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JWK105C7104MP-F Datasheet

Taiyo Yuden

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Datasheet

Notice for TAIYO YUDEN Products
[ For General Electronic Equipment
(General Environment) ]
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
Product information in this catalog is as of October 2017. All of the contents specified herein are subject to change
without notice due to technical improvements, etc. Therefore, please check for the latest information carefully
before practical application or use of our products.
Please note that TAIYO YUDEN shall not be in any way responsible for any damages and defects in products or
equipment incorporating our products, which are caused under the conditions other than those specified in this
catalog or individual product specification sheets.
Please contact TAIYO YUDEN for further details of product specifications as the individual product specification
sheets are available.
Please conduct validation and verification of our products in actual condition of mounting and operating
environment before using our products.
The products listed in this catalog are intended for use in general electronic equipment (e.g., AV equipment, OA
equipment, home electric appliances, office equipment, information and communication equipment including,
without limitation, mobile phone, and PC) and medical equipment classified as Class I or II by IMDRF. Please be
sure to contact TAIYO YUDEN for further information before using the products for any equipment which may
directly cause loss of human life or bodily injury (e.g., transportation equipment including, without limitation,
automotive powertrain control system, train control system, and ship control system, traffic signal equipment,
disaster prevention equipment, medical equipment classified as Class III by IMDRF, highly public information
network equipment including, without limitation, telephone exchange, and base station).
Please do not incorporate our products into any equipment requiring high levels of safety and/or reliability (e.g.,
aerospace equipment, aviation equipment*, medical equipment classified as Class IV by IMDRF, nuclear control
equipment, undersea equipment, military equipment).
*Note: There is a possibility that our products can be used only for aviation equipment that does not directly affect the safe operation of aircraft (e.g.,
in-flight entertainment, cabin light, electric seat, cooking equipment) if such use meets requirements specified separately by TAIYO YUDEN.
Please be sure to contact TAIYO YUDEN for further information before using our products for such aviation equipment.
When our products are used even for high safety and/or reliability-required devices or circuits of general electronic
equipment, it is strongly recommended to perform a thorough safety evaluation prior to use of our products and to
install a protection circuit as necessary.
Please note that unless you obtain prior written consent of TAIYO YUDEN, TAIYO YUDEN shall not be in any way
responsible for any damages incurred by you or third parties arising from use of the products listed in this catalog
for any equipment requiring inquiry to TAIYO YUDEN or prohibited for use by TAIYO YUDEN as described above.
Information contained in this catalog is intended to convey examples of typical performances and/or applications
of our products and is not intended to make any warranty with respect to the intellectual property rights or any
other related rights of TAIYO YUDEN or any third parties nor grant any license under such rights.
Please note that the scope of warranty for our products is limited to the delivered our products themselves and
TAIYO YUDEN shall not be in any way responsible for any damages resulting from a fault or defect in our products.
Notwithstanding the foregoing, if there is a written agreement (e.g., supply and purchase agreement, quality
assurance agreement) signed by TAIYO YUDEN and your company, TAIYO YUDEN will warrant our products in
accordance with such agreement.
The contents of this catalog are applicable to our products which are purchased from our sales offices or
authorized distributors (hereinafter TAIYO YUDENs official sales channel ). Please note that the contents of this
catalog are not applicable to our products purchased from any seller other than TAIYO YUDENs official sales
channel.
Caution for Export
Some of our products listed in this catalog may require specific procedures for export according to U.S. Export
Administration Regulations , Foreign Exchange and Foreign Trade Control Law of Japan, and other applicable
regulations. Should you have any questions on this matter, please contact our sales staff.
c_mlcc_e-E06R01
MULTILAYER CERAMIC CAPACITORS
WAVE
REFLOW
PARTS NUMBER
J M K 3 1 6 B J 1 0 6 M L T △=Blank space
①Rated voltage
Code Rated voltage[VDC]
P 2.5
A 4
J 6.3
L 10
E 16
T 25
G 35
U 50
H 100
Q 250
S 630
②Series name
Code Series name
M Multilayer ceramic capacitor
V Multilayer ceramic capacitor for high frequency
W LW reverse type multilayer capacitor
③End termination
Code End termination
K Plated
S Cu Internal Electrodes
④Dimension(L×W)
Type Dimensions
(L×W)[mm] EIA(inch)
021 0.25× 0.125 008004
042 0.4 × 0.2 01005
063 0.6 × 0.3 0201
105 1.0 × 0.5 0402
0.52× 1.0 0204
107 1.6 × 0.8 0603
0.8 × 1.6 0306
212 2.0 × 1.25 0805
1.25× 2.0 0508
316 3.2 × 1.6 1206
325 3.2 × 2.5 1210
432 4.5 × 3.2 1812
Note : ※LW reverse type(□WK) only
⑤Dimension tolerance
Code Type L[mm] W[mm] T[mm]
ALL Standard Standard Standard
A
063 0.6±0.05 0.3±0.05 0.3±0.05
105 1.0±0.10 0.5±0.10 0.5±0.10
107 1.6+0.15/-0.05 0.8+0.15/-0.05 0.8+0.15/-0.05
212 2.0+0.15/-0.05 1.25+0.15/-0.05
0.45±0.05
0.85±0.10
1.25+0.15/-0.05
316 3.2±0.20 1.6±0.20 0.85±0.10
1.6±0.20
325 3.2±0.30 2.5±0.30 2.5±0.30
B
063 0.6±0.09 0.3±0.09 0.3±0.09
105 1.0+0.15/-0.05 0.5+0.15/-0.05 0.5+0.15/-0.05
107 1.6+0.20/-0 0.8+0.20/-0 0.45±0.05
0.8+0.20/-0
212 2.0+0.20/-0 1.25+0.20/-0
0.45±0.05
0.85±0.10
1.25+0.20/-0
316 3.2±0.30 1.6±0.30 1.6±0.30
C 105 1.0+0.20/-0 0.5+0.20/-0 0.5+0.20/-0
Note: cf. STANDARD EXTERNAL DIMENSIONS = Blank space
⑥Temperature characteristics code
■High dielectric type(Excluding Super low distortion multilayer ceramic capacitor)
Code Applicable
standard
Temperature
range[℃] Ref. Temp.[℃] Capacitance change Capacitance
tolerance
Tolerance
code
BJ
JIS B -25~+ 85 20 ±10% ±10% K
±20% M
EIA X5R -55~+ 85 25 ±15% ±10% K
±20% M
B7 EIA X7R -55~+125 25 ±15% ±10% K
±20% M
C6 EIA X6S -55~+105 25 ±22% ±10% K
±20% M
C7 EIA X7S -55~+125 25 ±22% ±10% K
±20% M
LD(※) EIA X5R -55~+ 85 25 ±15% ±10% K
±20% M
Note : ※.LD Low distortion high value multilayer ceramic capacitor = Blank space
CERAMIC CAPACITORS
Thiscatalogcontainsthetypicalspecificationonlyduetothelimitationofspace.Whenyouconsiderthepurchaseofourproducts,pleasecheckourproductspecificationsheets.
