SPBTLE-1S Datasheet

STMicroelectronics

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Datasheet

October 2017
DocID030445 Rev 3
1/27
This is information on a product in full production.
www.st.com
SPBTLE-1S
Very low power application processor module for Bluetooth®
Low Energy v4.2
Datasheet - production data
Features
Bluetooth v4.2 compliant
Supports master and slave modes
Multiple roles supported simultaneously
High performance, ultra-low power Cortex-
M0 32-bit based architecture core
Programmable embedded 160 KB Flash
24 KB embedded RAM with data retention
Interfaces:
1 x UART, 2 x I²C, 1xSPI, 14 x GPIO, 2
x multifunction timer, 10-bit ADC,
Watchdog & RTC, DMA controller,
PDM stream processor, SWD debug
Interface
Bluetooth radio performance:
Max Tx power: + 5 dBm
Excellent link reliability
On-board chip antenna
Small form factor: 11.5 mm x 13.5 mm
Complemented with Bluetooth low energy
protocol stack library (GAP, GATT, SM,
L2CAP, LL)
AES security co-processor
Bluetooth low energy SDK with wide range
of profile available
Certifications:
EU (RED) Type certificate
FCC, IC modular approval certification
SRRC Chinese Certification
BT SIG End Product QDID
Pre-programmed UART bootloader
Operating supply voltage: from 1.7 to 3.6 V
Operating temperature range: -40 °C to
85 °C
Applications
Internet of Things
Smart Home
Building and Industrial Automation
Smart Lighting
Remote and access control
Fitness, wellness and sports
Consumer medical
Security and proximity
Assisted living
PC and smart phone peripherals
Description
The SPBTLE-1S is a Bluetooth® low Energy
System-on-Chip application processor certified
module, compliant with BT specifications v4.2
and BQE qualified. The SPBTLE-1S module
supports multiple roles simultaneously and can
act at the same time as Bluetooth Smart master
and slave device.
The SPBTLE-1S is based on BlueNRG-1 system-
on-chip and entire Bluetooth Low Energy stack
and protocols are embedded into module.
The SPBTLE-1S module provides a complete RF
platform in a tiny form factor. Radio, embedded
antenna and high frequency oscillators are
integrated to offer a certified solution to optimize
the time to market of the final applications.
The SPBTLE-1S can be powered directly with a
pair of AAA batteries or any power source from
1.7 to 3.6 V.
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Contents
1 General description ......................................................................... 5
2 Block schematic .............................................................................. 6
3 Software development .................................................................... 7
3.1 Software development Kit ................................................................. 7
3.2 Software architecture ........................................................................ 7
4 Hardware specifications ............................................................... 10
4.1 Current consumption ....................................................................... 10
4.2 Pin assignment ................................................................................ 12
4.3 Mechanical dimensions ................................................................... 14
5 Hardware design ........................................................................... 16
5.1 Reset circuitry ................................................................................. 16
5.2 Debug interface ............................................................................... 16
5.3 Reflow soldering .............................................................................. 17
6 Regulatory compliance ................................................................. 18
6.1 FCC certification .............................................................................. 18
6.1.1 Labeling instructions ......................................................................... 18
6.1.2 Product manual instructions ............................................................. 18
6.2 IC certification ................................................................................. 19
6.2.1 Labeling instructions ......................................................................... 20
6.2.2 Product manual instructions ............................................................. 20
6.3 SRRC .............................................................................................. 21
6.3.1 Modular approval .............................................................................. 21
6.3.2 Labeling instructions ......................................................................... 21
6.4 Bluetooth certification ...................................................................... 21
7 CE certification .............................................................................. 22
8 Ordering information ..................................................................... 23
9 ECOPACK® .................................................................................... 24
10 Traceability .................................................................................... 25
11 Revision history ............................................................................ 26
SPBTLE-1S
List of tables
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List of tables
Table 1: Absolute maximum ratings ......................................................................................................... 10
Table 2: Recommended operating conditions .......................................................................................... 10
