274, 281 Series Datasheet

Wakefield-Vette

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Datasheet

Board Level
Heat Sinks
22
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Surface Mount Heat Sinks D
2
PAK, TO-220, SOT-223, SOL-20
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Package Package Natural Forced
P/N in. (mm) in. (mm) Format Quantity Convection Convection)
217-36CTE6 .360 (9.1) .600 (15.2) x .740 (18.8) Bulk 1 55°C @ 1W 16.0°C/W @ 200 LFM
217-36CTTE6 .360 (9.1) .600 (15.2) x .740 (18.8) Tube 20 55°C @ 1W 16.0°C/W @ 200 LFM
217-36CTRE6 .360 (9.1) .600 (15.2) x .740 (18.8) Tape & Reel 250 55°C @ 1W 16.0°C/W @ 200 LFM
Material: Copper, Matte Tin Plated
Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a vari-
ety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increas-
ing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
component thermal specifications.
FEATURES AND BENEFITS:
No interface material is needed
Copper with matte tin plating for improved solderability and assembly
Both the component and the heat sink are installed on the PC-board utilizing
standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats
EIA standards and ESD protection are specified
Can be used with water soluble or no clean SMT solder creams or other pastes
REEL DETAILS
NOTES
1. Material to be “ESD”
2. Approximately 6 Meters per Reel
3. 250 Pieces per Reel.
217-36CTR6
SECTION A-A
TAPE DETAILS
217-36CT6
217 HEAT SINK WITH
DDPAK DEVICE
KEY: Device only, NC Device + HS, NC Device + HS, 100 lfm Device + HS, 200 lfm Device + HS, 300 lfm
MECHANICAL DIMENSIONS
Device Power Dissipation. W
Device Tab dT, C
THERMAL PERFORMANCE
6 LAYER BOARD, D
'
PAK
125°C LEAD, 40°C AMBIENT
Dimensions: in.
217 SERIES
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Board Level
Heat Sinks
23
Surface Mount Heat Sink SMT Devices
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
218-40CT3 218-40CT5
0
20
40
60
80
100
0 200 400 600 800 1000
AIR VELOCITY (LFM)
HEAT SINK TEMPERATURE RISE
ABOVE AMBIENT AIR (C)
0
5
10
15
20
25
0 200 400 600 800 1000
HEAT DISSIPATED (WATTS)
THERMAL RESISTANCE SINK TO
AMBIENT (C)
0.5 2.5 2.0 1.5 1.0
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Surface Mount Heat Sinks D
2
PAK, TO-220, SOL-20
217-36CT6
SOL 20
REF: JEDEC TO-263 (DD PAK)
REF: JEDEC MO-169 (DD PAK)
MECHANICAL DIMENSIONS
TUBE: 16.25 Inches Long,
Min. ESD Material with Nail
Stops
20 Pieces per Tube
217-36CTT6
217 SERIES
TUBE DETAILS
BOARD LAYOUT RECOMMENDATIONS
Dimensions: in.
Solid line = 218-40CT5 Dashed Line = 218-40CT3
Height Above Maximum
Standard PC Board Footprint Thermal Performance at Typical Load
P/N in. (mm) in. (mm) Natural Convection Forced Convection
218-40CTE3 .40 (10.2) .90 (22.9) x .315 (8.0) 62°C rise @ 2W 21°C/W @ 200LFM
218-40CTE5 .40 (10.2) 1.03 (26.2) x .50 (12.7) 62°C rise @ 2W 21°C/W @ 200LFM
Material: Copper, Matte Tin Plated
217 SERIES
218 SERIES
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Board Level
Heat Sinks
24
Vertical Mount Heat Sink
MECHANICAL DIMENSIONS
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
TO-220
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
0
20
40
60
80
100
0 200 400 600 800 1000
AIR VELOCITY (LFM)
HEAT SINK TEMPERATURE RISE
ABOVE AMBIENT AIR (C)
0
2
4
6
8
10
0 200 400 600 800 1000
HEAT DISSIPATED (WATTS)
THERMAL RESISTANCE SINK TO
AMBIENT (C)
2 10 8 6 4
Compact, Wavesolderable Low-Profile Self-Locking Heat Sinks
Height Above Footprint Solderable Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Tab Mounting Natural Forced
P/N in. (mm) in. (mm) Configuation Option Style Convection Convection)
230-75AB .750 (19.1) .570 (14.5) x .500 (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM
230-75ABE-01 .750 (19.1) .570 (14.5) x .500 (12.7) Vertical 01 Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM
230-75ABE-05 .500 (12.7) .750 (19.1) x .570 (14.5) Horizontal 05 Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM
230-75ABE-10 .875 (22.2) .570 (14.5) x .500 (12.7) Vertical 10 Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM
234-75AB .790 (20.0) .570 (14.5) x .500 (12.7) Vert./Horiz No Tab Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM
234-75ABE-01 .790 (20.0) .570 (14.5) x .500 (12.7) Vertical 01 Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM
234-75ABE-05 .500 (12.7) .790 (20.0) x .570 (14.5) Horizontal 05 Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM
Material: Aluminum, Black Anodized
TO-220
PATENT PENDING
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
230 SERIES
234 SERIES
230-75AB-05
230-75AB-10
230-75AB-01
234 SERIES
234-75AB 234-75AB-01 234-75AB-05
230 AND 234 SERIES
Dimensions: in. (mm)
Height Above Maximum
Standard PC Board Footprint Thermal Performance at Typical Load
P/N in. (mm) in. (mm) Natural Convection Forced Convection
206-1PABEH 1.18 (30.0) 1.00 (25.4) x .50 (12.7) 56°C rise @ 4W 7.3°C/W @ 200LFM
Material: Aluminum, Black Anodized
230 & 234 SERIES
206 SERIES
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Board Level
Heat Sinks
25
Horizontal and Vertical Mount Heat Sink
Horizontal Mount Heat Sink
TO-220
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
0
20
40
60
80
100
02004006008001000
AIR VELOCITY (LFM)
HEAT SINK TEMPERATURE RISE
ABOVE AMBIENT AIR (C)
0
2
4
6
8
10
02004006008001000
HEAT DISSIPATED (WATTS)
THERMAL RESISTANCE SINK TO
AMBIENT (C)
1 5 4 3 2
TO-220
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
0
20
40
60
80
100
02004006008001000
AIR VELOCITY (LFM)
HEAT SINK TEMPERATURE RISE
ABOVE AMBIENT AIR (C)
0
2
4
6
8
10
12
14
16
18
20
02004006008001000
HEAT DISSIPATED (WATTS)
THERMAL RESISTANCE SINK TO
AMBIENT (C)
1 5 4 3 2
Height Above Maximum
Standard PC Board Footprint Thermal Performance at Typical Load
P/N in. (mm) in. (mm) Natural Convection Forced Convection
241-69ABE-03 .39 (9.9) .86 (21.8) x .69 (17.5) 77°C rise @ 4W 12°C/W @ 200LFM
Material: Aluminum, Black Anodized
Height Above Maximum
Standard PC Board Footprint Thermal Performance at Typical Load
P/N in. (mm) in. (mm) Natural Convection Forced Convection
262-75ABE-05 .53 (13.4) .75 (19.1) x .50 (12.78) 80°C rise @ 2W 10°C/W @ 200LFM
262-75ABE-01 .75 (19.1) .53 (13.4) x .50 (12.7) 80°C rise @ 2W 10°C/W @ 200LFM
Material: Aluminum, Black Anodized
262 SERIES
241 SERIES
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Heat Sinks
