SMLP34RGB Series Datasheet

Rohm Semiconductor

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Datasheet

SMLP34RGB Series
Data Sheet
■Features ■Outline
The smallest class 3 color type LED in the world PICOLED
TM
-RGB
4pin type
•Low hei
g
ht contributes to the improvement of color mixture
■Size
■Dimensions Recommended Solder Pattern
■Spec
ifi
cat
i
ons
Typ. I
F
Max. V
R
Min.*2
Typ.
Max.*2
I
F
Min. Typ. I
F
(V) (mA) (μA) (V) (nm) (nm) (nm) (mA) (mcd) (mcd) (mA)
2.1 619 624 629 14 35
3.1 520 527 535 56 110
3.0 465 470 475 28 45
*PICOLED
TM
is ROHM's pendin
g
trademark.
PICOLED
TM
-RGB
35 -40+100-40 +85
5
Part No.
Chip Structure
Absolute Maximum Ratings (Ta=25ºC) Electrical and Optical Characteristics (Ta=25ºC)
Reverse
Operating Temp.
Storage Temp.
Forward Voltage V
F
Reverse Current I
R
Dominant Wavelength λ
D
Luminous Intensity I
V
Dissipation
Current
Current
Voltage
P
D
(mW)
Peak Forward
I
F
(mA)
I
FP
(mA)
V
R
(V) T
opr
(ºC) T
stg
(ºC)
Power
Emitting
*1 : Duty ≦1/20, Pulse width1ms *2 : Measurement tolerance:±2nm
AlGaInP
SMLP34RGB2W 55
Green
InGaN
Red
10 50
*1
5
Blue
10 5
Forward
Color
Tolerance : ±0.1 (unit : mm) (unit : mm)
Color
Type GRB
4pintype
1010 (0404)
1.0×1.0mm (t=0.2mm)
0.45 0.4 0.45
0.4 0.45
0.45
________________________________________________________
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©2019 ROHM Co., Ltd. All rights reserved 1/9 2019.3 - Rev.008
    
[Data Sheet]
■Electrical Characteristics Curves
Fi
g
.1 Forward Current Fi
g
.2 Luminous Intensit
y
-
- Forward Volta
g
es     Atmos
p
here Tem
p
erature
Fi
.3 Luminous Intensit
- Forward Current Fi
g
.4 Deratin
g
[SMLP34RGB series]
Reference
0
5
10
15
-40-200 20406080100
0
0.5
1
1.5
2
0246810
0.4
0.6
0.8
1.0
1.2
1.4
1.6
-40-20 0 20406080100
1
10
100
1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4
Ta=25ºC
FORWARD CURRENT : IF[mA]
FORWARD VOLTAGE : VF[V]
IF=5mA
RELATIVE LUMINOUS INTENSITY [a.u.]
ATMOSPHERE TEMPERATURE : Ta [ºC]
Ta=25ºC
RELATIVE LUMINOUS INTENSITY
FORWARD CURRENT : IF[mA]
MAXIMUM FORWARD CURRENT : [mA]
AMBIENT TEMPERATURE : Ta [ºC]
SMLP34RGB2W (R)
SMLP34RGB2W (G)
SMLP34RGB2W (B)
SMLP34RGB2W (R)
SMLP34RGB2W (G)
SMLP34RGB2W (B)
SMLP34RGB2W (R)
SMLP34RGB2W (G)
SMLP34RGB2W (B)
SMLP34RGB2W (R)
SMLP34RGB2W (G)
SMLP34RGB2W (B)
________________________________________________________
www.rohm.com
©2019 ROHM Co., Ltd. All rights reserved 2/9 2019.3 - Rev.008
    
[Data Sheet]
■Viewin
g
An
g
le
Reference
[SMLP34RGB series]
SCANNING ANGLE (deg) SCANNING ANGLE (deg)
RELATIVE INTENSITY (%) RELATIVE INTENSITY (%)
10°
10° 20°
20°
40°
50°
70°
80°
40°
50°
70°
80°
0 50 10050100
30°
60°
90°
30°
60°
90°
X - Y
G
BR
SMLP34RGB2W (R)
SMLP34RGB2W (G)
SMLP34RGB2W (B)
10°
10° 2
20°
40°
50°
70°
80°
40°
50°
70°
80°
0 50 10050100
30°
60°
90°
30°
60°
90°
X’ - Y’
G
BR
SMLP34RGB2W (R)
SMLP34RGB2W (B)
SMLP34RGB2W (G)
________________________________________________________
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©2019 ROHM Co., Ltd. All rights reserved 3/9 2019.3 - Rev.008
    