Table 3: Radio features............................................................................................................................. 10
Table 4: Current consumption .................................................................................................................. 11
Table 5: Pinout description ....................................................................................................................... 13
Table 6: SPI pin function ........................................................................................................................... 14
Table 7: Debug interface pin ..................................................................................................................... 16
Table 8: Soldering ..................................................................................................................................... 17
Table 9: Ordering information ................................................................................................................... 23
Table 10: Traceability information ............................................................................................................. 25
Table 11: Document revision history ........................................................................................................ 26
List of figures
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List of figures
Figure 1: Block diagram .............................................................................................................................. 6
Figure 2: SPBTLE-1S BLE application processor ...................................................................................... 8
Figure 3: SPBTLE-1S as BLE network processor ...................................................................................... 9
Figure 4: Configuration of the “BlueNRG current consumption estimation tool” ...................................... 11
Figure 5: Typical current consumption profile at +5 dBm ......................................................................... 11
Figure 6: Typical current consumption profile at 0 dBm ........................................................................... 12
Figure 7: Pin assignment .......................................................................................................................... 12
Figure 8: Mechanical dimensions ............................................................................................................. 14
Figure 9: Recommend land pattern .......................................................................................................... 15
Figure 10: Reset circuitry .......................................................................................................................... 16
Figure 11: Soldering profiles ..................................................................................................................... 17
Figure 12: CE marking .............................................................................................................................. 22
SPBTLE-1S
General description
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1 General description
The SPBTLE-1S is a Bluetooth Low Energy application processor module compliant with
Bluetooth® specifications v4.2 with embedded ceramic antenna.
The SPBTLE-1S module has been designed around the ST BlueNRG-1 SoC where its
Cortex-M0 core can execute both Bluetooth protocols and customer application. A
complete power-optimized Bluetooth stack library provides:
Master, slave, multiple roles support
GAP: central, peripheral, observer or broadcaster roles
Simultaneous advertising and scanning
capability of being slave of up to two masters simultaneously
ATT/GATT: client and server
SM: privacy, authentication and authorization
L2CAP
Link Layer: AES-128 encryption and decryption
The SPBTLE-1S has 160 KB embedded Flash and 24 KB embedded RAM memory.
In the module are available 32 MHz and 32 KHz crystal oscillators. It has been designed to
leverage the BlueNRG-1 integrated DC-DC step down converter in order to achieve best
power consumption in active mode.
It can be configured to support both application processor (host-less) and network
processor (hosted) modes.
Being based on the BlueNRG-1 SoC, the SPBTLE-1S module leverages all the tools and
documentation of its ecosystem: Development Kit, Application Notes, User Manuals,
Design Notes & Tips. A wide set of sample programs are also available in C source code.
The SPBTLE-1S module has a wide set of peripherals available for customer application (1
x UART interface, 1 x SPI interface, 2 x I2C interface, 14 GPIO, 2 x multifunction timer, 10-
bit ADC, Watchdog & RTC, DMA controller, PDM stream processor).
The SPBTLE-1S module enables wireless connectivity into electronic devices, not requiring
any RF experience or expertise for integration into the final product. The SPBTLE-1S
module provides a complete RF application platform in a tiny form factor (11.5 x 13.5 x 2.0
mm) and being a certified solution optimizes the time to market of the final applications.
The SPBTLE-1S module allows applications to meet the tight advisable peak current
requirements imposed with the use of standard coin cell batteries. Optimized results are
obtained with the embedded high-efficiency DC-DC step-down. SPBTLE-1S can be
powered directly with a standard 3 V coin cell battery as with a pair of AAA batteries or any
power source from 1.7 to 3.6 V.
