STPS1L30 Datasheet by STMicroelectronics

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Features
Very low forward voltage drop for less power dissipation
Surface mount miniature packages
Avalanche rated
• ECOPACK®2 compliant
Applications
Cordless appliance
• SSD
Battery charger
Telecom power
DC / DC converter
Description
Schottky rectifiers designed for high frequency miniature switched mode power
supplies such as adaptors and on board DC/DC converters.
Packaged in SMA or SMB, the STPS1L30 is ideal for use in parallel with MOSFETs
in synchronous rectification.
Product status
STPS1L30
Product summary
Symbol Value
IF(AV) 1 A
VRRM 30 V
T j(max.) 150 °C
VF(typ.) 0.26 V
30 V power Schottky rectifier
STPS1L30
Datasheet
DS1243 - Rev 7 - September 2018
For further information contact your local STMicroelectronics sales office.
www.st.com
1Characteristics
Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified)
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 30 V
IF(RMS) Forward rms current 10 A
IF(AV) Average forward current, δ = 0.5, square wave
SMA TL = 135 °C
1 A
SMB TL = 140 °C
IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 75 A
PARM Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 110 W
Tstg Storage temperature range -65 to +150 °C
TjMaximum operating junction temperature(1) +150 °C
1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink.
Table 2. Thermal resistance parameter
Symbol Parameter Max. value Unit
Rth(j-l) Junction to lead
SMA 30
°C/W
SMB 25
For more information, please refer to the following application note :
AN5088 : Rectifiers thermal management, handling and mounting recommendations
Table 3. Static electrical characteristics
Symbol Parameter Test conditions Min. Typ. Max. Unit
IR(1) Reverse leakage current
Tj = 25 °C
VR = VRRM
- 200 µA
Tj = 100 °C - 6 15 mA
VF(1) Forward voltage drop
Tj = 25 °C
IF = 1 A
- 0.395
V
Tj = 125 °C - 0.260 0.300
Tj = 25 °C
IF = 2 A
- 0.445
Tj = 125 °C - 0.325 0.375
1. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses, use the following equation:
P = 0.225x IF(AV) + 0.075 x IF2(RMS)
For more information, please refer to the following application notes related to the power losses :
AN604: Calculation of conduction losses in a power rectifier
AN4021: Calculation of reverse losses on a power diode
STPS1L30
Characteristics
DS1243 - Rev 7 page 2/12
1.1 Characteristics (curves)
Figure 1. Average forward power dissipation versus
average forward current
P (W)
F(AV)
T
δ=tp/T tp
I(A)
F(A V)
δ = 1
δ = 0.1 δ = 0.5
δ = 0.2
δ = 0.05
0.0 0.2 0.4 0.6 0.8 1.0 1.2
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
Figure 2. Average forward current versus ambient
temperature (δ = 0.5)
0
1
2
3
4
5
6
0 25 50 75 100 125 150
I (A)
F(AV)
T
δ=tp/T tp (°C)Tam
th(j-a) R
b
SMA
R = th(j-l)
SMB
Figure 3. Normalized avalanche power derating versus
junction temperature (Tj = 125 °C)
P (tp)
P (10 µs)
ARM
ARM
0.001
0.01
0.1
1
1 10 100 1000
t (µs)
p
Figure 4. Relative variation of thermal impedance junction
to ambient versus pulse duration (SMB)
Z / R
th(j-a) th(j-a)
0.01
0.10
1.00
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Single pulse
SMB
t (s)
p
STPS1L30
Characteristics (curves)
DS1243 - Rev 7 page 3/12
Figure 5. Relative variation of thermal impedance junction
to ambient versus pulse duration (SMA)
Z / R
th(j-a) th(j-a)
0.01
0.10
1.00
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Single pulse
SMA
t (s)
p
Figure 6. Reverse leakage current versus reverse voltage
applied (typical values)
I (mA)
R
1.E-3
1.E-2
1.E-1
1.E+0
1.E+1
1.E+2
020 25 30
V (V)
R
T =150°C
j
T =25°C
j
T =100°C
j
T =125°C
j
5 10 15
