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BNX02xH01x Ref Sheet

Murata Electronics North America

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Spec.No. JENF243H-9101C-01 P 1/ 13
MURATA MFG.CO.,LTD.
Reference Onl
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SMD Block Type EMIFIL ®
BNX02H01 Murata Standard Reference Specification [AEC-Q200]
1.Scope
This reference specification applies to Block Type EMIFIL® BNX02H01 Series for Automotive Electronics based on
AEC-Q200.
2.Part Numbering
BN X 024 H 01 L
Product ID Type Serial No. Category Features Packaging Code
for Automotive Electronics(L :Taping(φ178mm reel) / K :Taping(φ330mm reel) / B :Bulk)
3.Rating
Customer’s
Part Number Part Number Capacitance Rated
Voltage
Withstanding
Voltage
Rated
Current
DC
Resistance
Insulation
Resistance
Insertion
Loss
Voltage
Drop
ESD
Rank
2:2kV
BNX024H01L 4.7F
±15%
50V
(DC)
125V
(DC)
20A
(DC)
0.43m
±0.20m
100M
min.
35dB min.
(100kHz to
1GHz)
45 mV
max.
2
BNX024H01K
BNX024H01B
BNX025H01L 10F
±15%
25V
(DC)
62.5V
(DC)
20A
(DC)
0.43m
±0.20m
50M
min.
35dB min.
(50 kHz to
1GHz)
45mV
max.
BNX025H01K
BNX025H01B
BNX026H01L 10F
±10
20%
50V
(DC)
125V
(DC)
20A
(DC)
0.43m
±0.20m
10M
min.
35dB min.
(50KHz to
1GHz)
45mV
max.
BNX026H01K
BNX026H01B
BNX027H01L 22F
±20
40%
16V
(DC)
40V
(DC)
20A
(DC)
0.43m
±0.20m
1M
min.
35dB min.
(40KHz to
1GHz)
45mV
max.
BNX027H01K
BNX027H01B
Rated current is derated according to operating temperature.
Operating Temperature : - 55 °C to + 125 °C Storage Temperature : - 55 °C to + 125 °C
4.Standard Testing Condition
<Unless otherwise specified> <In case of doubt>
Temperature : Ordinary Temp. 15 °C to 35 ºC Temperature : 20 °C ± 2 °C
Humidity : Ordinary Humidity 25 %(RH) to 85 %(RH) Humidity : 60 %(RH) to 70 %(RH)
Atmospheric pressure : 86kPa to 106kPa
15
85 125
1
Operating Temperature (°C)
Rated Current (A)
20
Spec.No. JENF243H-9101C-01 P 2/ 13
MURATA MFG.CO.,LTD.
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5.Style and Dimensions
Coplanarity 0.10mm max.
Equivalent Circuit
L1 L3
L2 C1
C2
Unit Mass(Typical value)
0.86g
6.Marking
Filter shall be marked as follows.
(1) Murata Mark :
(2) Part Number : BNX024H01:( BNX024
BNX025H01:( BNX025
BNX026H01:( BNX026
BNX027H01:( BNX027
(3) Polarity Marking :
B Bias
CB Circuit + Bias
PSG Power Supply Ground
CG Circuit Ground
Spec.No. JENF243H-9101C-01 P 3/ 13
MURATA MFG.CO.,LTD.
Reference Onl
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7.Electrical Performance
No. Item Specification Test Method
7.1 Insertion
Loss
Meet item 3.
Insertion Loss = -20 log E1/E0 (dB)
E0 : Level without FILTER (short)
E1 : Level with FILTER
Measuring Equipment : Agilent 8753C or the equivalent
7.2 Capacitance Measured by the following condition between
Terminal ①② and ③④. (see item 5.)
Frequency : 1 ± 0.1kHz (except BNX027)
120 ± 24kHz (BNX027)
Voltage : 1 V(rms) max. (except BNX027)
0.5±0.1V(rms) (BNX027)
Measuring Equipment :
HP 4278A or the equivalent (except BNX027)
HP 4284A or the equivalent (BNX027)
7.3 DC
Resistance
Measured by the way of 4 terminal method between
and and between and . (see item 5.)
7.4 Insulation
Resistance
Measured at DC rated voltage between terminal
①② and ③④. (see item 5.)
Time : 60 s max
Charging current : 50 mA max.