26
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Self-Locking Wavesolderable Heat Sinks TO-220
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced
P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection
233-60AB .600 (15.2) .570 (14.5) x .500 (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 58°C @ 2W 11.0°C/W @ 400 LFM
233-60ABE-01 .600 (15.2) .570 (14.5) x .500 (12.7) Vertical 01 Clip/Mtg Hole 58°C @ 2W 11.0°C/W @ 400 LFM
233-60ABE-05 .500 (12.7) .600 (15.2) x .570 (14.5) Horizontal 05 Clip/Mtg Hole 58°C @ 2W 11.0°C/W @ 400 LFM
233-60ABE-10 .725 (18.4) .570 (14.5) x .500 (12.7) Vertical 10 Clip/Mtg Hole 58°C @ 2W 11.0°C/W @ 400 LFM
236-150AB 1.500 (38.1) .570 (14.5) x .500 (12.7) Vert./Horiz No Tab Clip/Mtg Hole 40°C @ 2W 4.80°C/W @ 400 LFM
236-150ABE-01 1.500 (38.1) .570 (14.5) x .500 (12.7) Vertical 01 Clip/Mtg Hole 40°C @ 2W 4.80°C/W @ 400 LFM
236-150ABE-05 .500 (12.7) 1.500 (38.1) x .570 (14.5) Horizontal 05 Clip/Mtg Hole 40°C @ 2W 4.80°C/W @ 400 LFM
236-150ABE-10 1.625 (41.3) .570 (14.5) x .570 (12.7) Vetrical 10 Clip/Mtg Hole 40°C @ 2W 4.80°C/W @ 400 LFM
Material: Aluminum, Black Anodized
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
233 AND 236 SERIES
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
233-60AB
233-60AB-05
236-150AB-05
236-150AB
233-60AB-01
236-150AB-01
233-60AB-10
236-150AB-10
Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks TO-220
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced
P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection
275-75AB .750 (19.1) .835 (21.2) x .400 (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 44 C @ 2W 7.9°C/W @ 400 LFM
275-75ABE-01 .750 (19.1) .835 (21.2) x .400 (12.7) Vertical 01 Clip/Mtg Hole 44°C @ 2W 7.9°C/W @ 400 LFM
275-75ABE-10 .875 (12.7) .835 (21.2) x .400 (14.5) Vertical 10 Clip/Mtg Hole 44°C @ 2W 7.9°C/W @ 400 LFM
231-69PAB .690 (18.4) .835 (21.2) x .400 (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 45°C @ 2W 8°C/W @ 400 LFM
231-69PABE .400 (10.1) .690 (17.5) x .835 (12.7) Horizontal 13H Clip/Mtg Hole 45°C @ 2W 8°C/W @ 400 LFM
231-69PABE-XXX .690 (17.5) .835 (21.2) x .400 (12.7) Vertical 13V, 14V, 15V Clip/Mtg Hole 45°C @ 2W 8°C/W @ 400 LFM
231-75PAB .750 (19.1) .835 (21.2) x .400 (14.5) Vert./Horiz. No Tab Clip/Mtg Hole 43°C @ 2W 7.9°C/W @ 400 LFM
231-75PABE .400 (10.1) .750 (19.1) x .835 (12.7) Horizontal 13H Clip/Mtg Hole 43°C @ 2W 7.9°C/W @ 400 LFM
231-75PABE-XXX .750 (19.1) .835 (21.2) x .400 (12.7) Vertical 13V, 14V, 15V Clip/Mtg Hole 43°C @ 2W 7.9°C/W @ 400 LFM
231-137PAB 1.375 (35) .835 (21.2 x .400 (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 32°C @ 2W 5.9°C/W @ 400 LFM
231-137PABE .400 (10.2) 1.375 (34.9) x .835 (12.7) Horizontal 13H Clip/Mtg Hole 32°C @ 2W 5.9°C/W @ 400 LFM
231-137PABE-XXX 1.375 (35) .835 (21.2) x .400 (12.7) Vertical 13V, 14V, 15V Clip/Mtg Hole 32°C @ 2W 5.9°C/W @ 400 LFM
Material: Aluminum, Pre-anodized Black (PAB), Anodized Black (AB)
Dimensions: in. (mm)
MECHANICAL
DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
All versions No Tab
275 AND 231 SERIES
TAB
14V
TAB
13V
TAB 13H
TAB 13H
TAB 01
TAB 10
TAB 15V
PATENT PENDING
PATENT 5381041
275 & 231 SERIES
233 & 236 SERIES
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Board Level
Heat Sinks
27
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced
P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection
235-85AB .850 (21.6) 1.000 (25.4) x .500 (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 40°C @ 2W 6.8°C/W @ 400 LFM
235-85ABE-01 .850 (21.6) 1.000 (25.4) x .500 (12.7) Vertical 01 Clip/Mtg Hole 40°C @ 2W 6.8°C/W @ 400 LFM
235-85ABE-05 .500 (12.7) .850 (21.6) x 1.000 (25.4) Horizontal 05 Clip/Mtg Hole 40°C @ 2W 6.8°C/W @ 400 LFM
235-85ABE-10 .975 (24.8) 1.000 (25.4) x .500 (12.7) Vertical 10 Clip/Mtg Hole 40°C @ 2W 6.8°C/W @ 400 LFM
Material: Aluminum, Black Anodized
TO-220
PATENT 5381041
Dimensions: in. (mm)
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
235 SERIES
235-85AB-10
235-85AB-01
235-85AB
235-85AB-05
Labor-Saving Clip-On Heat Sinks
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced
P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection
243-1PAB 1.000 (25.4) .800 (20.3) x .270 (6.9) Vert./Horiz. No Tab Clip 50°C@ 2W 4.5°C/W @ 400 LFM
243-3PAB .800 (20.3) .800 (20.3) x .270 (6.9) Verl./Horiz. No Tab Clip 78°C@ 2W 8.2°C/W @ 400 LFM
Material: Aluminum, Pre-anodized Black
TO-220
Dimensions: in. (mm)
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
VIEW B-B
SECTION A-A
243 SERIES
Snap-Down Self-Locking Heat Sinks
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced
P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection
239-75AB .750 (19.1) 1.120 (28.4) x .435 (11.0) Vert./Horiz No Tab Clip/Mtg Hole 38°C @ 2W 6°C/W @ 400 LFM
239-75ABE-03 .750 (19.1) 1.120 (28.4) x .435 (11.0) Vertical 03 Clip/Mtg Hole 38°C @ 2W 6°C/W @ 400 LFM
239-75ABE-04 .750 (19.1) 1.120 (28.4) x .435 (11.0) Vertical 04 Clip/Mtg Hole 38°C @ 2W 6°C/W @ 400 LFM
Material: Aluminum, Black Anodized
TO-220
PATENT PENDING
Dimensions: in. (mm)
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
239 SERIES
SECTION A-A
239-75AB
239-75AB-03
239-75AB-04
243 SERIES
239 SERIES
235 SERIES
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Board Level
Heat Sinks
28
Vertical Mount Heat Sink
Vertical Mount Heat Sink
TO-220
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
0
20
40
60
80
100
0 200 400 600 800 1000
AIR VELOCITY (LFM)
HEAT SINK TEMPERATURE RISE
ABOVE AMBIENT AIR (C)
0
2
4
6
8
10
0 200 400 600 800 1000
HEAT DISSIPATED (WATTS)
THERMAL RESISTANCE SINK TO
AMBIENT (C)
2 10 8 6 4
TO-220
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
0
20
40
60
80
100
0 200 400 600 800 1000
AIR VELOCITY (LFM)
HEAT SINK TEMPERATURE RISE
ABOVE AMBIENT AIR (C)
0
2
4
6
8
10
0 200 400 600 800 1000
HEAT DISSIPATED (WATTS)
THERMAL RESISTANCE SINK TO
AMBIENT (C)
2 10 8 6 4
Height Above Maximum
Standard PC Board Footprint Thermal Performance at Typical Load
P/N in. (mm) in. (mm) Natural Convection Forced Convection
265-118ABHE-22 1.18 (30.0) 1.00 (25.4) x .50 (12.7) 56°C rise @ 4W 7.0°C/W @ 200LFM
Material: Aluminum, Black Anodized
Height Above Maximum
Standard PC Board Footprint Thermal Performance at Typical Load
P/N in. (mm) in. (mm) Natural Convection Forced Convection
