C Series, Gen Appl Spec Datasheet by TDK Corporation

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@TDK acceplame. DATE: YEAR MONTH DAY
SPECIFICATION
SPEC. No.
Customer
DATE
CUSTOMER’S PRODUCT NAME
TDK PRODUCT NAME
MULTILAYER CERAMIC CHIP CAPACITORS
C0603, C1005, C1608, C2012, C3216, C3225, C4532,
C5750 Type / 4V to 50V
C0G, X5R, X7R, Y5V Characteristics
Please sign and return this specification to your local TDK representatives. If orders are
placed without this returned documentation, we must consider you found the specification
acceptable.
THIS SPECIFICATION IS RECEIVED
DATE: YEAR MONTH DAY
ENGINEERING
ISSUED CHECKED APPROVED
DATE DATE DATE
PRODUCT CLASSIFICATION
CODE 040320
REV 0.3 / 201012
Sales Office
Sales Tel.
TDK-EPC Corporation
1-13-1, Nihonbashi, Chuo-ku, Tokyo
103-0027, Japan
@TDK
1 of 34
1. SCOPE
This specification is applicable to chip type multilayer ceramic capacitors with a priority over other relevant
specifications. Production places defined in this specification shall be TDK-EPC Corporation Japan, TDK (Suzhou)
Co., Ltd, TDK-EPC HONG KONG LIMITED, TDK (Malaysia) Sdn. Bhd, and TDK Components U.S.A. Inc.
EXPLANATORY NOTE:
This specification warrants the quality of the TDK ceramic chip capacitor. The product should be evaluated and
confirmed in your product before use. If the use of the product exceeds the bounds of this specification, we can
not guarantee its quality and/ or reliability.
2. CODE CONSTRUCTION
C2012 X7R 1E 105 K T
(Example)
(1) (2) (3) (4) (5) (6)
1. Type
Please refer to product list for the dimension of each product. See Section 9 for inside structure and
material.
2. Temperature Characteristics (Details are shown in table 1 No.7 and No.8 at page 6)
Symbol Rated Voltage
1 H 50 V DC
1 E 25 V DC
1 C 16 V DC
1 A 10 V DC
0 J 6.3 V DC
0 G 4 V DC
3. Rated Voltage
L
B
G
BW
T
Terminal electrode
Ceramic dielectric
Internal electrode
@TDK
2 of 34
4. Rated Capacitance
Stated in three digits and in units of pico farads (pF). The first and second digits identify the first
and second significant figures of the capacitance; the third digit identifies the multiplier.
R is designated for a decimal point.
Example 2R2 2.2pF
105 1,000,000pF
Symbol Tolerance Capacitance
C ± 0.25 pF
D ± 0.5 pF
10pF and under
J ± 5 %
K ± 10 %
M ± 20 %
Z +80, -20 %
Over 10pF
5. Capacitance tolerance
Symbol Packaging
B Bulk
T Taping
6. Packaging
RATING TEMPERATURE RANGE @TDK
3 of 34
3. RATED CAPACITANCE AND CAPACITANCE TOLERANCE
3.1 Standard combination of rated capacitance and tolerances
Class Temperature
Characteristics Capacitance tolerance Rated capacitance
C (±0.25pF) 0.5, 1, 1.5, 2, 2.2, 3, 3.3, 4, 4.7, 5
10pF and
under D (±0.5pF) 6, 6.8, 7, 8, 9, 10
12pF to
10,000pF E – 12 series
1 C0G
Over
10,000pF
J (± 5 %)
K (± 10 %) E – 6 series
10uF and
under
K (± 10 %)
M (± 20 %)
X5R
X7R
Over 10uF M (± 20 %)
E – 6 series
0.1uF and
under E – 1 series
2
Y5V
Over 0.1uF
Z (+80, -20%)
E – 3 series
3.2 Capacitance Step in E series
E series Capacitance Step
E- 1 1.0
E- 3 1.0 2.2 4.7
E- 6 1.0 1.5 2.2 3.3 4.7 6.8
E-12 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2
4. OPERATING TEMPERATURE RANGE
T.C. Min. operating
Temperature
Max. operating
Temperature
Reference
Temperature
X5R -55°C 85°C 25°C
Y5V -30°C 85°C 25°C
X7R
C0G -55°C 125°C 25°C
F, )4 END] 7
4 of 34
5. STORING CONDITION AND TERM
5 to 40°C at 20 to 70%RH
6 months Max.
6. P.C. BOARD
When mounting on an aluminum substrate, large case sizes such as C3225,
C4532 and C5750 types are more likely to be affected by heat stress from the
substrate. Please inquire separate specification for the large case sizes when
mounted on the substrate.
7. INDUSTRIAL WASTE DISPOSAL
Dispose this product as industrial waste in accordance with local Industrial Waste Laws.
g .0 8 @TDK
5 of 34
8. PERFORMANCE
No. Item Performance Test or inspection method
1 External Appearance No defects which may affect
performance.
Inspect with magnifying glass (3×), in case
of C0603 type, with magnifying glass (10×)
2 Insulation Resistance 10,000M or 500M·μF min.
(As for the capacitors of rated
voltage 16, 10 and 6.3V DC, 10,000
M or 100M·μF min.,)
whichever smaller.
Apply rated voltage for 60s. As for the
rated voltage 630V DC, apply 500V DC.
Class Apply voltage
Class 1 3 × rated voltage
Class 2 2.5 × rated voltage
3 Voltage Proof Withstand test voltage without
insulation breakdown or other
damage.
Above DC voltage shall be applied for 1 to 5s.
Charge / discharge current shall not exceed 50mA.
Class Rated
Capacitance
Measuring
frequency
Measuring
voltage
1000pF and
under 1MHz±10%
Class 1
Over 1000pF 1kHz±10%
0.5 - 5 Vrms.
0.5±0.2Vrms.
10uF and
under 1kHz±10%
1.0±0.2Vrms.
Class 2
Over 10uF 120Hz±20% 0.5±0.2Vrms.
4 Capacitance Within the specified capacitance
tolerance.
Rated Capacitance Q
30pF and over 1,000 min.
Under 30pF 400+20×C min.
5 Q
(Class 1)
C : Rated capacitance (pF)
See No.4 in this table for measuring
condition.
T. C. Rated
voltage D.F.
X5R
X7R ------
0.03 max.
0.05 max.
0.075 max.
0.1 max.
0.125 max.
0.15 max.
50V DC 0.05 max.
25V DC 0.075 max.
16V DC 0.10 max.
10V DC 0.125 max.
Y5V
6.3V DC 0.20 max
6 Dissipation Factor
(Class 2)
See No.4 in this table for measuring
condition.
