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ESD, COG Dielectric Datasheet by KEMET

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One world. One KEMET
Benefits
• AEC–Q200automotivequalified
• ESDQualifiedperHBM–AECQ200–002
Available in package size EIA 0603 (1608)
DC Voltage ratings of 25V – 200V
Capacitance range from 1nF to 15nF
• −55°Cto+125°Coperatingtemperaturerange
• Lead(Pb)-Free,RoHSandREACHcompliant
• Availablecapacitancetolerancesof±1%,±2%,±5%,±10%,and±20%
No piezoelectric noise
• ExtremelylowESRandESL
• Highthermalstability
• Highripplecurrentcapability
Overview
KEMET’sESDRatedCommercialandAutomotiveGrade
SeriessurfacemountcapacitorsinC0Gdielectricare
suitedforavarietyofapplicationswhereElectroStatic
Dischargeeventsduringassemblyoroperationcould
damagethecapacitororthecircuit(ESD=ElectroStatic
Discharge).TheseESDratedcapacitorsprovidetheability
todesigntoagivenESDcriteriapertheHumanBody
Model(HBM)AECQ200–002criteria.KEMET'sautomotive
gradeseriescapacitorsalsomeettheotherdemanding
AutomotiveElectronicsCouncil'sAEC–Q200qualification
requirements.
TheC0Gdielectricfeaturesa125°Cmaximumoperating
temperatureandisconsidered“stable.”TheElectronics
IndustriesAlliance(EIA)characterizesC0Gdielectricas
aClassImaterial.Componentsofthisclassificationare
temperaturecompensatingandaresuitedforresonantcircuit
applicationsandthosewhereQandstabilityofcapacitance
characteristicsarerequired.TheC0Gdielectricexhibitsno
changeincapacitancewithrespecttotimeandvoltageand
boastsanegligiblechangeincapacitancecomparedtoits
valueat25°C.Capacitancechangeislimitedto±30ppm/°C
from−55°Cto+125°C.
SurfaceMountMultilayerCeramicChipCapacitors(SMDMLCCs)
ESD, C0G Dielectric, 25 – 200 VDC
(Commercial & Automotive Grade)
Ordering Information
C0603 C104 J 3 R E C AUTO
Ceramic Case Size
(L" x W") Specification/
Series Capacitance
Code(pF) Capacitance
Tolerance1RatedVoltage
(VDC) Dielectric FailureRate/
Design Termination
Finish2
Packaging/
Grade
(C-Spec)
0603 C=Standard
X=Flexible
Termination
Two
significant
digitsand
number of
zeros
F=±1%
G=±2%
J=±5%
K=±10%
M=±20%
3=25
5=50
M=63
1=100
2=200
G=C0G E=ESD C=100%
Matte Sn
See
"Packaging
C-Spec
Ordering
Options
Table"