286DBE .95 (24.1) 1.00 (25.4) x .50 (12.7) 65°C rise @ 4W 9.0°C/W @ 200LFM
Material: Aluminum, Black Anodized
286DB SERIES
265 SERIES
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Heat Sinks
29
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Low-Cost, Low-Height Wavesolderable Heat Sinks TO-218, TO-220
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced
P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection
273-AB .375 (9.5) .750 (19.1) x .750 (19.1) Vert./Horiz. No Tab Mtg Hole 49°C @ 2W 7.2°C/W @ 400 LFM
273-ABE-01 .375 (9.5) .750 (19.1) x .750 (19.1) Vertical 01 Mtg Hole 49°C @ 2W 7.2°C/W @ 400 LFM
273-ABE-02 .375 (9.5) .750 (19.1) x .750 (19.1) Vertical 02 Mtg Hole 49°C @ 2W 7.2°C/W @ 400 LFM
Material: Aluminum, Black Anodized
Dimensions: in. (mm)
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
273-AB
273-AB-01 273-AB-02
273 SERIES
Low-Cost, Low-Height Wavesolderable Heat Sinks TO-220
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced
P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection
274-1AB .375 (9.5) .520 (13.2) x .750 (19.1) Vert./Horiz. No Tab Mtg Hole 56°C @ 2W 8.0°C/W @ 400 LFM
274-1ABE-01 .375 (9.5) .520 (13.2) x .750 (19.1) Vertical 01 Mtg Hole 56°C @ 2W 8.0°C/W @ 400 LFM
274-1ABE-02 .375 (9.5) .520 (13.2) x .750 (19.1) Vertical 02 Mtg Hole 56°C @ 2W 8.0°C/W @ 400 LFM
274-2AB .500 (12.7) .520 (13.2) x .750 (19.1) Vert./Horiz. No Tab Mtg Hole 50°C @ 2W 7.0°C/W @ 400 LFM
274-2ABE-01 .500 (12.7) .520 (13.2) x .750 (19.1) Vertical 01 Mtg Hole 50°C @ 2W 7.0°C/W @ 400 LFM
274-2ABE-02 .500 (12.7) .520 (13.2) x .750 (19.1) Vertical 02 Mtg Hole 50°C @ 2W 7.0°C/W @ 400 LFM
274-3AB .250 (6.4) .520 (13.2) x .750 (19.1) Vert./Horiz. No Tab Mtg Hole 62°C @ 2W 9.0°C/W @ 400 LFM
274-3ABE-01 .250 (6.4) .520 (13.2) x .750 (19.1) Vertical 01 Mtg Hole 62°C @ 2W 9.0°C/W @ 400 LFM
274-3ABE-02 .250 (6.4) .520 (13.2) x .750 (19.1) Vertical 02 Mtg Hole 62°C @ 2W 9.0°C/W @ 400 LFM
281-1AB .375 (9.5) .520 (13.2) x .750 (19.1) Vertical No Tab Mtg Hole 56°C @ 2W 8.0°C/W @ 400 LFM
281-2AB .500 (12.7) .520 (13.2) x .750 (19.1) Vertical No Tab Mtg Hole 50°C @ 2W 7.0°C/W @ 400 LFM
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
274-XAB-01 274-XAB-02
274 SERIES
Labor-Saving Twisted Fin Heat Sinks TO-220
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced
P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection
240-118ABEH-22 1.180 (30.0) 1.000 (25.4) x .500 (12.7) Vertical 22 Clip/Mtg Hole 55°C @ 4W 5.3°C/W @ 400 LFM
240-118ABES-22 1.180 (30.0) 1.000 (25.4) x .500 (12.7) Vertical 22 Clip/Mtg Slot 55°C @ 4W 5.3°C/W @ 400 LFM
Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
240-118ABH-22
240-118ABS-22
240 SERIES
Dimensions: in. (mm)
Material: Aluminum,
Black Anodized
Dimensions: in. (mm)
274 SERIES
281 SERIES
273 SERIES
274 & 281 SERIES
240 SERIES
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Heat Sinks
30
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Low-Height, Low-Profile Twisted Fin Heat Sinks
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced
P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection
242-125ABE-22 1.285 (32.6) .875 (22.2) x .250 (6.4) Vertical 22 Mtg Hole 48°C @ 2W 6.2°C/W @ 400 LFM
Material: Aluminum, Black Anodized
TO-220
Dimensions: in. (mm)
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
242-125AB-22 242 SERIES
Staggered Fin Heat Sinks for Vertical Mounting
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced
P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection
232-200AB 2.000 (50.8) 1.380 (35.1) x .500 (12.7) Vertical 2, Twisted Clip/Mtg Hole 48°C @ 4W 3.3°C/W @ 400 LFM
232-200ABE-23 2.000 (50.8) 1.380 (35.1) x .500 (12.7) Vertical 2, Solderable Clip/Mtg Hole 48°C @ 4W 3.3°C/W @ 400 LFM
238-200AB 2.000 (50.8) 1.380 (35.1) x .500 (12.7) Verlical 2, Twisted Mtg Slot 48°C @ 4W 3.3° C/W @ 400 LFM
238-200ABE-23 2.000 (50.8) 1.380 (35.1) x .500 (12.7) Verlical 2, Solderable Mtg Slot 48°C @ 4W 3.3° C/W @ 400 LFM
TO-202, TO-220
Dimensions: in. (mm)
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
232-200AB-23
238-200AB 238-200AB-23
232-200AB 238 SERIES 232 AND 238 SERIES
Slim-Profile Heat Sinks With Integral Clips
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced
P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection
251-62AB .620 (15.7) .910 (23.1) x .380 (9.7) Vert./Horiz. No Tab Clip 66°C @ 3W 66°C/W @ 400 LFM
251-80AB .845 (21.5) .910 (23.1) x .380 (9.7) Vert./Horiz. No Tab Clip 64°C @ 3W 66°C/W @ 400 LFM
251-80ABE-19 .875 (22.2) .910 (23.1) x .380 (9.7) Vertical 19 Clip 64°C @ 3W 66°C/W @ 400 LFM
Material: Aluminum, Black Anodized
15 Lead Multiwatt
Dimensions: in. (mm)
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
251-62AB 251-80AB 251-80AB-19
251 SERIES
Material: Aluminum,
Black Anodized
242 SERIES
232 & 238 SERIES
251 SERIES
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31
BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND MULTIWATT™ COMPONENTS
Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks MULTIWATT
MULTIWATT
MULTIWATT
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Natural Forced Weight
P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams)
244-145AB 1.450 (36.8) 1.300 (33.0) x 480 (12.1) Vert/Horiz, No Tab 44°C @ 4W 4.4°C/W @ 400 LFM .0160 (7.25)
244-145ABE-50 1.650 (41.9) 1.300 (33.0) x 480 (12.1) Vertical 50 44°C @ 4W 4.4°C/W @ 400 LFM .0170 (7.20)
Material: Aluminum, Black Anodized
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Natural Forced Weight
P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams)
245-145AB 1.450 (36.8) 1.750 (44.5) x .380 (9.7) Ver.t/Horiz. No Tab 38°C @ 4W 3.2°C/W @ 400 LFM .0160 (7.25)
245-145ABE-50 1.650 (41.9) 1.750 (44.5) x .380 (9.7) Vertical 50 38°C @ 4W 3.2°C/W @ 400 LFM .0170 (7.20)
Material: Aluminum, Black Anodized
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
Medium Height, Slim Profile Wavesolderable Folded Fin Heat Sinks
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Natural Forced Weight
P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams)
246-197AB 1.968 (50.0) 1.986 (50.4) x 3.75 (9.5) Vert./Horiz. No Tab 35°C @ 4W 2.8°C/W @ 400 LFM .0240 (10.90)
246-197ABE-50 2.168 (55.1) 1.986 (50.4) x 3.75 (9.5) Vertical 50 35°C @ 4W 2.8°C/W @ 400 LFM .0250 (11.40)
Order SpeedClip™ 285SC or 330SC separately. (See 248 Series section).