 Fordetailsofeachproduct(characteristicsgraph,reliabilityinformation,precautionsforuse,andsoon),seeourwebsite(http://www.ty-top.com/).
REFLOWWAVE
MULTILAYER CERAMIC CAPACITORS
12
c_mlcc_e-E06R01
■Temperature compensating type
Code Applicable
standard
Temperature
range[℃] Ref. Temp.[℃] Capacitance change Capacitance
tolerance
Tolerance
code
CG EIA C0G -55~+125 25 0±30ppm/℃
±0.05pF A
±0.1pF B
±0.25pF C
±0.5pF D
±5% J
UJ JIS UJ -55~+125 20 -750±120ppm/℃
±0.25pF C
±0.5pF D
EIA U2J 25 ±5% J
UK JIS UK -55~+125 20 -750±250ppm/℃ ±0.25pF C
EIA U2K -55~+125 25
SL JIS SL -55~+125 20 +350~-1000ppm/℃ ±5% J
⑥Series code
・Super low distortion multilayer ceramic capacitor
Code Series code
SD Standard
・Medium-High Voltage Multilayer Ceramic Capacitor
Code Series code
SD Standard
⑦Nominal capacitance
Code
(example) Nominal capacitance
0R5 0.5pF
010 1pF
100 10pF
101 100pF
102 1,000pF
103 10,000pF
104 0.1μF
105 1.0μF
106 10μF
107 100μF
Note : R=Decimal point
⑧Capacitance tolerance
Code Capacitance tolerance
A ±0.05pF
B ±0.1pF
C ±0.25pF
D ±0.5pF
F ±1pF
G ±2%
J ±5%
K ±10%
M ±20%
Z +80/-20%
⑨Thickness
Code Thickness[mm]
K 0.125
H 0.13
E 0.18
C 0.2
D
P 0.3
T
K 0.45(107type or more)
V 0.5
W
A 0.8
D 0.85(212type or more)
F 1.15
G 1.25
L 1.6
N 1.9
Y 2.0 max
M 2.5
⑩Special code
Code Special code
Standard
⑪Packaging
Code Packaging
F φ178mm Taping (2mm pitch)
T φ178mm Taping (4mm pitch)
P φ178mm Taping (4mm pitch, 1000 pcs/reel)
325 type(Thickness code M)
R φ178mm Taping (2mm pitch)105type only
(Thickness code E,H
W φ178mm Taping(1mm pitch)021/042type only
⑫Internal code
Code Internal code
Standard
CERAMIC CAPACITORS
Thiscatalogcontainsthetypicalspecificationonlyduetothelimitationofspace.Whenyouconsiderthepurchaseofourproducts,pleasecheckourproductspecificationsheets.
 Fordetailsofeachproduct(characteristicsgraph,reliabilityinformation,precautionsforuse,andsoon),seeourwebsite(http://www.ty-top.com/).
13
c_mlcc_e-E06R01
STANDARD EXTERNAL DIMENSIONS
W
L
e
T
T
L
W
e
LW reverse type
Type( EIA ) Dimension [mm]
L W T *1 e
□MK021(008004) 0.25±0.013 0.125±0.013 0.125±0.013 K 0.0675±0.0275
□VS021(008004) 0.25±0.013 0.125±0.013 0.125±0.013 K 0.0675±0.0275
□MK042(01005) 0.4±0.02 0.2±0.02 0.2±0.02 C 0.1±0.03
D
□VS042(01005) 0.4±0.02 0.2±0.02 0.2±0.02 C 0.1±0.03
□MK063(0201) 0.6±0.03 0.3±0.03 0.3±0.03 P 0.15±0.05
T
□MK105(0402) 1.0±0.05 0.5±0.05
0.13±0.02 H
0.25±0.10
0.18±0.02 E
0.2±0.02 C
0.3±0.03 P
0.5±0.05 V
□VK105(0402) 1.0±0.05 0.5±0.05 0.5±0.05 W 0.25±0.10
□WK105(0204)※ 0.52±0.05 1.0±0.05 0.3±0.05 P 0.18±0.08
□MK107(0603) 1.6±0.10 0.8±0.10 0.45±0.05 K 0.35±0.25
0.8±0.10 A
□WK107(0306)※ 0.8±0.10 1.6±0.10 0.5±0.05 V 0.25±0.15
□MK212(0805) 2.0±0.10 1.25±0.10
0.45±0.05 K
0.5±0.25 0.85±0.10 D
1.25±0.10 G
□WK212(0508)※ 1.25±0.15 2.0±0.15 0.85±0.10 D 0.3±0.2
□MK316(1206) 3.2±0.15 1.6±0.15
0.85±0.10 D
0.5+0.35/-0.25 1.15±0.10 F
1.6±0.20 L
□MK325(1210) 3.2±0.30 2.5±0.20
0.85±0.10 D
0.6±0.3
1.15±0.10 F
1.9±0.20 N
1.9+0.1/-0.2 Y
2.5±0.20 M
□MK432(1812) 4.5±0.40 3.2±0.30 2.5±0.20 M 0.9±0.6
Note : ※. LW reverse type, *1.Thickness code
STANDARD QUANTITY
Type EIA(inch) Dimension Standard quantity[pcs]
[mm] Code Paper tape Embossed tape
021 008004 0.125 K 50000
042 01005 0.2 C 40000
D
063 0201 0.3 P 15000
T
105 0402
0.13 H 20000
0.18 E 15000
0.2 C 20000
0.3 P 15000
0.5 V
10000
W
0204 0.30 P
107 0603 0.45 K 4000
0.8 A
0306 0.50 V 4000
212 0805
0.45 K 4000
0.85 D
1.25 G 3000
0508 0.85 D 4000
316 1206
0.85 D 4000
1.15 F 3000
1.6 L 2000
325 1210
0.85 D
2000
1.15 F
1.9 N
2.0 max Y
2.5 M 1000
432 1812 2.5 M 500
Note : ※.LW Reverse type(□WK)
CERAMIC CAPACITORS
Thiscatalogcontainsthetypicalspecificationonlyduetothelimitationofspace.Whenyouconsiderthepurchaseofourproducts,pleasecheckourproductspecificationsheets.