Block schematic
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2 Block schematic
Figure 1: Block diagram
RF a nte nn a
B atte ry or Exte rn al Sup ply
Cr yst al
32 MH z
clock
SU PPLY F ILT ER
Bea d Ferrite
R F
BA LU N
+ Filt er
C rysta l
32 .7 68 kHz
clock
IN T ER NA L 2.4 5 G Hz
I/0
Sig nals
(O ption als)
B LU ET OOTH
BL UEN R G-1
32 MH z
in ternal
clock
32 .7 68 kHz
in ternal
clock
I2C BU S LI NE
I
SPI LI NE
U AR T LI NE
ADC (2 ch. ma x)
GPI O sign als
FL ASH
ME MO R Y
(16 0 kB )
R AM
MEM O R Y
(24 kB)
SPBTLE-1S
IN TE RN AL
SM PS
SPBTLE-1S
Software development
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3 Software development
3.1 Software development Kit
The SPBTLE-1S module embeds the BlueNRG-1 application processor. Refer to the
BlueNRG-1 web page (http://www.st.com/en/wireless-connectivity/bluenrg-1.html) to get
access to:
BlueNRG-1 datasheet
development kit
application notes
user manuals
tools & software
design note and tips
Software and firmware should be configured taking into account the SPBTLE-1 specific
configuration as described in the block diagram chapter. In particular the SPBTLE-1
module has:
32 MHz crystal oscillator
32 KHz crystal oscillator
SMPS DC-DC converter
10 µH SMPS inductor
The projects provided with the development kit should be customized defining as following:
HS_SPEED_XTAL=HS_SPEED_XTAL_32MHZ
LS_SOURCE=LS_SOURCE_EXTERNAL_32KHZ
SMPS_INDUCTOR=SMPS_INDUCTOR_10µH
3.2 Software architecture
There are two possible software architectures:
Host-less mode (application processor): customer application runs on the SPBTLE-1S
module. Many sample projects are available in the Development Kit
Software development
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Figure 2: SPBTLE-1S BLE application processor
Hosted mode (Network processor): the module is configured as network module
controlled by an external host connected via SPI or UART. A project named DTM is
available in the Development Kit that configures the SPBTLE-1S module as a network
module.
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Figure 3: SPBTLE-1S as BLE network processor
Hardware specifications
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4 Hardware specifications
General conditions (VIN = 3.3 V and 25 °C)
Table 1: Absolute maximum ratings
Rating
Min.
Typ.
Max.
Unit
Storage temperature range
- 40
+ 95
°C
Supply voltage, VIN
- 0.3
+ 3.9
V
I/O pin Voltage (VIO five-volt tolerant pin)
- 0.3
+ 3.9
V
RF saturation input power
8
dBm
Table 2: Recommended operating conditions
Rating
Min.
Typ.
Max.
Unit
Operating temperature range
- 40
+ 85
°C
Supply voltage, VIN
1.7
3.3
3.6
V
Signals & I/O pin voltage (according supply voltage)
1.7
3.6
V
Table 3: Radio features
Rating
Min.
Typ.
Max.
Unit
Bluetooth version
4.2
Radiated transmit power
+ 4.48
dBm
Receiver sensitivity
- 84
dBm
RF Frequency
2402
2480
MHz
HS_Startup_Time a
512
µs
4.1 Current consumption
Characteristics measured over recommended operating conditions unless otherwise
specified. Typical value are referred to TA = 25 °C, VIN = 3.0 V.
Current consumption values has been taken using the “BlueNRG current consumption
estimation tool”, configured to match the SPBTLE-1S configuration.
The tool is available on ST.com at:
http://www.st.com/en/embedded-software/stsw-bnrg001.html
Reported values have been taken configuring the tool as shown in the follow figure:
a
The HS_Startup_Time has been measured according to the “Bringing up the BlueNRG-1 device” (AN4818). The
HS_Startup_Time parameter is important because it permits minimization of the current consumption. A value that
is too short prevents the SPBTLE-1S from correctly sending/receiving packets. Users should set the typical value
as indicated in Table 3.
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Figure 4: Configuration of the “BlueNRG current consumption estimation tool”
Table 4: Current consumption
Symbol
Parameter
Test conditions
Typ.