10 Bendmg N0 mechanical damage. Rellow soldert board (shown \ Appendix 2b) a @TDK
6 of 34
(8. Performance, continued)
No. Item Performance Test or inspection method
T.C. Temperature Coefficient
(ppm/°C)
C0G 0 ± 30
7 Temperature
Characteristics
of Capacitance
(Class 1)
Capacitance drift
Within ± 0.2% or ±0.05pF, whichever larger.
Temperature coefficient shall be
calculated based on values at 25°C and
85°C temperature.
Measuring temperature below 20°C shall
be -10°C and -25°C.
Capacitance Change (%)
No voltage applied
X5R :
X7R :
Y5V :
±15%
±15%
+22%, -82%
8
Temperature
Characteristics
of Capacitance
(Class 2)
Capacitance shall be measured by the
steps shown in the following table after
thermal equilibrium is obtained for each
step.
C be calculated ref. STEP 3 reading
Measuring voltage: 0.1, 0.2, 0.5, 1.0Vrms.
9 Robustness of
Term ina t io ns
No sign of termination coming off,
breakage of ceramic, or other
abnormal signs.
Reflow solder the capacitor on P.C.
board (shown in Appendix 1a or
Appendix 1b) and apply a pushing force
of 2N (C0603, C1005) or 5N (C1608,
C2012, C3216, C3225, C4532, C5750)
for 10±1s.
10 Bending No mechanical damage.
Reflow solder the capacitor on P.C.
board (shown in Appendix 2a or
Appendix 2b) and bend it for 1mm.
(Unit: mm)
Pushing force
P.C. board
Capacitor
1
20
50 F
R230
45 45
Step Temperature(°C)
1 Reference temp. ± 2
2 Min. operating temp. ± 2
3 Reference temp. ± 2
4 Max. operating temp. ± 2
(8. Performance, continued) No. Item 11 Solderabihty {\lew‘sol‘ ermlna 25% ma spots b spot. Ceramic shall not melting material @TDK
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(8. Performance, continued)
No. Item Performance Test or inspection method
11 Solderability New solder to cover over 75% of
termination.
25% may have pinholes or rough
spots but not concentrated in one
spot.
Ceramic surface of A sections
shall not be exposed due to
melting or shifting of termination
material.
Completely soak both terminations in
solder at 235±5°C for 2±0.5s.
Solder: H63A (JIS Z 3282)
Flux: Isopropyl alcohol (JIS K 8839)
Rosin(JIS K 5902) 25% solid
solution.
External
appearance
No cracks are allowed and
terminations shall be covered at
least 60% with new solder.
Characteristics Change from the
value before test
Class 1 C0G
Capacitance drift
within ±2.5% or
±0.25pF,
whichever larger.
Class 2
X5R
X7R
Y5V
± 7.5 %
± 7.5 %
± 20 %
Capacitance
Rated Capacitance Q
30pF and over 1,000 min.
Under 30pF 400+20×C min.
Q
(Class 1)
C : Rated capacitance (pF)
D.F.
(Class 2) Meet the initial spec.
Insulation
Resistance Meet the initial spec.
12 Resistance
to solder
heat
Voltage
proof
No insulation breakdown or
other damage.
Completely soak both terminations in
solder at 260±5°C for 5±1s.
Preheating condition
Temp.: 150±10°C
Time: 1 to 2min.
Flux: Isopropyl alcohol (JIS K 8839)
Rosin (JIS K 5902) 25% solid
solution.
Solder: H63A (JIS Z 3282)
Leave the capacitor in ambient
conditions for 6 to 24h (Class 1) or 24±2h
(Class 2) before measurement.
A section
@TDK
8 of 34
(8. Performance, continued)
No. Item Performance Test or inspection method
External
appearance No mechanical damage.
Characteristics Change from the
value before test
Class1 C0G ±2.5% or ±0.25pF,
whichever larger.
Class2
X5R
X7R
Y5V
± 7.5 %
± 7.5 %
± 20 %
Capacitance
Rated Capacitance Q
30pF and over 1,000 min.
Under 30pF 400+20×C min.
Q
(Class 1)
C : Rated capacitance (pF)
13 Vibration
D.F.
(Class 2) Meet the initial spec.
Reflow solder the capacitor on P.C.
board (shown in Appendix 1a or
Appendix 1b) before testing.
Vibrate the capacitor with amplitude of
1.5mm P-P changing the frequencies
from 10Hz to 55Hz and back to 10Hz
after 1min. Repeat this for 2h each in 3
perpendicular directions.
External
appearance No mechanical damage.
Characteristics Change from the
value before test
Class1 C0G ±2.5% or ±0.25pF,
whichever larger.
Class2
X5R
X7R
Y5V
± 15 %
± 15 %
± 20 %
Capacitance
Rated Capacitance Q
30pF and over 1,000 min.
Under 30pF 400+20×C min.
Q
(Class 1)
C : Rated capacitance (pF)
D.F.
(Class 2) Meet the initial spec.
Insulation
Resistance Meet the initial spec.
14 Temperature
cycle
Voltage
proof No insulation breakdown or
other damage.
Reflow solder the capacitor on P.C.
board (shown in Appendix 1a or
Appendix 1b) before testing.
Expose the capacitor in the condition
step1 through step 4 and repeat 5 times
consecutively.
Leave the capacitor in ambient
conditions for 6 to 24h (Class 1) or
24±2h (Class 2) before measurement
Step Temperature(°C) Time (min.)
1 Min. operating
temp. ±3 30 ± 3
2 Reference Temp. 2 - 5
3 Max. operating
temp. ± 2 30 ± 2
4 Reference Temp. 2 - 5
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(8. Performance, continued)
No. Item Performance Test or inspection method
External
appearance No mechanical damage.
Characteristics Change from the
value before test
Class 1 C0G ±5% or ±0.5pF,
whichever larger.
Class 2
X5R
X7R
Y5V
± 25 %
± 25 %
± 30 %
Capacitance
Rated Capacitance Q
30pF and over 350 min.
10pF and over
under 30pF 275+5/2×C min.
Under 10pF 200+10×C min.
Q
(Class1)
C : Rated capacitance (pF)
D.F.
(Class2)
Characteristics
X5R: 200% of initial spec. max.
X7R: 200% of initial spec. max
Y5V: 150% of initial spec. max
15 Moisture
Resistance
(Steady
State)
Insulation
Resistance
1,000M or 50M·μF min.
(As for the capacitors of rated
voltage 16, 10 and 6.3V DC, 1,000
M or 10M·μF min.,)
whichever smaller.
Reflow solder the capacitor on P.C.
board (shown in Appendix 1a or
Appendix 1b) before testing.
Leave at temperature 40±2°C, 90 to
95%RH for 500 +24,0h.
Leave the capacitor in ambient
conditions for 6 to 24h (Class 1) or
24±2h (Class 2) before measurement.