Material: Aluminum, Black Anodized
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
244 SERIES
245 SERIES
246 SERIES
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BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND MULTIWATT™ COMPONENTS
Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Natural Forced Weight
P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams)
247-195AB 1.950 (49.5) 1.900 (48.3) x .950 (24.1) Vert./Horiz. No Tab 25°C@ 4W 2.4°C/W @ 400 LFM .0330 (15.10)
247-195ABE-50 1.950 (49.5) 1.900 (48.3) x .950 (24.1) Vertical 50 25°C@ 4W 2.4°C/W @ 400 LFM .0340 (15.60)
Order SpeedClip™ 285SC or 330SC separately. (See 248 Series section).
Material: Aluminum, Black Anodized
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
Low Height, Medium Profile Wavesolderable Folded Fin Heat Sinks
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Natural Forced Weight
P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams)
248-162AB 1.620 (41.1) 2.000 (50.8) x .750 (19.1) Vert/Horiz. No Tab 35°C @ 4W 2.5°C/W @ 400 LFM .026 (11.60)
248-162ABE-50 1.620 (41.1) 2.000 (50.8) x .750 (19.1) Vertical 50 35°C @ 4W 2.5°C/W @ 400 LFM .027 (12.20)
Order SpeedClip™ 285SC or 330SC separately.
Material: Aluminum, Black Anodized
Dimensions: in. (mm)
Order SpeedClips™ separately for use
with Series 246, 247, 248 or 249
MECHANICAL DIMENSIONS
Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Natural Forced Weight
P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams)
249-113AB 1.130 (28.7) 1.900 (48.3) x .950 (24.1) Vert./Horiz, No Tab 35°C@ 4W 3.29°C/W @ 400 LFM .020 (8.90)
249-113ABE-50 1.130 (28.7) 1.900 (48.3) x .950 (24.1) Vertical 50 35°C@ 4W 3.29°C/W @ 400 LFM .021 (9.40)
Order SpeedClip™ 285SC or 330SC separately. (See 248 Series section).
Material: Aluminum, Black Anodized
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
MULTIWATT
MULTIWATT
MULTIWATT
247 SERIES
248 SERIES
249 SERIES
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33
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Compact Wave-Solderable Low-Cost Heat Sinks
Height Above Maximum Thermal Performance at Typical Load
Standard PC Board Footprint Natural Forced Weight
P/N in. (mm) in. (mm) Convection Convection lbs. (grams)
288-1ABE 1.250 (31.8) 0.875 (22.2) x 0.215 (5.5) 85°C @ 4W 12°C/W @ 200 LFM 0.0057 (2.59)
TO-220, TO-202
Top-Mount Booster Heat Sinks for Use with 270/272/280 Series
TO-220
Horizontal
Height Above Mounting Footprint Thermal Performance at Typical Load
Standard Semiconductor Case Dimensions Natural Forced Weight
P/N in. (mm) in. (mm) Convection Convection lbs. (grams)
271-AB 0.500 (12.7) 1.750 (44.5) x 0.700 (17.8) 62°C @ 4W (NOTE A) 5.1°C/W @ 400 LFM 0.0052 (2.36)
31 °C @ 4W (NOTE B) 1.8°C/W 400 LFM (NOTE B)
Material: Aluminum, Black Anodized
This top-hat style booster heat sink can be added to any of the 270, 272, or 280
Series for improved performance.
NOTE A: Thermal resistance with one 271-AB. NOTE B: Thermal resistance
(total) as shown with (2) 271-AB types added to (1) 272-AB type.
Mounting tabs are pre-tinned to ensure excellent wave-solder bond and good
electrical connections for vertical mounting of TO-220 and TO-202 semiconduc-
tor packages. These heat sinks are designed for use where minimum PC board
space is available. The 288-1AB is a stamped aluminum heat sink, black an-
odized, designed for applications requiring good heat dissipation from a heat
sink occupying minimum space, available at minimum cost.
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
271 SERIES
Dimensions: in. (mm)
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
288 SERIES
Dimensions: in. (mm)
288 SERIES
271 SERIES
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34
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Small Footprint Low-Cost Heat Sinks TO-220, TO-202
Height Above Horizontal Mounting Thermal Performance at Typical Load
Standard PC Board Maximum Footing Solderable Natural Forced Weight
P/N in. (mm) in. (mm) Tab Options Convection Convection lbs. (grams)
270-AB 0.375 (9.4) 1.750 (44.5) x 0.700 (17.8) 70° C @ 4W 6.0°C/W @ 400 LFM 0.0052 (2.36)
272-AB 0.375 (9.4) 1.750 (44.5) x 1.450 (36.8) 01,02 42°C @ 4W 3.6°C/W @ 400 LFM 0.0105 (5.72)
280-AB 0.375 (9.4) 1.750 (44.5) x 0.700 (17.8) 70° C @ 4W 6.0°C/W @ 400 LFM 0.0048 (2.18)
Material: Aluminum, Black Anodized
These exceptionally low-cost heat sinks can be mounted horizontally under a TO-220 or
TO-202 case style with a maximum height of only 0.375 in. (9.4). For added performance,
a 271 Series heat sink can also be used for double-sided heat dissipation.
The 270-AB and 280-AB accept one power semiconductor; the 272-AB is designed for two
power semiconductors. Specify solderable tab options for the 272 Series by the addition of
suffix “O1” or “02” to the standard part number (i.e. 272-AB01 or 272-AB02).
Low-Cost Single or Dual Package Heat Sinks TO-218, TO-202, TO-220
Height Above Horizontal Mounting Thermal Performance at Typical Load
Standard PC Board Maximum Footing Natural Forced Weight
P/N in. (mm) in. (mm) Convection Convection lbs. (grams)
289-AB 0.500 (12.7) 1.000 (25.4) x 0.710 (18.1) 50°C @ 2W 9.0 C/W @ 400 LFM 0.0055 (2.49)
289-AP 0.500 (12.7) 1.000 (25.4) x 0.710 (18.1) 50°C @ 2W 9.0 C/W @ 400 LFM 0.0055 (2.49)
290-1AB 0.500 (12.7) 1.000 (25.4) x 1.180 (30.0) 44°C @ 2W 7.0 C/W @ 400 LFM 0.0082 (3.72)
290-2AB 0.500 (12.7) 1.000 (25.4) x 1.180 (30.0) 44°C @ 2W 7.0 C/W @ 400 LFM 0.0081 (3.67)
Material: Aluminum, Black Anodized
Low in cost and compact in overall dimensions, one 289 Series heat sink can
accommodate one semiconductor; the 289 Series is available with a black an-
odized finish (289-AB) or with no finish (289-AP). Two semiconductors can be
mounted to the 290-2AB style.
