2SB1694 Datasheet by Rohm Semiconductor

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my zr , m (3) (1) Emitter (2) Base (2) (3) Collector (1)
2SB1694
General purpose amplification (-30V, -1A) Datasheet
llOutline
Parameter Value   SOT-323  
  SC-70  
VCEO -30V   
IC-1A   
UMT3  
llFeatures ll Inner circuit
1)A collector current is large
2)Collector-Emitter saturation voltage is low.
 VCE(sat)-380mV
 at IC=-500mA/IB=-25mA
3)Complements the 2SD2656.
llApplication
LOW FREQUENCY AMPLIFIER
llPackaging specifications
Part No. Package Package
size
Taping
code
Reel size
(mm)
Tape width
(mm)
Quantity
(pcs) Marking
2SB1694 SOT-323
(UMT3) 2021 T106 180 8 3000 ES
                                                                                         
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© 2019 ROHM Co., Ltd. All rights reserved. 1/6 20190621 - Rev.003
2SB1694                          Datasheet
llAbsolute maximum ratings (Ta = 25°C)
Parameter Symbol Values Unit
Collector-base voltage VCBO -30 V
Collector-emitter voltage VCEO -30 V
Emitter-base voltage VEBO -6 V
Collector current
IC-1 A
ICP*1 -2 A
Power dissipation PD*2 200 mW
Junction temperature Tj150
Range of storage temperature Tstg -55 to +150
llElectrical characteristics (Ta = 25°C)
Parameter Symbol Conditions Values Unit
Min. Typ. Max.
Collector-base breakdown
voltage BVCBO IC = -10μA -30 - - V
Collector-emitter breakdown
voltage BVCEO IC = -1mA -30 - - V
Emitter-base breakdown voltage BVEBO IE = -10μA -6 - - V
Collector cut-off current ICBO VCB = -30V - - -100 nA
Emitter cut-off current IEBO VEB = -6V - - -100 nA
Collector-emitter saturation voltage VCE(sat) IC = -500mA, IB = -25mA - -180 -380 mV
DC current gain hFE VCE = -2V, IC = -100mA 270 - 680 -
Transition frequency fT
VCE = -2V, IE = 100mA,
f = 100MHz - 320 - MHz
Output capacitance Cob
VCB = -10V, IE = 0A,
f = 1MHz - 7 - pF
*1 Pw=1ms, Single Pulse.
*2 Each terminal mounted on a reference land.
                                                                                       
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© 2019 ROHM Co., Ltd. All rights reserved. 2/6 20190621 - Rev.003
COLLECTOR CURRENT : IC [mA] DC CURRENT GAIN : hFE 400° "000 w w w w ‘ g 7Ta=25"C am)?” E Pulsed 78m “ , T A - >v’ TL.) 800 ‘ 76M7m égg !- rSmA 400 : Z / / / , 74mA § / ’ E E 500 rSmA g‘fiéj:’ , % > /§// 7 0 //5 //// —2mA g 400 / -1o .— 7 /// 8 ,/ 71m If 4 200 / 6| / 0 IF BA .1 o 0 705 ,1 71 5 o -0 5 >1 —1 5 —2 BASE TO EMITTER VOLTAGE : V55 [V] COLLECTOR TO EMITTER VOLTAGE : VCE [V] 1000 1000 E Z < (3="" e="" 100="" 7="" m100="" 0:="" an="" 3="" o="" o="" o="" vcg="72v" pulsed="" 1o="" 10="" ,1="" ,10="" 400="" 4000="" -1="" -10="" -100="" -1="" 000="" collector="" current:="" ic="" [ma]="" collector="" current:="" ic="" [ma]="">
2SB1694     Datasheet
llElectrical characteristic curves(Ta = 25°C)
Fig.1 Ground Emitter Propagation
    Characteristics
Fig.2 Typical Output Characteristics
Fig.3 DC Current Gain
    vs. Collector Current (I)
Fig.4 DC Current Gain
    vs. Collector Current (II)
                                               
