STTH1R06 Datasheet by STMicroelectronics

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October 2009 Doc ID 10203 Rev 5 1/9
9
STTH1R06
Turbo 2 ultrafast high voltage rectifier
Features
Ultrafast switching
Low reverse recovery current
Low thermal resistance
Reduces switching and conduction losses
Description
The STTH1R06, which is using ST Turbo 2 600 V
technology, is specially suited as boost diode in
power factor correction circuitry.
The device is also intended for use as a free
wheeling diode in power supplies and other power
switching applications.
Table 1. Device summary
Symbol Value
IF(AV) 1 A
VRRM 600 V
IR (max) 75 µA
Tj175 °C
VF (typ) 1.0 V
trr (max) 25 ns
DO-41
STTH1R06
SMA
STTH1R06A
SMB
STTH1R06U
K
A
K
A
K
A
www.st.com
Characteristics STTH1R06
2/9 Doc ID 10203 Rev 5
1 Characteristics
To evaluate the conduction losses use the following equation: P = 1.03 x IF(AV) + 0.27 IF2(RMS)
Table 2. Absolute ratings (limiting values)
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 600 V
IF(RMS) Forward rms current DO-41 10 A
SMA / SMB 7
IF(AV) Average forward current
DO-41 Tc = 100 °C δ = 0.5
1ASMA Tc = 125 °C δ = 0.5
SMB Tc = 135 °C δ = 0.5
IFSM Surge non repetitive forward current DO-41 tp = 10ms sinusoidal 25 A
SMA / SMB 20
Tstg Storage temperature range -65 to + 175 °C
TjMaximum operating junction temperature 175 °C
Table 3. Thermal resistance
Symbol Parameter Value (max) Unit
Rth(j-l) Junction to lead
L = 10 mm DO-41 45
°C/WSMA 30
SMB 25
Rth(j-a) Junction to ambient (1) L = 10 mm DO-41 70 °C/W
1. Rth(j-a) is measured with a copper area S = Scm2 (see Figure 14).
Table 4. Static electrical characteristics
Symbol Parameter Test conditions Min. Typ. Max. Unit
IRReverse leakage current Tj = 25 °C VR = VRRM
1µA
Tj = 150 °C 10 75
VFForward voltage drop Tj = 25 °C IF = 1A 1.7 V
Tj = 150 °C 1.0 1.25
‘ z m tanu mm ‘ m2 meyfimum 1am man 150‘ ‘ E
STTH1R06 Characteristics
Doc ID 10203 Rev 5 3/9
Table 5. Dynamic characteristics
Symbol Parameter Test conditions Min. Typ. Max. Unit
trr
Reverse recovery
time Tj = 25 °C IF = 0.5A Irr = 0.25A IR =1A 25 ns
IF = 1A dIF/dt = -50 A/µs VR =30V 30 45
tfr
Forward recovery
time Tj = 25 °C IF = 1A dIF/dt = 100 A/µs
VFR = 1.1 x VFmax
100 ns
VFP
Forward recovery
voltage Tj = 25 °C IF = 1A dIF/dt = 100 A/µs
VFR = 1.1 x VFmax
10 V
Figure 1. Conduction losses versus average
forward current
Figure 2. Forward voltage drop vs forward
current
P(W)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
0.0 0.2 0.4 0.6 0.8 1.0 1.2
T
δ=tp/T tp
I (A)
F(AV)
δ= 1
δ= 0.5
δ= 0.05
δ= 0.1 δ= 0.2
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
012345
I (A)
FM
V (V)
FM
T =25°C
(maximum values)
j
T =125°C
(maximum values)
j
T =125°C
(typical values)
j
Figure 3. Relative variation of thermal
impedance junction to case vs
pulse duration (DO-41)
Figure 4. Relative variation of thermal
impedance junction to case vs
pulse duration (SMA)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
δ= 0.5
δ= 0.2
δ= 0.1
Single pulse
T
δ=tp/T tp
Z/R
th(j-c) th(j-c)
t (s)
p
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z/R
th(j-c) th(j-c)
T
δ=tp/T tp
t (s)
p
Single pulse
δ= 0.2
δ= 0.1
δ= 0.5
S = 1cm2
‘z m ‘ ma ‘ am ‘ E 4/9 E
Characteristics STTH1R06
4/9 Doc ID 10203 Rev 5
Figure 5. Relative variation of thermal
impedance junction to case vs
pulse duration (SMB)
Figure 6. Peak reverse recovery current vs
dIF/dt (typical values)
Z/R
th(j-c) th(j-c)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
T
δ=tp/T tp
t (s)
p
Single pulse
δ= 0.2
δ= 0.1
δ= 0.5
S = 1cm2
I (A)
RM
0
1
2
3
4
5
6
7
8
9
0 50 100 150 200 250 300 350 400 450 500
I =0.5 x I
F F(AV)
I =0.25 x I
F F(AV)
I=I
F F(AV)
I =2 x I
F F(AV)
V =400V
T =125°C
R
j
dI /dt(A/µs)
F
Figure 7. Reverse recovery time versus dIF/dt
(typical values)
Figure 8. Reverse recovery charges versus