 Fordetailsofeachproduct(characteristicsgraph,reliabilityinformation,precautionsforuse,andsoon),seeourwebsite(http://www.ty-top.com/).
14
PARTS NUMBER
LW Reversal Decoupling CapacitorsLWDCTM
105TYPE
【Temperature Characteristic BJ : X5R】 0.3mm thickness(P)
HTLT
Rated voltage x %
TWK105 BJ104MP-F 25 X5R 0.1 μ ±20 5 150 0.3±0.05 R
EWK105 BJ224MP-F 16 X5R 0.22 μ ±20 10 150 0.3±0.05 R
LWK105 BJ474MP-F 10 X5R 0.47 μ ±20 10 150 0.3±0.05 R
JWK105 BJ104MP-F X5R*1 0.1 μ ±20 5 150 0.3±0.05 R
JWK105 BJ474MP-F X5R*1 0.47 μ ±20 10 150 0.3±0.05 R
JWK105 BJ105MP-F X5R 1 μ ±20 10 150 0.3±0.05 R
JWK105 BJ225MP-F X5R 2.2 μ ±20 10 150 0.3±0.05 R
【Temperature Characteristic C6 : X6S , C7 : X7S】 0.3mm thickness(P)
HTLT
Rated voltage x %
EWK105 C6104MP-F 16 X6S 0.1 μ ±20 5 150 0.3±0.05 R
LWK105 C7104MP-F X7S 0.1 μ ±20 5 150 0.3±0.05 R
LWK105 C6224MP-F X6S 0.22 μ ±20 10 150 0.3±0.05 R
JWK105 C7104MP-F X7S 0.1 μ ±20 5 150 0.3±0.05 R
JWK105 C7224MP-F X7S 0.22 μ ±20 10 150 0.3±0.05 R
JWK105 C6474MP-F X6S 0.47 μ ±20 10 150 0.3±0.05 R
AWK105 C6224MP-F X6S 0.22 μ ±20 10 150 0.3±0.05 R
AWK105 C6474MP-F X6S 0.47 μ ±20 10 150 0.3±0.05 R
AWK105 C6105MP-F X6S 1 μ ±20 10 150 0.3±0.05 R
AWK105 C6225MP-F X6S 2.2 μ ±20 10 150 0.3±0.05 R
107TYPE
【Temperature Characteristic BJ : X5R】 0.5mm thickness(V)
HTLT
Rated voltage x %
TWK107 BJ104MV-T 25 X5R*1 0.1 μ ±20 5 150 0.5±0.05 R
EWK107 BJ224MV-T X5R*1 0.22 μ ±20 5 150 0.5±0.05 R
EWK107 BJ474MV-T X5R*1 0.47 μ ±20 5 150 0.5±0.05 R
LWK107 BJ105MV-T X5R 1 μ ±20 10 150 0.5±0.05 R
LWK107 BJ225MV-T X5R 2.2 μ ±20 10 150 0.5±0.05 R
JWK107 BJ105MV-T X5R*1 1 μ ±20 10 150 0.5±0.05 R
JWK107 BJ225MV-T X5R 2.2 μ ±20 10 150 0.5±0.05 R
JWK107 BJ475MV-T X5R 4.7 μ ±20 10 150 0.5±0.05 R
AWK107 BJ106MV-T 4 X5R 10 μ ±20 10 150 0.5±0.05 R
【Temperature Characteristic B7 : X7R , C6 : X6S , C7 : X7S】 0.5mm thickness(V)
HTLT
Rated voltage x %
TWK107 B7104MV-T 25 X7R 0.1 μ ±20 5 150 0.5±0.05 R
EWK107 B7224MV-T X7R 0.22 μ ±20 5 150 0.5±0.05 R
EWK107 B7474MV-T X7R 0.47 μ ±20 5 150 0.5±0.05 R
JWK107 C7105MV-T 6.3 X7S 1 μ ±20 10 150 0.5±0.05 R
AWK107 C7225MV-T X7S 2.2 μ ±20 10 150 0.5±0.05 R
AWK107 C6475MV-T X6S 4.7 μ ±20 10 150 0.5±0.05 R
PWK107 C6106MV-T 2.5 X6S 10 μ ±20 10 150 0.5±0.05 R
212TYPE
【Temperature Characteristic BJ : X5R】 0.85mm thickness(D)
HTLT
Rated voltage x %
TWK212 BJ475[]D-T 25 X5R 4.7 μ ±10, ±20 10 150 0.85±0.10 R
EWK212 BJ106MD-T 16 X5R 10 μ ±20 10 150 0.85±0.10 R
LWK212 BJ475[]D-T X5R 4.7 μ ±10, ±20 10 150 0.85±0.10 R
LWK212 BJ106MD-T X5R 10 μ ±20 10 150 0.85±0.10 R
JWK212 BJ226MD-T 6.3 X5R 22 μ ±20 10 150 0.85±0.10 R
【Temperature Characteristic B7 : X7R , C6 : X6S】 0.85mm thickness(D)
HTLT
Rated voltage x %
TWK212 B7225[]D-T 25 X7R 2.2 μ ±10, ±20 5 150 0.85±0.10 R
EWK212 C6475[]D-T 16 X6S 4.7 μ ±10, ±20 10 150 0.85±0.10 R
LWK212 C6106MD-T 10 X6S 10 μ ±20 10 150 0.85±0.10 R
AWK212 C6226MD-T 4 X6S 22 μ ±20 10 150 0.85±0.10 R
Part number 1 Part number 2 Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[%]
tanδ
[%] Thickness*3 [mm]
Soldering
R:Reflow
W:Wave
6.3
Part number 1 Part number 2 Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[%]
tanδ
[%] Thickness*3 [mm]
Soldering
R:Reflow
W:Wave
10
6.3
4
Part number 1 Part number 2 Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[%]
tanδ
[%] Thickness*3 [mm]
Soldering
R:Reflow
W:Wave
16
10
6.3
Part number 1 Part number 2 Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[%]
tanδ
[%] Thickness*3 [mm]
Soldering
R:Reflow
W:Wave
16
4
Capacitance tolerance
[%]
Part number 1 Part number 2 Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[%]
10
Part number 1 Part number 2
tanδ
[%] Thickness*3 [mm]
Soldering
R:Reflow
W:Wave
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
tanδ
[%] Thickness*3 [mm]
Soldering
R:Reflow
W:Wave
c_mlcc_e-E06R01
CERAMIC CAPACITORS
Thiscatalogcontainsthetypicalspecificationonlyduetothelimitationofspace.Whenyouconsiderthepurchaseofourproducts,pleasecheckourproductspecificationsheets.