[Data Sheet]
■Rank Reference of Bri
g
htness*
*Measurement tolerance:±10%
[SMLP34RGB series]
Triple Color
(Ta=25ºC, I
F
=5mA)
28〜56 56〜110 28〜56 56〜110 2856 56〜110 2856 56〜110 2856 56〜110 2856 56〜110
28〜 56
JKLM
90〜140 140〜220
GH
Blue
56〜90 90〜140 140〜220 56〜90
Green
Emitting
Color
Red 14〜28
形名
Rank Iv
(mcd)
AF
SMLP34RGB2W(R)
BDCE
________________________________________________________
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©2019 ROHM Co., Ltd. All rights reserved 4/9 2019.3 - Rev.008
    
[Data Sheet]
■Tapin
g
(3)
Unit:mm
Note)Tolerance is within ±0.1mm unless
otherwise specified.
■Part No. Construction
■Packin
g
Specification
ROHM LED products are being shipped with desiccant (silica gel) included in moisture-proof bags.
or enclosing the humidity indication card inside the bag is available upon request.
Please contact the nearest sales office or distributer if necessary.
[SMLP34RGB series]
Pasting the moisture sensitive label on the outer surface of the moisture-proof bags
*"-"will be taken out for emitting color Special Code will be applied for Chromaticity rank Rank sign
WB/B/E/RGB series. Emitting color WB/B/E/RGB series. (for white LED) (Brightness Rank)*
Series name Package Type Chip type Emitting Color Resin Color Taping Specification
SML P1 0 VT
E1 1 UW
D1 2U2 B
H1 3D
M1
4Y3
01 5Y2 notice)S1 series、81 seires
Z1/ZN
6Y
A1 7W
81/82
8
M2
K1 M
*Concerning the Brightness rank.
S1 F
*Please refer to the rank chart above for
P2 P
luminous intensity classification.
52 E
*Part name is individual for each rank.
P34
B
*When shipped as sample,the part name will
P36
WB
be a representative part name.
VN
T
General products are free of ranks.
RGB
Please contact sales if rank appointment
SCM
01
is needed.
Chip LED
3.0x1.5 t=2.2mm
3PRGB2W3
Standard Type
Red
Transparent Colorless
Low Current Type
Red
High Brightness type
SML- 4 A
T86
Cathode at sprocket hole side(the top)
3
T87
Anode at sprocket hole side(the top)
1Red
Milkey White
Black For white LED,
csthode at sprocket hole side
Chip LED
1.0x0.6 t=0.2mm
1.6x0.8 t=0.36mm
1.6x0.8 t=0.55mm
3.0x2.0 t=1.3mm
Yellow
2.0x1.25 t=0.8mm
Ultra High Brightness type
3.5x2.8 t=1.9mm
Yellowish green
Orange
Yellow
1.6x1.15 t=0.55mm
3.4x1.25 t=1.1mm
T86
Cathode at sprocket hole side(the back)
T68
Cathode at sprocket hole side(the top)
Yellowish green
White
Red/Green/Blue
1.5x1.0 t=0.2mm
Yellow
3.5x2.8 t=0.6mm
Phototransistors
Yellow
1.0x1.0 t=0.2mm
Green
1.3x1.5 t=0.6mm
Green
1.0x1.0 t=0.2mm
Blue
3.2x1.6 t=1.85mm
Green
4.5x2.0 t=0.6mm
8.0
1.75
4.0
2.0
φ180
φ60
φ13
11.4
2.0
φ1.5
(Feeding holes)
A'
Description
A-A'cross sectional view
B-B'cross sectional view
'
1.12
0.28
1.12
±1
Packing quantity
5,000pcs/reel Pull
direction
3.50
0.5
(cavities)
+0.1
-0
±0.05
±0.03
+0
-3
+1
-0
±0.05
±0.05
±0.1
±0.05
±0.05 ±0.1
+0.3
-0.1
±0.05
Description
________________________________________________________
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©2019 ROHM Co., Ltd. All rights reserved 5/9 2019.3 - Rev.008
    