below
1 Additional capacitance tolerance offerings may be available. Contact KEMET for details.
2 Additional termination finish options may be available. Contact KEMET for details.
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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
Benefits (cont'd)
• Preferredcapacitancesolutionatlinefrequenciesand
intotheMHzrange
• NocapacitancechangeswithrespecttoappliedDC
voltage
• Negligiblecapacitancechangewithrespecttotemperature
from−55°Cto+125°C
• Nocapacitancedecaywithtime
• Non-polardevices,minimizinginstallationconcerns
• 100%puremattetin-platedterminationfinishallowingfor
excellentsolderability
• Flexible Termination option available
• EIA0805and1206CaseSizesUnderDevelopment
Applications
Typicalapplicationsinclude:ESD(Electrostaticdischarge),IntegratedCircuit(IC)Protection,RFfilteringfunction,inputand
outputautomotiveapplicationslike:controllers,navigationsystems,airbagsandkeylesssystems
Table 1 – Capacitance Range/Selection Waterfall (0603 Case Size)
Capacitance Cap Code
Case Size/
Series C0603C
Rated Voltage (VDC) 25 50 63 100 200
Voltage Code 35M 1 2
Cap Tolerance ESD Level per AEC–Q200
1.0nF 102
F=±1%
G=±2%
J=±5%
K=±10%
M=±20%
6KV 6KV 6KV 6KV 6KV
1.5nF 152 8KV 8KV 8KV 8KV 8KV
2.2nF 222 12KV 12KV 12KV 12KV 12KV
3.3nF 332 16KV 16KV 16KV 16KV
4.7nF 472 16KV 16KV 16KV 16KV
6.8nF 682 25KV 25KV
10nF 103 25KV
15nF 153 25KV
ammmc compmm KEIVIEI' crummy: 7411 HA 0603 and smal‘er case sizes) 7210 EIA 0505 and Iar er case swzes AUT074‘I1 EIA 0603 and smaller case SIZES) AUT07210 EIA 0805 and \ar er case SIZES
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1091_C0G_ESD • 12/5/2016 3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
Packaging C-Spec Ordering Options Table
Packaging Type Packaging/Grade
Ordering Code (C-Spec)
CommercialGrade1
Bulk Bag
Notrequired(Blank)
7"Reel/Unmarked
TU
13"Reel/Unmarked
7411(EIA0603andsmallercasesizes)
7210(EIA0805andlargercasesizes)
7"Reel/Unmarked/2mmpitch
2
7081
13"Reel/Unmarked/2mmpitch
2
7082
AutomotiveGrade3
7"Reel
AUTO
13"Reel/Unmarked
AUTO7411(EIA0603andsmallercasesizes)
AUTO7210(EIA0805andlargercasesizes)
7"Reel/Unmarked/2mmpitch
2
3190
13"Reel/Unmarked/2mmpitch
2
3191
1 Default packaging is "Bulk Bag". An ordering code C-Spec is not required for "Bulk Bag" packaging.
1 The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain
capacitors that have not been laser marked. The option to laser mark is not available on these devices. For more information see "Capacitor Marking".
2 The 2mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2mm pitch option see "Tape & Reel Packaging Information".
3 Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L" x W") and thickness dimension. See "Chip Thickness/Tape & Reel
Packaging Quantities" and "Tape & Reel Packaging Information".
3 For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information".
3 All Automotive packaging C-Specs listed exclude the option to laser mark components. The option to laser mark is not available on these devices. For
more information see "Capacitor Marking".
Dimensions – Millimeters (Inches)
L
B
W
S
T
EIA Size
Code
Metric Size
Code
L
Length
W
Width
T
Thickness
B
Bandwidth
S
Separation
Minimum
Mounting
Technique
Without Flexible Termination
0603 1608 1.60 (0.063)
±0.15 (0.006)
0.80 (0.032)
±0.15 (0.006)
See Table 2 for
Thickness
0.35 (0.014)
±0.15 (0.006) 0.70 (0.028) SolderWaveor
SolderReflow
With Flexible Termination
0603 1608 1.60 (0.063)
±0.17 (0.007)
0.80 (0.032)
±0.15 (0.006)
See Table 2 for
Thickness
0.45 (0.018)
±0.15 (0.006) 0.58 (0.023) SolderWaveor
SolderReflow
ammmc compmm KEIVIEI' crummy:
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1091_C0G_ESD • 12/5/2016 4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
Automotive C-Spec Information
KEMETAutomotiveGradeproductsmeetorexceedtherequirementsoutlinedbytheAutomotiveElectronicsCouncil.
DetailsregardingtestmethodsandconditionsarereferencedindocumentAEC–Q200,StressTestQualificationforPassive
Components.TheseproductsaresupportedbyaProductChangeNotification(PCN)andProductionPartApprovalProcess
warrant (PPAP).
AutomotiveproductsofferedthroughourdistributionchannelhavebeenassignedaninclusiveorderingcodeC-Spec,“9170”.
ThisC-Specwasdevelopedinordertobetterservesmallandmediumsizedcompaniesthatpreferanautomotivegrade
componentwithouttherequirementtosubmitacustomerSourceControlledDrawing(SCD)orspecificationforreviewbya
KEMETengineeringspecialist.ThisC-SpecisthereforenotintendedforusebyKEMET’sOEMAutomotivecustomersandare
notgrantedthesame“privileges”asotherautomotiveC-Specs.CustomerPCNapprovalandPPAPrequestlevelsarelimited
(seedetailsbelow).          