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
270 SERIES 280 SERIES
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
289 SERIES 290 SERIES
Dimensions: in. (mm)
Dimensions: in. (mm)
272 SERIES 272AB01 272AB02
270/272/280 SERIES
289 & 290 SERIES
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35
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
High-Performance Slim Profile Heat Sinks With Integral Clips MULTIWATT
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced
P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection
250-122AB 1.220 (31.0) 1.000 (25.4) x .500 (12.7) Vert./Horiz. No Tab Clip 50°C @ 4W 3.7°C/W @ 400 LFM
250-122ABE-09 1.220 (31.0) 1.000 (25.4) x .500 (12.7) Vertical 09 Clip 50°C @ 4W 3.7°C/W @ 400 LFM
250-122ABE-25 1.380 (35.1) 1.000 (25.4) x .500 (12.7) Vertical 25 Clip 50°C @ 4W 3.7°C/W @ 400 LFM
Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
250-122AB
250-122AB-09 250-122AB-25
250 SERIES
High-Performance, High-Power Vertical Mount Heat Sinks TO-220
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced
P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection
237-167AB2 1.675 (42.5) 1.000 (25-4) x 1.000 (25.4) Vertical 2, Twisted Clip/Mtg Slot 46°C @ 4W 4.5° C/W @ 200 LFM
237-167AB3 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 3, Twisted Clip/Mtg Slot 46°C @ 4W 4.5° C/W @ 200 LFM
237-167ABE2-24 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 2, Solderable Clip/Mtg Slot 46°C @ 4W 4.5° C/W @ 200 LFM
252-167AB2 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 2, Twisted Clip/Mtg Slot 40°C @ 4W 4.5° C/W @ 200 LFM
252-167AB3 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 3, Twisted Clip/Mtg Slot 40°C @ 4W 4.5° C/W @ 200 LFM
252-167ABE2-24 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 2, Solderable Clip/Mtg Slot 40°C @ 4W 4.5° C/W @ 200 LFM
Order SpeedClips™ 285SC or 330SC separately for rapid component installation, lowering manufacturing costs. Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
227-167
237-167AB3
252-167AB3
237-167AB3
252-167 237-167AB2
252-167AB2
237-167AB2-24
252-167AB2-24
237 AND 252 SERIES
237 AND 252 SERIES
Dimensions: in. (mm)
252-167AB3
Labor-Saving Clip-on Heat Sinks
TO-220
Vertical
Height Above Mounting Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Mounting Natural Forced Weight
P/N in. (mm) in. (mm) Style Convection Convection lbs. (grams)
291-C236AB 0.860 (21.)9 1.100 (27.0) x 0.360 (9.1) TO-220 (Clip) 80°C @ 2W 24°C/W @ 600 LFM 0.0026 (1.18)
291-H36AB 0.860 (21.9) 1.100 (27.0) x 0.360 (9.1) TO-220 (Mtg. Hole) 68°C @ 2W 16°C/W @ 600 LFM 0.0026 (1.18))
Material: Aluminum, Black Anodized
Designed for mounting horizontally or vertically on a circuit board, 291 Series
heat sinks employ a unique clip for attachment of TO-220 case styles.
One type is available with a locking clip and one with a 0.140 in. (3.6) diameter
mounting hole only.
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
291 SERIES
Dimensions: in. (mm)
291-C2 291-H
Dimensions: in. (mm)
237 & 252 SERIES
250 SERIES
291 SERIES
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36
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Aluminum and Copper Low-Cost Wave-Solderable Heat Sinks
Height Above Thermal Performance at Typical Load
Standard PC Board Maximum Footprint Natural Forced Weight
P/N in. (mm) in. (mm) Material Convection Convection lbs. (grams)
286-AB 1.190 (30.2) 1.000 (25.4) x 0.500 (12.7) Aluminum, Anodized 58°C @ 4W 7.4°CW @ 200 LFM 0.0085 (3.86)
286-CBTE 1.190 (30.2) 1.000 (25.4) x 0.500 (12.7) Copper, Black 58°C @ 4W 7.4° CW @ 200 LFM 0.0250 (11.34)
286-CTE 1.190 (30.2) 1.000 (25.4) x 0.500 (12.7) Copper, Tinned 58°C @ 4W 7.4° CW @ 200 LFM 0.0250 (11.34)
Efficient heat removal at low cost can be achieved by inserting the 286 Series di-
rectly into pre-drilled circuit boards; scored mounting tabs may be bent after in-
sertion to provide added stability. The 286 Series can be wavesoldered directly to
the board. Material: 286-AB style (aluminum, black anodized), 286-CBT style
(copper, black paint tin tabs), and 286-CT style (copper, tinned).
TO-220
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
286 SERIES
Dimensions: in. (mm)
Wave-Solderable Low-Cost Heat Sinks
Height Above Maximum Thermal Performance at Typical Load
Standard P/N PC Board Footprint “A” Natural Forced Weight
Mounting Slot Mounting Hole in. (mm) in. (mm) Convection Convection lbs. (grams)
287-1ABE 287-1ABH 1.180 (30.0) 1.000 (25.4) x 0.500 (12.7) 65°C @ 4W 7.8°CW @ 200 LFM 0.0090 (4.08)
287-2ABE 287-2ABH 1.180 (30.0) 1.000 (25.4) x 1.000 (25.4) 55°C @ 4W 6.4°CW @ 200 LFM 0.0140 (6.35)
Material: Aluminum, Black Anodized
Mount these cost-effective TO-220 heat sinks vertically into pre-drilled printed
circuit boards. Soldered, pre-tinned tabs can be wavesoldered directly to the
board. A 0.375 in. (9.5 mm) mounting slot allows for correct positioning of TO-
220 and similar semiconductor packages.
TO-220
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
287 SERIES
Dimensions: in. (mm)
Standard P/N Dim. “A”
287-1AB 0.500 (12.7)
287-2AB 1.000 (25.4)
287-1ABH 0.500 (12.7)
287-2ABH 1.000 (25.4)
See also 286DB Series on Page 7.
285 SC and 330 SC SpeedClips™ Zif Socket 8 And
387 SPGA LIF
Standard Nominal Installed For Use Weight
P/N Loading Force With Series Material lbs. (grams)
285 SC 10 lbs 232, 237, 240, 252, 667 Carbon Steel 0.00053 (0.24)
330 SC 4 lbs 232, 237, 240, 252, 667 Stainless Steel 0.00074 (0.34)
SpeedClips™ employ a locking safety tab for mounting. Must be ordered sepa-
rately for these heat sink series. Use these SpeedClips™ with our 237, 240, and
252 Series heat sinks for the lowest production assembly time and cost. Order
one SpeedClip™ for each heat sink purchased. Must be purchased with heat
sinks.
MECHANICAL DIMENSIONS Speed
Clip
330 SC
4 lb (17.8N)
Nominal Force
Installed
Speed
Clip
285 SC
10 lb (44.5N)
Nominal Force
Installed
Dimensions: in. (mm)
287 SERIES
286 SERIES
285 & 330 SERIES
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37
Space-Saving Heat Sinks for Small Stud-Mounted Diodes
STUD-MOUNT
Maximum Thermal Performance at Typical Load
Standard Width Height Natural Forced Weight
P/N in. (mm) in. (mm) Convection Convection lbs. (grams)
695-1B 1.330 (33.8) 0.530 (13.7) 72°C @ 4.0W 5.2°C/W @ 400 LFM 0.008 (4.0)
Mount and effectively heat sink small stud-mounted diodes with the 695 Series
space-saving heat sink type. Each unit is black anodized aluminum with an
0.200 in. (5.1) dia. mounting hole centered in the base. The folded fin design
provides good heat dissipation for use where height is limited above the printed
circuit board or base plate.
MECHANICAL
DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
695 SERIES
Dimensions: in. (mm)
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Cup Clips for TO-5 Case Style Semiconductors TO-5
Thread
Size: 4 = #4-40 UNC Base Style: H = hex
6 = #6-32 UNC Semiconductor
Mounting T = tapped Case Style: 5 = TO-5
Style: S = stud Insulation E = epoxy
P = plain
Characteristics TO-5
Thermal Resistance – Epoxy Insulated 14° C/W
Breakdown Voltage – Epoxy Type (VAC), 60 Hz 500
Recommended Operating Voltage, AC or DC
Clean Conditions: % Hipot Rating 50
Dusty Conditions: % Hipot Rating 30
Dirty Conditions: % Hipot Rating 10 to 20
Temperature Range — Continuous (C°) -73/+149
Depth of
Model Tapped Base
260-4T5E 0.093 (2.36)
260-4TH5E 0.125 (3.18)
Base Mounting Configurations — TO-5
Plain Type — Epoxy bonded, or used with #4 pan head screws.