0 Rated capacuance 1pm @TDK
10 of 34
(8. Performance, continued)
No. Item Performance Test or inspection method
External
appearance No mechanical damage.
Characteristics Change from the
value before test
Class 1 C0G ±7.5% or ±0.75pF,
whichever larger.
Class 2
X5R
X7R
Y5V
± 25 %
± 25 %
± 30 %
*( ± 40 % )
Capacitance
* Inside ( ) is applied to Y5V 6.3V product.
Rated Capacitance Q
30pF and over 200 min.
Under 30pF 100+10/3×C min.
Q
(Class 1)
C : Rated capacitance (pF)
D.F.
(Class 2)
Characteristics
X5R: 200% of initial spec. max.
X7R: 200% of initial spec. max
Y5V: 150% of initial spec. max
16 Moisture
Resistance
Insulation
Resistance
500M or 25M·μF min.
(As for the capacitors of rated
voltage 16, 10 and 6.3V DC, 500
M or 5M·μF min.,)
whichever smaller.
Reflow solder the capacitor on P.C.
board (shown in Appendix 1a or
Appendix 1b) before testing.
Apply the rated voltage at temperature
40±2°C and 90 to 95%RH for 500
+24,0h.
Charge/discharge current shall not
exceed 50mA.
Leave the capacitor in ambient
conditions for 6 to 24h (Class 1) or
24±2h (Class 2) before measurement.
Voltage conditioning (only for Class 2)
Voltage treat the capacitor under
testing temperature and voltage for 1
hour.
Leave the capacitor in ambient
conditions for 24±2h before
measurement.
Use this measurement for initial value.
@TDK
11 of 34
(8. Performance, continued)
No. Item Performance Test or inspection method
External
appearance
No mechanical damage.
Characteristics Change from the value
before test
Class 1 C0G ±3% or ±0.3pF,
whichever larger.
Class 2
X5R
X7R
Y5V
± 25 %
± 25 %
± 30 %
*( ± 40 % )
Capacitance
* Inside ( ) is applied to Y5V 6.3V product.
Rated Capacitance Q
30pF and over 350 min.
10pF and over
under 30pF 275+5/2×C min.
Under 10pF 200+10×C min.
Q
(Class 1)
C : Rated capacitance (pF)
D.F.
(Class 2)
Characteristics
X5R: 200% of initial spec. max.
X7R: 200% of initial spec. max
Y5V: 150% of initial spec. max
17 Life
Insulation
Resistance
1,000M or 50M·μF min.
(As for the capacitors of rated
voltage 16, 10 and 6.3V DC, 1,000
M or 10M·μF min.,)
whichever smaller.
Reflow solder the capacitor on P.C.
board (shown in Appendix 1a or
Appendix 1b) before testing.
Below the voltage shall be applied at
125±2°C for 1,000 +48, 0h.
Charge/discharge current shall not
exceed 50mA.
Leave the capacitor in ambient
conditions for 6 to 24h (Class 1) or
24±2h (Class 2) before measurement.
Voltage conditioning (only for class 2)
Voltage treat the capacitor under
testing temperature and voltage for 1
hour.
Leave the capacitor in ambient
conditions for 24±2h before
measurement.
Use this measurement for initial value.
*As for the initial measurement of capacitors (Class2) on number 8,12,13,14 and 15, leave capacitor at
150 –10, 0°C for 1 hour and measure the value after leaving capacitor for 24±2h in ambient conditions.
Applied voltage
Rated voltage x2
Rated voltage x1.5
Rated voltage x1.2
Rated voltage x1
Appendix - la P. . Board for reliability test Applied lor COGOCL C1005. 01608, 02012 C32l6 100 Solder resist C r (Uml mm) P.C. Board for reliability test Appendix - 2a P.C. Board for bending test Applied lo! C0603. 01005 Appendix — 2b P.C. Board for bending test Applied lor C1608( C2012, 03216, 03225 C453 1.0 \ \ Solder reslsl Copper DU TDK (ElA style) Emmy?“ 00603 (000201) 0.3 0.8 01005 (000402) 0.4 1.5 C1608 (000603) 1.0 3.0 02012 (000805) 1.2 4.0 03216 (CC1206) 2.2 5.0 03225 (001210) 2.2 5.0 04532 (001812) 3.5 7.0 05750 (002220) 4.5 8.0 @TDK
12 of 34
Dimensions (mm)
TDK (EIA style) a b c
C0603 (CC0201) 0.3 0.8 0.3
C1005 (CC0402) 0.4 1.5 0.5
C1608 (CC0603) 1.0 3.0 1.2
C2012 (CC0805) 1.2 4.0 1.65
C3216 (CC1206) 2.2 5.0 2.0
C3225 (CC1210) 2.2 5.0 2.9
C4532 (CC1812) 3.5 7.0 3.7
C5750 (CC2220) 4.5 8.0 5.6
Appendix - 2a
P.C. Board for bending test
Applied for C0603, C1005
1.0
c
40
a
b
100
Copper
Solder resist
Appendix - 2b
P.C. Board for bending test
Applied for C1608, C2012, C3216, C3225, C4532, C5750
1.0
c
40
a
b
100
Copper
Solder resist
Appendix - 1a
P.C. Board for reliability test
Applied for C0603, C1005, C1608, C2012, C3216
100
c
a
b
40
Copper
Solder resist
(
Unitmm
)
Appendix - 1b
P.C. Board for reliability test
Applied for C3225, C4532, C5750
100
c
a
b
40
Copper
Solder resist
Slit
(Unit : mm)
(Unit : mm) (Unit : mm)
Material : Glass Epoxy ( As per JIS C6484 GE4 )
P.C. Board thickness : Appendix-2a 0.8mm
Appendix-1a, 1b, 2b 1.6mm
Copper ( thickness 0.035mm )
Solder resist
b
@TDK
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9. INSIDE STRUCTURE AND MATERIAL
MATERIAL
No. NAME Class 1 Class 2
1 Dielectric CaZrO3 BaTiO3
2 Electrode Nickel (Ni)
3 Copper (Cu)
4 Nickel (Ni)
5
Termination
Tin (Sn)
10. RECOMMENDATION
As for C3225, C4532 and C5750 types, it is recommended to provide a slit (about 1mm wide)
in the board under the components to improve washing flux. Please make sure to completely
remove all cleaning solvents.
11. SOLDERING CONDITION
For C1608 (CC0603) ~ C3216 (CC1206) case size, TDK recommends reflow or wave soldering.
Smaller case sizes, C0603 (CC0201) ~ C1005 (CC0402), and larger case sizes, C3225
(CC1210) ~ C5750 (CC2220), should use reflow solder only. See “Caution” Section No.3 for
details.
3
4
5
1 2
1 .1 lorage 2.1 Operating temperature applied. Especially at may damage maxlmum he e
14 of 34
12. Caution
No. Process Condition
1.1 Storage
1.
