STPS8170DEE Datasheet by STMicroelectronics

View All Related Products | Download PDF Datasheet
This is information on a product in full production.
September 2012 Doc ID 023260 Rev 1 1/8
8
STPS8170DEE
Power Schottky rectifier
Datasheet production data
Features
Very low conduction losses
Negligible switching losses
Extremely fast switching
Low thermal resistance
Avalanche capacity specified
High junction temperature
ECOPACK®2 compliant component
Description
This Schottky rectifier is designed for switch mode
power supply and high frequency DC to DC
converters.
Packaged in PowerFLAT™, this device is
intended for use in low voltage, high frequency,
inverters, free-wheeling, by-pass diode and
polarity protection applications.Its low profile was
especially designed to be used in applications
with space-saving constraints.
TM: PowerFLAT is a trademark of STMicroelectronics
Table 1. Device summary
Symbol Value
IF(AV) 8 A
VRRM 170 V
Tj (max) 175 °C
VF (typ) 0.66 V
A
A
K
A
NC
A
A
NC
NC
AA
AA
K
K
PowerFLAT(3.3 x 3.3)
STPS8170DEE-TR
www.st.com
Characteristics STPS8170DEE
2/8 Doc ID 023260 Rev 1
1 Characteristics
To evaluate the conduction losses use the following equation:
P = 0.62 x IF(AV) + 0.0125 x IF2(RMS)
Table 2. Absolute ratings (limiting values Tamb = 25 °C unless otherwise specified)
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 170 V
IF(RMS) Forward rms current 15 A
IF(AV) Average forward current Tc = 145 °C = 0.5 8 A
IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 100 A
PARM(1)
1. For pulse time duration deratings, please refer to Figure 3. More details regarding the avalanche energy
measurements and diode validation in the avalanche are provided in the STMicroelectronics Application
notes AN1768, “Admissible avalanche power of schottky diodes” and AN2025, “Converter improvement
using Schottky rectifier avalanche specification”.
Repetitive peak avalanche power tp = 10 µs Tj = 125 °C 400 W
Tstg Storage temperature range -65 to +175 °C
TjMaximum operating junction temperature 175 °C
Table 3. Thermal resistance
Symbol Parameter Value Unit
Rth(j-c) Junction to case 4 °C/W
Table 4. Static electrical characteristics
Symbol Parameter Test conditions Min. Typ. Max. Unit
IR(1)
1. Pulse test: tp = 5 ms, < 2%
Reverse leakage current Tj = 25 °C VR = VRRM
-15µA
Tj = 125 °C - 1.5 15 mA
VF(2)
2. Pulse test: tp = 380 µs, < 2%
Forward voltage drop Tj = 25 °C IF = 8A 0.90 V
Tj = 125 °C - 0.66 0.72
n 25 SD 15 mn 1:5 ISD 175 Mum musv 10 mm mm LE-DE ‘ m I. .n3 LE-DQ ‘ m nmn w an an mo 12:) 140 160 Ian 1 n) ma mun
STPS8170DEE Characteristics
Doc ID 023260 Rev 1 3/8
Figure 1. Average forward power dissipation
versus average forward current
Figure 2. Average forward current versus
ambient temperature( = 0.5)
PF(AV)(W)
0
1
2
3
4
5
6
7
8
9
01234567891011
()
IF(AV)(A)
T
δ=tp/T tp
δ= 0.05
δ= 0.1
δ= 0.2
δ= 0.5
δ= 1
IF(AV)(A)
0
2
4
6
8
10
0 25 50 75 100 125 150 175
T
δ=tp/T tp
T
amb
(°C)
Rth(j-a)=Rth(j-c)
Figure 3. Normalized avalanche power
derating versus pulse duration
Figure 4. Relative variation of thermal
impedance junction to case versus
pulse duration
P(t
p)
P (10 µs)
ARM
ARM
0.001
0.01
0.1
1
1 10 100 1000
t (µs)
p
Zth(j-c)/Rth(j-c)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
tp(s)
Single pulse
Figure 5. Reverse leakage current versus
reverse voltage applied (typical
values)
Figure 6. Junction capacitance versus
reverse voltage applied (typical
values)
C(pF)
10
100
1000
1 10 100 1000
F=1 MHz
V
OSC
=30 mV
RMS
Tj =25 °C
VR(V)
Characteristics STPS8170DEE
4/8 Doc ID 023260 Rev 1
Figure 7. Forward voltage drop versus
forward current
Figure 8. Thermal resistance junction to
ambient versus copper surface
under tab
IFM(A)
0.1
1.0
10.0
100.0
0.0 0.2 0.4 0.6 0.8 1.0 1.2
VFM(V)
Tj=25 °C
(Maximum values)
Tj=125 °C
(Maximum values)
Tj=125 °C
(Typical values)
Rth(j-a)(°C/W)
0
50
100
150
200
250
012345678910
PowerFLAT (3.3x3.3)
SCu(cm²)
epoxy printed board FR4, copper thickness=35µm
www.5Lcom
STPS8170DEE Package information
Doc ID 023260 Rev 1 5/8
2 Package information
Epoxy meets UL94,V0
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 9. PowerFLAT-3.3x3.3-8L dimensions (definitions)
Table 5. PowerFLAT-8L dimensions (values)
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.95 1.00 1.05 0.037 0.039 0.041
A3 0.20 0.0079
A4 0.20 0.0079
b 0.30 0.37 0.44 0.012 0.015 0.017
D 3.20 3.30 3.40 0.126 0.130 0.134
D2 2.24 2.31 2.38 0.088 0.091 0.094
D3 1.60 1.67 1.74 0.063 0.066 0.069
e 0.65 0.026
E 3.20 3.30 3.40 0.126 0.130 0.134
E2 1.68 1.75 1.82 0.066 0.069 0.072
L 0.31 0.38 0.45 0.012 0.015 0.018
L1 0.55 0.62 0.69 0.22 0.024 0.027
L2 0.86 0.93 1.00 0.034 0.037 0.039
A4
D2
L
E2
L1
b
e
e/2
D3
L2 A
A3
E
E/2
D
D/2
a
nc
kka
nc
Projection
Exposed pad
Index area
(D/2 x E/2)
Package information STPS8170DEE
6/8 Doc ID 023260 Rev 1
Figure 10. Footprint (dimensions in mm)
3.50
1.75
1.75
1.79 0.52
0.21
1.25
0.42
0.80 2.28
3.50
STPS8170DEE Ordering information
Doc ID 023260 Rev 1 7/8
3 Ordering information
4 Revision history
Table 6. Ordering information
Order code Marking Package Weight Base qty Delivery mode
STPS8170DEE-TR PS8170 PowerFLAT
(3.3 x 3.3) 34 mg 3000 Tape and reel
13” reel
Table 7. Document revision history
Date Revision Changes
09-Sep-2012 1 First issue.
STPS8170DEE
8/8 Doc ID 023260 Rev 1
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2012 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com

Products related to this Datasheet

DIODE SCHOTTKY 170V 8A POWERFLAT
DIODE SCHOTTKY 170V 8A POWERFLAT
DIODE SCHOTTKY 170V 8A POWERFLAT