Product Change Notifi cation (PCN)
TheKEMETProductChangeNotificationsystemisusedtocommunicateprimarilythefollowingtypesofchanges:
 •Product/processchangesthataffectproductform,fit,function,and/orreliability
 •Changesinmanufacturingsite
 •Productobsolescence
KEMET Automotive
C-Spec
Customer Notifi cation due to: Days prior to
implementation
Process/Productchange Obsolescence*
KEMETassigned1Yes(withapprovalandsignoff) Yes 180daysMinimum
AUTO Yes(withoutapproval) Yes 90daysMinimum
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specifi cation for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)
ThepurposeoftheProductionPartApprovalProcessis:
 •Toensurethatsuppliercanmeetthemanufacturabilityandqualityrequirementsforthepurchasedparts.
 •Toprovidetheevidencethatallcustomerengineeringdesignrecordandspecificationrequirementsareproperly
understoodand
fulfilledbythemanufacturingorganization.
 •Todemonstratethattheestablishedmanufacturingprocesshasthepotentialtoproducethepart
KEMET Automotive
C-Spec
PPAP (Product Part Approval Process) Level
12345
KEMETassigned1●●●●●
AUTO ○ ○
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specifi cation for review. For additional information contact KEMET.
PartNumberspecificPPAPavailable
ProductfamilyPPAPonly
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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1091_C0G_ESD • 12/5/2016 5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
Qualification/Certification
CommercialGradeproductsaresubjecttointernalqualification.Detailsregardingtestmethodsandconditionsare
referencedinTable4,Performance&Reliability.
AutomotiveGradeproductsmeetorexceedtherequirementsoutlinedbytheAutomotiveElectronicsCouncil.Details
regardingtestmethodsandconditionsarereferencedindocumentAEC–Q200,StressTestQualificationforPassive
Components.ForadditionalinformationregardingtheAutomotiveElectronicsCouncilandAEC–Q200,pleasevisittheir
website at www.aecouncil.com.
Environmental Compliance
Lead(Pb)-free,RoHS,andREACHcompliantwithoutexemptions.
Electrical Parameters/Characteristics
Item Parameters/Characteristics
OperatingTemperatureRange −55°Cto+125°C
CapacitanceChangewithReferenceto
+25°Cand0VDCApplied(TCC) ±30 ppm/ºC
AgingRate(Maximum%CapacitanceLoss/DecadeHour) 0%
1DielectricWithstandingVoltage(DWV)
250%ofratedvoltage
(5±1secondsandcharge/dischargenotexceeding50mA)"
2DissipationFactor(DF)MaximumLimitat25°C 0.1%
3InsulationResistance(IR)MinimumLimitat25°C
1,000megohmmicrofaradsor100GΩ
(Ratedvoltageappliedfor120±5secondsat25°C)
1 DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the
capacitor.
2 Capacitance and dissipation factor (DF) measured under the following conditions:
1 MHz ±100 kHz and 1.0 ±0.2 Vrms if capacitance ≤ 1,000 pF
1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance > 1,000 pF
3 To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known
as Automatic Level Control (ALC). The ALC feature should be switched to "ON."
Post Environmental Limits
Post Environmental Limits
Dielectric RatedDC
Voltage Capacitance Dissipation Factor
(Maximum %)
Capacitance
Shift
Insulation
Resistance
C0G All All 0.5 0.3% or
±0.25 pf
10% of
Initial Limit
ammmc compmm KEIVIEI' crummy:
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1091_C0G_ESD • 12/5/2016 6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
Table 2 – Capacitance Range/Selection Waterfall (0603 Case Size)
Capacitance Cap
Code
Case Size /
Series C0603C
Voltage Code 35M 1 2
Rated Voltage (VDC)
25
50
63
100
200
Capacitance
Tolerance
Chip Thickness Codes – See
Packaging Specs for Chip
1,000 pF 102 F G J K M CF CF CF CF CF
1,500 pF 152 F G J K M CF CF CF CF CF
2,200 pF 222 F G J K M CF CF CF CF CF
3,300 pF 332 F G J K M CF CF CF CF
4,700 pF 472 F G J K M CF CF CF CF
6,800 pF 682 F G J K M CF CF
10,000 pF 103 F G J K M CF
15,000 pF 153 F G J K M CF
Capacitance Cap
Code
Rated Voltage (VDC) 35M 1 2
Voltage Code
25
50
63
100
200
Case Size
/Series C0603C
These products are protected under US Patent 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts.
