05 0.4 03 02 01 US 05 04 03 02 01
11/19
BDxxGA5WEFJ Datasheet
TSZ02201-0R6R0A600190-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001 7.Feb.2013 Rev.002
Fig.25
Minimum dropout Voltage 5
VCC=10VTa=25℃)
Fig.26
Minimum dropout Voltage 6
VCC=12VTa=25℃)
Fig.23
Minimum dropout Voltage 3
VCC=6VTa=25℃)
Fig.24
Minimum dropout Voltage 4
VCC=8VTa=25℃)
Vdrop[V] Vdrop[V]
Vdrop[V]
Vdrop[V]
I
O[A]
I
O[A]
I
O[A]
I
O[A]
0.50 Therm tempe Mo de Ihe rm mc BD www mhm.c © 2013 ROH T822211! -I
12/19
BDxxGA5WEFJ Datasheet
TSZ02201-0R6R0A600190-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001 7.Feb.2013 Rev.002
Power Dissipation
HTSOP-J8
Thermal design should ensure operation within the following conditions. Note that the temperatures listed are the allowed
temperature limits and thermal design should allow sufficient margin beyond these limits.
1. Ambient temperature Ta can be no higher than 85.
2. Chip junction temperature (Tj) can be no higher than 150.
Chip junction temperature can be determined as follows:
Most of the heat loss that occurs in the BDxxGA5WEFJ series is generated from the output Pch FET. Power loss is
determined by the total VCC-VO voltage and output current. Be sure to confirm the system input and output voltage and
the output current conditions in relation to the heat dissipation characteristics of the VCC and VO in the design. Bearing in
mind that heat dissipation may vary substantially depending on the substrate employed (due to the power package
incorporated in the
BDxxGA5WEFJ make certain to factor conditions such as substrate size into the thermal design.
Power consumption [W] = Input voltage (VCC) - Output voltage (VO) ×IO (Ave)
Example) Where VCC=5.0V, VO=3.3V, IO(Ave) = 0.1A,
Power consumption [W] = 5.0V - 3.3V ×0.1A
=0.17[W]
Measurement condition: mounted on a ROHM board
Substrate size: 70mm × 70mm × 1.6mm
(Substrate with thermal via)
Solder the thermal pad to Ground
IC only
θj-a=249.5/W
1-layer (copper foil are :0mm×0mm)
θj-a=153.2/W
2-layer (copper foil are :15mm×15m)
θj-a=113.6/W
2-layer (copper foil are :70mm×70mm)
θj-a=59.2/W
4-layer (copper foil are :70mm×70m)
θj-a=33.3/W
Power Dissipation :Pd [W]
0 25 50 75 100 125 150
0
2.0
3.0
4.0
0.50W
周囲温度:Ta []
1.0 0.82W
1.10W
2.11W
3.76W
Ambient Temperature :Ta []
Calculation based on ambient temperature (Ta)
Tj=Ta+θj-a×W
Reference values
1-layer substrate (copper foil density 0mm×0mm)
2-layer substrate (copper foil density 15mm×15mm)
2-layer substrate (copper foil density 70mm×70mm)
4-layer substrate (copper foil density 70mm×70mm)
Substrate size: 70mm×70mm×1.6mm (substrate with thermal
θj-a: HTSOP-J8 153.2/W
113.6/W
59.2/W
33.3/W
.Equivalent Series Resistan To prevent oscillations, pl V0 and GND. Capacitors Series Resistance). Oper range shown to the electrolytic Capacitors h please ensure that you ar in the stable operating re please evaluate in the act Sa ety re am / a at oz ESR — lo characteristics www rchm.com © 2013 ROHM Ca.‘ Ltd. All rights reserved. TSZzzm-IS-om 13/19 T5202201~0R6ROA600190-1-2 7.Feb.2013 Rev.002
13/19
BDxxGA5WEFJ Datasheet
TSZ02201-0R6R0A600190-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001 7.Feb.2013 Rev.002
Input-to-Output Capacitor
It is recommended that a capacitor (over 1uF) is placed near pins between the input pin and GND as well as the output pin
and GND. A capacitor, between input pin and GND, is valid when the power supply impedance is high or trace is long. Also,
as for the capacitor between the output pin and GND, the greater the capacitance, the more sustainable the line regulation
will be and the capacitor will make improvements of characteristics depending on the load. However, please check the
actual functionality of this part by mounting it on a board for the actual application. Ceramic capacitors usually have different,
thermal and equivalent series resistance characteristics, and moreover capacitance decreases gradually in use.