Unit
IDD
Supply current
Reset
5
nA
Standby
500
nA
Sleep mode
0.9
µA
Active Mode
1.9
mA
RX
7.7
mA
TX: +5dBm
15
mA
TX: 0 dBm
11
mA
Figure 5: Typical current consumption profile at +5 dBm
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Figure 6: Typical current consumption profile at 0 dBm
4.2 Pin assignment
Figure 7: Pin assignment
As described in the previous picture the SPBTLE-1S module is using exposed pad in order
to allow a full optical visual inspection in order to fulfill the needs of industrial grade
applications.
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The follow table provides the association between SPBTLE-1S module pin and the related
BlueNRG-1 pin. Refer to the BlueNRG-1 datasheet for detailed description.
Table 5: Pinout description
Module
pin #
Name
BlueNRG-1
Pin (CSP
package)
Function
Mode:
"000"
Mode:
"001"
Mode:
"100"
Mode:
"010"
1
ADC2
D5
ADC input 2
2
ADC1
B4
ADC input 1
3
DIO4
C3
GPIO4
UART_RXD
I2C2_CLK
PWM0
4
DIO5
C2
GPIO5
UART_TXD
I2C2_DAT
PWM1
5
Vin
A3, E6
Supply pin
6
ANATEST0/
DIO14/
A5
GPIO14
I2C1_CLK
SPI_CLK
ADC_DATA
7
DIO7/BOOTa
D2
GPIO7
UART_CTS
I2C2_DAT
PDM_CLK
8
GND
A4, B6, C1, F5
Ground
9
DIO6
D1
GPIO6
UART_RTS
I2C2_CLK
PDM_DATA
10
DIO8
D3
GPIO8
UART_TXD
SPI_CLK
PDM_DATA
11
DIO11
E2
GPIO11
UART_RXD
SPI_CS1
12
DIO9
E1
GPIO9
SWCLK
SPI_IN b
13
DIO10
F1
GPIO10
SWDIO
SPI_OUT c
14
ANATES1
D4
Anatest1
15
DIO0
A2
GPIO0
UART_CTS
SPI_CLK
16
DIO2
A1
GPIO2
PWM0
SPI_OUT
PDM_CLK
17
DIO3
B1
GPIO3
PWM1
SPI_IN
ADC_CLK
18
DIO1
B2
GPIO1
UART_RTS
SPI_CS1
PDM_DATA
19
RESETN
B3
Reset Pin
20
DIO12
F2
GPI12 d
I2C1CLK
21
N.C.
N/A
Must be left floating
22
N.C.
N/A
Must be left floating
23
N.C.
N/A
Must be left floating
a The pin DIO7/BOOT is monitored by bootloader after power up or hardware Reset and it
should be low to prevent unwanted bootloader activation .
a
The pin DIO7/BOOT is monitored by bootloader after power up or hardware Reset and it should be low to
prevent unwanted bootloader activation
b
The function SPI_IN indicates that the pin is always an input when configured for SPI. Thus in case of SPI
master role, it acts as MISO pin. In case of SPI slave role, this pin act as MOSI. See Table 5.
c
The function SPI_OUT indicates that the pin is always an output when configured for SPI. Thus in case of SPI
master role, it acts as MOSI pin. In case of SPI slave role, this pin act as MISO. See Table 5.
d
DI012 can only be General Purpose Input pins (not output), or I2C1 clock pin.
Hardware specifications
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b The function SPI_IN indicates that the pin is always an input when configured for SPI.
Thus in case of SPI master role, it acts as MISO pin. In case of SPI slave role, this pin act
as MOSI. See Table 5: "Pinout description"
c The function SPI_OUT indicates that the pin is always an output when configured for SPI.
Thus in case of SPI master role, it acts as MOSI pin. In case of SPI slave role, this pin act
as MISO. See Table 5: "Pinout description"
d DI012 can only be General Purpose Input pins (not output), or I2C1 clock pin.
Table 6: SPI pin function
SPI function
SPBTLE-1S SPI Role = Master
SPBTLE-1S SPI Role = Slave
SPI_IN
SPI MISO
SPI MOSI
SPI_OUT
SPI MOSI
SPI MISO
4.3 Mechanical dimensions
Figure 8: Mechanical dimensions
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Figure 9: Recommend land pattern
Hardware design
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5 Hardware design
All unused pins should be left floating; do not ground
GND pin must be well grounded
Traces should not be routed underneath the module
The area around the module should be free of any ground planes, power planes,
trace routings, or metal for 6 mm from the module antenna position, in all
directions.