Table 3 – Chip Thickness/Tape & Reel Packaging Quantities
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
Paper Quantity1Plastic Quantity
7" Reel 13" Reel 7" Reel 13" Reel
CF 0603 0.80 ± 0.07* 4,000 15,000 0 0
E‘ucuomc Compcnonu KEIWEI' CHARGED!
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1091_C0G_ESD • 12/5/2016 7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
Table 4 – Land Pattern Design Recommendations per IPC–7351
EIA
Size
Code
Metric
Size
Code
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
C Y X V1 V2 C Y X V1 V2 C Y X V1 V2
Without Flexible Termination
0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20
With Flexible Termination
0603 1608 0.85 1.25 1.10 4.00 2.10 0.75 1.05 1.00 3.10 1.50 0.65 0.85 0.90 2.40 1.20
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Y
C C
X X
V1
V2
Grid Placement Courtyard
Y
cccccccccccccccccccc Emma):
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1091_C0G_ESD • 12/5/2016 8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
Soldering Process
Recommended Soldering Technique:
 •SolderwaveorsolderreflowforEIAcasesizes0603,0805and1206
 •AllotherEIAcasesizesarelimitedtosolderreflowonly
Recommended Reflow Soldering Profile:
KEMET’sfamiliesofsurfacemountmultilayerceramiccapacitors(SMDMLCCs)arecompatiblewithwave(singleordual),
convection,IRorvaporphasereflowtechniques.Preheatingofthesecomponentsisrecommendedtoavoidextremethermal
stress.KEMET’srecommendedprofileconditionsforconvectionandIRreflowreflecttheprofileconditionsoftheIPC/J-
STD-020standardformoisturesensitivitytesting.Thesedevicescansafelywithstandamaximumofthreereflowpassesat
theseconditions.
Profile Feature Termination Finish
100% Matte Sn
Preheat/Soak
Temperature Minimum (TSmin)
150°C
Temperature Maximum (T
Smax
)200°C
Time (tS) from TSmin to TSmax
60–120seconds
Ramp-UpRate(TL to TP)3°C/secondmaximum
LiquidousTemperature(TL)217°C
TimeAboveLiquidous(tL)60–150seconds
Peak Temperature (TP)260°C
TimeWithin5°CofMaximumPeak
Temperature (t
P
)30secondsmaximum
Ramp-DownRate(TP to TL)6°C/secondmaximum
Time25°CtoPeakTemperature 8 minutes maximum
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
Time
Temperature
Tsmin
25
Tsmax
TL
TPMaximum Ramp Up Rate = 3ºC/sec
Maximum Ramp Down Rate = 6ºC/sec
tP
tL
ts
25ºC to Peak
Electronic Componcnls KEIl/IEI' EHARGED! Load Humidity: 1,000 hours BET/05% RH and rated voltage, Add 100 K ohm resistor, Measurement at 24 hours +17 4 hours alter test conclusion. Low Volt Humidity: 1,000 hours EST/35% RH and 1.5 V. Add 100 K ohm resistor. Measurement at 24 hours +17 4 hours alter test conclusion. M|L7STD7202 Method t: 24 hours/cycle, Steps 7a and 7b not required. 106 755’C/+125"C. Note: Number oi cycles required 7 300. Maximum transfer time 7 20 seconds, Dwell time 715 minutes, Air 7 Air, M|L7STD7202 Method 108 M|L7STD7202 Method 213 M|L7STD7202 Method 215
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1091_C0G_ESD • 12/5/2016 9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
Table 5 – Performance & Reliability: Test Methods and Conditions
Stress Reference Test or Inspection Method
TerminalStrength JIS–C–6429 Appendix1,Note:Forceof1.8kgfor60seconds.
BoardFlex JIS–C–6429
Appendix2,Note:Standardterminationsystem–2.0mm(minimum)forallexcept3mmfor
C0G. Flexible termination system – 3.0 mm (minimum).
