Through-hole Socket Mount Sytem Datasheet by Vicor Corporation

View All Related Products | Download PDF Datasheet
2:; VICOR’
Design Guide & Applications Manual
Maxi, Mini, Micro Family DC-DC Converters and Configurable Power Supplies
Maxi, Mini, Micro Design Guide Rev 5.0
Page 77 of 87 03/2018
16. Through-Hole Socket-Mount System (InMate)
InMates are an innovative solution for through-hole socket
requirements. Consisting of individual plastic carriers for the input
and the output, each contains an array of sockets for either a full-,
half- or quarter-brick sized module. The sockets are factory loaded
into the carrier, which holds them rigidly in place throughout the
assembly and soldering process. The carriers are later removed,
leaving the sockets accurately positioned.
Designed for use with pin-compatible Maxi, Mini and Micro Family
converters, InMates are available for a wide range of PCB sizes and
mounting styles. PCB thicknesses can range from 0.055in [1,39mm]
to 0.1375in [3,49mm].
Sockets also allow for mounting modules either inboard, with a
cutout in the PCB for the module, to minimize the height above the
board or onboard. InMates are compatible with the ModuMate or
RoHS pin style.
InMates are available in standard recyclable JEDEC style trays for
use with automated pick-and-place equipment and are compatible
with most standard wave or hand solder operations. The sockets
are soldered into the board as part of the PCB assembly process.
The module can then be plugged into place at anytime later.
NOTE: Please refer to Section 13 of the design guide for the InMate
soldering procedure.
Figure 16.1 — InMate carrier / socket assembly and soldering process
Insert
Solder
Remove Carrier
Insert Module
i QnaflerBrlck v u! _ '1 empu 75 18386 r VICOR
Design Guide & Applications Manual
Maxi, Mini, Micro Family DC-DC Converters and Configurable Power Supplies
Maxi, Mini, Micro Design Guide Rev 5.0
Page 78 of 87 03/2018
16. Through-Hole Socket-Mount System (InMate)
1. Select Board Thickness:
Nominal 0.062in [1,5mm], 0.093in [2,4mm] or 0.125in [3,1mm].
2. Select Mounting Style:
Inboard requires a PCB cutout for the “belly” of the module.
See dotted lines in PCB drawing links on Page 80 for
cut-out area.
3. Identify Module Type:
Full brick (Maxi), half brick (Mini) or quarter brick (Micro).
4. Select the Ordering Part Number:
Order packages of five input / output sets or in higher
quantities order input and output InMates separately. For
individual input or output InMates, minimum orders of 35 for
Maxi or Mini and 40 for Micro apply.
5. Verify Correct Pin Style for the Module:
For predefined parts, “S” or “F= short ModuMate and “N” or
G” = long ModuMate
See Table 16.4 for standoff recommendations.
Table 16.1 — Guide to InMate selection
InMate: Through-Hole Sockets
Board Thickness Full Brick [Maxi) Half Brick [Mini) Quarter Brick [Micro)
Normal
[Min / Max)
Mounting
Style Input Output Five
Sets Input Output Five
Sets Input Output Five
Sets
Pin
Style
0.062in
(0.055in / 0.071in)
1,5mm
(1,4mm / 1,8mm)
Inboard 18374 18382 18362 18374 18384 18366 18376 18386 18370 S or F
Onboard 18378 18388 18364 18378 18390 18368 18380 18392 18372 N or G
0.093in
(0.084in / 0.104in)
2,4mm
(2,1mm / 2,6mm)
Inboard 18375 18383 18363 18375 18385 18367 18377 18387 18371 S or F
Onboard 18379 18389 18365 18379 18391 18369 18381 18393 18373 N or G
0.125in
(0.1125in / 0.1375in)
3,1mm
(2,8mm / 3,5mm)
Onboard 21539 21543 21510 21539 21544 21511 21540 21545 21512 N or G
2. 3. 5.1. 4.