5.1 Reset circuitry
The SPBTLE-1S module requires an external pull-up reset circuitry to ensure proper
operation at power on. Refer to the “Reset management” chapter of the BlueNRG-1
datasheet for details.
Figure 10: Reset circuitry
5.2 Debug interface
The SPBTLE-1S embeds the ARM serial wire debug (SWD) port. It is two pins (clock and
single bi-directional data) debug interface, providing all the debug functionality plus real
time access to system memory without halting the processor or requiring any target
resident code.
Table 7: Debug interface pin
Pin functionality
Module PIN
Pin description
SWCLK
12
SWD clock signal
SWDIO
13
SWD data signal
For more information refer to the BlueNRG-1 technical documentation
SPBTLE-1S
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(http://www.st.com/en/wireless-connectivity/bluenrg-1.html )
5.3 Reflow soldering
The SPBTLE-1S is a high temperature strength surface mount Bluetooth® module supplied
on a 23 pin, 4-layer PCB.
Module is assembled with special soldering paste that allow to make the additional reflow
with no changes in the module original characteristic. It’s important to respect the
parameter listed in the follow table.
The final assembly recommended reflow profiles are indicated here below.
Soldering phase has to be executed with care: in order to avoid undesired melting
phenomenon, particular attention has to be taken on the set up of the peak temperature.
Here following some suggestions for the temperature profile based on following
recommendations.
Table 8: Soldering
Profile feature
Pb-free assembly
Average ramp up rate (TSMAX to Tp)
3 °C / sec max
Preheat
Temperature min (TS min)
150 °C
Temperature max (TS max)
200 °C
Time (tS min to tS max) (tS))
60 - 100 sec
Time maintained above
Temperature TL
217 °C
Time tL
60 - 70 sec
Peak temperature (TP)
240 + 0 °C
Time within 5 °C of actual peak temperature (TP)
10 - 20 sec
Ramp down rate
6 °C / sec
Time from 25 °C to peak temperature
8 minutes max
Figure 11: Soldering profiles
Regulatory compliance
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6 Regulatory compliance
6.1 FCC certification
This module has been tested and found to comply with the FCC part 15 rules. These limits
are designed to provide reasonable protection against harmful interference in approved
installations. This equipment generates, uses, and can radiate radio frequency energy and,
if not installed and used in accordance with the instructions, may cause harmful
interference to radio communications.
However, there is no guarantee that interference may not occur in a particular installation.
This device complies with part 15 of the FCC rules. Operation is subject to the following
two conditions:
1. This device may not cause harmful interference,
and
2. this device must accept any interference received, including interference that may
cause undesired operation.
Modifications or changes to this equipment not expressly approved by STMicroelectronics
may render void the user's authority to operate this equipment.
Modular approval
FCC ID: S9NSPBTLE1S
In accordance with FCC part 15, the SPBTLE-1S is listed as a modular transmitter device.
This module is evaluated for stand-alone use only. Finished products incorporating
multiple transmitters must comply with colocation and RF exposure requirements in
accordance with FCC multi-transmitter product procedures. Collocated transmitters
operating in portable RF Exposure conditions (e.g. <20 cm from persons including but not
limited to body worn and hand held devices) may require separate approval.