Solderability J–STD–002
Magnification50X.Conditions:
a)MethodB,4hoursat155°C,dryheatat235°C
b)MethodBat215°Ccategory3
c)MethodD,category3at260°C
Temperature Cycling JESD22MethodJA–104 1,000Cycles(−55°Cto+125°C).Measurementat24hours+/−4hoursaftertestconclusion.
BiasedHumidity MIL–STD202Method
103
LoadHumidity:1,000hours85°C/85%RHandratedvoltage.Add100Kohmresistor.
Measurementat24hours+/−4hoursaftertestconclusion.
LowVoltHumidity:1,000hours85°C/85%RHand1.5V.Add100Kohmresistor.
Measurementat24hours+/−4hoursaftertestconclusion.
MoistureResistance
MILSTD202Method
106
t=24hours/cycle.Steps7aand7bnotrequired.
Measurementat24hours+/−4hoursaftertestconclusion.
ThermalShock MIL–STD202Method
107
55°C/+125°C.Note:Numberofcyclesrequired–300.Maximumtransfertime–20
seconds.
Dwell time – 15 minutes. Air – Air.
HighTemperatureLife MIL–STD–202Method
108/EIA–198 1,000hoursat125°C(85°CforX5R,Z5UandY5V)with2Xratedvoltageapplied.
Storage Life
MILSTD202Method
108
150°C,0VDCfor1,000hours.
Vibration MIL–STD–202Method
204
5g'sfor20minutes,12cycleseachof3orientations.Note:Use8"X5"PCB0.031"thick
7securepointsononelongsideand2securepointsatcornersofoppositesides.Parts
mountedwithin2"fromanysecurepoint.Testfrom10–2,000Hz
MechanicalShock
MILSTD202Method
213
Figure1ofMethod213,ConditionF.
ResistancetoSolvents
MILSTD202Method
215
Addaqueouswashchemical,OKEMCleanorequivalent.
Storage and Handling
Ceramicchipcapacitorsshouldbestoredinnormalworkingenvironments.Whilethechipsthemselvesarequiterobustin
otherenvironments,solderabilitywillbedegradedbyexposuretohightemperatures,highhumidity,corrosiveatmospheres,
andlongtermstorage.Inaddition,packagingmaterialswillbedegradedbyhightemperature–reelsmaysoftenorwarp
andtapepeelforcemayincrease.KEMETrecommendsthatmaximumstoragetemperaturenotexceed40ºCandmaximum
storagehumiditynotexceed70%relativehumidity.Temperaturefluctuationsshouldbeminimizedtoavoidcondensationon
thepartsandatmospheresshouldbefreeofchlorineandsulfurbearingcompounds.Foroptimizedsolderabilitychipstock
shouldbeusedpromptly,preferablywithin1.5yearsofreceipt.
.................... CHARGED!
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1091_C0G_ESD • 12/5/2016 10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
Construction – Standard Termination
Detailed Cross Section
Barrier Layer
(Ni)
Dielectric Material
(CaZrO3)
End Termination/
External Electrode
(Cu)
Dielectric
Material (CaZrO3)
Barrier Layer
(Ni)
End Termination/
External Electrode
(Cu)
Termination Finish
(100% Matte Sn)
Inner Electrodes
(Ni)
Inner Electrodes
(Ni)
Termination Finish
(100% Matte Sn)
Construction – Flexible Termination
Dielectric
Material (CaZrO3)
Detailed Cross Section
Inner Electrodes
(Ni)
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn)
Inner Electrodes
(Ni)
Dielectric Material
(CaZrO3)
Epoxy Layer
(Ag)
End Termination/
External Electrode
(Cu)
Barrier Layer
(Ni)
Termination
Finish
(100% Matte Sn)
Epoxy Layer
(Ag)
End Termination/
External Electrode
(Cu)
ammm Compancnls KEIVIEI' cumin:
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1091_C0G_ESD • 12/5/2016 11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
Capacitor Marking (Optional):
Lasermarkingoptionisnotavailableon:
• C0G,UltraStableX8RandY5Vdielectricdevices
• EIA0402casesizedevices
• EIA0603casesizedeviceswithFlexibleTerminationoption.