For additional details, please check with the manufacturer, and select the best ceramic capacitor for your application.
Equivalent Series Resistance ESR (ceramic capacitor etc.)
To prevent oscillations, please attach a capacitor between
VO and GND. Capacitors usually have ESR (Equivalent
Series Resistance). Operation will be stable in the ESR-IO
range shown to the right. Ceramic, tantalum and
electrolytic Capacitors have different ESR values, so
please ensure that you are using a capacitor that operates
in the stable operating region shown on the right. Finally,
please evaluate in the actual application.
ESR – IO characteristics
0.01
0.10
1.00
10.00
00.1 0.2 0.3 0.4 0.5
Io [A]
ESR [Ω]
Safety Area
DC Bias Voltage [V]
Ceramic capacitor capacity – DC bias characteristics
(Characteristics example)
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
10
0 1 2 3 4
Rated Voltage10V
B1 characteristics
Rated Voltage4V
X6S characteristics
Capacitance Change [%]
Rated Voltage:10V
F characteristics
Rated Voltage6.3V
B characteristics
B characteristics
Rated Voltage10V
CO=1μF
111 3—H— 3%? m rgll—E (gal—E .Evaluation Board Parts List Designation Value Pan No. R1 43%? MCR01PZPZF4302 R2 8.2M? MCR01PZPZF8201 R3 - - R4 - - R5 - - R6 - - C1 1uF CM1OSB105K16A ()2 - - CS - - .Board Layout EN Vcc(ViNl|:> n n n n o IJLlLlLl PCB layout considerations. - Input capaCitor Cw connected to Vcc (Vin) should be pla Output oapaCitor Cour also should be placed as close I GND plane, please use several through holes - FE! pin has comparatively high impedance and can be possible Please take care of this during layout. - Please make GND pattern Wide enough to handle ther - For output voltage setting (BDDDGASWEFJ) Output voltage can be set by FB pin voltage (0.800V (The use of resistors with R1+R2:1kto 90k is re www rohm.com © 2013 ROHM Co.‘ Ltd. All rights reserved. TSZzzm-IS-nm
14/19
BDxxGA5WEFJ Datasheet
TSZ02201-0R6R0A600190-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001 7.Feb.2013 Rev.002
Evaluation Board Circuit
Evaluation Board Parts List
Board Layout
PCB layout considerations:
Input capacitor CIN connected to VCC (Vin) should be placed as close to VCC(VIN) pin as possible.
Output capacitor COUT also should be placed as close to IC pin as possible. In case the part is connected to inner layer
GND plane, please use several through holes.
FB pin has comparatively high impedance and can be affected by noise, so stray capacitance should be as small as
possible. Please take care of this during layout.
Please make GND pattern wide enough to handle thermal dissipation.
For output voltage setting (BD00GA5WEFJ)
Output voltage can be set by FB pin voltage0.800V typ.and external resistance R1, R2.
The use of resistors with R1+R2=1k to 90k is recommended
Designation Value Part No. Company Designation Value Part No. Company
R1 43kΩ MCR01PZPZF4302 ROHM C4
R2 8.2kΩ MCR01PZPZF8201 ROHM C5 1μF CM105B105K16A KYOCERA
R3 C6
R4 C7
R5 C8
R6 C9
C1 1μF CM105B105K16A KYOCERA C10
C2 U1 BD00GA5WEFJ ROHM
C3 U2
N.C
GND
FB N.C
N.C.
