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PESD1CAN Datasheet

Nexperia USA Inc.

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Datasheet

Important notice
Dear Customer,
On 7 February 2017 the former NXP Standard Product business became a new company with the
tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS
semiconductors with its focus on the automotive, industrial, computing, consumer and wearable
application markets
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use
the references to Nexperia, as shown below.
Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/,
use http://www.nexperia.com
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salesaddresses@nexperia.com (email)
Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on
the version, as shown below:
- © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights
reserved
Should be replaced with:
- © Nexperia B.V. (year). All rights reserved.
If you have any questions related to the data sheet, please contact our nearest sales office via e-mail
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Team Nexperia
1. Product profile
1.1 General description
PESD1CAN in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic
package designed to protect two automotive Controller Area Network (CAN) bus lines
from the damage caused by ElectroStatic Discharge (ESD) and other transients.
1.2 Features
nDue to the integrated diode structure only one small SOT23 package is needed to
protect two CAN bus lines
nMax. peak pulse power: PPP = 200 W at tp= 8/20 µs
nLow clamping voltage: VCL = 40 V at IPP =1A
nUltra low leakage current: IRM <1nA
nTyp. diode capacitance matching: Cd/Cd= 0.1 %
nESD protection up to 23 kV
nIEC 61000-4-2, level 4 (ESD)
nIEC 61000-4-5 (surge); IPP = 3 A at tp= 8/20 µs
nSmall SMD plastic package
1.3 Applications
nCAN bus protection
nAutomotive applications
1.4 Quick reference data
PESD1CAN
CAN bus ESD protection diode
Rev. 04 — 15 February 2008 Product data sheet
Table 1. Quick reference data
T
amb
=25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Per diode
VRWM reverse standoff voltage - - 24 V
Cddiode capacitance f = 1 MHz; VR=0V- 1117pF
PESD1CAN_4 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 04 — 15 February 2008 2 of 12
NXP Semiconductors PESD1CAN
CAN bus ESD protection diode
2. Pinning information
3. Ordering information
4. Marking
[1] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
5. Limiting values
[1] Non-repetitive current pulse 8/20 µs exponential decay waveform according to IEC 61000-4-5.
[2] Measured from pin 1 to 3 or 2 to 3.
Table 2. Pinning
Pin Description Simplified outline Symbol
1 cathode 1
2 cathode 2
3 common cathode
12
3
2
1
006aaa155
3
Table 3. Ordering information
Type number Package
Name Description Version
PESD1CAN - plastic surface-mounted package; 3 leads SOT23
Table 4. Marking codes
Type number Marking code[1]
PESD1CAN *AN
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per diode
PPP peak pulse power tp= 8/20 µs[1][2] - 200 W
IPP peak pulse current tp= 8/20 µs[1][2] -3A
Per device
Tjjunction temperature - 150 °C
Tamb ambient temperature 65 +150 °C
Tstg storage temperature 65 +150 °C
PESD1CAN_4 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 04 — 15 February 2008 3 of 12
NXP Semiconductors PESD1CAN
CAN bus ESD protection diode
[1] Device stressed with ten non-repetitive ESD pulses.
[2] Measured from pin 1 to 3 or 2 to 3.
Table 6. ESD maximum ratings
Symbol Parameter Conditions Min Max Unit
Per diode
VESD electrostatic discharge voltage IEC 61000-4-2
(contact discharge)
[1][2] -23kV
MIL-STD-883 (human
body model) -10kV
Table 7. ESD standards compliance
Standard Conditions
Per diode
IEC 61000-4-2; level 4 (ESD) > 15 kV (air); > 8 kV (contact)
MIL-STD-883; class 3 (human body model) > 4 kV
Fig 1. 8/20 µs pulse waveform according to
IEC 61000-4-5 Fig 2. ESD pulse waveform according to
IEC 61000-4-2
t (µs)
0403010 20
001aaa630
40
80
120
IPP
(%)
0
et
100 % IPP; 8 µs
50 % IPP; 20 µs
001aaa631
IPP
100 %
90 %
t
30 ns
60 ns
10 %
tr = 0.7 ns to 1 ns
PESD1CAN_4 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 04 — 15 February 2008 4 of 12
NXP Semiconductors PESD1CAN
CAN bus ESD protection diode
6. Characteristics
[1] Cdis the difference of the capacitance measured between pin 1 and pin 3 and the capacitance measured
between pin 2 and pin 3.
[2] Non-repetitive current pulse 8/20 µs exponential decay waveform according to IEC 61000-4-5.
[3] Measured from pin 1 to 3 or 2 to 3.
Table 8. Characteristics
T
amb
=25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Per diode
VRWM reverse standoff voltage - - 24 V
IRM reverse leakage current VRWM =24V - <1 50 nA
VBR breakdown voltage IR= 5 mA 25.4 27.8 30.3 V
Cddiode capacitance f = 1 MHz; VR=0V - 1117pF
Cd/Cddiode capacitance
matching
[1]
f = 1 MHz; VR=0V - 0.1 - %
f = 1 MHz; VR= 2.5 V - 0.1 - %
VCL clamping voltage [2][3]
IPP =1A --40V
IPP =3A --70V
rdif differential resistance IR= 1 mA - - 300
PESD1CAN_4 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 04 — 15 February 2008 5 of 12
NXP Semiconductors PESD1CAN
CAN bus ESD protection diode
Tamb =25°C
Fig 3. Peak pulse power as a function of exponential
pulse duration; typical values Fig 4. Relative variation of peak pulse power as a
function of junction temperature; typical values
f = 1 MHz; Tamb =25°C
Fig 5. Diode capacitance as a function of reverse