• KPSCommercialandAutomotivegradestackeddevices.
Thesecapacitorsaresuppliedunmarkedonly.
ammm Compancnls KEIVIEI' Emma): 73 mm (7 00“} unamm CamerTape
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1091_C0G_ESD • 12/5/2016 12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
Tape & Reel Packaging Information
KEMEToffersmultilayerceramicchipcapacitorspackagedin8,12and16mmtapeon7"and13"reelsinaccordancewith
EIAStandard481.Thispackagingsystemiscompatiblewithalltape-fedautomaticpickandplacesystems.SeeTable2for
detailsonreelingquantitiesforcommercialchips.
8 mm, 12 mm
or 16 mm Carrier Tape
178 mm (7.00")
or
330 mm (13.00")
Anti-Static Reel
Embossed Plastic* or
Punched Paper Carrier.
Embossment or Punched Cavity
Anti-Static Cover Tape
(.10 mm (.004") Maximum Thickness)
Chip and KPS Orientation in Pocket
(except 1825 Commercial, and 1825 and 2225 Military)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
KEMET
®
Bar Code Label
Sprocket Holes
Table 5 – Carrier Tape Confi guration, Embossed Plastic & Punched Paper (mm)
EIA Case Size
Tape
Size
(W)*
Embossed Plastic Punched Paper
7"Reel 13"Reel 7"Reel 13"Reel
Pitch(P
1
)* Pitch(P
1
)*
01005 – 0402 8 2 2
0603 82/4 2/4
0805 84444
1206 1210 84444
1805 – 1808 12 4 4
≥1812 12 8 8
KPS 1210 12 8 8
KPS1812&2220 16 12 12
Array0508&0612 844
*Refer to Figures 1 & 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 & 7 for tolerance specifi cations.
New 2 mm Pitch Reel Options*
Packaging
Ordering Code
(C-Spec)
Packaging Type/Options
C-3190
Automotivegrade7"reelunmarked
C-3191
Automotivegrade13"reelunmarked
C-7081
Commercialgrade7"reelunmarked
C-7082
Commercialgrade13"reelunmarked
* 2 mm pitch reel only available for 0603 EIA case size.
2 mm pitch reel for 0805 EIA case size under development.
Benefi ts of Changing from 4 mm to 2 mm Pitching Spacing
Lower placement costs
• Doublethepartsoneachreelresultsinfewerreel
changesandincreasedefficiency
• Fewerreelsresultinlowerpackaging,shippingand
storagecosts,reducingwaste
Eiecxmmc Compancnls KEIVIEI' EHARGED: c mum: DY Minimum R Reierence SY Minimum T T‘ Note 1 Note 2 Note 3 Maximum Maximum i3Y Maximum E2 T2 W Nme4 Minimum Maximum Maximum
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1091_C0G_ESD • 12/5/2016 13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
Po
T
F
W
Center Lines of Cavity
Ao
Bo
User Direction of Unreeling
Cover Tape
Ko
B
1
is for tape feeder reference only,
including draft concentric about B
o
.
T
2
ØD
1
ØDo
B
1
S
1
T
1
E
1
E
2
P
1
P
2
Embossment
For cavity size,
see Note 1 Table 4
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D0
D
1
Minimum
Note 1
E1P0 P2
RReference
Note 2
S
1
Minimum
Note 3
T
Maximum
T
1
Maximum
8 mm
1.5+0.10/-0.0
(0.059+0.004/-
0.0)
1.0
(0.039)
1.75 ±0.10
(0.069 ±0.004) 4.0 ±0.10
(0.157 ±0.004) 2.0 ±0.05
(0.079 ±0.002)
25.0
(0.984)
0.600
(0.024) 0.600
(0.024) 0.100
(0.004)
12 mm 1.5
(0.059) 30
(1.181)
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch
B
1
Maximum
Note 4
E
2
Minimum
F P1
T
2
Maximum
W
Maximum
A0,B0&K0
8 mm Single (4 mm)
4.35
(0.171)
6.25
(0.246)
3.5 ±0.05
(0.138 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
2.5
(0.098)
8.3
(0.327)
Note 512 mm Single(4mm)&
Double (8 mm)
8.2
(0.323)
10.25
(0.404)
5.5 ±0.05
(0.217 ±0.002)
8.0 ±0.10
(0.315 ±0.004)
4.6
(0.181)
12.3
(0.484)
16 mm Triple (12 mm)
12.1
(0.476)
14.25
(0.561)
7.5 ±0.05
(0.138 ±0.002)
12.0 ±0.10
(0.157 ±0.004)
4.6
(0.181)
16.3
(0.642)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment
location and hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defi ned by A0, B0 and K0 shall surround the component with suffi cient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see
Figure 4).