VICOR
Design Guide & Applications Manual
Maxi, Mini, Micro Family DC-DC Converters and Configurable Power Supplies
Maxi, Mini, Micro Design Guide Rev 5.0
Page 79 of 87 03/2018
16. Through-Hole Socket-Mount System (InMate)
Parameter Specification Value Reference
Compatibility
Module Pin Styles
F = short Au plated Short RoHS pins
Short ModuMate pins
S = short Au plated
G = long Au plated Long RoHS pins
Long ModuMate pins
N = long Au plated
Mechanical
Contact Normal Force 100g EOL min GR-1217-CORE, R5-23
Number of Mating Cycles 5 max
[h] Exception to GR-1217-CORE which specifies 25 mating cycle
Module Engagement Force 32lbs per connector set max GR-1217-CORE, R5-31,32
Module Disengagement Force 32lbs per connector set max GR-1217-CORE, R5-31,32
Electrical
Current Rating for Output Pin Sockets
50A Maxi
[e] / 50A Mini / 25A Micro
(Based on 248°F [120°C] max socket temp
& 86°F [30°C] max temperature rise of contact)
Gold plating standards and accepted
industry standards such as
IICIT, EIA, Bellcore guidelines
Low-Level Contact Resistance
0.080in [2,03mm] dia socket (LLCR) 400µΩ max GR-1217-CORE, 6.2.1
Low-Level Contact Resistance
0.150in [3,81mm] dia socket (LLCR) 300µΩ max GR-1217-CORE, 6.2.1
Low-Level Contact Resistance
0.180in [4,57mm] dia sockets (LLCR) 200µΩ max GR-1217-CORE, 6.2.1
Thermal
Max Socket Temperature 248°F [120°C] max Max continuous-use temperature for gold plating
Temperature Rise 86°F [30°C] max GR-1217-CORE
[g]
EIA-364-70A
[f]
Environmental
Shock and Vibration
InMate products are tested in random vibration environments to best simulate the broad spectrum of frequencies
and amplitudes that may be encountered in typical applications. Actual system resonant frequencies will depend on
PCB construction and mounting details. For critical or unusual shock and vibration environments, the performance
of the system should be independently verified.
Table 16.2 — InMate specifications and materials
Materials Ratings
Headers
Material: Ryton™ R–7 PPS, 65% Glass Fiber and
Mineral-Filled Compound Poly-Phenylene Sulfide
Flammability UL94 V-0/5VA
Thermal Stability (short term) 500°F [260°C]
Thermal Stability (long term) 392°F [200°C]
Solder Cap
Material 305 stainless steel
Plating Clear passivate to repel solder
Sockets
Material Brush Wellman Alloy #25 C17200 deep draw quality or equiv. 0.010in thick
Plating Woods nickel strike followed by 50µin min low stress sulfamate-based electrolytic nickel,
followed by 20µin min hard gold, followed by 10µin min soft gold
Table 16.3 — Material properties of InMate components
[e] For 80A operation with Maxi, contact Applications Engineering.
[f] GR-1217-CORE issue 1, November 1995 Generic requirements for separable electrical connectors used in telecommunications hardware.
A module of NEBSFR, FR-2063
[g] ANSI/EIA-364 American National Standards Institute / Electronic Industries Association (Electronic Components, Assemblies & Materials Association)
[h] The module and socket must be replaced after five mating cycles.