 Fordetailsofeachproduct(characteristicsgraph,reliabilityinformation,precautionsforuse,andsoon),seeourwebsite(http://www.ty-top.com/).
43
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E06R01
Multilayer Ceramic Capacitors
PACKAGING
①Minimum Quantity
Taped package
Type(EIA) Thickness Standard quantity [pcs]
mm code Paper tape Embossed tape
□MK021(008004) 0.125 K 50000
□VS021(008004)
□MK042(01005) 0.2 C, D 40000
□VS042(01005) 0.2 C
□MK063(0201) 0.3 P,T 15000
□WK105(0204) 0.3 P 10000
□MK105(0402)
□MF105(0402)
0.13 H 20000
0.18 E 15000
0.2 C 20000
0.3 P 15000
0.5 V 10000
□VK105(0402) 0.5 W 10000
□MK107(0603)
□WK107(0306)
□MF107(0603)
0.45 K 4000
0.5 V 4000
0.8 A 4000
□VS107(0603) 0.7 C 4000
□MJ107(0603) 0.8 A 3000 3000
□MK212(0805)
□WK212(0508)
□MF212(0805)
0.45 K 4000
0.85 D
1.25 G 3000
□VS212(0805) 0.85 D 4000
□MJ212(0805) 0.85 D 4000
1.25 G 2000
□MK316(1206)
□MF316(1206)
0.85 D 4000
1.15 F 3000
1.6 L 2000
□MJ316(1206) 1.15 F 3000
1.6 L 2000
□MK325(1210)
□MF325(1210)
0.85 D
2000
1.15 F
1.9 N
2.0max. Y
2.5 M 1000
□MJ325(1210) 1.9 N 2000
2.5 M 500(T), 1000(P)
□MK432(1812) 2.5 M 500
Note : LW Reverse type.
②Taping material
※No bottom tape for pressed carrier tape
Card board carrier tape
Top tape
Base tape
Sprocket hole
Bottom tape Chip cavity
Embossed tape
Top tape
Base tape
Sprocket hole
Chip cavity
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E06R01
Chip filled
Chip
LW Reverse type.
③Representative taping dimensions
Paper Tape(8mm wide)
Pressed carrier tape 2mm pitch Unitmminch)
F2.0±0.05
(0.079±0.002)
4.0±0.1
(0.157±0.004)
1.75
±
0.1
(0.069±0.004)
3.5±0.05
(0.138±0.002)
8.0±0.3
(0.315±0.012)
φ1.5+0.1/-0
(φ0.059+0.004/-0)
Sprocket hole
A
B
T
T1
Type(EIA) Chip Cavity Insertion Pitch Tape Thickness
T1
□MK063(0201) 0.37 0.67
2.0±0.05
0.45max. 0.42max.
□WK105(0204)
0.65 1.15
□MK105(0402) (*1 C) 0.4max. 0.3max.
□MK105(0402) (*1 P) 0.45max. 0.42max.
Note *1 Thickness, C:0.2mm ,P:0.3mm. LW Reverse type. Unit:mm
●Punched carrier tape (2mm pitch) Unit:mm(inch)
F2.0±0.05
(0.079±0.002)
4.0±0.1
(0.157±0.004)
1.75
±
0.1
(0.069±0.004)
3.5±0.05
(0.138±0.002)
8.0±0.3
(0.315±0.012)
φ1.5+0.1/-0
(φ0.059+0.004/-0)
Sprocket hole
A
B
T
Type(EIA) Chip Cavity Insertion Pitch Tape Thickness
□MK105 (0402)
□MF105 (0402)
□VK105 (0402)
0.65 1.15 2.0±0.05 0.8max.
Unit:mm
●Punched carrier tape (4mm pitch) Unit:mm(inch)
F
2.0±0.1
(0.079±0.004)
4.0±0.1
(0.157±0.004)
1.75
±
0.1
(0.069±0.004)
3.5±0.05
(0.138±0.002)
8.0±0.3
(0.315±0.012)
φ1.5+0.1/-0
(φ0.059+0.004/-0)
Sprocket hole
A
B
T
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E06R01
Type(EIA) Chip Cavity Insertion Pitch Tape Thickness
□MK107(0603)
□WK107(0306)
□MF107(0603)
1.0 1.8
4.0±0.1
1.1max.
□MK212(0805)
□WK212(0508) 1.65 2.4 1.1max.
□MK316(1206) 2.0 3.6
Note:Taping size might be different depending on the size of the product. LW Reverse type. Unit:mm
Embossed tape4mm wide Unitmminch
F1.0±0.02
0.039
±
0.001)
2.0±0.04
0.079
±
0.002)
0.9
±
0.05
(0.035±0.002)
1.8±0.02
(0.071±0.001)
4.0±0.05
(0.157±0.002)
φ0.8±0.04
(φ0.031±0.002)
Sprocket hole
A
B
Type(EIA) Chip Cavity Insertion Pitch Tape Thickness
K T
□MK021(008004) 0.135 0.27
1.0±0.02 0.5max. 0.25max.
□VS021(008004)
□MK042(01005) 0.23 0.43
□VS042(01005)
Unit:mm
Embossed tape8mm wide Unitmminch
F
2.0±0.1
(0.079±0.004)
4.0±0.1
(0.157±0.004)
1.75±0.1
(0.069±0.004)
3.5±0.05
(0.138±0.002)
8.0±0.3
(0.315±0.012)
φ1.5+0.1/-0
(φ0.059+0.004/-0)
Sprocket hole
A
B
Type(EIA) Chip Cavity Insertion Pitch Tape Thickness
K T
□MK105(0402) 0.6 1.1 2.0±0.1 0.6max 0.2±0.1
□WK107(0306) 1.0 1.8
4.0±0.1
1.3max. 0.25±0.1
□MK212(0805)
□MF212(0805) 1.65 2.4
3.4max. 0.6max.
□MK316(1206)
□MF316(1206) 2.0 3.6
□MK325(1210)
□MF325(1210) 2.8 3.6
Note: LW Reverse type. Unit:mm
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E06R01
Embossed tape(12mm wide) Unit:mm(inch)
F
2.0±0.1
(0.079±0.004)
4.0±0.1
(0.157±0.004)
1.75±0.1
(0.069±0.004)
5.5±0.05
(0.217±0.002)
12.0±0.3
(0.472±0.012)
φ1.5+0.1/-0
(φ0.059+0.004/-0)
Sprocket hole
A
B
Type(EIA) Chip Cavity Insertion Pitch Tape Thickness
K T
□MK325(1210) 3.1 4.0 8.0±0.1 4.0max. 0.6max.