(e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
ammm Compancnls KEIVI mam): T - V 1 f ¢¢§9 W \ +7: Tiifi‘eri / #4 j/ l ‘X J x — RRefevence NmeZ 0.10 (0.004) Maximum (0.3%i%%%2) (0237) 4.0 10.10 3.3 (0.157 :a 004) (0.327)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1091_C0G_ESD • 12/5/2016 14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
User Direction of Unreeling
Top Cover Tape
T
Center Lines of Cavity
P1
ØDo Po E1
F
E2W
G
A0
B0
Cavity Size,
See
Note 1, Table 7
Bottom Cover Tape
T1
T1
Bottom Cover Tape
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D
0
E
1
P
0
P
2
T
1
Maximum G Minimum
RReference
Note 2
8 mm 1.5+0.10-0.0
(0.059+0.004-0.0) 1.75 ±0.10
(0.069 ±0.004) 4.0 ±0.10
(0.157 ±0.004) 2.0 ±0.05
(0.079 ±0.002)
0.10
(0.004)
Maximum
0.75
(0.030) 25
(0.984)
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch E2 Minimum F P1 T Maximum W Maximum A0 B0
8 mm Half(2mm) 6.25
(0.246) 3.5 ±0.05
(0.138 ±0.002)
2.0 ±0.05
(0.079 ±0.002)
1.1
(0.098)
8.3
(0.327)
Note 1
8 mm Single (4 mm)
4.0 ±0.10
(0.157 ±0.004)
8.3
(0.327)
1. The cavity defi ned by A0, B0 and T shall surround the component with suffi cient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
c) rotation of the component is limited to 20° maximum (see Figure 3).
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).
e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6).
cccccccccccccccccccc Emma): e 7/////////////////////l‘ e O @379
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1091_C0G_ESD • 12/5/2016 15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg minimum.
2. Cover Tape Peel Strength: Thetotalpeelstrengthofthecovertapefromthecarriertapeshallbe:
Tape Width Peel Strength
8 mm 0.1 to 1.0 Newton (10 to 100 gf)
12and16mm 0.1 to 1.3 Newton (10 to 130 gf)
Thedirectionofthepullshallbeoppositethedirectionofthecarriertapetravel.Thepullangleofthecarriertapeshallbe
165°to180°fromtheplaneofthecarriertape.Duringpeeling,thecarrierand/orcovertapeshallbepulledatavelocityof
300 ±10 mm/minute.