Tapped Base — #4-40 UNC screw (not supplied) fits tapped hole. Care should
be taken not to use too long a screw, which could short against the semicon-
ductor case. For correct screw lengths:
Correct Screw Length (L) = Depth of Base +Panel Thickness +Washer Thickness
Stud Mounting Base. #6-32 UNC. Nuts and washers not supplied. Stud hole
must be slightly countersunk to ensure flat mounting.
To determine the correct mounting screw lengths, add dimensions as follows:
Correct Screw Length (L) = Depth of Base + Panel Thickness + Washer Thickness
Materials and Finish: Cups – beryllium copper, black ebonol “C”; Bases – brass, black ebonol “C”
TO-5 CASE STYLE CUP CLIPS — ORDERING GUIDE
Outline Dimension
Standard Insulation L x W x I.D. Weight Case
P/N Type in. (mm) lbs. (grams) Style
260-4T5E Epoxy Insulated 0.370 (9.4) x 0.380 (9.7) dia. x 0.290 (7.4) 0.0024 (1.09) TO-5
260-4TH5E Epoxy Insulated 0.400 (10.2) x 0.370 (9.4) hex. x 0.290 (7.4) 0.0031 (1.41) TO-5
260-6SH5E Epoxy Insulated 0.557 (14.1) x 0.370 (9.4) hex. x 0.290 (7.4) 0.0037 (1.68) TO-5
695 SERIES
260 SERIES
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Heat Sinks
38
Power semiconductors packaged in a TO-92 style plastic case can be cooled ef-
fectively at little additional cost with the addition of the 292-AB heat sink. The
292-AB is effective over the typical power range of such devices.
Material: Aluminum, Black Anodized
Epoxy Insulated For TO-5
260-4T5E 260-4TH5E 260-6SH5E
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Thermal Links for Fused Glass Diodes DIODES
Standard Dimensions Weight
P/N in. (mm) Material Finish lbs. (grams)
258 0.500 (12.7) x 0.250 (6.4) x 0.340 (8.6) Aluminum DeltaCoate™ 151 on all surfaces 0.0018 (0.82)
except solder pads and base
The thermal resistance from diode leads to chassis or heat sink is 12°C/watt,
when unit is mounted with TYPE 120 Joint Compound. If a 10°C/watt chassis or
sink to ambient impedance is available, the thermal resistance from the diode
leads to ambient is reduced from about 150°C/watt to 22°C/watt.
Heat Sink for Single TO-92 TO-92
Height Above Overall
Standard PC Board Fin Width Thermal Performance Weight
P/N in. (mm) in. (mm) Natural Convection Finish lbs. (grams)
292-AB 0.750 (19.1) 0. 600 (15.3) 0.225°C/W @ 0.250 W Black Anodized 0.00049 (0.22)
Dimensions: in. (mm)
MECHANICAL DIMENSIONS 292 SERIES NATURAL AND FORCED
CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
258 SERIES
260 SERIES
258 SERIES
292 SERIES
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39
High-Efficiency Heat Sinks For Vertical Board Mounting
Height Above Thermal Performance at Typical Load
Standard PC Board “A” Maximum Footprint Natural Forced Weight
P/N in. (mm) in. (mm) Convection Convection lbs. (grams)
637-10ABEP 1.000 (25.4) 1.375 (34.9) x 0.500 (12.7) 76°C @ 6W 5.8°C/W @ 200 LFM 0.023 (10.43)
637-15ABEP 1.500 (38.1) 1.375 (34.9) x 0.500 (12.7) 65°C @ 6w 5.5° C/W @ 200 LFM 0.035 (15.88)
637-20ABEP 2.000 (50.8) 1.375 (34.9) x 0.500 (12.7) 55°C @ 6W 4.7°C/W @ 200 LFM 0.050 (22.68)
637-25ABEP 2.500 (63.5) 1.375 (34.9) x 0.500 (12.7) 48°C @ 6W 4.2°C/W @ 200 LFM 0.062 (28.12)
Material: Aluminum, Black Anodized
Wave-solderable pins on 1 in. centers for vertical mounting on printed circuit boards. Maxi-
mum semiconductor package width 0.625 in. (15.9). Use this heat sink where weight and
board space occupied must be minimized. Refer to the Accessory products section for thermal
interface materials, thermal compounds, and other accessories products.
TO-220
MECHANICAL DIMENSIONS 637 SERIES
(EXTRUSION PROFILE 5183) NATURAL AND FORCED
CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
637 SERIES
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Slim Profile Unidirectional Fin Vertical Mount Heat Sink
Standard Height Above Footprint
P/N PC Board Dimensions Weight
Plain Pin Without Pin in. (mm) in. (mm) lbs. (grams)
634-10ABEP 634-10AB 1.000 (25.4) 0.640 (16.26) x 0.640 (16.26) 0.016 (7.48
634-15ABEP 634-15AB 1.500 (38.1) 0.640 (16.26) x 0.640 (16.26) 0.025 (11.21)
634-20ABEP 634-20AB 2.000 (50.8) 0.640 (16.26) x 0.640 (16.26) 0.033 (14.95)
Material: Aluminum, Black Anodized.
These slim profile unidirectional fin heat sinks offer users two assembly alternatives for verti-
cally mounting TO-220 and TO-218 components. Models are available with or without wave-
solderable pins on 0.40 in. (10.2) centers, making them ideal for a variety of applications
where quick assembly is needed and space is at a premium.
TO-220 and TO-218
MECHANICAL DIMENSIONS 634 SERIES
TYPICAL THERMAL PERFORMANCE
FOR 634-15ABP
Dimensions: in. (mm)
Notes:
1. Thermal compound is as-
sumed between device
and heat sink.
2. Tab temp with longer heat
sink (634-20ABP) will
typically be about 15%
cooler. Tab temp with
shorter heat sink
(634- I0ABP) will typically
be about 25% higher.