[Data Sheet]
1.Stora
g
e
If the
p
roduct is heated durin
g
the reflow under the condition of h
yg
rosco
p
ic state,
it ma
y
va
p
orize and ex
p
and which will influence the
p
erformance of the
p
roduct.
Therefore, the
p
acka
g
e is water
p
roof. Please use the
p
roduct followin
g
the conditions:
・Usin
g
Conditions
・Bakin
g
Bake the
p
roduct in case of below:
①The ex
p
iration date is
p
assed.
②The color of indicator
(
silica
g
el
)
turned from blue to colorless or from
g
reen to
p
ink.
・Bakin
g
Conditions
2.A
pp
lication Methods
2-1.Precaution for Drive S
y
stem and Off Mode
Desi
g
n the circuit without the electric load exceedin
g
the ABSOLUTE MAXIMUM RATING that
p
lease do not a
pp
l
y
volta
g
e neither forward nor reverse. Es
p
eciall
y
, for the
p
roducts with the
A
g
-
p
aste used in the die bondin
g
, thereʼs hi
g
h
p
ossibilit
y
to cause electro mi
g
ration and result
2-2.About Deratin
g
 It is considered that deratin
g
characteristics will not result in LED chi
p
's electrical destruction.
Even within the deratin
g
, the reliabilit
y
and luminous life can be affected de
p
endin
g
on o
p
eratin
g
conditions and ambient environment. So we would be a
pp
reciate it if
y
ou can confirm with
y
our
a
pp
lication a
g
ain.
2-3.About
p
roduct life
De
p
endin
g
on o
p
eratin
g
conditions and environment
(
a
pp
lied current, ambient tem
p
erature and
humidit
y
, corrosive
g
as
)
, decreasin
g
of luminosit
y
and chan
g
e of chromaticit
y
ma
y
occur even
within the s
p
ecification conditions.
Please contact our sales office if
y
ou use it for the followin
g
a
pp
lications.
①It re
q
uires lon
g
luminosit
y
life
②It is alwa
y
s lit
2-4.A
pp
lied Stress on Product
No resin hardenin
g
a
g
ent such as filler is used in the sealin
g
resin of the
p
roduct.
Therefore,
p
lease
p
a
y
attention to the overstress on it which ma
y
influence its reliabilit
y
.
2-5.Usa
g
e
The Product is LED. We are not responsible for the usa
g
e as the diode such as Protection Chip,
Rectifier, Switchin
g
and so on.
[SMLP34RGB series]
Precaution (Surface Mount Device)
Temperature Time Humidity
・Bake products in reel.
・Reel and embossed tape are easy to be deformed when bakin
g
,
②After opening
package
5〜30℃ Below 70%RH
Remark so please try not to apply stress on it.
・Recommend bake once.
applies on the products. If drive by constant volta
g
e, it may cause current deviation of the LED and
result in deviation of luminous intensity, so we recommend to drive by constant current.
(Deviation of VF Value will cause deviation of current in LED.) Furthermore, for off mode,
in function failure.
Please storin
g
in the airti
g
ht container
Storage with waterproof package
Within 168h with our desiccant (silica
g
el)
(Even if the product is within the expiration date.)
60±3℃ 12〜24h Below 20%RH
Temperature
Humidity Expiration Date Remar
k
①Before using 5〜30℃ 30〜70%RH Within 1 year
from Receiving
Classification
________________________________________________________
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©2019 ROHM Co., Ltd. All rights reserved 6/9 2019.3 - Rev.008
    
[Data Sheet]
3.Others
3-1.Surroundin
g
Gas
Notice that if it is stored under the condition of acid
g
as
(
chlorine
g
as, sulfured
g
as
)
or
alkali
g
as
(
ammonia
)
, it ma
y
result in low solderin
g
abilit
y
(
caused b
y
the chan
g
e in
q
ualit
y
of
the
p
latin
g
surface
)
or o
p
tical characteristics chan
g
es
(
li
g
ht intensit
y
, chrominance
)
and chan
g
e
in
q
ualit
y
of cause die bondin
g
(
A
g
-
p
aste
)
materials. All of the above will function failure of
Therefore, please pay attention to the stora
g
e environment for mounted product (concern the
3-2.Electrostatic Dama
g
e
The
p
roduct is
p
art of semiconductor and electrostatic sensitive, thereʼs hi
g
h
p
ossibilit
y
to be dama
g
ed
b
y
the electrostatic dischar
g
e. Please take a
pp
ro
p
riate measures to avoid the static electricit
y
from
human bod
y
and earthin
g
of
p
roduction e
q
ui
p
ment. Es
p
eciall
y
, InGaN t
yp
e LEDs have lower resistance
value of electrostatic dischar
g
e and it is recommended to introduce the ESD
p
rotection circuit.
The resistance values of electrostatic dischar
g
e
(
actual values
)
var
y
with
p
roducts, therefore,
p
lease call our Sales staffs for in
q
uiries.
3-3. Electroma
g
netic Wave
A
pp
lications with stron
g
electroma
g
netic wave such as, IH cooker, will influence the reliabilit
y
of LED,
therefore please evaluate before usin
g
it.
[SMLP34RGB series]
the products.
g
enerated
g
as of the surroundin
g
parts of the products and the atmospheric environment).
________________________________________________________
www.rohm.com
©2019 ROHM Co., Ltd. All rights reserved 7/9 2019.3 - Rev.008
    
