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RNCP Series Datasheet

Stackpole Electronics Inc.

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Datasheet

Rev Date: 03/05/2019 1 www.seielect.com
This specification may be changed at any time without prior notice marketing@seielect.com
Please confirm technical specifications before you order and/or use.
RNCP Series
High Power Anti-Sulfur Thin Film Chip Resistor
Stackpole Electronics, Inc.
Resistive Product Solutions
Features:
(1) Power rating for each package size is valid if ambient temp ≤80 ºC and terminal temp ≤105 ºC
(2) Lesser of √PR or maximum working voltage
Certain resistance values will require a higher minimum order quantity. Contact Stackpole Customer Service for details.
Please refer to the High-Power Resistor Application Note (page 5) for more information on designing and implementing high power
resistor types.
Higher power ratings than standard thick film chips
Absolute TCRs to ±100 ppm/C
Inner termination engineered to deter sulfur contamination
Absolute Tolerances to 1%
Completely lead free - RoHS compliant and halogen-free
Comparable in cost to standard thick film chip resistors
Electrical Specifications
Performance Characteristics
Mechanical Specifications
Test Item
Reference Standard
Condition of Test
Test Limits (ΔR)
1000 hours at T=125ºC. Unpowered.
Measurement at 24 ± 2 hours
after test conclusion.
High Temperature
Exposure (Storage)
MIL-STD-202
Method 108
F: ± (2% + 0.1Ω)
J: ± (2% + 0.1Ω)
±100 ppm/ºC
2.5 times rated voltage for 5 seconds.
MIL-R-55342D Paragraph 4.7.5;
JIS-C5201-1-4.13
Short Time Overload
Temperature Coefficient
of Resistance
MIL-STD-202F Method 304;
JIS-C5201-1-4.8
+25~ +125ºC
0.039 ±0.004 0.020 ±0.002 0.012 ±0.002 0.010 ±0.006 0.012 ±0.006 inches
1.00 ±0.10 0.50 ±0.05 0.30 ±0.05 0.25 ±0.15 0.30 ±0.15 mm
0.059 ±0.004 0.031 ±0.004 0.016 ±0.004 0.012 ±0.008 0.016 ±0.008 inches
1.50 ±0.10 0.80 ±0.10 0.40 ±0.10 0.30 ±0.20 0.40 ±0.20 mm
0.079 ±0.006 0.049 ±0.006 0.020 ±0.004 0.016 ±0.008 0.024 ±0.008 inches
2.00 ±0.15 1.25 ±0.15 0.50 ±0.10 0.40 ±0.20 0.60 ±0.20 mm
0.122 ±0.008 0.059 ±0.008 0.020 ±0.004 0.020 ±0.012 0.028 ±0.008 inches
3.10 ±0.20 1.50 ±0.20 0.50 ±0.10 0.50 ±0.30 0.70 ±0.20 mm
RNCP1206
Type / Code
Unit
RNCP0402
RNCP0603
W
H
a
b
Body Width
Body Height
Top Termination
Bottom Termination
L
Body Length
RNCP0805
Power Rating (1)
(Watts)
@ 70 ºC 1%, 5%
RNCP0402 0.1W 50V 100V 1 - 10K
RNCP0603 0.125W 150V 300V 1 - 47K
RNCP0805 0.25W
RNCP1206 0.5W
200V
1 - 100K
Ohmic Range (Ω) and Tolerance
Resistance
Temperature Coefficient
Type / Code
Maximum Working
Voltage(2)
Maximum Overload
Voltage
±100 ppm/ºC
400V
Rev Date: 03/05/2019 2 www.seielect.com
This specification may be changed at any time without prior notice marketing@seielect.com
Please confirm technical specifications before you order and/or use.
RNCP Series
High Power Anti-Sulfur Thin Film Chip Resistor
Stackpole Electronics, Inc.
Resistive Product Solutions
0
Power Load (%)
100
70ºC
80
60
40
20
20
40
60
80
-55ºC
Ambient Temperature (ºC)
120
140
160
180
100
155ºC
-60
0
Power Derating Curve:
Performance Characteristics (cont.)
