Hoja de datos de CPC1016N

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CPC1016N
Single-Pole, Normally Open
4-Lead SOP OptoMOS® Relay
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DS-CPC1016N-R10 1
Part # Description
CPC1016N 4-Lead SOP (100/tube)
CPC1016NTR 4-Lead SOP (2000/reel)
Parameter Rating Units
Blocking Voltage 100 VP
Load Current 100 mArms / mADC
On-Resistance (max) 16
Applications
Features
Description
Ordering Information
Pin Configuration
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Meters (Watt-Hour, Water, Gas)
Medical Equipment—Patient/Equipment Isolation
Security Systems
Aerospace
Industrial Controls
Reed Relay Replacement
1500Vrms Input/Output Isolation
100% Solid State
Low Drive Power Requirements
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Tape & Reel Version Available
Flammability Rating UL 94 V-0
CPC1016N is a miniature, low-voltage, low
on-resistance, normally open (1-Form-A) solid state
relay in a 4-lead SOP package. The relay uses
optically coupled MOSFET technology to provide
1500Vrms of input/output isolation. The efficient
MOSFET switches and photovoltaic die use IXYS
Integrated Circuits Division’s patented OptoMOS
architecture while the optically coupled output is
controlled by a highly efficient infrared LED.
The CPC1016N uses IXYS Integrated Circuits
Division’s state of the art double-molded vertical
construction packaging to produce a very compact
solid state relay that is ideal for replacing larger,
less-reliable reed and electromechanical relays.
Approvals
UL Recognized Component: File E76270
CSA Certified Component: Certificate 1172007
EN/IEC 60950-1 Certified Component:
TUV Certificate B 13 12 82667 003
Switching Characteristics
of Normally Open Devices
Form-A
I
F
I
LOAD
10%
90%
t
on
t
off
1
23
4
+ Control
- Control
Load
Load
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2R10
CPC1016N
Absolute Maximum Ratings @ 25ºC
Parameter Ratings Units
Blocking Voltage 100 VP
Reverse Input Voltage 5 V
Input Control Current
Peak (10ms)
50 mA
1A
Input Power Dissipation 170 mW
Total Power Dissipation 2400 mW
Isolation Voltage, Input to Output 1500 Vrms
Operational Temperature -40 to +85 ºC
Storage Temperature -40 to +125 ºC
1 Derate linearly 1.33 mW / ºC
2 Derate linearly 3.33 mW / ºC
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current
Continuous 1-I
L- - 100 mArms / mADC
Peak t=10ms ILPK - - ±350 mAP
On-Resistance 2IL=100mA RON --16
Off-State Leakage Current VL=100VPILEAK --1 A
Switching Speeds
Turn-On IF=5mA, VL=10V ton --2 ms
Turn-Off toff --1 ms
Output Capacitance IF=0mA, VL=50V, f=1MHz COUT -25 - pF
Input Characteristics
Input Control Current to Activate IL=100mA IF- 0.5 2 mA
Input Control Current to Deactivate - IF0.3 0.4 - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.5 V
Reverse Input Current VR=5V IR--10A
Common Characteristics
Capacitance, Input to Output VIO=0, f=1MHz CIO -1 - pF
1 Load current derates linearly from 100mA @ 25ºC to 80mA @ 85ºC.
2 Measurement taken within 1 second of on-time.
Electrical Characteristics @ 25ºC
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Typical values are characteristic of the device at the specified
temperatures and are the result of engineering evaluations.
They are provided for information purposes only and are not
part of the manufacturing testing requirements.
