SML-D12,3x8 Datasheet

Rohm Semiconductor

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Datasheet

SML-D12x8/D13x8 Series
Data Sheet
Features
Outline
• EXCELED
TM
series
Original device technology enables high brightness
and high reliability
Dimensions
Recommended Solder Pattern
Specications
Typ. I
F
Max. V
R
Min.*
2
Typ.
Max.*
2
I
F
Min. Typ. I
F
(V) (mA) (µA) (V) (nm) (nm) (nm) (mA) (mcd) (mcd) (mA)
625 630 635 16 40
615 620 625 25 63
602 605 608 40 100
587 590 593 25 63
569 572 575 10 25
557 560 563 2.5 6.3
2.1 615 620 625 40 70
587 590 593 63 100
569 572 575 16 30
*EXCELED
TM
is ROHM's pending trademark.
SML-D12V8W
SML-D12U8W
SML-D12D8W
SML-D12Y8W
SML-D12M8W
SML-D12P8W
SML-D13U8W
SML-D13Y8W
SML-D13M8W
Emitting
Color
5
P
D
(mW)
I
F
(mA)
Part No.
Chip Structure
Absolute Maximum Ratings (Ta=25ºC) Electrical and Optical Characteristics (Ta=25ºC)
Power
Forward Peak Forward
Forward Voltage V
F
Reverse Current I
R
Dominant Wavelength λ
D
Luminous Intensity I
V
Dissipation
54
20 20
Orange
Yellow
Green
Red 52
Yellow
2.2
Yellowish green
20 100*
1
5-40+85 -40+100
2.2
20 10
EXCELED
TM
Yellowish green
Reverse
Operating Temp.
Storage Temp.
*1:Duty1/10, 1kHz *2:Measurement torelance:±1nm
I
FP
(mA)
V
R
(V)
Current
Current
Voltage
AlGaInP
Red
54
T
opr
(ºC) T
stg
(ºC)
Tolerance : ±0.1
(unit : mm) (unit : mm)
1608 (0603)
1.6×0.8mm (t=0.55mm)
Color
Type V U D
YP
M
0.8
0.85
0.8
0.8
PCB Bonding Direction
1.6
1.2
0.8
0.65
0.8
0.55
0.18
Cathode index
1.5
0.5
R0.275
R0.15
Electrode
________________________________________________________
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©2018 ROHM Co., Ltd. All rights reserved 1/10 2018.12 - Rev.009
    
[Data Sheet]
Electrical Characteristics Curves
Fig.1 Forward Current
Fig.2 Luminous Intensity -
- Forward Voltages
     Atmosphere Temperature
Fig.3 Luminous Intensity - Forward Current
Fig.4 Derating
Reference
[SML-D12x8/D13x8 series]
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0 4 8 12 16 20
0.4
0.6
0.8
1
1.2
1.4
1.6
-40 -20 0 20 40 60 80 100
1
10
100
1.5 2.0 2.5
Ta=25ºC
FORWARD CURRENT : IF[mA]
FORWARD VOLTAGE : VF[V]
IF=20mA
RELATIVE LUMINOUS INTENSITY [a.u.]
ATMOSPHERE TEMPERATURE : Ta [ºC]
Ta=25ºC
RELATIVE LUMINOUS INTENSITY
FORWARD CURRENT : IF[mA]
MAXIMUM FORWARD CURRENT : [mA]
AMBIENT TEMPERATURE : Ta [ºC]
SML-D12V8W
SML-D12U8W
SML-D12D8W
SML-D12Y8W
SML-D12M8W
SML-D12P8W
SML-D12V8W
SML-D12U8W
SML-D12D8W
SML-D12Y8W
SML-D12M8W
SML-D12P8W
SML
-D12V8W
SML
-D12U8W
SML
-D12D8W
SML
-D12Y8W
SML
-D12M8W
SML
-D12P8W
0
10
20
30
-40 -20 0 20 40 60 80 100
SML
-D12V8W
SML
-D12U8W
SML
-D12D8W
SML
-D12Y8W
SML
-D12M8W
SML
-D12P8W
________________________________________________________
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©2018 ROHM Co., Ltd. All rights reserved 2/10 2018.12 - Rev.009
    