2.
3.
4.
5.
The capacitor must be stored in an ambient temperature of 5 to 40°C with a
relative humidity of 20 to 70%RH. The product should be used within 6 months
upon receipt.
The capacitor must be operated and stored in an environment free of
condensation and corrosive gases such as hydrogen sulphide, hydrogen
sulphate, chlorine, ammonia and sulfur.
Avoid storing in sun light and falling of dew.
Do not use capacitor under high humidity and high/low atmospheric pressure
which may compromise product reliability.
Capacitor should be tested for solderability when stored for long periods of time.
1.2 Handling in transportation
1 Operating
Condition
(Storage,
Transportation)
In case of the transportation, the performance of the capacitor may be
deteriorated depending on the transportation condition. (Refer to JEITA
RCR-2335B 9.2 “Handling in transportation”)
2.1 Operating temperature
Operating temperature should be followed strictly within this specification.
1.
2.
3.
Do not use capacitors above the maximum allowable operating temperature.
Surface temperature including self heating should be below maximum operating
temperature.
(Due to dielectric loss, capacitors will heat itself when AC is applied. Especially a
t
high frequencies around its SRF, the heat might be so extreme that it may damag
e
itself or the product it’s mounted on. Please design the circuit so that the maximum
temperature of the capacitors (including the self heating) will be below th
e
maximum allowable operating temperature. Temperature rise at capacitor surfac
e
shall be below 20°C)
The electrical characteristics of the capacitor will vary depending on the
temperature. The capacitor should be selected and designed after taking
temperature into consideration.
2.2 Operating voltage
1. Operating voltage across the terminals should be below the rated voltage.
When AC and DC are super imposed, V0-P must be below the rated voltage.
Reference figures 1 and 2 below. AC or pulse with overshooting, VP-P must be
below the rated voltage. Reference figures 3, 4, and 5 below. When the
voltage is started/stopped to the circuit an irregular voltage may be generated for
a transit period because of resonance or switching. Be sure to use the capacitor
within rated voltage during these Irregular voltage periods.
Voltage (1) DC voltage (2) DC+AC voltage (3) AC voltage
Positional
Measurement
(Rated voltage)
V0-P
0
V0-P
0
VP-P
Voltage (4) Pulse voltage (A) (5) Pulse voltage (B)
2 Circuit design
Positional
Measurement
(Rated voltage)
VP-P
VP-P
0
0
0
A Flow so1dering Type C1608 02012 as Symbo‘ [CC0603] [CC0805] [CC1 A 0.7-1.0 1.0-1.3 2.1 B 0.8-1.0 1.0-1.2 1.1 C 0.6-0.8 0.8-1.1 1.0 Reflow soldering Type C0603 C1005 C1608 Symbol [CC0201] [C00402] [CC0603] A 0.25 - 0.35 0.3 - 0.5 0.6 - 0.8 B 0.2 - 0.3 0.35 - 0.45 0.6 - 0.8 C 0.25 - 0.35 0.4 - 0.6 0.6 - 0.8 Type C3216 C3225 C4532 Symbol [CC1206] [come] [comm] A 2.0-2.4 2.0-2.4 3.1 -3.7 B 1.0-1.2 1.0-1.2 1.2-1.4 C 1.1-1.6 1.9-2.5 2.4-3.2 @TDK
15 of 34
(12. Caution, continued)
No. Process Condition
2.2
2.
3.
Operation Voltage (continued)
Even below the rated voltage, if repetitive high AC frequency or pulsed voltage is
applied, the reliability of the capacitors may be reduced.
The effective capacitance will vary depending on applied DC and AC voltages.
The capacitor should be selected after considering the voltage affects.
2.3 Frequency
2 Circuit design
When Class 2 capacitors are used in AC and/or pulsed voltages, the capacitors
may self vibrate and generate audible sound (piezoelectric affect).
The amount of solder at the terminations has a direct effect on the reliability of the
capacitor.
1.
2.
3.
The greater the amount of solder, the higher the stress on the chip capacitor,
and the more likely that it will break. When designing a P.C. board, determine
the shape and size of the solder lands to have proper amount of solder on the
terminations.
Avoid using common solder land for multiple terminations and provide individual
solder land for each termination instead.
Size and recommended land dimensions provided below:
Flow soldering (mm)
Type
Symbol
C1608
[CC0603]
C2012
[CC0805]
C3216
[CC1206]
A 0.7 - 1.0 1.0 - 1.3 2.1 - 2.5
B 0.8 - 1.0 1.0 - 1.2 1.1 - 1.3
C 0.6 - 0.8 0.8 - 1.1 1.0 - 1.3
3 Designing
P. C . B o a r d
Reflow soldering (mm)
Type
Symbol
C0603
[CC0201]
C1005
[CC0402]
C1608
[CC0603]
C2012
[CC0805]
A 0.25 - 0.35 0.3 - 0.5 0.6 - 0.8 0.9 - 1.2
B 0.2 - 0.3 0.35 - 0.45 0.6 - 0.8 0.7 - 0.9
C 0.25 - 0.35 0.4 - 0.6 0.6 - 0.8 0.9 - 1.2
Type
Symbol
C3216
[CC1206]
C3225
[CC1210]
C4532
[CC1812]
C5750
[CC2220]
A 2.0 - 2.4 2.0 - 2.4 3.1 - 3.7 4.1 - 4.8
B 1.0 - 1.2 1.0 - 1.2 1.2 - 1.4 1.2 - 1.4
C 1.1 - 1.6 1.9 - 2.5 2.4 - 3.2 4.0 - 5.0
A
B
C
Chi
p
ca
p
acitor Solder land
Solder resist
KW K Mounting \ face Break P.C. board With Break P.C. board with mounted side up. mounted side down. Mount perpendiculariy to Mount in parallei With perforation or slit perforation or siit Perforation or slit Perforation or siit Chip 1 l‘ i arrangement P i (Direction) [U E Distance from slit Closer to slit is higher stress Away from slit is less stres (li<(2) @tdk="">
16 of 34
(12. Caution, continued)
No. Process Condition
4. Recommended chip capacitor layout is provided below:
Disadvantage against
bending stress
Advantage against
bending stress
Mounting
face
Perforation or slit
Break P.C. board with
mounted side up.
Perforation or slit
Break P.C. board with
mounted side down.