VO
2
VO
C7
3
4
7
5
U1
8
C1
C2
C3
R1
R2
C6
C5
1 VCC
6
EN
GND
SW1
EN
FIN
Vcc
VO
EN GND
(
VCC VIN )
CIN
R1 R2
COUT
VO = VFB× R1+R2
R2
8pm(Vcc)/1pin (v0) 2pin (FE) '— Ai E c § [j p_ .l/O Equivalem Circuiks (Fixed type) (Vo) 2pm (V075) fii E 03M? i h . (ngfix'fi nQfiTcm m. A” “gm mew. 15,19 Tszozzm-onenmsomso- TSZzzm-IS-om 7.Feb.2013 Rev.0
15/19
BDxxGA5WEFJ Datasheet
TSZ02201-0R6R0A600190-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001 7.Feb.2013 Rev.002
I/O Equivalent Circuits (Vairable type)
I/O Equivalent Circuits (Fixed type)
8pin (VCC) / 1pin (VO) 2pin (FB) 5pin (EN)
2pin (FB)
8pin (VCC)
1pin (VO)
5pin (EN)
1MΩ
2MΩ
8pin (VCC) / 1pin (VO) 2pin (VO_S) 5pin (EN)
2pin (VO_S)
8pin (VCC)
1pin (VO)
5pin (EN)
1MΩ
2MΩ
16/19
BDxxGA5WEFJ Datasheet
TSZ02201-0R6R0A600190-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001 7.Feb.2013 Rev.002
Operational Notes
(1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down the device, thus making it impossible to identify the damage mode, such as a short circuit or an open circuit.
If there is any possibility of exposure over the rated values, please consider adding circuit protection devices such as
fuses.
(2) Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage the IC. Take precautions when connecting the power
supply lines. An external direction diode can be added.
(3) Power supply lines
Design the PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply
line, separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply
terminals to ICs, connect a capacitor between the power supply and GND terminal. When using electrolytic capacitors in
a circuit, note that capacitance values are reduced at low temperatures and over time.
(4) GND voltage
The potential of the GND pin must be minimum potential under all operating conditions.
(5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating
conditions.
(6). Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.
(7). Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
(8). ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
(9). Thermal shutdown circuit
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is
designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation.
Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit
is assumed.
(10). Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.
Always discharge capacitors after each process or step. Always turn the IC’s power supply off before connecting it to or
removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic
measure. Use similar precaution when transporting or storing the IC.
TSD ON Temperature[] (typ.) Hysteresis Temperature [] (typ.)
BDxxGA5WEFJ 175 15
f: in?” mm P substrate on Parasitic ei Farasmc ele em (12). Ground Wiring Pattern. When using both small signal and large current GND patterns, it is re placing a single ground point at the ground potential ol application s variations caused by large currents do not cause variations in the change the END wiring pattern ol any external components, either. www rohm.com (c: 2013 ROHM 0a.. Ltd. All rights reserved. 17/19 TSZZZHI '15'001
17/19
BDxxGA5WEFJ Datasheet
TSZ02201-0R6R0A600190-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001 7.Feb.2013 Rev.002
(11). Regarding input pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated.P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example, the relation between each potential is as follows:
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes can occur inevitable in the structure of the IC.
The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical
damage. Accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the
GND (P substrate) voltage to an input pin, should not be used.
(12). Ground Wiring Pattern.
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to
change the GND wiring pattern of any external components, either.