[Data Sheet]
Electrical Characteristics Curves
Fig.1 Forward Current
Fig.2 Luminous Intensity -
- Forward Voltages
     Atmosphere Temperature
Fig.3 Luminous Intensity - Forward Current
Fig.4 Derating
Reference
[SML-D12x8/D13x8 series]
1
10
100
1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0 4 8 12 16 20
0.4
0.6
0.8
1
1.2
1.4
1.6
-40 -20 0 20 40 60 80 100
Ta=25ºC IF=20mA
Ta=25ºC
FORWARD CURRENT : IF[mA]
FORWARD VOLTAGE : VF[V]
RELATIVE LUMINOUS INTENSITY [a.u.]
ATMOSPHERE TEMPERATURE : Ta [ºC]
RELATIVE LUMINOUS INTENSITY
FORWARD CURRENT : IF[mA]
MAXIMUM FORWARD CURRENT : [mA]
AMBIENT TEMPERATURE : Ta [ºC]
SML
-D13U8W
SML
-D13Y8W
SML
-D13M8W
SML-D13U8W
SML-D13Y8W
SML-D13M8W
0
10
20
30
-40 -20 0 20 40 60 80 100
SML
-D13U8W
SML
-D13Y8W
SML
-D13M8W
SML-D13U8W
SML-D13Y8W
SML-D13M8W
________________________________________________________
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©2018 ROHM Co., Ltd. All rights reserved 3/10 2018.12 - Rev.009
    
[Data Sheet]
Viewing Angle
Reference
[SML-D12x8/D13x8 series]
SML
-D12V8W
SML
-D12U8W
SML
-D13U8W
SML
-D12D8W
SML
-D13Y8W
SML
-D12Y8W
SML
-D12M8W
SML
-D13M8W
SML
-D12P8W
SCANNING ANGLE (deg) SCANNING ANGLE (deg)
RELATIVE INTENSITY (%) RELATIVE INTENSITY (%)
________________________________________________________
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©2018 ROHM Co., Ltd. All rights reserved 4/10 2018.12 - Rev.009
    
[Data Sheet]
Rank Reference of Brightness*
*Measurement tolerance:±10%
[SML-D12x8/D13x8 series]
Red(V,U) (Ta=25ºC, I
F
=20mA)
Rank
H
J
K
L
M
N
P
Q
R
S
T
U
Iv (mcd)
1.6〜2.5 2.5〜4.0 4.0〜6.3 6.3〜10 10〜16 16〜25 25〜40 40〜63 63〜100 100〜160 160〜250 2500〜400
SML-D13U8W
SML-D12V8W
SML-D12U8W
Orange(D) (Ta=25ºC, I
F
=20mA)
Rank
H
J
K
L
M
N
P
Q
R
S
T
U
Iv (mcd)
1.6〜2.5 2.5〜4.0 4.0〜6.3 6.3〜10 10〜16 16〜25 25〜40 40〜63 63〜100 100〜160 160〜250 2500〜400
SML-D12D8W
Yellow(Y) (Ta=25ºC, I
F
=20mA)
Rank
H
J
K
L
M
N
P
Q
R
S
T
U
Iv (mcd)
1.6〜2.5 2.5〜4.0 4.0〜6.3 6.3〜10 10〜16 16〜25 25〜40 40〜63 63〜100 100〜160 160〜250 2500〜400
SML-D13Y8W
SML-D12Y8W
Yellowish Green/Green (M,P) (Ta=25ºC, I
F
=20mA)
Rank
H
J
K
L
M
N
P
Q
R
S
T
U
Iv (mcd)
1.6〜2.5 2.5〜4.0 4.0〜6.3 6.3〜10 10〜16 16〜25 25〜40 40〜63 63〜100 100〜160 160〜250 2500〜400
SML-D13M8W
SML-D12P8W
SML-D12M8W
________________________________________________________
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©2018 ROHM Co., Ltd. All rights reserved 5/10 2018.12 - Rev.009
    