□MK432(1812) 3.7 4.9 8.0±0.1 4.0max. 0.6max.
Unit:mm
④Trailer and Leader
Blank portion Chip cavity Blank portion Leader
160mm or more
(6.3inches or more)
Direction of tape feed
100mm or more
(3.94inches or more)
400mm or more
(15.7inches or more)
⑤Reel size
E
C
D
R B
t
A
W
A B C D E R
φ178±2.0 φ50min. φ13.0±0.2 φ21.0±0.8 2.0±0.5 1.0
T W
4mm wide tape 1.5max. 5±1.0
8mm wide tape 2.5max. 10±1.5
12mm wide tape 2.5max. 14±1.5 Unit:mm
⑥Top Tape Strength
The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow as illustrated below.
0~20° Top tape
Base tape
Pull direction
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-E06R01
Super Low Distortion Multilayer Ceramic Capacitors , Medium-High Voltage Multilayer Ceramic Capacitors and
High Reliability Application Multilayer Ceramic Capacitors are noted separately.
Multilayer Ceramic Capacitors
RELIABILITY DATA
1.Operating Temperature Range
Specified
Value
Temperature
Compensating(Class1)
Standard -55 to +125℃
High Frequency Type
High Permittivity (Class2)
Specification Temperature Range
BJ B -25 to +85℃
X5R -55 to +85℃
B7 X7R -55 to +125℃
C6 X6S -55 to +105℃
C7 X7S -55 to +125℃
LD(※) X5R -55 to +85℃
Note: ※LD Low distortion high value multilayer ceramic capacitor
2. Storage Conditions
Specified
Value
Temperature
Compensating(Class1)
Standard -55 to +125℃
High Frequency Type
High Permittivity (Class2)
Specification Temperature Range
BJ B -25 to +85℃
X5R -55 to +85℃
B7 X7R -55 to +125℃
C6 X6S -55 to +105℃
C7 X7S -55 to +125℃
LD(※) X5R -55 to +85℃
Note: ※LD Low distortion high value multilayer ceramic capacitor
3. Rated Voltage
Specified
Value
Temperature
Compensating(Class1)
Standard 50VDC, 25VDC, 16VDC
High Frequency Type 50VDC, 25VDC, 16VDC
High Permittivity (Class2) 50VDC, 35VDC, 25VDC, 16VDC, 10VDC, 6.3VDC, 4VDC, 2.5VDC
4. Withstanding Voltage (Between terminals)
Specified
Value
Temperature
Compensating(Class1)
Standard
No breakdown or damage
High Frequency Type
High Permittivity (Class2)
Test
Methods and
Remarks
Class 1 Class 2
Applied voltage Rated voltage×3 Rated voltage×2.5
Duration 1 to 5 sec.
Charge/discharge current 50mA max.
5. Insulation Resistance
Specified
Value
Temperature
Compensating(Class1)
Standard 10000 MΩ min.
High Frequency Type
High Permittivity (Class2) Note 1 C≦0.047μF : 10000 MΩ min.
C>0.047μF : 500MΩ・μF
Test
Methods and
Remarks
Applied voltage : Rated voltage
Duration : 60±5 sec.
Charge/discharge current : 50mA max.
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-E06R01
6. Capacitance (Tolerance)
Specified
Value
Temperature
Compensating(Class1)
Standard
C□
U□
SL
0.2pF≦C≦5pF : ±0.25pF
0.2pF≦C≦10pF : ±0.5pF
C>10pF : ±5% or ±10%
High Frequency Type CG 0.2pF≦C≦2pF : ±0.1pF
C>2pF : ±5%
High Permittivity (Class2) ±10% or ±20%
Test
Methods and
Remarks
Class 1 Class 2
Standard High Frequency Type C≦10μF C>10μF
Preconditioning None Thermal treatment (at 150℃ for 1hr) Note 2
Measuring frequency 1MHz±10% 1kHz±10% 120±10Hz
Measuring voltage Nte 0.5 to 5Vrms 1±0.2Vrms 0.5±0.1Vrms
Bias application None
7. Q or Dissipation Factor
Specified
Value
Temperature
Compensating(Class1)
Standard C<30pF : Q≧400+20C
C≧30pF : Q≧1000CNominal capacitance)
High Frequency Type Refer to detailed specification
High Permittivity (Class2) Note 1 BJ, B7, C6, C7:2.5% max.
Test
Methods and
Remarks
Class 1 Class 2
Standard High Frequency Type C≦10μF C>10μF
Preconditioning None Thermal treatment (at 150℃ for 1hr) Note 2
Measuring frequency 1MHz±10% 1GHz 1kHz±10% 120±10Hz
Measuring voltage Note 1 0.5 to 5Vrms 1±0.2Vrms 0.5±0.1Vrms
Bias application None
High Frequency Type
Measuring equipment : HP4291A
Measuring jig : HP16192A
8. Temperature Characteristic (Without voltage application)
Specified
Value
Temperature
Compensating(Class1)
Standard
Temperature Characteristic [ppm/℃] Tolerance [ppm/℃]
C□ : 0 CG G : ±30
U□ : -750 UJ, UK J:±120
K:±250
SL : +350 to -1000
High Frequency Type Temperature Characteristic [ppm/℃] Tolerance [ppm/℃]
C□ : 0 CG G : ±30
High Permittivity (Class2)
Specification Capacitance
change
Reference
temperature Temperature Range
BJ B ±10% 20℃ -25 to +85℃
X5R ±15% 25℃ -55 to +85℃
B7 X7R ±15% 25℃ -55 to +125℃
C6 XS ±22% 25℃ -55 to +105℃
C7 X7S ±22% 25℃ -55 to +125℃
LD(※) X5R ±15% 25℃ -55 to +85℃
Note : ※LD Low distortion high value multilayer ceramic capacitor
Test
Methods and
Remarks
Class 1
Capacitance at 20℃ and 85℃ shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the
following equation.
(C85-C20 ×106(ppm/℃)
C20×△T △T=65
Class 2
Capacitance at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following
equation.
Step B X5R、X7R、X6S、X7S
1 Minimum operating temperature
2 20℃ 25℃
3 Maximum operating temperature
(C-C2 ×100(%) C :Capacitance in Step 1 or Step 3
C2 :Capacitance in Step 2
C2
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-E06R01
9. Deflection
Specified
Value
Temperature
Compensating(Class1)
Standard Appearance : No abnormality
Capacitance change : Within ±5% or ±0.5 pF, whichever is larger.