6.1.1 Labeling instructions
When integrating the SPBTLE-1S into the final product, the OEM must ensure that the FCC
labeling requirements are satisfied. A statement must be included on the exterior of the
final product which indicates the product includes a certified module. The label should state
the following (or similar wording that conveys the same meaning):
This product uses SRRC approved Radio modular. CMIIT ID: 2017DJ5956
6.1.2 Product manual instructions
This section applies to OEM final products containing the SPBTLE-1S module, subject to
FCC compliance. The final product manual must contain the following statement (or a
similar statement that conveys the same meaning):
Changes or modifications not expressly approved by the party responsible for
compliance could void the user's authority to operate the equipment. (Part. 15.21)
In the case where an OEM seeks Class B (residential) limits for the final product, the
following statement must be included in the final product manual:
SPBTLE-1S
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This equipment has been tested and found to comply with the limits for a Class B
digital device, pursuant to part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may
cause harmful interference to radio communications. However, there is no
guarantee that interference will not occur in a particular installation. If this
equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to
try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna
Increase the separation between the equipment and receiver
Connect the equipment into an outlet on a circuit different from that to which
the receiver is connected
Consult the dealer or an experienced radio/TV technician for help
In the case where an OEM seeks the lesser category of a Class A digital device for the final
product, the following statement must be included in the final product manual:
This equipment has been tested and found to comply with the limits for a Class A
digital device, pursuant to part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with
the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful
interference in which case the user will be required to correct the interference at
his expense.
6.2 IC certification
The SPBTLE-1S module has been tested and found compliant with the IC RSS-210 rules.
These limits are designed to provide reasonable protection against harmful interference in
approved installations. This equipment generates, uses, and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications.
However, there is no guarantee that interference may not occur in a particular installation.
This device complies with RSS-210 of the IC rules. Operation is subject to the following two
conditions:
this device may not cause harmful interference
and
this device must accept any interference received, including interference that may
cause undesired operation
Modifications or changes to this equipment not expressly approved by STMicroelectronics
may render void the user's authority to operate this equipment.
Modular approval
IC: 8976C-SPBTLE1S
In accordance with IC RSS-210, the SPBTLE-1S is listed as a modular transmitter device.
Regulatory compliance
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This module is evaluated for stand-alone use only. Finished products incorporating multiple
transmitters must comply with colocation and RF exposure requirements in accordance
with IC multi-transmitter product procedures. Collocated transmitters operating in portable
RF Exposure conditions (e.g. < 20 cm from persons including but not limited to body worn
and hand held devices) may require separate approval.
6.2.1 Labeling instructions
When integrating the SPBTLE-1S into the final product, the OEM must ensure that the IC
labeling requirements are satisfied. A statement must be included on the exterior of the
final product which indicates that the product includes a certified module. The label should
state the following (or similar wording that conveys the same meaning):
Contains IC: 8976C-SPBTLE1S
OR
This product contains IC: 8976C-SPBTLE1S
The OEM must include the following statements on the exterior of the final product unless
the product is too small (e.g. less than 4 x 4 inches):
This device complies with RSS-210 of the IC Rules. Operation is subject to the following
two conditions:
this device may not cause harmful interference
and
this device must accept any interference received, including any interference that may
cause undesired operation
6.2.2 Product manual instructions
This section applies to OEM final products containing the SPBTLE-1S module, subject to
IC compliance. The final product manual must contain the following statement (or a similar
statement that conveys the same meaning):
Changes or modifications not expressly approved by the party responsible for
compliance could void the user's authority to operate the equipment. (RSS-210)
In the case where an OEM seeks Class B (residential) limits for the final product, the
following statement must be included in the final product manual:
This equipment has been tested and found to comply with the limits for a Class B
digital device, pursuant to RSS-210 of the IC Rules. These limits are designed to
provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may
cause harmful interference to radio communications. However, there is no
guarantee that interference will not occur in a particular installation. If this
equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to
try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna
Increase the separation between the equipment and receiver
Connect the equipment into an outlet on a circuit different from that to which
the receiver is connected
SPBTLE-1S
Regulatory compliance
DocID030445 Rev 3
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Consult the dealer or an experienced radio/TV technician for help
In the case where an OEM seeks the lesser category of a Class A digital device for the final
product, the following statement must be included in the final product manual:
This equipment has been tested and found to comply with the limits for a Class A
digital device, pursuant to RSS-210 of the IC Rules. These limits are designed to
provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with
the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful
interference in which case the user will be required to correct the interference at
his expense.
6.3 SRRC
6.3.1 Modular approval
The SPBTLE-1S module complies with Chinese SRRC certification.
