QSH-yyy-01-y-D-yyy Drawing

Samtec Inc.

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Datasheet

(0.50 mm) .0197" QSH SERIES
QSH–030–01F–D–A
QSH–060–01–L–D–A–K
QSH–060–01–L–D–DP–A
Integral metal plane
for power or ground
Blade &
Beam
Design
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
QSH PINS PER ROW
NO. OF PAIRS
PLATING
OPTION
030, –060, –090
(60 total pins per bank = –D)
020, –040, –060
(20 pairs per bank = –D–DP)
–D
= Single-
Ended
–D–DP
= Differential
Pair
(–01 only)
TYPE AOTHER
OPTION
01
For complete specifications and
recommended PCB layouts see
www.samtec.com?QSH
Insulator Material:
Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating:
Contact:
2 A per pin
(2 pins powered)
Ground Plane:
25 A per ground plane
(1 ground plane powered)
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating:
175 VAC (5 mm Stack Height)
Max Cycles:
100
RoHS Compliant:
Ye s
HIGH-SPEED GROUND PLANE SOCKET
–L
(20.00) .7875
–DP = (No. of Pairs per Row/20) x
(20.00) .7875 + (1.27) .050
–D = (No. of Pins per Row/30) x
(20.00) .7875 + (1.27) .050
01
02
(7.49)
.295
(0.15)
.006
(0.50)
.0197
(3.25)
.128
(0.76)
.030
(7.24)
.285
(0.89)
.035
DIA
(3.05)
.120
(0.64)
.025
–K
= (8.25 mm)
.325" DIA
Polyimide Film
Pick & Place Pad
–TR
= Tape & Reel
(–090 positions
maximum)
–L
= Latching
Option
(Not available on
–060 (–D–DP)
& –090 positions)
QTH
LEAD STYLE
MATED HEIGHT
WITH QSH*
01 (5.00) .197
02 (8.00) .315
03 (11.00) .433
04 (16.00) .630
05 (19.00) .748
07 (25.00) .984
09 (14.00) .551
*Processing conditions will affect
mated height. See SO Series for
board space tolerances
SPECIFICATIONS
For complete scope of
recognitions see
www.samtec.com/quality
RECOGNITIONS
PROCESSING
Lead–Free Solderable:
Ye s
SMT Lead Coplanarity:
(0.10 mm) .004" max (020-060)
Board Stacking:
For applications requiring more
than two connectors per board
contact ipg@samtec.com
Gbps
25
HIGH-SPEED CHANNEL PERFORMANCE
QTH/QSH @ 5 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
FILE NO. E111594
EXTENDED LIFE
PRODUCT
10 YEAR MFG
WITH 50 µ" GOLD
HIGH MATING
CYCLES
–F
= Gold Flash
on Signal Pins
and Ground Plane,
Matte Tin on tails
–L
= 10 µ" (0.25 µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
C*
= Electro-Polished
Selective
50 µ" (1.27 µm) min
Au over 150 µ" (3.81 µm)
Ni on Signal Pins
in contact area,
10 µ" (0.25 µm) min
Au over 50 µ" (1.27 µm)
Ni on Ground Plane
in contact area,
Matte Tin over
50 µ" (1.27 µm) min
Ni on all solder tails
Board Mates:
QTH
Cable Mates:
HQCD, HQDP
(See Also Available Note)
Standoffs:
SO
®
Compatible with
UMPT/UMPS for
flexible two-piece
power/signal solutions
POWER/SIGNAL
APPLICATION
F-219
*Note:
–C Plating passes
10 year MFG testing
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
STANDARDS
PISMO 1
Visit www.samtec.com/standards
for more information.
ALSO AVAILABLE
(MOQ Required)
15 mm, 22 mm and
30 mm stack height
30 µ" (0.76 µm) Gold
(Specify -H plating for
Data Rate cable mating
applications.)
Edge Mount & Guide Posts
80 (-DP), 120, 150
positions per row
Retention Option

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