Hoja de datos de CPC1117N(TR) de IXYS Integrated Circuits Division

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DS-CPC1117N-R10 1
CPC1117N
60V Normally-Closed Single-Pole
4-Pin SOP OptoMOS® Relay
Part # Description
CPC1117N 4-Pin SOP (100/tube)
CPC1117NTR 4-Pin SOP (2000/reel)
Parameter Rating Units
Blocking Voltage 60 VP
Load Current 150 mArms / mADC
On-Resistance (max) 16
LED Current to Operate 1 mA
Applications
Features
Description
Ordering Information
Security
Passive Infrared Detectors (PIR)
Data Signalling
Sensor Circuitry
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Meters (Watt-Hour, Water, Gas)
Medical Equipment—Patient/Equipment Isolation
Aerospace
Industrial Controls
Designed for use in security systems complying
with EN50130-4
Only 1mA of LED current required to operate
1500Vrms Input/Output Isolation
Small 4-Pin SOP Package
High Reliability
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Immune to radiated EM fields
Tape & Reel Version Available
Flammability Rating UL 94 V-0
The CPC1117N is a miniature normally-closed
single-pole (1-Form-B) solid state relay in a 4-pin
SOP package that employs optically coupled
MOSFET technology to provide 1500Vrms of input/
output isolation. The efficient MOSFET switches and
photovoltaic die use IXYS Integrated Circuits' patented
OptoMOS architecture. The optically coupled output is
controlled by the input's highly efficient infrared LED.
IXYS Integrated Circuits' state of the art double-
molded vertical construction packaging makes the
CPC1117N one of the world’s smallest relays. It
offers board space savings of at least 20% over the
competitor’s larger 4-pin SOP relay.
Approvals
Form-B
IF
10% 90%
ILOAD
toff ton
Pin Configuration
Switching Characteristics
of Normally-Closed Devices
1
23
4
+ Control
– Control
Load
Load
UL Recognized Component: File E76270
CSA Certified Component: Certificate 1172007
EN/IEC 60950-1 Certified Component:
Certificate available on our website
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2R10
CPC1117N
Absolute Maximum Ratings @ 25ºC
Parameter Ratings Units
Blocking Voltage 60 VP
Reverse Input Voltage 5 V
Input Control Current 50 mA
Peak (10ms) 1 A
Input Power Disipation 170 mW
Total Power Dissipation 2400 mW
Isolation Voltage, Input to Output 1500 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 1.33 mW / ºC
2 Derate linearly 3.33 mW / ºC
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current
Continuous 1IF=0mA IL- - 150 mArms / mADC
Peak t=10ms ILPK - - ±350 mAP
On-Resistance 2IF=0mA, IL=120mA RON -516
Off-State Leakage Current IF=1mA, VL=60VPILEAK --1 µA
Switching Speeds
Turn-On IF=2mA, VL=10V ton - 0.316 10 ms
Turn-Off toff - 1.55 10
Output Capacitance IF=0.5mA, VL=50V, f=1MHz COUT -10- pF
Input Characteristics
Input Control Current to Activate (Output Open) 3-I
F- 0.16 1 mA
Input Control Current to Deactivate (Output Closed) IL=120mA IF0.1 0.14 - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.5 V
Reverse Input Current VR=5V IR- - 10 µA
Common Characteristics
Capacitance, Input to Output VIO=0V, f=1MHz CIO -1- pF
1 Load current derates linearly from 150mA @ 25oC to 100mA @85oC.
2 Measurement taken within 1 second of on-time.
3 For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 3mA is recommended.
Electrical Characteristics @ 25ºC
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Typical values are characteristic of the device at +25°C, and
are the result of engineering evaluations. They are provided for
information purposes only, and are not part of the manufacturing
testing requirements.