Design Guide & Applications Manual
Maxi, Mini, Micro Family DC-DC Converters and Configurable Power Supplies
Maxi, Mini, Micro Design Guide Rev 5.0
Page 80 of 87 03/2018
16. Through-Hole Socket-Mount System (InMate)
Table 16.4 — InMate standoff recommendations
Standoff Kits for InMate Mounted Modules
Board
Thickness
Mounting
Options
Slotted
Baseplate
Through-Hole
Baseplate
Threaded
Baseplate
Nominal
(Min / Max]
Mounting
Style
Through-Hole
Heat Sink
Threaded
Heat Sink
Through-Hole
Heat Sink
Threaded
Heat Sink
Through-Hole
Heat Sink
0.062in
(0.055in / 0.071in)
1,5mm
(1,4mm /1,8mm)
Inboard Kit -18153 Kit -18154 Kit -18148 Kit -18149 Kit -18148
Bag -19129 Bag -19130 Bag -19124 Bag -19125 Bag -19124
Onboard Kit -18158 Kit -18159 Kit -18153 Kit -18155 Kit -18153
Bag -19134 Bag -19135 Bag -19129 Bag -19131 Bag -19129
0.093in
(0.084in / 0.104in)
2,4mm
(2,1mm /2,6mm)
Inboard Kit -18153 Kit -18154 Kit -18148 Kit -18149 Kit -18148
Bag -19129 Bag -19130 Bag -19124 Bag -19125 Bag -19124
Onboard Kit -18156 Kit -18157 Kit -18150 Kit -18152 Kit -18150
Bag -19132 Bag -19133 Bag -19126 Bag -19128 Bag -19126
0.125in
(0.113in / 0.138in)
3,1mm
(2,8mm / 3,5mm)
Onboard
Kit - 24054 Kit -18157 Kit -24056 Kit - 18152 Kit-24056
Bag -19132 Bag -19133 Bag -19126 Bag - 19128 Bag-19126
Kits include six (6] standoffs and screws. Mini and Micro modules require a minimum of four (4] standoffs.
Bags of one hundred (100] do not include screws; #4-40 thread hardware required.
References
InMate PCB layout drawing for Maxi Module http://asp.vicorpower.com/cadUtil/display_cad.asp?pn=18400&ct=PDF
InMate PCB layout drawing for Mini Module http://asp.vicorpower.com/cadUtil/display_cad.asp?pn=18399&ct=PDF
InMate PCB layout drawing for Micro Module http://asp.vicorpower.com/cadUtil/display_cad.asp?pn=18398&ct=PDF
InMate and Socket outline drawing for Inboard Maxi Modules http://asp.vicorpower.com/cadUtil/display_cad.asp?pn=18483-XX&ct=PDF
InMate and Socket outline drawing for Inboard Mini Modules http://asp.vicorpower.com/cadUtil/display_cad.asp?pn=18482-XX&ct=PDF
InMate and Socket outline drawing for Inboard Micro Modules http://asp.vicorpower.com/cadUtil/display_cad.asp?pn=18481-XX&ct=PDF
InMate and Socket outline drawing for Onboard Maxi Modules http://asp.vicorpower.com/cadUtil/display_cad.asp?pn=18480-XX&ct=PDF
InMate and Socket outline drawing for Onboard Mini Modules http://asp.vicorpower.com/cadUtil/display_cad.asp?pn=20030-XX&ct=PDF
InMate and Socket outline drawing for Onboard Micro Modules http://asp.vicorpower.com/cadUtil/display_cad.asp?pn=20029-XX&ct=PDF
Module Exchange Tool
Used in facilitating the proper extraction of modules from InMate or SurfMate sockets.
Removal without using the Exchange Tool may cause damage to the sockets.
Description Part Number
Maxi Exchange Tool 22827
Mini Exchange Tool 22828
Micro Exchange Tool 22829
22827
22829
22828

Products related to this Datasheet

SOCKET KIT
INMATE SOCKET MICRO SET 5IN/5OUT
INMATE SOCKET MAXI 5IN/5OUT SET
INMATE MINI SL BOB 5 1=10PCS
INMATE MINI LL BOB 5 SETS
INMATE MAXI/MINI IN SL BOB
INMATE MAXI/MINI IN LL BOB
INMATE MICRO IN SL BOB
INMATE MICRO IN LL BOB
INMATE MAXI OUT LL BOB
INMATE MICRO OUT SL BOB
INMATE MICRO OUT LL BOB
INMATE MAXI/MINI IN XL BOB
INMATE SOCKET FOR MAXI MODULE