dIF/dt (typical values)
t (ns)
rr
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
0 50 100 150 200 250 300 350 400 450 500
I =2 x I
F F(AV)
I=I
F F(AV)
I =0.5 x I
F F(AV)
V =400V
T =125°C
R
j
dI /dt(A/µs)
F
Q (nC)
rr
0
25
50
75
100
125
150
175
200
225
250
0 50 100 150 200 250 300 350 400 450 500
I =2 x I
F F(AV)
I=I
F F(AV)
I =0.5 x I
F F(AV)
dI /dt(A/µs)
F
V =400V
T =125°C
R
j
Figure 9. Reverse recovery softness factor
vs dIF/dt (typical values)
Figure 10. Relative variations of dynamic
parameters vs junction temperature
S factor
0
1
2
3
4
5
6
0 50 100 150 200 250 300 350 400 450 500
I=I
T =125°C
F F(AV)
j
V =400V
R
dI /dt(A/µs)
F0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
25 50 75 100 125
T (°C)
j
I=I
Reference: T =125°C
F F(AV)
j
V =400V
R
IRM
QRR
S factor
STTH1R06 Characteristics
Doc ID 10203 Rev 5 5/9
Figure 11. Transient peak forward voltage vs
dIF/dt (typical values)
Figure 12. Forward recovery time vs dIF/dt
(typical values)
Figure 13. Junction capacitance versus
reverse voltage applied
(typical values)
Figure 14. Thermal resistance junction to
ambient versus copper surface
under each lead
Figure 15. Thermal resistance junction to ambient versus copper surface under each lead
(epoxy FR4, Cu = 35 µm) (SMA)
V (V)
FP
0
5
10
15
20
25
0 20 40 60 80 100 120 140 160 180 200
dI /dt(A/µs)
F
I=I
T =125°C
F F(AV)
j
t (ns)
fr
0
20
40
60
80
100
120
140
160
180
200
0 20 40 60 80 100 120 140 160 180 200
I=I
T =125°C
F F(AV)
j
V =1.1 x V max.
FR F
dI /dt(A/µs)
F
1
10
100
1 10 100 1000
C(pF)
V (V)
R
F=1MHz
V =30mV
T =25°C
OSC
j
0
10
20
30
40
50
60
70
80
90
100
110
0
12
3
4
56
7
89
1
0
R (°C/W)
th(j-a)
S(cm²)
DO-41
Lleads = 10mm
SMB
(epoxy FR4, Cu = 35 µm) (DO-41, SMB)
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
S(cm²)
SMA
b\§\§\
Package information STTH1R06
6/9 Doc ID 10203 Rev 5
2 Package information
Epoxy meets UL94, V0
Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 16. Footprint (dimensions in mm)
Table 6. SMA dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.094
A2 0.05 0.20 0.002 0.008
b 1.25 1.65 0.049 0.065
c 0.15 0.40 0.006 0.016
D 2.25 2.90 0.089 0.114
E 4.80 5.35 0.189 0.211
E1 3.95 4.60 0.156 0.181
L 0.75 1.50 0.030 0.059
E
CL
E1
D
A1
A2
b
2.63
(0.103)
5.43
(0.214)
1.4
1.64
(0.064)
1.4
(0.055) (0.055)
STTH1R06 Package information
Doc ID 10203 Rev 5 7/9
Figure 17. Footprint (dimensions in mm)
Table 7. SMB dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008
b 1.95 2.20 0.077 0.087
c 0.15 0.40 0.006 0.016
E 5.10 5.60 0.201 0.220
E1 4.05 4.60 0.159 0.181
D 3.30 3.95 0.130 0.156
L 0.75 1.50 0.030 0.059
Table 8. DO-41 (plastic) dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A 4.07 5.20 0.160 0.205
B 2.04 2.71 0.080 0.107
C25.4 1
D 0.71 0.86 0.028 0.034
E
C
L
E1
D
A1
A2
b
2.60
5.84
1.62
2.18
1.62
(0.064) (0.102)
(0.300)
(0.064)
(0.086)
ØD ØB
A
CC
Ordering information STTH1R06
8/9 Doc ID 10203 Rev 5
3 Ordering information
4 Revision history
Table 9. Ordering information
Order code Marking Package Weight Base qty Delivery mode
STTH1R06 STTH1R06 DO-41 0.34 g 2000 Ammopack
STTH1R06RL STTH1R06 DO-41 0.34 g 5000 Tape and reel
STTH1R06A HR6 SMA 0.068 g 5000 Tape and reel
STTH1R06U BR6 SMB 0.11 g 2500 Tape and reel
Table 10. Document revision history
Date Revision Changes
Apr-2003 1 First issue.
07-Sep-2004 2 DO-41 and SMA packages added.
24-Feb-2005 3 SMA package dimensions update. Reference A1 max.
changed from 2.70 mm (0.106 inc.) to 2.03 mm (0.080).
02-Jul-2007 4
Reformatted to current standards. Added cathode bars to
cover illustrations. Updated dimensions and footprint
illustrations for SMA and SMB packages. Corrected part
number in Table 9.
30-Sep-2009 5 Updated table 8 package dimensions.
STTH1R06
Doc ID 10203 Rev 5 9/9
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