[Data Sheet]
Taping(T86)
Unit:mm
Note)Tolerance is within ±0.2mm unless
otherwise specified.
Part No. Construction
Packing Specication
ROHM LED products are being shipped with desiccant (silica gel) included in moisture-proof bags.
or enclosing the humidity indication card inside the bag is available upon request.
Please contact the nearest sales office or distributer if necessary.
[SML-D12x8/D13x8 series]
Pasting the moisture sensitive label on the outer surface of the moisture-proof bags
8.0
1.75
3.5
5.5
0~0.5
1
2
1.9
φ180
φ60
φ13
±0.1
±0.05
φ1.5
+0.1
±0.1
+1
0
-3
0
±0.05
0
0.73
4
Packing quantity
3,000pcs/reel
Pull
direction
11.4
±1
+0.1
-0.07
+0.1
-0.07
±0.1
0 . 2
±0.05
*"-"will be taken out for emitting color Special Code will be applied for Chromaticity rank Rank sign
WB/B/E series. Emitting color WB/B/E series. (for white LED (Brightness Rank)*
Series name Package Type Chip type Emitting Color Resin Color Taping Specification
SML
P1 0 V T
E1 1 U W
D1
2U2 B
H1
3D
M1
4Y3
01 5Y2 noticeS1 series81 seires
Z1/ZN
6Y
A1 7W
81/82
8
M2
K1 M
*Concerning the Brightness rank.
S1 F
*Please refer to the rank chart above for
P2 P
luminous intensity classification.
52 E
*Part name is individual for each rank.
P34
B
*When shipped as sample,the part name will
P36
WB
be a representative part name.
VN
T
General products are free of ranks.
RGB
Please contact sales if rank appointment
SCM
01
is needed.
Transparent Colorless
T86
Cathode at sprocket hole side(the top)
1.6x0.8 t=0.55mm
Low Current Type
Red
Milkey White
T87
1Black
Anode at sprocket hole side(the top)
High Brightness type
For white LED,
Red
csthode at sprocket hole side
Red/Green/Blue
Cathode at sprocket hole side(the back)
3.0x1.5 t=2.2mm
3.5x2.8 t=0.6mm
Phototransistors
Chip LED
1.0x1.0 t=0.2mm
Blue
1.5x1.0 t=0.2mm
White
1.3x1.5 t=0.6mm
Green
3.2x1.6 t=1.85mm
Green
1.0x1.0 t=0.2mm
Green
4.5x2.0 t=0.6mm
Yellowish green
1.6x1.15 t=0.55mm
T68
Cathode at sprocket hole side(the top)
T86
Ultra High Brightness type
3.0x2.0 t=1.3mm
3.5x2.8 t=1.9mm
Yellowish green
Yellow
3.4x1.25 t=1.1mm
2.0x1.25 t=0.8mm
Yellow
Yellow
Yellow
Orange 3
Chip LED
1.0x0.6 t=0.2mm
1.6x0.8 t=0.36mm
Red
P
Standard Type
1S M L - D 6 A2 M 8 W T 8
________________________________________________________
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©2018 ROHM Co., Ltd. All rights reserved 6/10 2018.12 - Rev.009
    
[Data Sheet]
Storage
If the product is heated during the reflow under the condition of hygroscopic state,
it may vaporize and expand which will influence the performance of the product.
Therefore, the package is waterproof. Please use the product following the conditions:
Using Conditions
Baking
Bake the product in case of below:
The expiration date is passed.
The color of indicator (silica gel) turned from blue to colorless or from green to pink.
Baking Conditions
Application Methods
Precaution for Drive System and O Mode
Design the circuit without the electric load exceeding the ABSOLUTE MAXIMUM RATING that
please do not apply voltage neither forward nor reverse. Especially, for the products with the
Ag-paste used in the die bonding, theres high possibility to cause electro migration and result
About Derating
 It is considered that derating characteristics will not result in LED chip's electrical destruction.
Even within the derating, the reliability and luminous life can be affected depending on operating
conditions and ambient environment. So we would be appreciate it if you can confirm with your
application again.
About product life
Depending on operating conditions and environment(applied current, ambient temperature and
humidity, corrosive gas), decreasing of luminosity and change of chromaticity may occur even
within the specification conditions.
Please contact our sales office if you use it for the following applications.
It requires long luminosity life
It is always lit
Applied Stress on Product
No resin hardening agent such as filler is used in the sealing resin of the product.
Therefore, please pay attention to the overstress on it which may influence its reliability.
Usage
The Product is LED. We are not responsible for the usage as the diode such as Protection Chip,
Rectifier, Switching and so on.
Classification
Temperature
Humidity
Expiration Date
Remark
30〜70%RH
Within 1 year
from Receiving Storage with waterproof package
②After opening
package
5〜30℃ Below 70%RH Within 168h
with our desiccant (silica gel)
(Even if the product is within the expiration date.)
60±3℃
12〜24h
Below 20%RH
①Before using 5〜30℃
[SML-D12x8/D13x8 series]
Precaution (Surface Mount Device)
Remark
so please try not to apply stress on it.
Recommend bake once.
Please storing in the airtight container
Temperature
Time
Humidity
Bake products in reel.
Reel and embossed tape are easy to be deformed when baking,
applies on the products. If drive by constant voltage, it may cause current deviation of the LED and
result in deviation of luminous intensity, so we recommend to drive by constant current.
(Deviation of VF Value will cause deviation of current in LED.) Furthermore, for off mode,
in function failure.
________________________________________________________
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©2018 ROHM Co., Ltd. All rights reserved 7/10 2018.12 - Rev.009
    