SRRC CMIIT ID: 2017DJ5956
6.3.2 Labeling instructions
When integrating the SPBTLE-1S into the final product, the OEM must ensure that the FCC
labeling requirements are satisfied. A statement must be included on the exterior of the
final product which indicates the product includes a certified module. The label should state
the following (or similar wording that conveys the same meaning):
This product uses SRRC approved Radio modular. CMIIT ID: 2017DJ5956
6.4 Bluetooth certification
The module with embedded stack and profile has been qualified in accordance with SIG
qualification rules:
Declaration ID: D034470
Qualified design ID: 92838
Product type: End Product
Core spec version: 4.2
Product description: Bluetooth Smart v4.2 module
CE certification
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7 CE certification
The SPBTLE-1S module has been certified according to the following certification rules :
EN 300 328 V 2.1.1 (2016-11) (a)
ETSI EN 301 489-17 V3.1.1 (2017-02) (b)
ETSI EN 301 489-1 V2.1.1 (2017-02) (c)
EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011 + A2:2013 (d)
EN 62479:2010
a) EN 300 328 V 2.1.1 (2016 11): “electromagnetic compatibility and radio spectrum
Matters (ERM); Wideband transmission systems; data transmission equipment operating in
the 2.4 GHZ ISM band and using wideband modulation techniques; harmonized EN
covering essential requirements under article 3.2 of the R&TTE directive”.
b) EN 301 489-17 V 3.1.1 (2017 02): “electromagnetic compatibility and radio spectrum
Matters (ERM); electromagnetic compatibility (EMC) standard for radio equipment and
services; part 17: specific condition for 2.4 GHz wideband transmission systems and 5 GHz
high performance RLAN equipment.
c) ETSI EN 301 489-1 V2.1.1 (2017 02): “electromagnetic compatibility and radio spectrum
Matters (ERM); electromagnetic compatibility (EMC) standard for radio equipment and
services; part 1: Common technical requirements”.
d) EN60950-1:2006 +A11:2009+A1:2010+A12:2011+A2:2013: “Information technology
equipment - safety”.
The module is provided by CE marking:
Figure 12: CE marking
The module has obtained the RED certificate: No. 0051-RED-0010 REV. 0
The certified module production firmware release is:
2.X
For additional information please refer to:
STMicroelectronics Via C. Olivetti , 2 Agrate Brianza 20864 (ITALY)
SPBTLE-1S
Ordering information
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8 Ordering information
Table 9: Ordering information
Order code
Description
Packing
MOQ
SPBTLE-1S
Bluetooth® V4.2 smart module
Tray
2448
SPBTLE-1STR
Bluetooth® V4.2 smart module
tape and reel
1000 pcs
ECOPACK®
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9 ECOPACK®
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance.
ECOPACK® specifications, grade definitions and product status are available at:
www.st.com. ECOPACK® is an ST trademark.
SPBTLE-1S
Traceability
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10 Traceability
Each module is univocally identified by serial number stored in a 2D data matrix laser
marked on the bottom side of the module itself or on top of the module shieldThe serial
number has the following format:
Table 10: Traceability information
Letter
Meaning
WW
Week
YY
Year
D
Product ID family
FF
Production panel coordinate identification
NNN
Progressive serial number
Each module bulk is identified by a bulk ID.
BULK ID and module 2D data matrix are linked by a reciprocal traceability link.
The module 2D data matrix traces the lot number of any raw material used.
Revision history
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11 Revision history
Table 11: Document revision history
Date
Version
Changes
03-Jul-2017
1
Initial release.
12-Jul-2017
2
Updated Table 9: "Ordering information".
Document status promoted from preliminary to production data.
Minor text changes.
16-Oct-2017
3
Removed section EU type approval for SPBTLE-1S module.
Updated Table 1: "Absolute maximum ratings".
Added Section 1: "General description" and text updated.
Added Section 6.3: "SRRC" , Section 6.3: "SRRC" and Section 1:
"General description".
Updated Table 5: "Pinout description".
Minor text changes.
SPBTLE-1S
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products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order
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