Chip
arrangement
(Direction)
Mount perpendicularly to
perforation or slit
Perforation or slit
Mount in parallel with
perforation or slit
Perforation or slit
Distance from
slit
Closer to slit is higher stress
1
( 1 < 2 )
Away from slit is less stress
2
( 1 < 2 )
3 Designing
P. C . B o a r d
The relative stress apphed to these capacitors durmg depaneling is m the (0 order: A > B = C > D > E 6. Layout recommendation . . Use of com Example USI: otloorgmon Src‘zldeljlng With solder Ian so er an o assls otherSM Lead LIE Chas Need to / avoid D Excessive so FCE Adhesive ‘ t —»,—‘<_ some="" \and="" l1="" m="" \ssin="" solderg="" solder="" land="" lead="" we="" solder="" res="" solder="" reswst="" [7="" reoommen-="" fl="" datwon="" [26="" so‘der="" res="" t="" “="" fl="" @tdk="">
17 of 34
(12. Caution, continued)
No. Process Condition
5. Mechanical stress varies according to location of chip capacitors on the P.C. board.
The relative stress applied to these capacitors during depaneling is in the following
order:
A > B = C > D > E
3 Designing
P. C . B o a r d
(continued)
6. Layout recommendation
Example Use of common
solder land
Soldering with
chassis
Use of common
solder land with
other SMD
Need to
avoid
Recommen-
dation
Solder
land
Excessive solder
Missing
solder
Solder land
Lead wire
Solder resist
A
C
D
B
E
Slit
Perforation
Solder resis
t
Lead wire
Solder
Chi
p
Solder land
Adhesive
PCB
Chassis
1
Excessive solder
Solder resist
2 > 1
2
(12. Caution, continued) Single sided Crack mounting V T 2' Support pin Double-sided E mm W W Solder ) f /' peeling CraCk Support pin When the centering jaw is worn mechanical impact on the capacitor may occur and damage the product. Please control the closing dimension of the centering jaw and provide sufficient preventive maintenance and/or replacement if necessary. 4.2 Amount of adhesive —:i_‘_.: Example: c2012 (ccosos), c3216 (come) 0.2mm min. 70 - lOOum Do not touch the solder land @TDK
18 of 34
(12. Caution, continued)
No. Process Condition
4 4.1 Stress from mounting head
If the mounting head is adjusted too low, it may induce excessive stress on the
chip capacitor and result in cracking. Please take following precautions.
1.
2.
3.
Adjust the bottom dead center of the mounting head to reach the P.C. board
surface but do not contact it.
Adjust the mounting head pressure to be 1 to 3N of static weight.
To minimize the impact energy from mounting head, it is important to provide
support from the bottom side of the P.C. board.
See following examples.
Not recommended Recommended
Single sided
mounting
Double-sided
mounting
When the centering jaw is worn mechanical impact on the capacitor may occur and
damage the product. Please control the closing dimension of the centering jaw and
provide sufficient preventive maintenance and/or replacement if necessary.
4.2 Amount of adhesive
Example : C2012 (CC0805), C3216 (CC1206)
a 0.2mm min.
b 70 - 100μm
c Do not touch the solder land
Mounting
Crac
k
Solder
peeling Crac
k
Support pin
Support pin
aa
b
cc
‘ Nalural cuollngl Fvenealmg I ‘ ‘ ‘ Preheallng ‘ l F l I G . HE) _ . g 0 Over EU sec auu Temp. ("0) u Ovevfifl sec Oversu sec Manual soldering (Solder lron) APPLICATlON AT Prehea lng 35st: (As shon as passmle, 5.3 Recommended soldering peak temp and dura Temp/Duration Wave soldemg Solder Peak lemp(°C) Durallon Sn-Pb Solder 250 max. 3 ma Lead Free Solder 260 max. 5 ma Recommended solder compositions Sn-37Pb (Sn-Pb solder) Sn-3.0Ag-0.50u (Lead Free Solder) @TDK
19 of 34
(12. Caution, continued)
No. Process Condition
5.1 Flux selection
Although highly-activated flux gives better solderability, substances which increase
activity may also degrade the insulation of the chip capacitor. To avoid such
degradation, the following is recommended.
1.
2.
3.
Use a mildly activated rosin flux (less than 0.1wt% chlorine).
Excessive flux must be avoided. Please provide proper amount of flux.
When water-soluble flux is used, sufficient washing is necessary.
5.2 Recommended soldering profile by various methods
5.3 Recommended soldering peak temp and duration
Wave soldering Reflow soldering
Temp./Duration
Solder Peak temp(°C) Duration(sec.) Peak temp(°C) Duration(sec.)
Sn-Pb Solder 250 max. 3 max. 230 max. 20 max.
Lead Free Solder 260 max. 5 max. 260 max. 10 max.
5 Soldering
Recommended solder compositions
Sn-37Pb (Sn-Pb solder)
Sn-3.0Ag-0.5Cu (Lead Free Solder)
T
Preheatin
g
3sec. (As short as possible)
0
Te m p .. (°C)
300
Manual soldering
(Solder iron) APPLICATION
As for C1608 (CC0603), C2012 (CC0805)
and C3216 (CC1206), applied to wave
soldering and reflow soldering.
As for C0603 (CC0201), C1005 (CC0402),
C3225 (CC1210), C4532 (CC1812), C5750
(CC2220), applied only to reflow soldering.
0
T
Over 60 sec.
Natural cooling
Preheating Soldering
Reflow soldering
P
ea
k
Te m p
Te m p .. (°C)
Peak Temp time
0
Peak Temp time
Over 60 sec.
Over 60 sec.
Tem p . ( °C )
T
P
ea
k
Tem p
Natural cooling
Soldering
Preheating
Wave soldering
ion, continued) 5.4 Avoiding thermal shock 1- Preheating condition Soldering Wave soldering Rellow soldering Manual soldering 000000000000 2. Cooling condition Natural cooling using airi cleaning. the temperature 5.5 Amount of solder Excessive solder WIII ind temperature changes an detach the capacitor lrorn 7W Excessive I Adequate solder Maximum amount Minimum amount Insufficient solder 7 5.6 Solder repair by solder iron 1. Selection of the soldering Tip temperatures of solder land sizes. Higher temper shock may cause a crack temperature belore solder accordance With lollowmg capacitors With the conditi Recommended solder ir Temp. (”C) D 300 max. @TDK
20 of 34
(12. Caution, continued)
No. Process Condition
5.4 Avoiding thermal shock
Preheating condition
Soldering Type Temp. (°C)
Wave soldering C1608(CC0603), C2012(CC0805),
C3216(CC1206) T 150
C0603(CC0201), C1005(CC0402),
C1608(CC0603), C2012(CC0805),
C3216(CC1206)
T 150
Reflow soldering
C3225(CC1210), C4532(CC1812),
C5750(CC2220) T 130
C0603(CC0201), C1005(CC0402),
C1608(CC0603), C2012(CC0805),
C3216(CC1206)
T 150
1.
Manual soldering
C3225(CC1210), C4532(CC1812),
C5750(CC2220) T 130
2. Cooling condition
Natural cooling using air is recommended. If the chips are dipped into a solvent for
cleaning, the temperature difference (T) must be less than 100°C.