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© 2019 ROHM Co., Ltd. All rights reserved. 3/6 20190621 - Rev.003
COLLECTOR—EMITTER BASE-EMITTER o E E ? E ? Lu -o1 '— Lu 4 2 E 2 '3 E '3 9 2 9 z o 2 90,01 Ta=100°C E Q m I— 25°C 4 I- § 740°C 8 § 3 D '2 2 U) U) -o 001 70.01 —1 -10 400 4000 -1 -10 400 4000 COLLECTOR CURRENT: Ic [mA] COLLECTOR CURRENT: IC [mA] 40 woo E E vcg 72v 5 E. v=woMHz E .3; Pulsed ? ; 6 3 < g="" '3="" o="" 100="" o="" '1="" lli=""> n: 2 “2L .9 9 E 5, E E w E 701 1o -1 -I0 400 4000 0-01 OJ 1 COLLECTOR CURRENT: Ic [mA] EMITTER CURRENT: IE [A]
2SB1694     Datasheet
llElectrical characteristic curves(Ta = 25°C)
Fig.5 Collector-Emitter Saturation
    Voltage vs. Collector Current (I)
Fig.6 Collector-Emitter Saturation
    Voltage vs. Collector Current (II)
Fig.7 Base-Emitter Saturation Voltage
    vs. Collector Current
Fig.8 Gain Bandwidth Product vs.
    Emitter Current
                                               
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© 2019 ROHM Co., Ltd. All rights reserved. 4/6 20190621 - Rev.003
COLLECTOR OUTPUT CAPACITANCE . Cub [pF] EMI'I'I'ER INPUT CAPACITANCE ' C‘b [pF] Tl- 15'0 lc-IJA 1'1 MHZ 1 41.1 —1 40 400 COLLECTOR-BASE VOLTAGE : vCB [V] EMITTER-BASE VOLTAGE : vEB [v1 lcl COLLECTOR CURRENT: -0.1 41.01 TII 25°C Sink Pub. 43.501 $.1 71 710 7100 COLLECTOR TO EMITTER VOLTAGE : VCE [V]
2SB1694     Datasheet
llElectrical characteristic curves(Ta = 25°C)
Fig.9 Emitter Input Capacitance
    vs. Emitter-Base Voltage
    Collector Output Capacitance vs.
    Collector-Base Voltage
Fig.10 Safe Operating Area
                                               
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© 2019 ROHM Co., Ltd. All rights reserved. 5/6 20190621 - Rev.003
SOT-323 30-70 ( UMT3 ) C ‘ _g % 4 i i E ‘6» |1 bZ Pattern of terminal positlon areas [Not a patiern oi soldering pads] DIM MILlMETERS INCHES MIN MAX MIN MAX A 0.80 1.00 0.031 0.039 A1 0.00 0.10 0.000 0.004 A3 0.25 0.010 b 025 0.40 0.010 0.016 c 010 0,20 0,004 0.000 D 1.90 2.10 0.075 0.033 E 1.15 1.35 0.045 0.053 e 0.65 0.026 HE 200 220 0079 0087 L1 010 0,40 0,004 0016 La 0.25 0.55 0.010 0.022 0 0.10 0.30 0.004 0.012 x - 0.10 - 0.004 b2 e1 I1 MILIMETERS 0.50 1.55 0 E5 Dimension in mm/inches INCHES
2SB1694     Datasheet
llDimensions
                                               
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© 2019 ROHM Co., Ltd. All rights reserved. 6/6 20190621 - Rev.003
Datasheet (No‘e1) Medical Equipmem Classifica‘ion of me Specific Applicafions JAPAN USA EU CH‘NA CLASS CLASS b CLASS CLASS Notice-PGA-E © 2015 ROHM Co.‘ Ltd Au nghls reserved. Rev. 004
Notice-PGA-E Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
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serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
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(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
CHINA
CLASS
CLASS
CLASS
CLASS
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[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
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[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6.In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.Confirm that operation temperature is within the specified range described in the product specification.
9.ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
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Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Datasheet Notice-PGA-E Rev.004 © 2015 ROHM Co.‘ Ltd AH nghls reserved.
Notice-PGA-E Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
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This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
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isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
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1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
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DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
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