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R10
PERFORMANCE DATA*
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
35
30
25
20
15
10
5
0
1.17 1.19 1.21 1.23 1.25
LED Forward Voltage Drop (V)
Device Count (N)
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
LED Current (mA)
0.11 0.13 0.15 0.17 0.19 0.21 0.23
Device Count (N)
0
5
10
15
20
Typical IF for Switch Operation
(N=50, IL=150mA)
35
30
25
20
15
10
5
0
5.0 5.2 5.4 5.65.1 5.3 5.5
Device Count (N)
Typical On-Resistance Distribution
(N=50, IL=150mA)
On-Resistance (:)
Turn-On Time (ms)
0.28 0.30 0.32 0.34 0.36 0.38
Device Count (N)
0
5
10
15
20
25
Typical Turn-On Time
(N=50, IF=2mA, IL=100mA)
Turn-Off Time (ms)
1.15 1.30 1.45 1.60 1.75 1.90 2.05
Device Count (N)
0
5
10
15
20
Typical Turn-Off Time
(N=50, IF=2mA, IL=100mA)
35
30
25
20
15
10
5
0
85 95 105 11590 100 110
Blocking Voltage (VP)
Device Count (N)
Typical Blocking Voltage Distribution
(N=50, IF=1mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Current (mA)
0.10
0.15
0.20
0.25
0.30
Typical IF for Switch Operation
vs. Temperature
(IL=100mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Forward Voltage (V)
1.0
1.1
1.2
1.3
1.4
1.5
1.6
Typical LED Forward Voltage Drop
vs. Temperature
IF=5mA
IF=2mA
IF=1mA
IF=50mA
IF=20mA
IF=10mA
Load Voltage (V)
Load Current (mA)
150
100
50
0
-50
-100
-150
-1.00 -0.66 -0.33 0 0.33 0.66 1.00
Typical Load Current vs. Load Voltage
LED Current (mA)
0 1020304050
Turn-On Time (ms)
0.25
0.26
0.27
0.28
0.29
0.30
0.31
0.32
0.33
0.34
0.35
Typical Turn-On Time
vs. LED Forward Current
(IL=100mA)
LED Current (mA)
0 1020304050
Turn-Off Time (ms)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Typical Turn-Off Time
vs. LED Forward Current
(IL=100mA)
-40
8
7
6
5
4
3
2
-20 0 20 40 60 80 100
Typical On-Resistance vs. Temperature
(IF=0mA, IL=150mA)
Temperature (ºC)
On-Resistance (:)
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CPC1117N
PERFORMANCE DATA*
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
Blocking Voltage (VP)
-40
125
120
115
110
105
100
95
90
-20 0 20 40 60 80 100
Temperature (ºC)
Typical Blocking Voltage
vs. Temperature
(IF=2mA)
Leakage (µA)
-40
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
-20 0 20 40 60 80 100
Temperature (ºC)
Typical Leakage vs. Temperature
Measured Across Pins 3&4
(IF=2mA, VL=60V)
Load Voltage (V)
0 102030405060
Output Capacitance (pF)
5
10
15
20
25
30
35
40
Output Capacitance vs. Load Voltage
(IF=0.5mA)
Time
Load Current (A)
10μs
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1ms100μs 100ms 1s
10ms 10s 100s
Energy Rating Curve
225
200
175
150
125
100
75
50
25
0
Temperature (ºC)
Load Current (mA)
-40 -20 0 20 40 60 80 120100
Maximum Load Current
vs. Temperature
(IF=0mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-On Time (ms)
0.20
0.25
0.30
0.35
0.40
0.45
Typical Turn-On Time
vs. Temperature
(IL=100mA)
IF=10mA
IF=5mA
IF=2mA
IF=1mA
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-Off Time (ms)
0
1
2
3
4
5
Typical Turn-Off Time
vs. Temperature
(IL=100mA)
IF=1mA
IF=2mA
IF=5mA
IF=10mA
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Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of
the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of
our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices
when handled according to the limitations and information in that standard as well as to any limitations set forth in
the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Classifi cation
CPC1117N MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum
Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other
processes, the guidelines of J-STD-020 must be observed.
Device Classifi cation Temperature (Tc) Dwell Time (tp) Max Refl ow Cycles
CPC1117N 260ºC 30 seconds 3
Board Wash
IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux
residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage
to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow
up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the
variability of the wash parameters used to clean the board, determination of the bake temperature and duration
necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning
or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the
device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
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IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes
to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits'
Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but
not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property
or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1117N-R10
©Copyright 2018, IXYS Integrated Circuits
OptoMOS® is a registered trademark of IXYS Integrated Circuits
All rights reserved. Printed in USA.
6/1/2018
For additional information please visit our website at: www.ixysic.com
6
CPC1117N
Mechanical Dimensions
CPC1117N
CPC1117NTR Tape & Reel
Dimensions
mm
(inches)
NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted
Embossment
Embossed
Carrier
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
U
ser Direction o
f
Feed
User Direction of Feed
K0=2.70
(0.106)
K1=2.30
(0.091)
B0=4.70
(0.185)
W=12.00
(0.472)
P1=8.00
(0.315)
A0=6.50
(0.256)
Recommended PCB Land Pattern
2.54
(0.10)
3.85
(0.152)
1.54
(0.061)
0.60
(0.024)
Dimensions
mm
(inches)
Pin 1
4.089 ± 0.025
(0.161 ± 0.001)
2.54 Typ
(0.100 Typ)
6.096 ± 0.102
(0.240 ± 0.004)
3.810 ± 0.025
(0.150 ± 0.001) 0.559 ± 0.127
(0.022 ± 0.005)
0.910 ± 0.025
(0.036 ± 0.001)
2.030± 0.025
(0.080± 0.001)
0.381 ± 0.025
(0.015 ± 0.001)
Package standoff:
0.064 ± 0.040
(0.0025 ± 0.0015)
0-0.1
(
0-0.004
)
0.481
(0.019)
0.203 ± 0.025
(0.008 ± 0.001)
Note:
1. Lead dimensions do not include plating: 1000 microinches max.