voltage; typical values Fig 6. V-I characteristics for a bidirectional ESD
protection diode
006aaa257
103
102
104
PPP
(W)
10
tp (µs)
110
4
103
10 102
Tj (°C)
0 20015050 100
001aaa193
0.4
0.8
1.2
PPP
0
PPP(25°C)
VR (V)
0252010 155
006aaa258
8
12
4
16
20
Cd
(pF)
0
006aaa676
VCL VBR VRWM VCL
VBR
VRWM
IRM
IRM
IR
IR
IPP
IPP
+
PESD1CAN_4 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 04 — 15 February 2008 6 of 12
NXP Semiconductors PESD1CAN
CAN bus ESD protection diode
Fig 7. ESD clamping test setup and waveforms
006aaa259
50
RZ
CZ
D.U.T.
(Device
Under
Test)
vertical scale = 200 V/div
horizontal scale = 50 ns/div
unclamped +1 kV ESD voltage waveform
(IEC 61000-4-2 network) clamped +1 kV ESD voltage waveform
(IEC 61000-4-2 network)
unclamped 1 kV ESD voltage waveform
(IEC 61000-4-2 network) clamped 1 kV ESD voltage waveform
(IEC 61000-4-2 network)
vertical scale = 200 V/div
horizontal scale = 50 ns/div
vertical scale = 20 V/div; horizontal scale = 50 ns/div
vertical scale = 20 V/div; horizontal scale = 50 ns/div
GND
GND
450
RG 223/U
50 coax
ESD TESTER
IEC 61000-4-2 network
CZ = 150 pF; RZ = 330
4 GHz DIGITAL
OSCILLOSCOPE
10×
ATTENUATOR
GND
GND
PESD1CAN_4 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 04 — 15 February 2008 7 of 12
NXP Semiconductors PESD1CAN
CAN bus ESD protection diode
7. Application information
The PESD1CAN is designed for the protection of two automotive CAN bus lines from the
damage caused by ESD and surge pulses. The device can be used for both, high-speed
CAN bus and fault-tolerant CAN bus protection. The PESD1CAN provides a surge
capability of up to 200 W per line for an 8/20 µs waveform.
Circuit board layout and protection device placement:
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT)
and surge transients. The following guidelines are recommended:
1. Place the PESD1CAN as close to the input terminal or connector as possible.
2. The path length between the PESD1CAN and the protected line should be minimized.
3. Keep parallel signal paths to a minimum.
4. Avoid running protection conductors in parallel with unprotected conductors.
5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and
ground loops.
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Ground planes should be used whenever possible. For multilayer PCBs, use ground
vias.
Fig 8. Typical application: ESD protection of two automotive CAN bus lines
006aaa473
CG
CAN BUS
TRANSCEIVER CAN
bus
PESD1CAN
SPLIT
2
3
1
RT/2
RT/2
CANH
CANL Common
mode choke
(optional)
PESD1CAN_4 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 04 — 15 February 2008 8 of 12
NXP Semiconductors PESD1CAN
CAN bus ESD protection diode
8. Package outline
9. Packing information
[1] For further information and the availability of packing methods, see Section 13.
Fig 9. Package outline SOT23 (TO-236AB)
04-11-04Dimensions in mm
0.45
0.15
1.9
1.1
0.9
3.0
2.8
2.5
2.1 1.4
1.2
0.48
0.38 0.15
0.09
12
3
Table 9. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number Package Description Packing quantity
3000 10000
PESD1CAN SOT23 4 mm pitch, 8 mm tape and reel -215 -235
PESD1CAN_4 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 04 — 15 February 2008 9 of 12
NXP Semiconductors PESD1CAN
CAN bus ESD protection diode
10. Soldering
Fig 10. Reflow soldering footprint SOT23 (TO-236AB)
Fig 11. Wave soldering footprint SOT23 (TO-236AB)
solder resist
occupied area
solder lands
solder paste
Dimensions in mm
sot023
1.00
0.60
(3x)
1.30
12
3
2.50
3.00
0.85
2.70
2.90
0.50 (3x)
0.60 (3x)
3.30
0.85
sot023
4.004.60
2.80
4.50
1.20
3.40
3
21
1.20 (2x)
preferred transport direction during soldering
Dimensions in mm
solder resist
occupied area
solder lands
PESD1CAN_4 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 04 — 15 February 2008 10 of 12
NXP Semiconductors PESD1CAN
CAN bus ESD protection diode
11. Revision history
Table 10. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PESD1CAN_4 20080215 Product data sheet - PESD1CAN_3
Modifications: Section 1.2 “Features”: list item for diode capacitance matching added
Table 8 “Characteristics”:Cd/Cd diode capacitance matching added
PESD1CAN_3 20070521 Product data sheet - PESD1CAN_2
PESD1CAN_2 20051017 Product data sheet - PESD1CAN_1
PESD1CAN_1 20050125 Objective data sheet - -
PESD1CAN_4 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 04 — 15 February 2008 11 of 12
NXP Semiconductors PESD1CAN
CAN bus ESD protection diode
12. Legal information
12.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
12.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
NXP Semiconductors PESD1CAN
CAN bus ESD protection diode
© NXP B.V. 2008. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 15 February 2008
Document identifier: PESD1CAN_4
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
14. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
7 Application information. . . . . . . . . . . . . . . . . . . 7
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
9 Packing information. . . . . . . . . . . . . . . . . . . . . . 8
10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10
12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
12.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
13 Contact information. . . . . . . . . . . . . . . . . . . . . 11
14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

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