5.5 Amount of solder
Excessive solder will induce higher tensile force on the chip capacitor during
temperature changes and may result in chip cracking. Insufficient solder may
detach the capacitor from the P.C. board.
Excessive
solder
Higher tensile force on
the chip capacitor may
cause cracking.
Adequate
solder
Insufficient
solder
Small solder fillet may
cause contact failure or
failure to hold the chip
capacitor to the P.C.
board.
5.6 Solder repair by solder iron
1. Selection of the soldering iron tip
Tip temperatures of solder iron vary by its type, P.C. board material and solder
land sizes. Higher temperatures may provide quicker operation; however, heat
shock may cause a crack in the chip capacitor. Please make sure the tip
temperature before soldering and keep the peak temperature and time in
accordance with following recommended condition. (Please preheat the chip
capacitors with the condition in 5.4 to avoid the thermal shock.)
Recommended solder iron condition (Sn-Pb Solder and Lead Free Solder)
Temp. (°C) Duration (sec.) Wattage (W) Shape (mm)
300 max. 3 max. 20 max. Ø 3.0 max.
5 Soldering
(continued)
Maximum amoun
t
Minimum amoun
t
@TDK
21 of 34
(12. Caution, continued)
Process Condition
2.
Direct contact of the soldering iron with ceramic dielectric of the chip capacitor may
cause cracking. Do not touch the ceramic dielectric and the terminations by solder
iron.
5 Soldering
(continued)
5.7 Sn-Zn solder
Sn-Zn solder affects product reliability.
Please contact TDK in advance when utilize Sn-Zn solder.
5.8 Countermeasure for tombstone
The misalignment between the mounted positions of the capacitors and the land
patterns should be minimized. The tombstone phenomenon may occur especially
when the capacitors are mounted (in longitudinal direction) in the same direction of
the reflow soldering. (Refer to JEITA RCR-2335B Annex 1 “Recommendations to
prevent the tombstone phenomenon”.)
1.
2.
If an unsuitable cleaning fluid is used, flux residue or some foreign articles may
stick to the chip capacitor surface and deteriorate insulation resistance.
If cleaning condition is not suitable, it may deteriorate the chip capacitor’s insulation
resistance.
2.1 Insufficient washing
1.
2.
3.
Terminal electrodes may be corroded by Halogen in the flux.
Halogen in the flux may adhere on the surface of capacitor, and lower the
insulation resistance.
Water soluble flux has higher tendency to have above mentioned
problems (1) and (2).
2.2 Excessive washing
When ultrasonic cleaning is used, excessively high energy output can affect
the connection between the ceramic chip capacitor's body and the terminal
electrode. To avoid the, following is recommended.
Power: 20 W/ max.
Frequency: 40 kHz max.
Washing time: 5 minutes max.
6 Cleaning
2.3 If the cleaning fluid is contaminated, density of Halogen can increase, and bring the
same result as insufficient cleaning.
2. When lunctronal check of the P.C. board is performed. to be used for fear of \oose contact. But If the pressur the P.C. board, rt may crack the chip capacitor 0r pee adjust the prns according‘y to ensure the P.C. board we n Item Not recommended R Terminatron peering \ Board / :l bending W Check pin ‘7 Check @TDK
22 of 34
(12. Caution, continued)
No. Process Condition
7 Coating and
molding of the
P. C . B oa r d
1.
2.
3.
When the P.C. board is coated, please verify the impact on the capacitor.
Please carefully verify that there is no harmful decomposing or reaction gas
emission during curing which may damage the chip capacitor.
Please verify the curing temperature.
1.
Please pay attention not to bend or distort the P.C. board after soldering otherwise
the chip capacitors may crack.
Bend Twist
2. When functional check of the P.C. board is performed, higher pin pressure tends
to be used for fear of loose contact. But if the pressure is excessive and bends
the P.C. board, it may crack the chip capacitor or peel the termination. Please
adjust the pins accordingly to ensure the P.C. board is not flexed.
Item Not recommended Recommended
Board
bending
8 Handling after
chip mounted
Check pin
Termination
peeling Support pin
Chec
k
pin
ion, continued) Class 2 capacitors have an aging characteristic, whi over time due to crystalline changes that occur in fer consideration should be done in case of a time cons The estimated life and (failure rate) depend on the temperature and voltage applied. This can be calculated by the equation described in “Calculation of the estimated lifetime and the estima decreased by reducing the temperature and the volt guaranteed. The products listed on this specification sheet are intended for use in general electronic equipment (AV equipment, telecommunicati appliances, amusement equipment, oomputer equipm equipment, measurement equipment, industrial robo use condition. The products are not designed or warranted to meet the applications listed below whose performance and/or qu level of safety or reliabi y, or whose failure, malfunctio serious damage to society, person or property. Please responsible for any damage or liability caused by use the applications below or for any other use exceedin forth in this specification sheet: Aerospace/Aviation equipment. Transportation equipm ships, etc.) Medical equipment. Power-generation cont energy-related equipment. Seabed equipment. Transp Public information-processing equipment. Military equ apparatus, burning equipment. Disaster prevention/c Safety equipment. Other applications that are not co applications. When using this product in general-purpose applica to take into consideration securing protection circuit/ circuits, etc., to ensure higher safety. @TDK
23 of 34
(12. Caution, continued)
No. Process Condition
9 Handling of loose
chip capacitors
1.
The chip capacitor may crack if dropped, especially the large case sizes.
Please handle with care and do not use if dropped.
2.
When stacking the P.C. board for storage or handling after soldering, the corner
of the P.C. board may hit the chip capacitors of a neighboring board and cause a
crack.
10 Capacitance aging
Class 2 capacitors have an aging characteristic, which is a decrease in capacitance
over time due to crystalline changes that occur in ferroelectric ceramics. Careful
consideration should be done in case of a time constant circuit.
11 Estimated life and
estimated failure
rate of capacitors
The estimated life and (failure rate) depend on the temperature and voltage applied.
This can be calculated by the equation described in JEITA RCR-2335B Annex 6
Calculation of the estimated lifetime and the estimated failure rate.” The risk can be
decreased by reducing the temperature and the voltage but the failure rate can not be
guaranteed.
12 Others
The products listed on this specification sheet are intended for use in general
electronic equipment (AV equipment, telecommunications equipment, home
appliances, amusement equipment, computer equipment, personal equipment, office
equipment, measurement equipment, industrial robots) under a normal operation and
use condition.
The products are not designed or warranted to meet the requirements of the
applications listed below, whose performance and/or quality require a more stringent
level of safety or reliability, or whose failure, malfunction or trouble could cause
serious damage to society, person or property. Please understand that TDK is not
responsible for any damage or liability caused by use of this product in any of
the applications below or for any other use exceeding the range or conditions set
forth in this specification sheet:
Aerospace/Aviation equipment. Transportation equipment (cars, electric trains,
ships, etc.) Medical equipment. Power-generation control equipment. Atomic
energy-related equipment. Seabed equipment. Transportation control equipment.