[Data Sheet]
Stress stren
g
th accordin
g
to
he mountin
g
p
osition:
A>B>C>D
so
p
lease
p
a
y
attention to the touch on
p
roduct.
We recommend the solderin
g
p
attern that shows on the ri
g
ht.
It will be different accordin
g
to mountin
g
situation of circuit board,
therefore,
p
lease concern before desi
g
nin
g
.
※The
p
roduct has ado
p
ted the electrode structure that it should solder
with back electrode of the
p
roduct.
Thus,
p
lease be informed that the sha
p
e of electrode
p
in of
solder fillet formation is not
g
uaranteed.
The throu
g
h hole on electrode surface is for conduction of front
 and rear electrodes but not for formation of solder fillet.
・No resin hardenin
g
a
g
ent such as filler is used in the sealin
g
resin of the product. Therefore, resin
expansion and moisture absorption at humidity will cause heat stress durin
g
solderin
g
process and
・Compare with N2 reflow, durin
g
air reflow, because of the heat and surroundin
g
conditions,
it may cause the discoloration of the resin.
・For our product that has no solder resist, because of its solder amount and solderin
g
conditions,
finally has bad influence on the productʼs reliability.
・The product is not
g
uaranteed for flow solderin
g
.
In case of carryin
g
out flow solderin
g
of surroundin
g
parts without recommended conditions, please
contact us for inquiries.
・Please set appropriate reflow temperature based on our product usa
g
e conditions and specification.
・The max for reflowin
g
is 2 times, please finish the second reflow solderin
g
and flow solderin
g
with other parts within the usa
g
e limitation after open the moistureproof packa
g
e.
4―4. Mechanical Stress after Mountin
g
・Do not expose the product in the environment of hi
g
h temperature (over 100℃) or rapid temperature
shift (within 3℃/sec. of temperature
g
radient) durin
g
the flow solderin
g
of surroundin
g
parts.
4-1. Solderin
g
4.Mountin
g
[SMLP34RGB series]
to prevent electrostatic char
g
e.
4-3. Mountin
g
Location
The stress like bendin
g
stress of circuit board dividin
g
after mountin
g
, may cause LED packa
g
e crack
or dama
g
e of LED internal
j
unction, therefore, please concern the mountin
g
direction and position
to avoid bendin
g
or screwin
g
with
g
reat stress of the circuit board.
the mounter to control the product stabilization. In addition, it is recommended to set ionizer
 one of its specific characteristics is that solder will penetrate into LED. Thus, there's hi
g
h possibility
that will influence its reliability.Therefore, please be informed, concernin
g
it before usin
g
it.
4-2. Automatic Mountin
g
4-2-1. Silicon Resin Sealin
g
Product
The sealin
g
resin of LED is very soft, so please select adsorption nozzle that would not apply stress
directly on the sealin
g
section.
4-2-2. Mini Packa
g
e (Smaller than 1608 size)
・Vibration may result in low mountin
g
rate since it will cause the static electricity of product and
adhere to top cover tape. Therefore, the ma
g
net should be set on parts feeder cassette of
The mechanical stress may dama
g
e the LED after Circuit Mountin
g
,
4-5.Solderin
g
Pattern for Recommendation
Mask open area ratio : 80%
Mask thickness : 80100μm
Reference
0.45 0.4 0.45
0.4 0.45
0.45
(Unit : mm)
________________________________________________________
www.rohm.com
©2019 ROHM Co., Ltd. All rights reserved 8/9 2019.3 - Rev.008
    