Pressure X kgf a R0.5 pressure rod
for 60 seconds.
Test Item
Reference Standard
Condition of Test
Test Limits (ΔR)
F: ± (0.5% + 0.05Ω)
J: ± (1% + 0.1Ω)
Solderability
J-STD-002
>95% area covered with tin
F: ± (0.5% + 0.05Ω)
J: ± (1% + 0.1Ω)
3mm deflection.
AEC-Q200-005
Board Flex (Bending)
AEC-Q200-006
Terminal Strength (SMD)
1000 hours TA=125ºC at rated power.
Measurement at 24 ± 2 hours after test
conclusion. Remark: Mounted quantity:
Mounted 2 pieces on 1 PCB.
MIL-STD-202
Method 108
245 ±C solder, 2 ± 0.5 s. dwell
Solder: Sn96.5 / Ag3.0 / Cu0.5.
F: ± (1% + 0.0)
J: ± (2% + 0.1Ω)
Moisture Resistance
MIL-STD-202
Method 106
1000 hours 8C / 85% RH.
Specified conditions: 10% of operating
power. Measurement at 24 ± 2 hours
after test conclusion.
Biased Humidity
MIL-STD-202
Method 103
F: ± (3% + 0.1Ω)
J: ± (3% + 0.1Ω)
Operational Life
F: ± (1% + 0.0)
J: ± (3% + 0.1Ω)
Condition B: Immerse the specimens in an
eutectic solder at 260 ±C
for 10 ± 1 seconds.
Resistance to Soldering
Heat
MIL-STD-202
Method 210
F: ± (0.5% + 0.05Ω)
J: ± (1% + 0.1Ω)
1000 cycles (-55ºC to +125ºC).
Measurement at 24 ± 2 hours
after test conclusion.
Temperature Cycling
JESD22
Method JA-104
Rev Date: 03/05/2019 3 www.seielect.com
This specification may be changed at any time without prior notice marketing@seielect.com
Please confirm technical specifications before you order and/or use.
RNCP Series
High Power Anti-Sulfur Thin Film Chip Resistor
Stackpole Electronics, Inc.
Resistive Product Solutions
Packaging Specifications
RNCP0402
(2mm Pitch Paper)
RNCP0603, 0805, 1206
(4mm Pitch Paper)
Type / Code Unit
0.079 ± 0.004 0.079 ± 0.004 0.157 ± 0.004 0.059 ± 0.004 0.018 ± 0.004 inches
2.00 ± 0.10 2.00 ± 0.10 4.00 ± 0.10 1.50 ± 0.10 0.45 ± 0.10 mm
0.157 ± 0.004 0.079 ± 0.002 0.157 ± 0.004 0.059 ± 0.004 0.025 ± 0.004 inches
4.00 ± 0.10 2.00 ± 0.05 4.00 ± 0.10 1.50 ± 0.10 0.64 ± 0.10 mm
0.157 ± 0.004 0.079 ± 0.002 0.157 ± 0.004 0.059 ± 0.004 0.033 ± 0.004 inches
4.00 ± 0.10 2.00 ± 0.05 4.00 ± 0.10 1.50 ± 0.10 0.84 ± 0.10 mm
0.157 ± 0.004 0.079 ± 0.002 0.157 ± 0.004 0.059 ± 0.004 0.033 ± 0.004 inches
4.00 ± 0.10 2.00 ± 0.05 4.00 ± 0.10 1.50 ± 0.10 0.84 ± 0.10 mm
T
RNCP0402
RNCP0603
RNCP0805
RNCP1206
P1
P2
P0
D0(ø)
Type / Code Unit
0.028 ± 0.002 0.047 ± 0.002 0.315 ± 0.008 0.069 ± 0.004 0.138 ± 0.002 inches
0.70 ± 0.05 1.20 ± 0.05 8.00 ± 0.20 1.75 ± 0.10 3.50 ± 0.05 mm
0.043 ± 0.004 0.075 ± 0.004 0.315 ± 0.008 0.069 ± 0.004 0.138 ± 0.002 inches
1.10 ± 0.10 1.90 ± 0.10 8.00 ± 0.20 1.75 ± 0.10 3.50 ± 0.05 mm
0.063 ± 0.006 0.094 ± 0.008 0.315 ± 0.008 0.069 ± 0.004 0.138 ± 0.002 inches
1.60 0.15 2.40 ± 0.20 8.00 ± 0.20 1.75 ± 0.10 3.50 ± 0.05 mm
0.079 ± 0.006 0.142 ± 0.008 0.315 ± 0.008 0.069 ± 0.004 0.138 ± 0.002 inches
2.00 ± 0.15 3.60 ± 0.20 8.00 ± 0.20 1.75 ± 0.10 3.50 ± 0.05 mm
E
RNCP0603
RNCP0805
0.079
2.00
0.157
4.00
0.157
4.00
Paper Tape Pitch
F
RNCP1206
RNCP0402
A
B
W
0.157
4.00
Rev Date: 03/05/2019 4 www.seielect.com
This specification may be changed at any time without prior notice marketing@seielect.com
Please confirm technical specifications before you order and/or use.