Parasitic element
Resistor Transistor (NPN)
N
N N P+ P
+
P
P substrate
GND
Pin A
N
NP+
P+
P
P substrate
GND
Parasitic element
Pin B CB
E
N
GND
Pin A
P
aras
iti
c
element
Pin B
Other adjacent elements
E
B C
GND
P
aras
iti
c
element
3 l m: g ww Mm \ n 545 J mm 065L005 Mama *L “W \—\‘ 1pm Direclmn 0! read (um mm) REE‘ XOrdEv quaumy vvaeds m be muny‘E m we mHHmum qunnhlv Marking Diagram SOP.J8 (Top VIEW) xx Producl Name . 00 BDOOGASWEFJ —9 Part Number Markln 15 BD1SGA5WEFJ K 18 BD18GA5WEFJ LOT Number 25 BDZSGASWEFJ 30 BDSOGASWEFJ 33 BDSSGASWEFJ 50 BDSOGASWEFJ 60 BDGOGASWEFJ 70 BD7OGA5WEFJ 1P|N MARK 80 BDBOGASWEFJ 90 BDBOGASWEFJ JO BDJOGASWEFJ J2 BDJZGASWEFJ
18/19
BDxxGA5WEFJ Datasheet
TSZ02201-0R6R0A600190-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001 7.Feb.2013 Rev.002
Physical Dimension Tape and Reel Information
Marking Diagram
xx Product Name
00 BD00GA5WEFJ
15 BD15GA5WEFJ
18 BD18GA5WEFJ
25 BD25GA5WEFJ
30 BD30GA5WEFJ
33 BD33GA5WEFJ
50 BD50GA5WEFJ
60 BD60GA5WEFJ
70 BD70GA5WEFJ
80 BD80GA5WEFJ
90 BD90GA5WEFJ
J0 BDJ0GA5WEFJ
J2 BDJ2GA5WEFJ
(Unit : mm)
HTSOP-J8
0.08 S
0.08
M
S
1.0MAX
0.85±0.05
1.27
0.08±0.08
0.42 +0.05
-
0.04
1.05±0.2
0.65±0.15
4
°
+
6
°
4
°
0.17 +0.05
-
0.03
234
568
(MAX 5.25 include BURR)
7
1
0.545
(3.2)
4.9±0.1
6.0±0.2
(2.4)
3.9±0.1
1PIN MARK
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
()
Direction of feed
Reel 1pin
HTSOP-J8 (TOP VIEW)
xxGA5W
Part Number Marking
LOT Number
1PIN MARK
19/19
BDxxGA5WEFJ Datasheet
TSZ02201-0R6R0A600190-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001 7.Feb.2013 Rev.002
Revision History
Date Revision Changes
23.July.2012 001 New Release
7.Feb.2013 002 The description was modified.
Datasheet
Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASS CLASS CLASSb CLASS
CLASS CLASS
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.

Products related to this Datasheet

IC REG LIN POS ADJ 500MA 8HTSOP
IC REG LIN 1.5V 500MA 8HTSOP-J
IC REG LIN 1.8V 500MA 8HTSOP-J
IC REG LIN 2.5V 500MA 8HTSOP-J
IC REG LINEAR 3V 500MA 8HTSOP-J
IC REG LINEAR 6V 500MA 8HTSOP-J
IC REG LINEAR 7V 500MA 8HTSOP-J
IC REG LINEAR 8V 500MA 8HTSOP-J
IC REG LINEAR 9V 500MA 8HTSOP-J
IC REG LINEAR 10V 500MA 8HTSOP-J
IC REG LINEAR 12V 500MA 8HTSOP-J
IC REG LINEAR 8V 500MA 8HTSOP-J
IC REG LINEAR 3V 500MA 8HTSOP-J
IC REG LINEAR 6V 500MA 8HTSOP-J
IC REG LIN 2.5V 500MA 8HTSOP-J
IC REG LIN 1.8V 500MA 8HTSOP-J
IC REG LINEAR 7V 500MA 8HTSOP-J
IC REG LINEAR 9V 500MA 8HTSOP-J
IC REG LIN 1.5V 500MA 8HTSOP-J
IC REG LIN 3.3V 500MA 8HTSOP-J
IC REG LIN POS ADJ 500MA 8HTSOP
IC REG LINEAR 10V 500MA 8HTSOP-J
IC REG LINEAR 5V 500MA 8HTSOP-J
IC REG LINEAR 12V 500MA 8HTSOP-J
IC REG LIN POS ADJ 500MA 8HTSOP
IC REG LIN 3.3V 500MA 8HTSOP-J
IC REG LINEAR 5V 500MA 8HTSOP-J
IC REG LIN 1.5V 500MA 8HTSOP-J
IC REG LIN 1.8V 500MA 8HTSOP-J
IC REG LIN 2.5V 500MA 8HTSOP-J