High Frequency Type Appearance : No abnormality
Capacitance change : Within±0.5 pF
High Permittivity (Class2) Appearance : No abnormality
Capacitance change : Within ±12.5%
Test
Methods and
Remarks
Multilayer Ceramic Capacitors
021, 042, 063, 105 Type The other types
Board Glass epoxy-resin substrate
Thickness 0.8mm 1.6mm
Warp 1mm
Duration 10 sec.
105 Type thickness, C: 0.2mm ,P: 0.3mm.
Capacitance measurement shall be conducted
with the board bent
10. Body Strength
Specified
Value
Temperature
Compensating(Class1)
Standard
High Frequency Type No mechanical damage.
High Permittivity (Class2)
Test
Methods and
Remarks
High Frequency 105Type
Applied force : 5N
Duraton : 10 sec.
11. Adhesive Strength of Terminal Electrodes
Specified
Value
Temperature
Compensating(Class1)
Standard
No terminal separation or its indication.
High Frequency Type
High Permittivity (Class2)
Test
Methods and
Remarks
Multilayer Ceramic Capacitors
021, 042, 063 Type 105 Type or more
Applied force 2N 5N
Duration 30±5 sec.
12. Solderability
Specified
Value
Temperature
Compensating(Class1)
Standard
At least 95% of terminal electrode is covered by new solder.
High Frequency Type
High Permittivity (Class2)
Test
Methods and
Remarks
Eutectic solder Lead-free solder
Solder type H60A or H63A Sn-3.0Ag-0.5Cu
Solder temperature 230±5℃ 245±3℃
Duration 4±1 sec.
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-E06R01
13. Resistance to Soldering
Specified
Value
Temperature
Compensating(Class1)
Standard
Appearance : No abnormality
Capacitance change : Within ±2.5% or ±0.25pF, whichever is larger.
Q : Initial value
Insulation resistance : Initial value
Withstanding voltage (between terminals) : No abnormality
High Frequency Type
Appearance : No abnormality
Capacitance change : Within ±2.5%
Q : Initial value
Insulation resistance : Initial value
Withstanding voltage (between terminals) : No abnormality
High Permittivity (Class2) Note 1
Appearance : No abnormality
Capacitance change : Within ±7.5%
Dissipation factor : Initial value
Insulation resistance : Initial value
Withstanding voltage (between terminals): No abnormality
Test
Methods and
Remarks
Class 1
021, 042, 063 Type 105 Type
Preconditioning None
Preheating 150℃, 1 to 2 min. 80 to 100℃, 2 to 5 min.
150 to 200℃, 2 to 5 min.
Solder temp. 270±5℃
Duration 3±0.5 sec.
Recovery 6 to 24 hrs (Standard condition) Note 5
Class 2
021, 042、063 Type 105, 107, 212 Type 316, 325, 432 Type
Preconditioning Thermal treatment at 150℃ for 1 hr) Note 2
Preheating 150℃, 1 to 2 min. 80 to 100℃, 2 to 5 min.
150 to 200℃, 2 to 5 min.
80 to 100℃, 5 to 10 min.
150 to 200℃, 5 to 10 min.
Solder temp. 270±5℃
Duration 3±0.5 sec.
Recovery 24±2 hrs (Standard condition) Note 5
14. Temperature Cycle (Thermal Shock)
Specified
Value
Temperature
Compensating(Class1)
Standard
Appearance : No abnormality
Capacitance change : Within ±2.5% or ±0.25pF, whichever is larger.
Q : Initial value
Insulation resistance : Initial value
Withstanding voltage (between terminals) : No abnormality
High Frequency Type
Appearance : No abnormality
Capacitance change : Within ±0.25pF
Q : Initial value
Insulation resistance : Initial value
Withstanding voltage (between terminals) : No abnormality
High Permittivity (Class2) Note 1
Appearance : No abnormality
Capacitance change : Within ±7.5%
Dissipation factor : Initial value
Insulation resistance : Initial value
Withstanding voltage (between terminals) : No abnormality
Test
Methods and
Remarks
Class 1 Class 2
Preconditioning None Thermal treatment (at 150℃ for 1 hr)
Note 2
1 cycle
Step Temperature(℃) Time(min.)
1 Minimum operating temperature 30±3
2 Normal temperature 2 to 3
3 Maximum operating temperature 30±3
4 Normal temperature 2 to 3
Number of cycles 5 times
Recovery 6 to 24 hrs (Standard condition) Note 5 24±2 hrs (Standard condition) Note 5
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-E06R01
15. Humidity (Steady State)
Specified
Value
Temperature
Compensating(Class1)
Standard
Appearance : No abnormality
Capacitance change : Within ±5% or ±0.5pF, whichever is larger.
Q : C<10pF : Q≧200+10C
10≦C<30pF : Q≧275+2.5C
C≧30pF:Q≧350(C:Nominal capacitance)
Insulation resistance : 1000 MΩ min.
High Frequency Type
Appearance : No abnormality
Capacitance change : Within ±0.5pF,
Insulation resistance : 1000 MΩ min.
High Permittivity (Class2) Note 1
Appearance : No abnormality
Capacitance change : Within ±12.5%
Dissipation factor : 5.0% max.
Insulation resistance : 50 MΩμF or 1000 MΩ whichever is smaller.
Test
Methods and
Remarks
Class 1 Class 2
Standard High Frequency Type All items
Preconditioning None Thermal treatment( at 150℃ for 1 hr) Note 2
Temperature 40±2℃ 60±2℃ 40±2℃
Humidity 90 to 95%RH 90 to 95%RH
Duration 500+24/-0 hrs 500+24/-0 hrs
Recovery 6 to 24 hrs (Standard condition) Note 5 24±2 hrs (Standard condition) Note 5
16. Humidity Loading
Specified
Value
Temperature
Compensating(Class1)
Standard
Appearance : No abnormality
Capacitance change : Within ±7.5% or ±0.75pF, whichever is larger.
Q : C<30pF:Q≧100+10C/3
C≧30pF:Q≧200 (C:Nominal capacitance)
Insulation resistance : 500 MΩ min.
High Frequency Type
Appearance : No abnormality
Capacitance change : C≦2pF:Within ±0.4 pF
C>2pF:Within ±0.75 pF
CNominal capacitance)
Insulation resistance : 500 MΩ min.
High Permittivity (Class2) Note 1
Appearance : No abnormality
Capacitance change : Within ±12.5%
Dissipation factor : 5.0% max.
Insulation resistance : 25 MΩμF or 500 , whichever is smaller.