634 SERIES
WTS001_p26-49 6/14/07 10:56 AM Page 39
High-Efficiency Heat Sinks for Vertical Board Mounting TO-218, TO-220
Height Above Maximum Thermal Performance at Typical Load
Standard Standard PC Board “A” Footprint Natural Forced
P/N P/N in. (mm) in. (mm) Convection Convection
626-10ABEP 627-10ABP 1.000 (25.4) 1.375 (34.9) x .500 (12.7) 76°C @ 6W 5.8°C/W @ 200 LFM
626-15ABEP 627-15ABP 1.500 (38.1) 1.375 (34.9) x .500 (12.7) 65°C @ 6W 5.5°C/W @ 200 LFM
626-20ABEP 627-20ABP 2.000 (50.8) 1.375 (34.9) x .500 (12.7) 55°C @ 6W 4.7°C/W @ 200 LFM
626-25ABEP 627-25ABP 2.500 (63-5) 1.375 (34.9) x .500 (12.7) 48°C @ 6W 4.2°C/M @ 200 LFM
Wave-solderable pins. Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
626 AND 627 SERIES
Dimensions: in. (mm)
626 & 627 SERIES
Board Level
Heat Sinks
40
Labor-Saving SpeedClip™ Heat Sinks for Vertical Board Mounting TO-220
Height Above Maximum Thermal Performance at Typical Load
Standard P/N PC Board “A” Footprint Natural Forced Weight
Standoff Pin Plain Pin in. (mm) in. (mm) Convection Convection lbs (grams)
667-10ABESP 667-10ABPP 1.000 (25.4) 1.375 (34.9) x 0.500 (12.7) 76°C @ 6W 5.8°C/W @ 200 LFM 0.0240 (11.0)
667-15ABESP 667-15ABPP 1.500 (38.1) 1.375 (34.9) x 0.500 (12.7) 66°C @ 6W 5.5°C/W @ 200 LFM 0.0340 (15.6)
667-20ABESP 667-20ABPP 2.000 (50.8) 1.375 (34.9) x 0.500 (12.7) 58°C @ 6W 4.7°C/W @ 200 LFM 0.0460 (21.0)
667-25ABESP 667-25ABPP 2.500 (63.5) 1.375 (34.9) x 0.500 (12.7) 48°C @ 6W 4.2°C/W @ 200 LFM 0.0580 (26.2)
Wave-solderable pins. Material: Aluminum, Black Anodized
0 4 8121620
0 200 400 600 800 1000
0
20
40
60
80
100
0
1
2
3
4
5
AIR VELOCITY (FPM)
POWER DISSIPATION (WATTS)
HEAT SINK TEMPERATURE
RISE ABOVE AMBIENT (°C)
THERMAL RESISTANCE
SINK TO AMBIENT (°C/WATT)
6
6
7
-
1
0
A
B
P
6
6
7
-
1
0
A
B
P
6
6
7
-
2
5
A
B
P
6
6
7
-
2
5
A
B
P
Speed
Clip
330SC
4 lb
Nominal
Force
Installed
Speed
Clip
285SC
10 lb
Nominal
Force
Installed
0.093
(2.4) DIA
0.156
(4.0)
0.670
(17.0)
0.730
(18.5)
0.062
(1.6) REF
1.375
(34.9)REF
0.500
(12.7)REF
1.000
(25.4)
0.180
(4.6) DIA
0.093
(2.4)
(NOMINAL)
DIA
0.044 (1.1) (STANDOFF)
0.130 (3.3)
0.125 (3.2) DIA
RAISED BOSS x 0.030 (0.8) HIGH
A
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
667 SERIES
(EXTRUSION PROFILE 8073)
STANDOFF
PINS
"SP"
PLAIN
PINS
"PP"
Dimensions: in. (mm)
Excellent performance, choice of wave-solderable plain pins (PP-Type) or wave-solderable hex-shaped standoff pins (SP-Type), and reduced assembly cost.
Note: Order 330 SC or 285 SC SpeedClip™ separately.
667 SERIES
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
WTS001_p26-49 6/14/07 10:56 AM Page 40
Board Level
Heat Sinks
41
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
High-Performance Heat Sinks for Vertical Board Mounting TO-220, TO-247, TO-218
Height Above Maximum Thermal Performance at Typical Load
Standard PC Board “A” Footprint Natural Forced Weight
P/N in. (mm) in. (mm) Convection Convection lbs (grams)
657-10ABEP 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 41°C @ 6W 3.7°C/W @ 200 LFM 0.0515 (23.36)
657-15ABEP 1.500 (38.1) 1.650 (41.9) x 1.000 (25.4) 38°C @ 6W 3.3°C/W @ 200 LFM 0.0760 (34.60)
657-20ABEP 2.000 (50.8) 1.650 (41.9) x 1.000 (25.4) 32°C @ 6W 2.9°C/W @ 200 LFM 0.1030 (47.00)
657-25ABEP 2.500 (63.5) 1.650 (41.9) x 1.000 (25.4) 25°C @ 6W 2.7°C/W @ 200 LFM 0.1250 (57.00)
Wave-solderable pins. Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
657 SERIES
657 SERIES
(EXTRUSION PROFILE 6533)
Dimensions: in. (mm)
657 SERIES
High-Performance Heat Sinks for Vertical Board Mounting
Height Above Thermal Performance at Typical Load
Standard PC Board “A” Maximum Footprint Natural Forced Weight
P/N in. (mm) in. (mm) Convection Convection lbs. (grams)
647-1OABEP 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 42°C @ 6W 3.8° C/W @ 200 LFM 0.055 (24.95)
647-15ABEP 1.500 (38.1) 1.650 (41.9) x 1.000 (25.4) 37°C @ 6W 3.5°C/W @ 200 LFM 0.075 (34.02)
647-175ABEP 1.750 (44.5) 1.650 (41.9) x 1.000 (25.4) 34° C @ 6W 3.3°C/W @ 200 LFM 0.090 (40.82)
647-20ABEP 2.000 (50.8) 1.650 (41.9) x 1.000 (25.4) 31°C @ 6W 3.1°C/W @ 200 LFM 0.104 (47.17)
647-25ABEP 2.500 (63.5) 1.650 (41.9) x 1.000 (25.4) 25°C @ 6W 2.8°C/W @ 200 LFM 0.125 (56.70)
Material: Aluminum, Black Anodized
Wave-solderable pins on 1 in. centers for vertical mounting of larger devices on printed
circuit boards. Maximum semiconductor package width: 0.625 (15.9). Refer to the Accessory
Products section for thermal interface materials, 126 Series silicone-free thermal compounds,
and other accessories products.
TO-220
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
647 SERIES
(EXTRUSION PROFILE 5195)
Dimensions: in. (mm)
647 SERIES
WTS001_p26-49 6/14/07 10:56 AM Page 41
Board Level
Heat Sinks
42
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
High-Performance Notched Heat Sinks for Vertical Board Mounting TO-220, TO-247, TO-218
Height Above Maximum Thermal Performance at Typical Load
Standard PC Board “A” Footprint Natural Forced
P/N in. (mm) in. (mm) Convection Convection
657-10ABEPN 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 41°C @ 6W 3.7°C/W @ 200 LFM
657-15ABEPN 1.500 (38.1) 1.650 (41.9) x 1.000 (25.4) 38°C @ 6W 3.3°C/W @ 200 LFM
657-20ABEPN 2.000 (50.8) 1.650 (41.9) x 1.000 (25.4) 32°C @ 6W 2.9°C/W @ 200 LFM
657-25ABEPN 2.500 (63.5) 1.650 (41.9) x 1.000 (25.4) 25°C @ 6W 2.7°C/W @ 200 LFM
Wave-solderable pins. Material: Aluminum, Black Anodized
Dimensions: in. (mm)
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
657 SERIES
High-Performance Heat Sinks with SpeedClips™ for Vertical Board Mounting TO-220, TO-247, TO-218
Height Above Maximum Thermal Performance at Typical Load
Standard PC Board “A” Footprint Natural Forced
P/N in. (mm) in. (mm) Convection Convection
657-10ABEPSC 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 41°C @ 6W 3.7°C/W @ 200 LFM
657-15ABEPSC 1.500 (38.1) 1.650 (41.9) x 1.000 (25.4) 38°C @ 6W 3.3°C/W @ 200 LFM
657-20ABEPSC 2.000 (50.8) 1.650 (41.9) x 1.000 (25.4) 32°C @ 6W 2.9°C/W @ 200 LFM
657-25ABEPSC 2.500 (63.5) 1.650 (41.9) x 1.000 (25.4) 25°C @ 6W 2.7°C/W @ 200 LFM
Wave-solderable pins. Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
657 SERIES
(EXTRUSION PROFILE 6533)
657 SERIES
(EXTRUSION PROFILE 6533)
657 SERIES
High-Performance, High-Power Heat Sinks for Vertical Board Mounting TO-218, TO-220, TO-247
15-LEAD Multiwatt
Height Above Maximum Thermal Performance at Typical Load
Standard PC Board “A” Footprint Natural Forced
P/N in. (mm) in. (mm) Convection Convection
677-10ABEP 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 52°C @ 6W 3.1°C/W @ 200 LFM
677-15ABEP 1.500 (38.1) 1.650 (41.9) x 1.000 (25.4) 46°C @ 6W 2.8°C/W @ 200 LFM
677-20ABEP 2.000 (50.8) 1.650 (41.9) x 1.000 (25.4) 40°C @ 6W 2.5°C/W @ 200 LFM
677-25ABEP 2.500 (63.5) 1.650 (41.9) x 1.000 (25.4) 35°C @ 6W 2.2°C/W @ 200 LFM
Wave-solderable pins. Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
677 SERIES
Dimensions: in. (mm)
Dimensions: in. (mm)
677 SERIES
(EXTRUSION PROFILE 8719)
657 SERIES
657 SERIES
677 SERIES
WTS001_p26-49 6/14/07 10:56 AM Page 42
Board Level
Heat Sinks
43
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
HIghest Efficiency/Lowest Unit Cost Heat Sinks
Height Above Thermal Performance at Typical Load Semiconductor
Standard PC Board Outline Dimensions Natural Forced Mounting Weight
P/N in. (mm) in. (mm) Convection Convection Hole Pattern lbs. (grams)
690-3B 1.310 (33.3) 1.860 (47.2)-sq 44° C @ 7.5W 2.0°C/W @ 400 LFM (1) TO-3 0.0700 (31.75)
690-66B 1.310 (33.3) 1.860 (47.2)-sq 44°C @ 7.5W 2.0°C/W @ 400 LFM (1) TO-66 0.0700 (31.75)
690-220B 1.310 (33.3) 1.860 (47.2)-sq 44°C @ 7.5W 2.0°C/W @ 400 LFM (2) TO-220 0.0700 (31.75)
Material: Aluminum, Black Anodized
These low-cost heat sinks provide the most power dissipation at the lowest unit cost and are
available in three standard types to mount and cool one TO-3 or TO-66 metal power semicon-
ductor type or two plastic package TO-220 power semiconductor types. For higher power
semiconductors, the 690 Series can dissipate up to 20 watts while maintaining a mounting
surface temperature rise above ambient air temperature of no more than 91°C.