Figure 7. Junction capacitance versus reverse voltage
applied (typical values)
C(pF)
10
100
500
1 2 10 50
V (V)
R
F=1MHz
V =30mV
T =25°C
OSC RMS
j
520
Figure 8. Forward voltage drop versus forward current
(typical values, high level)
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7
0.10
1.00
10.00
I (A)
F
V (V)
F
T =25°C
j
T =150°C
j
T =100°C
j
Figure 9. Forward voltage drop versus forward current
(maximum values, low level)
0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60
0.0
0.5
1.0
1.5
2.0
2.5
3.0
I (A)
F
V (V)
F
T =25°C
j
Tj =150°C
T =125°C
j
T =100°C
j
Figure 10. Thermal resistance junction to ambient versus
copper surface under each lead (SMB)
0
50
100
150
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
SMB
S(Cu)(cm²)
Epoxy p ri nted ci rcuit board FR4, coppe r t hick ness: 35 µm
STPS1L30
Characteristics (curves)
DS1243 - Rev 7 page 4/12
Figure 11. Thermal resistance junction to ambient versus copper surface under each lead (SMA)
0
50
100
150
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
SMA
S(Cu)(cm²)
Epoxy printed circuit board FR4, copper thic kness: 35 µm
STPS1L30
Characteristics (curves)
DS1243 - Rev 7 page 5/12
2Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK®
packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions
and product status are available at: www.st.com. ECOPACK® is an ST trademark.
2.1 SMB package information
Epoxy meets UL94, V0
Lead-free package
Figure 12. SMB package outline
E1
E
D
C
L
A1
A2
b
STPS1L30
Package information
DS1243 - Rev 7 page 6/12
Table 4. SMB package mechanical data
Ref.
Dimensions
Millimeters Inches (for reference only)
Min. Max. Min. Max.
A1 1.90 2.45 0.0748 0.0965
A2 0.05 0.20 0.0020 0.0079
b 1.95 2.20 0.0768 0.0867
c 0.15 0.40 0.0059 0.0157
D 3.30 3.95 0.1299 0.1556
E 5.10 5.60 0.2008 0.2205
E1 4.05 4.60 0.1594 0.1811
L 0.75 1.50 0.0295 0.0591
Figure 13. SMB recommended footprint
2.60
(0.102)
5.84
(0.230)
1.62
2.18
(0.086)
1.62
)640.0()460.0(
STPS1L30
SMB package information
DS1243 - Rev 7 page 7/12
2.2 SMA package information
Epoxy meets UL94, V0
Cooling method : by conduction (C)
Figure 14. SMA package outline
E1
E
D
C
L
A1
A2
b
Table 5. SMA package mechanical data
Ref.
Dimensions
Millimeters Inches (for reference only)
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.097
A2 0.05 0.20 0.002 0.008
b 1.25 1.65 0.049 0.065
c 0.15 0.40 0.006 0.016
D 2.25 2.90 0.089 0.114
E 4.80 5.35 0.189 0.211
E1 3.95 4.60 0.156 0.181
L 0.75 1.50 0.030 0.059
STPS1L30
SMA package information
DS1243 - Rev 7 page 8/12
Figure 15. SMA recommended footprint in mm (inches)
2.63
(0.104)
5.43
(0.214)
1.4
1.64
(0.065)
1.4
)550.0()550.0(
STPS1L30
SMA package information
DS1243 - Rev 7 page 9/12
3Ordering Information
Table 6. Ordering information
Order code Marking Package Weight Base qty. Delivery mode
STPS1L30A GB3 SMA 0.068 g 5000 Tape and reel
STPS1L30U G23 SMB 0.107 g 2500 Tape and reel
STPS1L30
Ordering Information
DS1243 - Rev 7 page 10/12
Revision history
Table 7. Document revision history
Date Version Changes
Jul-2003 5A Last update.
Aug-2004 6 SMA package dimensions update. Reference A1 max changed from 2.70 mm (0.106 inc.) to 2.03 mm
(0.080 inc).
17-Sep-2018 7 Updated Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) and
Figure 3. Normalized avalanche power derating versus junction temperature (Tj = 125 °C).
STPS1L30
DS1243 - Rev 7 page 11/12
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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2018 STMicroelectronics – All rights reserved
STPS1L30
DS1243 - Rev 7 page 12/12

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