Test
Methods and
Remarks
Class 1 Class 2
Standard High Frequency Type All items
Preconditioning None Voltage treatment
(Rated voltage are applied for 1 hour at 40℃) Note 3
Temperature 40±2℃ 60±2℃ 40±2℃
Humidity 90 to 95%RH 90 to 95%RH
Duration 500+24/-0 hrs 500+24/-0 hrs
Applied voltage Rated voltage Rated voltage
Charge/discharge
current 50mA max. 50mA max.
Recovery 6 to 24 hrs (Standard condition) Note 5 24±2 hrs(Standard condition) Note 5
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-E06R01
17. High Temperature Loading
Specified
Value
Temperature
Compensating(Class1)
Standard
Appearance : No abnormality
Capacitance change : Within ±3% or ±0.3pF, whichever is larger.
Q : C<10pF: Q≧200+10C
10≦C<30pF:Q≧275+2.5C
C≧30pF: Q≧350(C:Nominal capacitance)
Insulation resistance : 1000 MΩ min.
High Frequency Type
Appearance : No abnormality
Capacitance change : Within ±3% or ±0.3pF, whichever is larger.
Insulation resistance : 1000 MΩ min.
High Permittivity (Class2) Note 1
Appearance : No abnormality
Capacitance change : Within ±12.5%
Dissipation factor : 5.0% max.
Insulation resistance : 50 MΩμF or 1000 MΩ, whichever is smaller.
Test
Methods and
Remarks
Class 1 Class 2
Standard High Frequency Type BJ, LD(※) C6 B7, C7
Preconditioning None Voltage treatment(Twice the rated voltage shall be applied for
1 hour at 85℃, 105℃ or 125℃) Note 3, 4
Temperature Maximum operating temperature Maximum operating temperature
Duration 1000+48/-0 hrs 1000+48/-0 hrs
Applied voltage Rated voltage×2 Note 4 Rated voltage×2 Note 4
Charge/discharge
current 50mA max. 50mA max.
Recovery 6 to 24hr (Standard condition) Note 5 24±2 hrs (Standard condition) Note 5
Note: ※LD Low distortion high value multilayer ceramic capacitor
Note 1 The figures indicate typical specifications. Please refer to individual specifications in detail.
Note 2 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150+0/-10℃ for an hour and kept at room temperature for
24±2hours.
Note 3 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in
the test conditions, and kept at room temperature for 24±2hours.
Note 4 150% of rated voltage is applicable to some items. Please refer to their specifications for further information.
Note 5 Standard condition: Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa When there are questions concerning
measurement results, in order to provide correlation data, the test shall be conducted under the following condition.
Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa Unless otherwise specified, all the tests are conducted under the
"standard condition".
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E05R01
High Reliability Application Multilayer Ceramic Capacitors are noted separately.
Precautions on the use of Multilayer Ceramic Capacitors
PRECAUTIONS
1. Circuit Design
Precautions
◆Verification of operating environment, electrical rating and performance
1. A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have
severe social ramifications.
Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from
them used in general purpose applications.
◆Operating Voltage (Verification of Rated voltage)
1. The operating voltage for capacitors must always be their rated voltage or less.
If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less.
For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less.
2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC
voltage or a pulse voltage having rapid rise time is used in a circuit.
2. PCB Design
Precautions
◆Pattern configurations (Design of Land-patterns)
1. When capacitors are mounted on PCBs, the amount of solder used (size of fillet) can directly affect the capacitor performance.
Therefore, the following items must be carefully considered in the design of land patterns:
(1)Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider
appropriate land-patterns for proper amount of solder.
(2)When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by
solder-resist.
◆Pattern configurations (Capacitor layout on PCBs)
After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes (PCB
cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.). For this reason, land
pattern configurations and positions of capacitors shall be carefully considered to minimize stresses.
Technical
considerations
◆Pattern configurations (Design of Land-patterns)
The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts.
(1)Recommended land dimensions for typical chip capacitors
●Multilayer Ceramic Capacitors : Recommended land dimensions
(unit: mm)
Wave-soldering
Type 107 212 316 325
Size L 1.6 2.0 3.2 3.2
W 0.8 1.25 1.6 2.5
A 0.8 to 1.0 1.0 to 1.4 1.8 to 2.5 1.8 to 2.5
B 0.5 to 0.8 0.8 to 1.5 0.8 to 1.7 0.8 to 1.7
C 0.6 to 0.8 0.9 to 1.2 1.2 to 1.6 1.8 to 2.5
Land patterns for PCBs
C
B A B
Chip capacitor
Land pattern
Solder-resist
L
W
Chip capacitor
Reflow-soldering
Type 021 042 063 105 107 212 316 325 432
Size L 0.25 0.4 0.6 1.0 1.6 2.0 3.2 3.2 4.5
W 0.125 0.2 0.3 0.5 0.8 1.25 1.6 2.5 3.2
A 0.095~0.135 0.15~0.25 0.20~0.30 0.45~0.55 0.8~1.0 0.8~1.2 1.8~2.5 1.8~2.5 2.5~3.5
B 0.085~0.125 0.15~0.20 0.20~0.30 0.40~0.50 0.6~0.8 0.8~1.2 1.0~1.5 1.0~1.5 1.5~1.8
C 0.110~0.150 0.15~0.30 0.25~0.40 0.45~0.55 0.6~0.8 0.9~1.6 1.2~2.0 1.8~3.2 2.3~3.5
Note:Recommended land size might be different according to the allowance of the size of the product.
●LWDC: Recommended land dimensions for reflow-soldering
(unit: mm)
Type 105 107 212
Size L 0.52 0.8 1.25
W 1.0 1.6 2.0
A 0.18~0.22 0.25~0.3 0.5~0.7
B 0.2~0.25 0.3~0.4 0.4~0.5
C 0.9~1.1 1.5~1.7 1.9~2.1
L
W
LWDC
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E05R01
(2)Examples of good and bad solder application
Item Not recommended Recommended
Mixed mounting of SMD and
leaded components
Lead wire of component
Solder-resist
Component placement close to
the chassis
Chassis
Solder (for grounding)
Electrode pattern
Solder-resist
Hand-soldering of leaded
components near mounted
components
Soldering iron
Lead wire of component
Solder-resist
Horizontal component
placement
Solder-resist
◆Pattern configurations (Capacitor layout on PCBs)
1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any possible mechanical
stresses from board warp or deflection.
Items Not recommended Recommended
Deflection of board
Place the product at a right
angle to the direction of the
anticipated mechanical
stress.
1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.
E
D
C
A B
Slit
Magnitude of stress A>B=C>D>E
Perforation
1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods
are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB,
split methods as well as chip location.
3. Mounting
Precautions
◆Adjustment of mounting machine
1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.