RNCP Series
High Power Anti-Sulfur Thin Film Chip Resistor
Stackpole Electronics, Inc.
Resistive Product Solutions
Reel Specifications
Peel-off Force Specifications
Peel-off force of paper and blister tape is in accordance with “JIS-C5202”, that is, 0.1 to 0.7N at a
peel-off speed of 300 mm/minute.
Type / Code Unit
7.008 ± 0.079 2.362 ± 0.039 0.512 ± 0.039 0.354 ± 0.039 0.453 ± 0.039 inches
178.00 ± 2.00 60.00 ± 1.00 13.00 ± 1.00 9.00 ± 1.00 11.50 ± 1.00 mm
T
RNCP
ØA
ØB
Øc
W
Solder Land Pattern
Type / Code A B C Unit
0.016 0.059 0.024 inches
0.40 1.50 0.60 mm
0.026 0.083 0.035 inches
0.65 2.10 0.90 mm
0.039 0.118 0.051 inches
1.00 3.00 1.30 mm
0.079 0.165 0.063 inches
2.00 4.20 1.60 mm
0402
0603
0805
1206
Rev Date: 03/05/2019 5 www.seielect.com
This specification may be changed at any time without prior notice marketing@seielect.com
Please confirm technical specifications before you order and/or use.
RNCP Series
High Power Anti-Sulfur Thin Film Chip Resistor
Stackpole Electronics, Inc.
Resistive Product Solutions
(Solder: Sn96.5 / Ag3 / Cu0.5)
High Power Chip Resistors and Thermal Management
Stackpole has developed several surface mount resistor series in addition to our current sense resistors, which have
had higher power ratings than standard resistor chips. This has caused some uncertainty and even confusion by users
as to how to reliably use these resistors at the higher power ratings in their designs.
The data sheets for the RHC, RMCP, RNCP, CSR, CSRN, CSRF, CSS, and CSSH state that the rated power assumes
an ambient temperature of no more than 100°C for the CSS / CSSH series and 70°C for all other high power resistor
series. In addition, IPC and UL best practices dictate that the combined temperature on any resistor due to power
dissipated and ambient air shall be no more than 105°C. At first glance this wouldn’t seem too difficult, however the
graph below shows typical heat rise for the CSR ½ 100 milliohm at full rated power. The heat rise for the RMCP and
RNCP would be similar. The RHC with its unique materials, design, and processes would have less heat rise and
therefore would be easier to implement for any given customer.
Recommended IR Reflow Profile
Peak: 250 +5/-0 °C, 5 seconds
Pre-heat Zone: 150 to 180 °C, 90 ± 30 seconds
Soldering Zone: 230 °C or higher, 30 ± 10 seconds
Rev Date: 03/05/2019 6 www.seielect.com
This specification may be changed at any time without prior notice marketing@seielect.com
Please confirm technical specifications before you order and/or use.
RNCP Series
High Power Anti-Sulfur Thin Film Chip Resistor
Stackpole Electronics, Inc.