[Data Sheet]
Others
Surrounding Gas
Notice that if it is stored under the condition of acid gas (chlorine gas, sulfured gas) or
alkali gas (ammonia), it may result in low soldering ability (caused by the change in quality of
the plating surface ) or optical characteristics changes (light intensity, chrominance) and change
in quality of cause die bonding (Ag-paste) materials. All of the above will function failure of
Therefore, please pay attention to the storage environment for mounted product (concern the
Electrostatic Damage
The product is part of semiconductor and electrostatic sensitive, theres high possibility to be damaged
by the electrostatic discharge. Please take appropriate measures to avoid the static electricity from
human body and earthing of production equipment. Especially, InGaN type LEDs have lower resistance
value of electrostatic discharge and it is recommended to introduce the ESD protection circuit.
The resistance values of electrostatic discharge (actual values) vary with products, therefore,
please call our Sales staffs for inquiries.
Electromagnetic Wave
Applications with strong electromagnetic wave such as, IH cooker, will influence the reliability of LED,
therefore please evaluate before using it.
the products.
generated gas of the surrounding parts of the products and the atmospheric environment).
[SML-D12x8/D13x8 series]
________________________________________________________
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©2018 ROHM Co., Ltd. All rights reserved 8/10 2018.12 - Rev.009
    
[Data Sheet]
Stress strength according to
he mounting position:
ABCD
so please pay attention to the touch on product.
We recommend the soldering pattern that shows on the right.
It will be different according to mounting situation of circuit board,
therefore, please concern before designing.
The product has adopted the electrode structure that it should solder
with back electrode of the product.
Thus, please be informed that the shape of electrode pin of
solder fillet formation is not guaranteed.
The through hole on electrode surface is for conduction of front
 and rear electrodes but not for formation of solder llet.
. Mechanical Stress after Mounting
The mechanical stress may damage the LED after Circuit Mounting,
Soldering Pattern for Recommendation
to prevent electrostatic charge.
. Mounting Location
The stress like bending stress of circuit board dividing after mounting, may cause LED package crack
or damage of LED internal junction, therefore, please concern the mounting direction and position
to avoid bending or screwing with great stress of the circuit board.
[SML-D12x8/D13x8 series]
Mounting
. Soldering
No resin hardening agent such as ller is used in the sealing resin of the product. Therefore, resin
For our product that has no solder resist, because of its solder amount and soldering conditions,
 one of its specic characteristics is that solder will penetrate into LED. Thus, there's high possibility
that will influence its reliability.Therefore, please be informed, concerning it before using it.
. Automatic Mounting
--. Silicon Resin Sealing Product
The sealing resin of LED is very soft, so please select adsorption nozzle that would not apply stress
directly on the sealing section.
--. Mini Package (Smaller than 1608 size)
Vibration may result in low mounting rate since it will cause the static electricity of product and
adhere to top cover tape. Therefore, the magnet should be set on parts feeder cassette of
the mounter to control the product stabilization. In addition, it is recommended to set ionizer
after opening the moistureproof package.
expansion and moisture absorption at humidity will cause heat stress during soldering process and
finally has bad influence on the products reliability.
The product is not guaranteed for ow soldering.
Thermal stress during the ow soldering of surrounding parts will inuence the reliability of LED and
please evaluate the soldering conditions before using it. Also please make sure the expiration date
Please set appropriate reow temperature based on our product usage conditions and specication.
The max for reowing is 2 times, please nish the second reow soldering and ow soldering
with other parts within the usage limitation after open the moistureproof package.
Compare with N2 reow, during air reow, because of the heat and surrounding conditions,
it may cause the discoloration of the resin.
0.8mm
0.85mm
0.8mm
0.8mm
PCB Bonding Direction
________________________________________________________
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©2018 ROHM Co., Ltd. All rights reserved 9/10 2018.12 - Rev.009
    