2. Maintenance and inspection of mounting machines shall be conducted periodically.
◆Selection of Adhesives
1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the
following factors are appropriately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and
hardening period. Therefore, please contact us for further information.
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E05R01
Technical
considerations
◆Adjustment of mounting machine
1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid
this, the following points shall be considerable.
(1)The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection.
(2)The pressure of nozzle shall be adjusted between 1 and 3 N static loads.
(3)To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be
used on the other side of the PCB. The following diagrams show some typical examples of good and bad pick-up nozzle
placement:
Item Improper method Proper method
Single-sided mounting
chipping
or cracking
supporting pins
or back-up pins
Double-sided mounting
chipping
or cracking
supporting pins
or back-up pins
2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical
impact on the capacitors.
To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of
the pin shall be conducted periodically.
◆Selection of Adhesives
Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in
stresses on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect
components. Therefore, the following precautions shall be noted in the application of adhesives.
(1)Required adhesive characteristics
a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive shall have sufficient strength at high temperatures.
c. The adhesive shall have good coating and thickness consistency.
d. The adhesive shall be used during its prescribed shelf life.
e. The adhesive shall harden rapidly.
f. The adhesive shall have corrosion resistance.
g. The adhesive shall have excellent insulation characteristics.
h. The adhesive shall have no emission of toxic gasses and no effect on the human body.
(2)The recommended amount of adhesives is as follows;
[Recommended condition]
Figure 212/316 case sizes as examples
a 0.3mm min
b 100 to 120μm
c Adhesives shall not contact land
Amount adhesive
a a
b
After capacitor are bonded
c c
4. Soldering
Precautions
◆Selection of Flux
Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;
(1)Flux used shall be less than or equal to 0.1 wt%( in Cl equivalent) of halogenated content. Flux having a strong acidity content shall
not be applied.
(2)When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level.
(3)When water-soluble flux is used, special care shall be taken to properly clean the boards.
◆Soldering
Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions.
Sn-Zn solder paste can adversely affect MLCC reliability.
Please contact us prior to usage of Sn-Zn solder.
Technical
considerations
◆Selection of Flux
1-1. When too much halogenated substance(Chlorine, etc.) content is used to activate flux, or highly acidic flux is used, it may lead to
corrosion of terminal electrodes or degradation of insulation resistance on the surfaces of the capacitors.
1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted
and may adversely affect the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high
humidity conditions may cause a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning
methods and the capability of the machines used shall also be considered carefully when water-soluble flux is used.
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E05R01
◆Soldering
Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.
Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal
shock.
Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within
130℃.
Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100℃.
[Reflow soldering]
【Recommended conditions for eutectic
soldering】
Preheating 230℃
Within 10sec.
Slow cooling
60sec.
Min.
60sec
Min.
300
200
100
0
Temperature(℃)
【Recommended condition for Pb-free
soldering】
Peak
260℃ Max.
Within 10sec.
Slow
cooling
Heating above
230℃
40sec. Max.
300
200
100
0
Temperature(℃)
Preheating150℃
60sec. Min.
Caution
The ideal condition is to have solder mass(fillet)controlled to 1/2 to 1/3 of the
thickness of a capacitor.
②Because excessive dwell times can adversely affect solderability, soldering duration shall
be kept as close to recommended times as possible. soldering for 2 times.
1/2T~1/3T
PC board
Solder
Capacitor
T
[Wave soldering]
【Recommended conditions for eutectic
soldering】
230~250℃
Within 3sec.
Slow cooling
Preheating
120sec. Min.
300
200
100
0
Temperature(℃)
【Recommended condition for Pb-free
soldering】
Peak
260℃ Max.
Within 10sec.
Slow
cooling
120sec. Min.
300
200
100
0
Temperature(℃)
Preheating
150℃
Caution
①Wave soldering must not be applied to capacitors designated as for reflow soldering only. soldering for 1 times.
[Hand soldering]
【Recommended conditions for eutectic
soldering】
230~280℃
Within 3sec.
Slow cooling
Preheating
60sec. Min.
400
200
100
0
Temperature(℃)
300
【Recommended condition for Pb-free
soldering】
Peak
350℃ Max.
Within 3sec.
Slow cooling
⊿T
400
200
100
0
Temperature(℃)
Preheating
150℃ Min.
60sec. Min.
300
⊿T
316type or less ⊿T≦150℃
Peak
280℃ Max.
Within 3sec.
Slow cooling
⊿T
400
200
100
0
温度(℃)
Preheating
150℃ Min.
60sec. Min.
300
⊿T
325type or more ⊿T≦130℃
Caution
①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm.
②The soldering iron shall not directly touch capacitors. soldering for 1 times.
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E05R01
5. Cleaning
Precautions
◆Cleaning conditions
1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use
of the cleaning. (e.g. to remove soldering flux or other materials from the production process.)
2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect
capacitor's characteristics.
Technical
considerations
1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate
their outer coating, resulting in a degradation of the capacitor's electrical properties (especially insulation resistance).
2. Inappropriate cleaning conditions( insufficient or excessive cleaning) may adversely affect the performance of the capacitors.
In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead to the cracking of
capacitors or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall be carefully
checked;
Ultrasonic output : 20 W/ or les Ultrasonic frequency : 40 kHz or less
Ultrasonic washing period : 5 min. or less
6. Resin coating and mold
Precautions
1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while
left under normal storage conditions resulting in the deterioration of the capacitor's performance.
2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat
may lead to damage or destruction of capacitors.
The use of such resins, molding materials etc. is not recommended.
7. Handling
Precautions
◆Splitting of PCB
1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board.
2. Board separation shall not be done manually, but by using the appropriate devices.
◆Mechanical considerations
Be careful not to subject capacitors to excessive mechanical shocks.
(1)If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used.
(2)Please be careful that the mounted components do not come in contact with or bump against other boards or components.
8. Storage conditions
Precautions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control
temperature and humidity in the storage area. Humidity should especially be kept as low as possible.
・Recommended conditions
Ambient temperature : Below 30℃ Humidity : Below 70% RH
The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of capacitor is deteriorated as
time passes, so capacitors shall be used within 6 months from the time of delivery.
・Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air.
2. The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, so care shall be taken to
design circuits. Even if capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at 150℃ for
1hour.
Technical
considerations
If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and
quality loss of taping/packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the
above period, please check solderability before using the capacitors.
※RCR-2335B(Safety Application Guide for fixed ceramic capacitors for use in electronic equipment)is published by JEITA.
Please check the guide regarding precautions for deflection test, soldering by spot heat, and so on.

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