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CPC1016N
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R10
PERFORMANCE DATA*
35
30
25
20
15
10
5
0
1.17 1.19 1.21 1.23 1.25
LED Forward Voltage Drop (V)
Device Count (N)
Typical LED Forward Voltage Drop
(N=50, I
F
=5mA)
0.25 0.35 0.45 0.550.30 0.40 0.50
Turn-On Time (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-On Time
(N=50, IF=5mA, IL=100mA)
0.21 0.23 0.25 0.270.260.240.22
Turn-Off Time (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, IF=5mA, IL=100mA)
0.30 0.40 0.500.25 0.35 0.45 0.55
LED Current (mA)
Device Count (N)
25
20
15
10
5
0
Typical I
F
for Switch Operation
(N=50, I
L
=100mA)
25
20
15
10
5
0
0.30 0.40 0.500.25 0.35 0.45 0.55
LED Current (mA)
Device Count (N)
Typical IF for Switch Dropout
(N=50, IL=100mA)
35
30
25
20
15
10
5
0
On-Resistance (:)
Device Count (N)
6.8 6.9 7.17.0 7.47.2 7.3
Typical On-Resistance Distribution
(N=50, I
L
=100mA)
35
30
25
20
15
10
5
0
106 112 118 124109 115 121
Blocking Voltage (VP)
Device Count (N)
Typical Blocking Voltage Distribution
(N=50)
Typical Turn-Off Time
vs. LED Forward Current
(IL=80mA)
LED Forward Current (mA)
Turn-Off Time (ms)
05 1015202530354045
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
50
LED Forward Voltage Drop (V)
Typical LED Forward Voltage Drop
vs. Temperature
1.8
1.6
1.4
1.2
1.0
0.8
-40 -20 0 20 40 60 80 120100
I
F
=50mA
Temperature (ºC)
I
F
=10mA
I
F
=5mA
I
F
=2mA
Typical Turn-On Time
vs. LED Forward Current
(IL=80mA)
LED Forward Current (mA)
Turn-On Time (ms)
05 1015202530354045
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
50
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
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CPC1016N
PERFORMANCE DATA*
IF=5mA
Turn-On Time (ms)
-40
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Typical Turn-On Time vs. Temperature
(IL=80mA)
IF=10mA
Temperature (ºC)
Turn-Off Time (ms)
-40
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-20 0 20 40 60 80 100
IF=10mA
Typical Turn-Off Time vs. Temperature
(IL=80mA)
Temperature (ºC)
IF=5mA
-40
14
12
10
8
6
4
-20 0 20 40 60 80 100
2
Steady State
Instantaneous
Typical On-Resistance vs. Temperature
(IL=Max Rated @ Temperature)
Temperature (ºC)
On-Resistance (:)
IF=5mA
IF=5mA
IF=10mA
Typical IF for Switch Operation
vs. Temperature
(IL=80mA)
LED Current (mA)
-40 -20 0 20 40 60 80 100
1.8
1.5
1.2
0.9
0.6
0.3
0
Temperature (ºC)
Typical IF for Switch Dropout
vs. Temperature
(IL=80mA)
LED Current (mA)
-40
1.8
1.5
1.2
0.9
0.6
0.3
0
-20 0 20 40 60 80 100
Temperature (ºC) Load Voltage (V)
Load Current (mA)
150
100
50
0
-50
-100
-150
-1.5 -1.0 -0.5 0 0.5 1.0 1.5
Typical Load Current vs. Load Voltage
(IF=5mA)
Load Current (mA)
120
115
110
105
100
95
90
85
80
75
Temperature (ºC)
-40 -20 0 20 40 60 80 120100
I
F
=10mA
Maximum Load Current
vs. Temperature
I
F
=5mA
Blocking Voltage (VP)
-40
122
121
120
119
118
117
116
115
-20 0 20 40 60 80 100
Temperature (ºC)
Typical Blocking Voltage
vs. Temperature
Leakage (PA)
-40
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
-20 0 20 40 60 80 100
Temperature (ºC)
Typical Leakage vs. Temperature
Measured Across Pins 3&4
(VL=100VP)
Time
Load Current (A)
10Ps
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1ms100Ps 100ms 1s
10ms 10s 100s
Energy Rating Curve
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
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CPC1016N
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R10
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest
version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We
test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our
devices when handled according to the limitations and information in that standard as well as to any limitations set
forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Classifi cation
CPC1016N MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum
Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other
processes, the guidelines of J-STD-020 must be observed.
Device Classifi cation Temperature (Tc) Dwell Time (tp) Max Refl ow Cycles
CPC1016N 260ºC 30 seconds 3
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce
or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken
to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash
and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the
washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake
temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the
user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not
be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
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IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1016N-R10
©Copyright 2018, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
1/30/2018
For additional information please visit our website at: www.ixysic.com
6
CPC1016N
MECHANICAL DIMENSIONS
Dimensions
mm
(inches)
NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted
Embossment
Embossed
Carrier
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
U
ser Direction of Fee
d
User Direction of Feed
K0=2.70
(0.106)
K1=2.30
(0.091)
B0=4.70
(0.185)
W=12.00
(0.472)
P1=8.00
(0.315)
A0=6.50
(0.256)
CPC1016N
CPC1016NTR Tape & Reel
Recommended PCB Land Pattern
2.54
(0.10)
5.50
(0.217)
1.45
(0.057)
0.55
(0.022)
Dimensions
mm
(inches)
Pin 1
4.089 ± 0.025
(0.161 ± 0.001)
2.54 Typ
(0.100 Typ)
6.096 ± 0.102
(0.240 ± 0.004)
3.810 ± 0.025
(0.150 ± 0.001) 0.559 ± 0.127
(0.022 ± 0.005)
0.910 ± 0.025
(0.036 ± 0.001)
2.030± 0.025
(0.080± 0.001)
0.381 TYP.
(0.015 TYP.)
Package standoff:
0.064 ± 0.040
(0.0025 ± 0.0015)
0-0.1
(0-0.004)
0.481
(0.019)
0.203 Typ
(0.008 Typ)