Public information-processing equipment. Military equipment. Electric heating
apparatus, burning equipment. Disaster prevention/crime prevention equipment.
Safety equipment. Other applications that are not considered general-purpose
applications.
When using this product in general-purpose applications, you are kindly requested
to take into consideration securing protection circuit/equipment or providing backup
circuits, etc., to ensure higher safety.
Crack
Floor
P.C. board
Crack
@TDK
24 of 34
13. Packaging label
Packaging shall be done to protect the components from the damage during
transportation and storing, and a label which has the following information shall be
attached.
1) Inspection No.
2) TDK P/N
3) Customer's P/N
4) Quantity
*Composition of Inspection No.
Example M 0 AΟΟ ΟΟΟ
(a) (b) (c) (d) (e)
a) Line code
b) Last digit of the year
c) Month and A for January and B for February and so on. (Skip I)
d) Inspection Date of the month.
e) Serial No. of the day
14. Bulk packaging quantity
Total number of components in a plastic bag for bulk packaging: 1,000pcs.
As for C0603 and C1005 types, not available for bulk packaging.
0 Appendix 3, 4. to Appendix 5, 6. i—i—vi—i DVD} DYDYIIIYV IIIHYD'DY/ IZIVIZI // | Drawing direction a LL 400mm mln 3. Dimensions of reel Dimensions of [5178 reel shall be according to Appendix 7, 8. Dimensions of [5330 reel shall be according to Appendix 9, 10. 4. Structure 01 taping @TDK 25““
25 of 34
15. TAPE PACKAGING SPECIFICATION
1. CONSTRUCTION AND DIMENSION OF TAPING
1. Dimensions of carrier tape
Dimensions of paper tape shall be according to Appendix 3, 4.
Dimensions of plastic tape shall be according to Appendix 5, 6.
2. Bulk part and leader of taping
3. Dimensions of reel
Dimensions of Ø178 reel shall be according to Appendix 7, 8.
Dimensions of Ø330 reel shall be according to Appendix 9, 10.
4. Structure of taping
Drawing direction Leader
400mm min
Bulk
160mm
Chi
p
sBulk
160mm min
Paper carrier tape
Pitch hole
To
p
cover ta
p
e
Bottom cover tape
Plastic carrier tape
Top c o ve r ta p e
Pitch hole
@TDK
26 of 34
2. CHIP QUANTITY
Chip quantity (pcs.)
Type Thickness
of chip
Taping
Material φ178mm reel φ330mm reel
C0402 0.20 mm Paper 20,000 -
C0603 0.30 mm Paper 15,000 -
C1005 0.50 mm Paper 10,000 50,000
C1608 0.80 mm Paper 4,000 10,000
0.60 mm 20,000
0.85 mm
Paper
*Plastic 4,000
C2012
1.25 mm Plastic 2,000 10,000
0.60 mm Paper
0.85 mm Paper
*Plastic
4,000
1.15 mm
1.30 mm
10,000
C3216
1.60 mm
Plastic 2,000
8,000
1.15 mm 2,000 10,000
1.25 mm
1.30 mm
1.60 mm
2,000 8,000
2.00 mm
2.30 mm
C3225
2.50 mm
Plastic
1,000 5,000
1.60 mm
2.00 mm 1,000
2.30 mm
2.50 mm
3,000
2.80 mm
C4532
3.20 mm
Plastic
500
2,000
2.00 mm
2.30 mm
2.50 mm
3,000
C5750
2.80 mm
Plastic 500
2,000
@TDK
27 of 34
3. PERFORMANCE SPECIFICATIONS
1. Peel back Cover (top tape)
0.05-0.7N. (See the following figure.)
2. Carrier tape shall be flexible enough to be wound around a minimum radius of 30mm
with components in tape.
3. The missing of components shall be less than 0.1%
4. Components shall not stick to the cover tape.
5. The cover tapes shall not protrude beyond the edges of the carrier tape
not shall cover the sprocket holes.
0~15°
Carrier tape
Top cover tape
Direction of pulling
Direction of cover tape pulling
Pager Tape . 3—111-010-0- "f WEIMHMIBH{11111113131110 ' The values m (he parentheses ( ) are (or reference @TDK Lil H G F (Unit: mm) T Symb0' A B c D E F ype C0603 (@0201) (0.38) (0.68) C1005 005) (115) 8001030 3501005 1751010 2001005 (@0402) ( . . . . . . . . . . C1005/4.7uF (0.71 ) (1.33) Symbol G H J T Type c0003 (CC0201) 0.40 mm. (21005 1010 20010.05 40010.10 (211.5 (cc0402) 0 ((160) c1005/4.7uF
28 of 34
Appendix 3
Paper Tape
(Unit: mm)
Symbol
Type A B C D E F
C0603
(CC0201) ( 0.38 ) ( 0.68 )
C1005
(CC0402) ( 0.65 ) ( 1.15 )
C1005/4.7uF ( 0.71 ) ( 1.33 )
8.00 ± 0.30 3.50 ± 0.05 1.75 ± 0.10 2.00 ± 0.05
Symbol
Type G H J T
C0603
(CC0201) 0.40 min.
C1005
(CC0402)
C1005/4.7uF
2.00 ± 0.05 4.00 ± 0.10 Ø 1.5 +0.10
0 ( 0.60 )
* The values in the parentheses ( ) are for reference.
T
A
J
Pitch hole
HGF
B
E
D C
Pager Tape \ I - 22209.9" 750570751955 D _ ___ _B ___—____________________ __ ll-l H G F (Unit: mm) T Symb0' A B c D E F ype C1608 (CC0603) (1.10) (1.90) C2012 800 030 350 005 175 010 400 010 (CCOSOS) (1.50) (2.30) . t . . x . . t . . t . C3216 (cc1206) (1.90) (3.50) mb°' G H J T Type C1608 (CC0603) 02012 +0.10 (c00305) 2.00: 0.05 4.00 1 0.10 (a 1.5 0 1.10 max. C3216 (cc1206) ' The values 1n (he parentheses ( ) are (or reference @TDK
29 of 34
Appendix 4
Paper Tape
(Unit: mm)
Symbol
Type A B C D E F
C1608
(CC0603) ( 1.10 ) ( 1.90 )
C2012
(CC0805) ( 1.50 ) ( 2.30 )
C3216
(CC1206) ( 1.90 ) ( 3.50 )
8.00 ± 0.30 3.50 ± 0.05 1.75 ± 0.10 4.00 ± 0.10
Symbol
Type G H J T
C1608
(CC0603)
C2012
(CC0805)
C3216
(CC1206)
2.00 ± 0.05 4.00 ± 0.10 Ø 1.5 +0.10
0 1.10 max.