TO-3, TO-66, TO-220
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
SEMICONDUCTOR MOUNTING HOLES
690 SERIES
Dimensions: in. (mm)
Maximum Efficiency Omnidirectional Heat Sinks
Height Above Horizontal Mounting Thermal Performance at Typical Load Semiconductor
Standard PC Board “A” Footprint Dimensions Natural Forced Mounting Weight
P/N in. (mm) in. (mm) Convection Convection Hole Pattern lbs. (grams)
680-5A 0.500 (12.7) 1.810 (46.0)-sq 70° C @ 7.5W 3.0°C/W @ 400 LFM (1) TO-3 0.0700 (31.75)
680-75A 0.750 (19.1) 1.810 (46.0)-sq 58°C @ 7.5W 2.4°C/W @ 400 LFM (1) TO-3 0.0900 (40.82)
680-10A 1.000 (25.4) 1.810 (46.0)-sq 52°C @ 7.5W 2.0°C/W @ 400 LFM (1) TO-3 0.0980 (44.45)
680-125A 1.250 (31.8) 1.810 (46.0)-sq 45°C @ 7.5W 1.5°C/W @ 400 LFM (1) TO-3 0.1100 (49.90)
680-5220 0.500 (12.7) 1.810 (46.0)-sq 7O°C @ 7.5W 3.0°C/W @ 400 LFM (2) TO-220 0.0700 (31.75)
680-75220 0.750 (19.1) 1.810 (46.0)-sq 58°C @ 7.5W 2.4°C/W @ 400 LFM (2) TO-220 0.0900 (40.82)
680-10220 1.000 (25.4) 1.810 (46.0)-sq 52°C @ 7.5W 2.0°C/W @ 400 LFM (2) TO-220 0.0980 (44.45)
680-125220 1.250 (31.8) 1.810 (46.0)-sq 45°C @ 7.5W 1.5°C/W @ 400 LFM (2) TO-220 0.1100 (49.90)
Material: Aluminum, Black Anodized
Achieve optimum natural convection cooling per unit volume occupied above the printed
circuit board for TO-3 (one semiconductor package per heat sink) or for two TO-220 style cases,
when this low-cost heat sink is used. Any mounting attitude will provide free circulation of air in
natural convection applications. These 680 Series heat sinks can also be specified without any
semiconductor mounting hole pattern by specifying suffix “K” (Example: 680-5K).
TO-3, TO-220
MECHANICAL
DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
SEMICONDUCTOR MOUNTING HOLES
680 SERIES
Dimensions: in. (mm)
TO-3 TO-66 *TWO TO-220’S
TO-3
A220 K
*TWO TO-220’S
680 SERIES
690 SERIES
WTS001_p26-49 6/14/07 10:56 AM Page 43
Board Level
Heat Sinks
44
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Low-Height Heat Sinks DO-4/DO-5 Diodes
Footprint Mounting Thermal Performance at Typical Load
Standard Dimensions Height Hole Dia. Natural Forced Weight
P/N in. (mm) in. (mm) in. (mm) Convection Convection lbs. (grams)
601E 2.000 (50.8) x 1.250 (31.8) 0.562 (14.3) 0.200 (5.1) 52°C @ 5.0W 4.5°C/W @ 175 LFM 0.0500 (22.68)
601F 2.000 (50.8) x 1.250 (31.8) 0.562 (14.3) 0.270 (6.9) 52°C @ 5.0W 4.5°C/W @ 175 LFM 0.0500 (22.68)
601K 2.000 (50.8) x 1.250 (31.8) 0.562 (14.3) None 52°C @ 5.0W 4.5°C/W @ 175 LFM 0.0500 (22.68)
603K 2.000 (50.8) x 2.000 (50.8) 0.562 (14.3) None 41° C @ 5.0W 4.0°C/W @ 175 LFM 0.0810 (36.74)
Material: Aluminum Alloy, Black Anodized
Use these low-height heat sinks on printed circuit board applications for TO-66 power semi-
conductors and DO-4 and DO-5 diodes, where close board-to-board spacing and efficient heat
dissipation are required. The 601 and 603 Series may also be attached to enclosure panels or
brackets using isolation hardware where necessary.
MECHANICAL DIMENSIONS NATURAL AND FORCED
CONVECTION CHARACTERISTICS
SEMICONDUCTOR MOUNTING HOLES
601 SERIES
(EXTRUSION PROFILE 1284)
603 SERIES
(EXTRUSION PROFILE 1284)
KEF
Dimensions: in. (mm)
MECHANICAL
DIMENSIONS
641 SERIES
(EXTRUSION PROFILE 1371)
Dimensions: in. (mm)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
SEMICONDUCTOR MOUNTING HOLES
Maximum Performance Natural Convection Heat Sink for all Metal-Case Semiconductors
Outline Mounting Thermal Performance at Typical Load
Standard Dimensions Height Hole Natural Forced Weight
P/N in. (mm) in. (mm) Pattern Convection Convection lbs. (grams)
641A 4.125 (104.8) x 3.000 (76.2) 1.000 (25.4) (1) TO-3 36°C @ 15W 0.9° C/W @ 250 LFM 0.2900 (131.54)
641K 4.125 (104.8) x 3.000 (76.2) 1.000 (25.4) None 36° C @ 15W 0.9° C/W @ 250 LFM 0.2900 (131.54)
Available with a standard TO-3 mounting hole pattern predrilled for cost-effective mounting in
limited-height applications, the 641 Series provides maximum performance in natural convec-
tion with an optimized heat sink surface area. The 641K type with an open channel area of
1.300 in. (33.0) and no predrilled mounting holes can be adapted to meet mounting require-
ments for most metal case power semiconductor types. Material: Aluminum Alloy, Black An-
odized.
TO-3
AK
601 & 603 SERIES
641 SERIES
WTS001_p26-49 6/14/07 10:56 AM Page 44

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