[Data Sheet]
Ultrasonic Cleaning
15WBelow 1 liter (capacity of tank)
Drying
Under 100 within 3 minutes
furnaces vary by customers own conditions.
So thermal stress by soldering greatly influence its reliability.
Please keep following points for manual soldering.
ITEM
a) Heating method
[SML-D12x8/D13x8 series]
Reow Prole
For reow prole, please refer to the conditions below:()
Meaning of marks, Conditions
Mark
Meanings
Conditions
Ts
max
Maximum of pre-heating temperature
180℃
Ts
min
Minimum of pre-heating temperature
140℃
t
s
Time from Tsmin to Tsmax
Over 60sec.
T
L
Reference temperature
230260
t
L
Retention time for TL
Within 40sec.
T
P
Peak temperature
260(Max)
t
P
Time for peak temperature
Within 10sec.
ΔT
R
/Δt
Temperature rising rate
Under 3/sec.
ΔT
D
/Δt
Temperature decreasing rate
Over -3/sec.
Above conditions are for reference. Therefore, evaluate by customers own circuit boards and
reflow furnaces before using, because stress from circuit boards and temperature variations of reflow
Please handle after the part temp.
goes down to room temp.
Cleaning after Soldering
Please follow the conditions below if the cleaning is necessary after soldering.
Solvent
We recommend to use alcohols solvent such as, isopropyl alcohols
Attention Points in Soldering Operation
This product was developed as a surface mount LED especially suitable for reflow soldering.
So reflow soldering is recommended. In case of implementing manual soldering,
please take care of following points.
SOLDER USED
Sn-CuSn-Ag-CuSn-Ag-Bi-Cu
HAND SOLDERING CONDITION
LED products do not contain reinforcement material such as a glass fillers.
RECOMMENDED CONDITION
Temperature
Under 30 within 3 minutes
Heating on PCB pattern, not direct to the
LED. (Fig-1)
Condition ) Temp. of iron top less than
400 within 3 sec.
b)
Handling after
soldering
Fig-1
SOLDERING
LAND
SOLDERING IRON
________________________________________________________
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©2018 ROHM Co., Ltd. All rights reserved 10/10 2018.12 - Rev.009
R1102
A
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© 201 ROHM Co., Ltd. All rights reserved.
Notice
ROHM Customer Support System
http://www.rohm.com/contact/
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
Notes
The information contained herein is subject to change without notice.
Before you use our Products, please contact our sales representative
and verify the latest specifica-
tions :
Although ROHM is continuously working to improve product reliability and quality, semicon-
ductors can break down and malfunction due to various factors.
Therefore, in order to prevent personal injury or fire arising from failure, please take safety
measures such as complying with the derating characteristics, implementing redundant and
fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no
responsibility for any damages arising out of the use of our Poducts beyond the rating specified by
ROHM.
Examples of application circuits, circuit constants and any other information contained herein are
provided only to illustrate the standard usage and operations of the Products. The peripheral
conditions must be taken into account when designing circuits for mass production.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly,
any license to use or exercise intellectual property or other rights held by ROHM or any other
parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of
such technical information.
The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communi-
cation, consumer systems, gaming/entertainment sets) as well as the applications indicated in
this document.
The Products specified in this document are not designed to be radiation tolerant.
For use of our Products in applications requiring a high degree of reliability (as exemplified
below), please contact and consult with a ROHM representative : transportation equipment (i.e.
cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety
equipment, medical systems, servers, solar cells, and power transmission systems.
Do not use our Products in applications requiring extremely high reliability, such as aerospace
equipment, nuclear power control systems, and submarine repeaters.
ROHM shall have no responsibility for any damages or injury arising from non-compliance with
the recommended usage conditions and specifications contained herein.
ROHM has used reasonable care to ensur the accuracy of the information contained in this
document. However, ROHM does not warrants that such information is error-free, and ROHM
shall have no responsibility for any damages arising from any inaccuracy or misprint of such
information.
Please use the Products in accordance with any applicable environmental laws and regulations,
such as the RoHS Directive. For more details, including RoHS compatibility, please contact a
ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting
non-compliance with any applicable laws or regulations.
When providing our Products and technologies contained in this document to other countries,
you must abide by the procedures and provisions stipulated in all applicable export laws and
regulations, including without limitation the US Export Administration Regulations and the Foreign
Exchange and Foreign Trade Act.
This document, in part or in whole, may not be reprinted or reproduced without prior consent of
ROHM.
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14)
Datasheet
Part Number SML-D12V8W
Package SML-D12
Unit Quantity 3000
Minimum Package Quantity 3000
Packing Type Taping
Constitution Materials List inquiry
RoHS Yes
SML-D12V8W - Web Page
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