* The values in the parentheses ( ) are for reference.
T HG F
A
C
E
D
Pitch hole J
B
~ W0 Plastic Tage $000040 {>77<>77{>77{>77%§ 4977 ,, (Unit: mm) Symbol Type 02012 (CCOBOS) (1.50) (2.30) 03210 (CC1206) (1.90) 0.00 1 0.30 3.50 ( 3.50 ) 03225 (001210) (2.90) [12.0 x 0.30] [5.50 (3.60) :005 1.75 :t 0.10 4.00 t 0.10 10.05] Symbol Type C2012 (CCOBOS) C3216 (CC1206) 03225 (001210) 2.00 t 0.05 4.00:0.10 (a 1.5 ““0 2.50 max. 0.30 max. 60.50 min. 3.20 max. 0.60 max. ' The vames m me parentheses( )are tor reverence. 'As lor 2.5mm thwckness products. apply values m me brackem 1. @TDK
30 of 34
Appendix 5
Plastic Tape
(Unit: mm)
Symbol
Type A B C D E F
C2012
(CC0805) ( 1.50 ) ( 2.30 )
C3216
(CC1206) ( 1.90 ) ( 3.50 )
C3225
(CC1210) ( 2.90 ) ( 3.60 )
8.00 ± 0.30
[12.0 ± 0.30]
3.50 ± 0.05
[5.50 ± 0.05]
1.75 ± 0.10 4.00 ± 0.10
Symbol
Type G H J K t Q
C2012
(CC0805)
C3216
(CC1206)
2.50 max. 0.30 max.
C3225
(CC1210)
2.00 ± 0.05 4.00 ± 0.10 Ø 1.5 +0.10
0
3.20 max.
0.60 max.
Ø 0.50 min.
* The values in the parentheses ( ) are for reference.
* As for 2.5mm thickness products, apply values in the brackets [ ].
t
K
HGF
A
C
E
D
Pitch hole J
B
Q
619 0 ea <19 69="" eb="" e1="" a="" d‘="" b="" 7="" 777777="" 707""="">< 7="" 77777="">< 77777="" w="" h="" h="" g="" f="" k="" typesymbol="" a="" b="" c="" d="" 04532="" (ccmz)="" (3.60)="" (4.90)="" 05750="" 12.0="" 1="" 0.30="" 5.50="" x="" o.="" (cczzzo)="" (5.40)="" (6.10)="" typesymbol="" g="" h="" j="" k="" 04532="" w="" 2.001005="" 4.00:0.10="" (a="" 1.5="" ““0="" 6.50="" ma="" c5750="" 0="" (cczzzo)="" '="" the="" vames="" m="" me="" parentheses="" (="" )="" are="" tor="" reverence.="" @tdk="">
31 of 34
Appendix 6
Plastic Tape
(Unit: mm)
Symbol
Type A B C D E F
C4532
(CC1812) ( 3.60 ) ( 4.90 )
C5750
(CC2220) ( 5.40 ) ( 6.10 )
12.0 ± 0.30 5.50 ± 0.05 1.75 ± 0.10 8.00 ± 0.10
Symbol
Type G H J K t Q
C4532
(CC1812)
C5750
(CC2220)
2.00 ± 0.05 4.00 ± 0.10 Ø 1.5 +0.10
0 6.50 max. 0.60 max. Ø 1.50 min.
* The values in the parentheses ( ) are for reference.
t
K
HGF
A
C
E
D
Pitch hole J
B
Q
(Unit: mm) Symbol A B C D E Wl Dlmension 0178120 [56012.0 [51310.5 [52110.8 2010.5 9010.3 Symbol W2 r Dlmension 13.0 11.4 1.0 Appendix 8 03225. 04532. 05750 (As tor 03225 type. appned to 2.5mm lhlckness products) (Malenal, Polystyrene) * B (Unit: mm) Symbol A B C D E Wl Dlmension 0178120 [56012.0 lZl1310.5 [52110.8 2.010.5 13010.3 Symbol W2 r Dlmension 17.0 11.4 1.0 @TDK 3““
32 of 34
Appendix 7
C0603, C1005, C1608, C2012, C3216, C3225 (As for C3225 type, any thickness of the item except 2.5mm)
(Material: Polystyrene)
(Unit: mm)
Symbol A B C D E W1
Dimension Ø178 ± 2.0 Ø60 ± 2.0 Ø13 ± 0.5 Ø21 ± 0.8 2.0 ± 0.5 9.0 ± 0.3
Symbol W2 r
Dimension 13.0 ± 1.4 1.0
Appendix 8
C3225, C4532, C5750 (As for C3225 type, applied to 2.5mm thickness products)
(Material: Polystyrene)
(Unit: mm)
Symbol A B C D E W1
Dimension Ø178 ± 2.0 Ø60 ± 2.0 Ø13 ± 0.5 Ø21 ± 0.8 2.0 ± 0.5 13.0 ± 0.3
Symbol W2 r
Dimension 17.0 ± 1.4 1.0
B
W1
A
E
C
D
r
W2
B
W1
A
E
C
D
r
W2
Symbol A B C D E 0382 max. Dlmenslon (Nomlnal [350 mm. [313 t 0.5 @211 0.8 2.0 1 2:330) Symbol t r Dlmension 2.0 :t 0.5 1.0 Appendix 1 0 (33225. C4532. C5750 (AS Vor C3225 type, applled to 2,5mm lhlckness p (Material. Polystyrene) l Symbol A B C D 0382 max. Dlmenslon (Nomlnal [350 mm. [313 t 0.5 [321 t 0.8 2:330) Symbol t r Dlmension 2.0 :t 0.5
33 of 34
Appendix 9
C1005, C1608, C2012, C3216, C3225 (As for C3225 type, any thickness of the item except 2.5mm)
(Material: Polystyrene)
(Unit: mm)
Symbol A B C D E W
Dimension
Ø382 max.
(Nominal
Ø330)
Ø50 min. Ø13 ± 0.5 Ø21 ± 0.8 2.0 ± 0.5 10.0 ± 1.5
Symbol t r
Dimension 2.0 ± 0.5 1.0
Appendix 10
C3225, C4532, C5750 (As for C3225 type, applied to 2.5mm thickness products)
(Material: Polystyrene)
(Unit: mm)
Symbol A B C D E W
Dimension
Ø382 max.
(Nominal
Ø330)
Ø50 min. Ø13 ± 0.5 Ø21 ± 0.8 2.0 ± 0.5 14.0 ± 1.5
Symbol t r
Dimension 2.0 ± 0.5 1.0
B
W
A
EC
D
r
t
B
W
A
E
C
D
r
t
33 of 34
END PAGE

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