Bergquist

- Henkel’s BERGQUIST® brand thermal management materials include a broad range of solutions for reliability-enhancing heat dissipation within modern electronic devices. The company’s BERGQUIST GAP PAD® gap filling thermal interface materials (TIMs) are soft, compliant, pre-cut pads that reduce assembly stress while providing excellent thermal conductivity. Liquid BERGQUIST Gap Filler TIMs, which can be automatically dispensed, are ideal for applications where complex dimensions are the norm and/or high throughput is required. The expansive thermal solutions portfolio also includes SIL PAD® thermally conductive insulators, BOND PLY® thermal adhesives, HI FLOW® phase change materials and TCLAD® Insulated Metal Substrates (IMS®).

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Newest Products Ver todos (41)

Thermal Performance and Silicone Extraction Advantages of Gap Pad S-Class Filling Materials Fecha de publicación: 0001-01-01

Bergquist's Gap Pad is typically used for low-pressure applications that have either built in stand-offs or are clip assembled.

Repair Instructions - Hi-Flow 225FT Fecha de publicación: 0001-01-01

Bergquist's Hi-Flow 225FT is a “tackified” phase change material on an aluminum carrier designed for ease of use with “reworkable” characteristics.

Thermal Properties and Testing Fecha de publicación: 0001-01-01

Thermal conductivity is the time rate of heat flow through a unit area producing a unit temperature difference across a unit thickness.

Bergquist / Henkel Fecha de publicación: 0001-01-01

The Bergquist Company is the world’s leading developer and manufacturer of thermal management materials which include Sil-Pad®, thermally conductive insulators and various specialty materials; Gap Pad®, gap filling materials, Hi-Flow®, phase change materials, Softface® and Bond-Ply®.

Repair Instructions - Hi-Flow 225FT TAB STYLE Fecha de publicación: 0001-01-01

Bergquist's Hi-Flow 225FT is a “tackified” phase change material on an aluminum carrier designed for ease of use with “reworkable” characteristics.

Note on Copper Substrates Fecha de publicación: 0001-01-01

Most applications of copper clad insulated metal substrates use an aluminum base.

Recent PTMs Ver todos (41)

Thermal Performance and Silicone Extraction Advantages of Gap Pad S-Class Filling Materials Fecha de publicación: 0001-01-01

Bergquist's Gap Pad is typically used for low-pressure applications that have either built in stand-offs or are clip assembled.

Repair Instructions - Hi-Flow 225FT Fecha de publicación: 0001-01-01

Bergquist's Hi-Flow 225FT is a “tackified” phase change material on an aluminum carrier designed for ease of use with “reworkable” characteristics.

Thermal Properties and Testing Fecha de publicación: 0001-01-01

Thermal conductivity is the time rate of heat flow through a unit area producing a unit temperature difference across a unit thickness.

Bergquist / Henkel Fecha de publicación: 0001-01-01

The Bergquist Company is the world’s leading developer and manufacturer of thermal management materials which include Sil-Pad®, thermally conductive insulators and various specialty materials; Gap Pad®, gap filling materials, Hi-Flow®, phase change materials, Softface® and Bond-Ply®.

Featured Videos Ver todos (1)

Liquid Dispensed TIM

This animation demonstrates how to combine your Thermal Clad® IMS with Bergquist Liquid Dispensed TIM for an optimal thermal solution.

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