Resistive Product Solutions
RNCP
High Power Anti-Sulfur
Thin Film Chip Resistor
SMD YES 100% Matte Sn over Ni Always Always
Lead-Free
Mfg. Effective Date
(Std Product Series)
Lead-Free
Effective Date
Code
(YY/WW)
Standard
Product
Series
Description
Package /
Termination
Type
Standard
Series
RoHS
Compliant
Lead-Free Termination
Composition
The 102°C heat rise shown here would indicate there will be additional thermal reduction techniques needed to keep
this part under 105°C total hot spot temperature if this part is to be used at 0.75 watts of power. However, this same
part at the usual power rating for this size would have a heat rise of around 72°C. This additional heat rise may be dealt
with using wider conductor traces, larger solder pads and land patterns under the solder mask, heavier copper in the
conductors, via through PCB, air movement, and heat sinks, among many other techniques. Because of the variety of
methods customers can use to lower the effective heat rise of the circuit, resistor manufacturers simply specify power
ratings with the limitations on ambient air temperature and total hot spot temperatures and leave the details of how to
best accomplish this to the design engineers. Design guidelines for products in various market segments can vary
widely so it would be unnecessarily constraining for a resistor manufacturer to recommend the use of any of these
methods over another.
Note: The final resistance value can be affected by the board layout and assembly process, especially the size of the
mounting pads and the amount of solder used. This is especially notable for resistance values 50mΩ.
This should be taken into account when designing.
RoHS Compliance
Stackpole Electronics has joined the worldwide effort to reduce the amount of lead in electronic components and to meet the various
regulatory requirements now prevalent, such as the European Union’s directive regarding “Restrictions on Hazardous Substances”
(RoHS 3). As part of this ongoing program, we periodically update this document with the status regarding the availability of our
compliant components. All our standard part numbers are compliant to EU Directive 2011/65/EU of the European Parliament as
amended by Directive (EU) 2015/863/EU as regards the list of restricted substances.
“Conflict Metals” Commitment
We at Stackpole Electronics, Inc. are joined with our industry in opposing the use of metals mined in the “conflict region” of the
eastern Democratic Republic of the Congo (DRC) in our products. Recognizing that the supply chain for metals used in the
electronics industry is very complex, we work closely with our own suppliers to verify to the extent possible that the materials and
products we supply do not contain metals sourced from this conflict region. As such, we are in compliance with the requirements of
Dodd-Frank Act regarding Conflict Minerals.
Compliance to “REACH”
We certify that all passive components supplied by Stackpole Electronics, Inc. are SVHC (Substances of Very High Concern) free
and compliant with the requirements of EU Directive 1907/2006/EC, “The Registration, Evaluation, Authorization and Restriction of
Chemicals”, otherwise referred to as REACH. Contact us for complete list of REACH Substance Candidate List.
Environmental Policy
It is the policy of Stackpole Electronics, Inc. (SEI) to protect the environment in all localities in which we operate. We continually
strive to improve our effect on the environment. We observe all applicable laws and regulations regarding the protection of our
environment and all requests related to the environment to which we have agreed. We are committed to the prevention of all forms
of pollution.
RoHS Compliance Status
Rev Date: 03/05/2019 7 www.seielect.com
This specification may be changed at any time without prior notice marketing@seielect.com
Please confirm technical specifications before you order and/or use.
RNCP Series
High Power Anti-Sulfur Thin Film Chip Resistor
Stackpole Electronics, Inc.
Resistive Product Solutions
Size
0402 Tol Value Code Quantity Code
ppm
0603 1% E96, E24 10,000 D
100
0805 5% E24 5,000
1206
Product Series
Power
TCR
Resistance Value
Packaging
Tolerance
RNCP
0.5W
0.125W
Four characters
with the multiplier
used as the
decimal holder.
0.25W
J
T
Code
F
0.1W
High Power
Anti-Sulfur
Thin Film
1 ohm = 1R00
Description
0402
7" Reel - Paper Tape
0603, 0805, 1206
Size
100 Kohm = 100K
Certain resistance values will require a higher minimum order quantity. Contact Stackpole Customer Service for details.
47 Kohm = 47K0
How to Order
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
R N C P 0 6 0 3 F T D 4 K 7 5

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