3. Labeling:Barcodelabeling(standardorcustom)shallbeonthesideofthereeloppositethesprocketholes.Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
Ao
Bo
°
T
°
s
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Tape Maximum
Width (mm) Rotation (°
T)
8,12 20
16 – 200 10 Tape Maximum
Width (mm) Rotation ( °
S)
8,12 20
16 – 56 10
72 – 200 5
Typical Pocket Centerline
Typical Component Centerline
Figure 4 – Maximum Lateral Movement
0.5 mm maximum
0.5 mm maximum
8 mm & 12 mm Tape
1.0 mm maximum
1.0 mm maximum
16 mm Tape
Figure 5 – Bending Radius
RR
Bending
Radius
Embossed
Carrier
Punched
Carrier
ammm Compancnls KEIVIEI' Emma): 5.4 +1540 0 (0.331 “1.05940 0) 12 4 +2.0/ra 0 (a 488 mus/70.0) 1e 4 +2.0/ro.o (a 545 mom/70.0) 14.4 (a 567) 15.4 (0.724) 22.4 (o 882)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1091_C0G_ESD • 12/5/2016 16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
Figure 6 – Reel Dimensions
AD(See Note)
Full Radius,
See Note
B(see Note)
Access Hole at
Slot Location
(Ø 40 mm minimum)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
W3 (Includes
flange distortion
at outer edge)
W2 (Measured at hub)
W1 (Measured at hub)
C
(Arbor hole
diameter)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
N
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size A B Minimum CD Minimum
8 mm 178 ±0.20
(7.008 ±0.008)
or
330 ±0.20
(13.000 ±0.008)
1.5
(0.059) 13.0+0.5/-0.2
(0.521+0.02/-0.008) 20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size N Minimum W1 W2 Maximum W3
8 mm
50
(1.969)
8.4+1.5/-0.0
(0.331+0.059/-0.0)
14.4
(0.567)
Shallaccommodatetape
widthwithoutinterference
12 mm
12.4+2.0/-0.0
(0.488+0.078/-0.0)
18.4
(0.724)
16 mm
16.4+2.0/-0.0
(0.646+0.078/-0.0)
22.4
(0.882)
EHARGED! 1 fi%¢ee¢o¢¢ o¢ as» ¢¢‘eo¢»$—e¢¢ / u )) rH/mm‘ yllm‘ #e4 keH/ +4 #:4 #é+\#++ \ \LLJ LLW (Lu ‘9900099fl/60fi999wv99 \‘ 90999990 Waif¢‘W¢oe6Too‘6o1 lg: Qiiiggfi1u9M133333§L @y’émawmammm gag“? HHHHH H‘HHHHH
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1091_C0G_ESD • 12/5/2016 17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Trailer
160 mm Minimum
Carrier Tape
END START
Round Sprocket Holes
Elongated Sprocket Holes
(32 mm tape and wider)
Top Cover Tape
Top Cover Tape
Punched Carrier
8 mm & 12 mm only
Embossed Carrier
Components
100 mm
Minimum Leader
400 mm Minimum
Figure 8 – Maximum Camber
Carrier Tape
Round Sprocket Holes
1 mm Maximum, either direction
Straight Edge
250 mm
Elongated sprocket holes
(32 mm & wider tapes)
ammm Compancnls KEIVIEI' cumin:
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1091_C0G_ESD • 12/5/2016 18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
KEMET Electronic Corporation Sales Offi ces
Foracompletelistofourglobalsalesoffices,pleasevisitwww.kemet.com/sales.
Disclaimer
Allproductspecifications,statements,informationanddata(collectively,the“Information”)inthisdatasheetaresubjecttochange.Thecustomerisresponsiblefor
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StatementsofsuitabilityforcertainapplicationsarebasedonKEMETElectronicsCorporation’s(“KEMET)knowledgeoftypicaloperatingconditionsforsuch
applications,butarenotintendedtoconstitute–andKEMETspecificallydisclaims–anywarrantyconcerningsuitabilityforaspecificcustomerapplicationoruse.
TheInformationisintendedforuseonlybycustomerswhohavetherequisiteexperienceandcapabilitytodeterminethecorrectproductsfortheirapplication.Any
technicaladviceinferredfromthisInformationorotherwiseprovidedbyKEMETwithreferencetotheuseofKEMET’sproductsisgivengratis,andKEMETassumesno
obligationorliabilityfortheadvicegivenorresultsobtained.
AlthoughKEMETdesignsandmanufacturesitsproductstothemoststringentqualityandsafetystandards,giventhecurrentstateoftheart,isolatedcomponent
failuresmaystilloccur.Accordingly,customerapplicationswhichrequireahighdegreeofreliabilityorsafetyshouldemploysuitabledesignsorothersafeguards
(suchasinstallationofprotectivecircuitryorredundancies)inordertoensurethatthefailureofanelectricalcomponentdoesnotresultinariskofpersonalinjuryor
propertydamage.
Althoughallproduct–relatedwarnings,cautionsandnotesmustbeobserved,thecustomershouldnotassumethatallsafetymeasuresareindictedorthatother
measuresmaynotberequired.
KEMET is a registered trademark of KEMET Electronics Corporation.

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