[Data Sheet]
Solvent We recommend to use alcohols solvent such as, isopropyl alcohols
Temperature Under 30 within 3 minutes
b) Handlin
g
after
soldering
Please handle after the part temp.
g
oes down to room temp.
4-8.Cleanin
g
after Solderin
g
①SOLDER USED
Heatin
g
on PCB pattern, not direct to the
LED. (Fi
g
-1)
Sn-Cu,Sn-A
g
-Cu,Sn-A
g
-Bi-Cu
②HAND SOLDERING CONDITION
LED products do not contain reinforcement material such as a
g
lass fillers.
RECOMMENDED CONDITION
Condition ) Temp. of iron top less than
400℃ within 3 sec.
Peak temperature 260℃(Max)
t
P
Time for peak temperature
4-7.Attention Points in Solderin
g
Operation
This product was developed as a surface mount LED especially suitable for reflow solderin
g
.
So reflow solderin
g
is recommended. In case of implementin
g
manual solderin
g
,
please take care of followin
g
points.
ΔT
R
/
Δt
Temperature rising rate
Under 3℃/sec.
ΔT
D
/
Δt
Temperature decreasing rate
Over -3/sec.
※Above conditions are for reference. Therefore, evaluate by customerʼs own circuit boards and
reflow furnaces before usin
g
, because stress from circuit boards and temperature variations of reflow
Reference temperature
230〜260℃
t
L
Retention time for TL Within 40sec.
T
P
Within 10sec.
[SMLP34RGB series]
4-6.Reflow Profile
For reflow profile, please refer to the conditions below:(※)
■Meanin
g
of marks, Conditions
Mar
k
Meanings Conditions
Please follow the conditions below if the cleanin
g
is necessary after solderin
g
.
Ultrasonic Cleanin
g
15W/Below 1 liter (capacity of tank)
Dryin
g
Under 100℃ within 3 minutes
furnaces vary by customerʼs own conditions.
So thermal stress by solderin
g
g
reatly influence its reliability.
Please keep followin
g
points for manual solderin
g
.
ITEM
a) Heating method
Ts
max
Maximum of pre-heating temperature
180℃
Ts
min
Minimum of pre-heating temperature
140℃
t
s
Time from Tsmin to Tsmax
Over 60sec.
T
L
Fig-1 SOLDERING IRON
SOLDERING LAND
________________________________________________________
www.rohm.com
©2019 ROHM Co., Ltd. All rights reserved 9/9 2019.3 - Rev.008
R1102
A
www.rohm.com
© 201 ROHM Co., Ltd. All rights reserved.
Notice
ROHM Customer Support System
http://www.rohm.com/contact/
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
Notes
The information contained herein is subject to change without notice.
Before you use our Products, please contact our sales representative
and verify the latest specifica-
tions :
Although ROHM is continuously working to improve product reliability and quality, semicon-
ductors can break down and malfunction due to various factors.
Therefore, in order to prevent personal injury or fire arising from failure, please take safety
measures such as complying with the derating characteristics, implementing redundant and
fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no
responsibility for any damages arising out of the use of our Poducts beyond the rating specified by
ROHM.
Examples of application circuits, circuit constants and any other information contained herein are
provided only to illustrate the standard usage and operations of the Products. The peripheral
conditions must be taken into account when designing circuits for mass production.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly,
any license to use or exercise intellectual property or other rights held by ROHM or any other
parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of
such technical information.
The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communi-
cation, consumer systems, gaming/entertainment sets) as well as the applications indicated in
this document.
The Products specified in this document are not designed to be radiation tolerant.
For use of our Products in applications requiring a high degree of reliability (as exemplified
below), please contact and consult with a ROHM representative : transportation equipment (i.e.
cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety
equipment, medical systems, servers, solar cells, and power transmission systems.
Do not use our Products in applications requiring extremely high reliability, such as aerospace
equipment, nuclear power control systems, and submarine repeaters.
ROHM shall have no responsibility for any damages or injury arising from non-compliance with
the recommended usage conditions and specifications contained herein.
ROHM has used reasonable care to ensur the accuracy of the information contained in this
document. However, ROHM does not warrants that such information is error-free, and ROHM
shall have no responsibility for any damages arising from any inaccuracy or misprint of such
information.
Please use the Products in accordance with any applicable environmental laws and regulations,
such as the RoHS Directive. For more details, including RoHS compatibility, please contact a
ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting
non-compliance with any applicable laws or regulations.
When providing our Products and technologies contained in this document to other countries,
you must abide by the procedures and provisions stipulated in all applicable export laws and
regulations, including without limitation the US Export Administration Regulations and the Foreign
Exchange and Foreign Trade Act.
This document, in part or in whole, may not be reprinted or reproduced without prior consent of
ROHM.
1)
2)
3)
4)
5)
6)
7)
8)
9)
10)
11)
12)
13)
14)
Datasheet
Part Number SMLP34RGB2W
Package SMLP34
Unit Quantity 5000
Minimum Package Quantity 5000
Packing Type Taping
Constitution Materials List inquiry
RoHS Yes
SMLP34RGB2W - Web Page
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