Measuring Equipment : R8340A or the equivalent
7.5 Withstanding
Voltage
Filter shall be no failure. Withstanding voltage shall be applied between terminal
and ③④. (see item 5.)
Test Voltage : BNX024 125V(DC)
BNX025 62.5V(DC)
BNX026 125V(DC)
BNX027 40V(DC)
Time : 5 ± 1 s
Charging current : 50 mA max.
7.6 Voltage
Drop
Meet item 3. After soldering the part on the test substrate, measure
the voltage with passing the rated current as shown in the
schematic below.
Where the terminals of the part shall be connected as
follows:
Referring to the terminal No. shown in item 5,
connect terminal No. and by soldering
copper wire with diameter more than 1mm /
length less than 6mm.
Then connect terminal No. as (1) and terminal
No. as (2) the measurement circuit as
mentioned above.
The probe for measuring the voltage shall be
touched on the solder fillet of ①③.
A
V
Specimen
(1)
(2)
50
Ω
10dB
E
Method of measurement based on MIL- STD- 220
50
Ω
SG
50
Ω
50
Ω
10dB
Attenuator
Balun
Specimen Attenuator
(1) (2)
(3) (4)
Spec.No. JENF243H-9101C-01 P 4/ 13
MURATA MFG.CO.,LTD.
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8. Q200 Requirement
8-1. Performance (based on Table 13 for Ferrite EMI SUPPRESSORS/FILTERS)
AEC-Q200 Rev.D issued June. 1 2010
AEC-Q200 Murata Specification / Deviation
No. Stress Test Method
3 High
Temperature
Exposure
(Storage)
1000hours at 125C
Set for 24hours
at room temperature,
then measured.
Meet Table A after testing.
4 Temperature
Cycling
1000cycles(-55C to 125C)
Measurement at 24±2 hours
after test conclusion.
Meet Table A after testing.
5 Destructive
Physical
Analysis
Per EIA469
No electrical tests
Not Applicable
7 Biased
Humidity
1000hours 85C/85%RH.
Apply Maximum rated Voltage.
Measurement at 24+/-2 hours
after test conclusion.
Meet Table B after testing.
8 Operational Life 1000hours at 125C
Apply Maximum rated Voltage.
Measurement at 24+/-2 hours
after test conclusion.
Meet Table A after testing.
9 External Visual Visual inspection No abnormalities
10 Physical
Dimension
Meet ITEM 4
(Style and Dimensions)
No defects
12 Resistance
to Solvents
Per MIL-STD-202 Method 215 Not Applicable
13 Mechanical
Shock
Per MIL-STD-202 Method 213
Figure 1 of Method 213.
Condition
F(1500g's/0.5ms/Half sine)
Three times each 6 direction.
Meet Table C after testing.
14 Vibration 5g's for 20 minutes, 12cycles
each of 3 oritentations
Osscillation Frequency :
10-2000Hz.
Meet Table C after testing.
15 Resistance
to Soldering
Heat
No heating.
260C +/- degree C
Immersion time 10s
Pre-heating: 150C+/-5C, 60s+/-5s
Meet Table D after testing.
17 ESD
Per AEC-Q200-002 Meet Table C after testing.
ESD Rank: Refer to Item 3. Rating.
18 Solderbility Per J-STD-002 Method b : Not Applicable
75% of the terminations is to be soldered.
19 Electrical
Characterization
Measured :Capacitance No defects
20 Flammability Per UL-94 Not Applicable
21 Board Flex Epoxy-PCB(1.6mm)
Deflection 2mm(min)
60s minimum holding time
Meet Table D after testing.
22 Terminal
Strength
Per AEC-Q200-006
A force of 17.7N
for 60sec
17.7N for 60sec
No defects
30 Electrical
Transient
Conduction
Per ISO-7637-2 Not Applicable
Spec.No. JENF243H-9101C-01 P 5/ 13
MURATA MFG.CO.,LTD.
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Table A
Appearance No damaged
Capacitance Change Within +/-12.5% (BNX024/BNX025)
Within +/-15% (BNX026/BNX027)
I.R.
10M min. (BNX024)
5M min. (BNX025)
1M min. (BNX026)
0.1M min. (BNX027)
Table B
Appearance No damaged
Capacitance Change Within +/-12.5% (BNX024/BNX025)
Within +/-15% (BNX026/BNX027)
I.R.
5M min. (BNX024)
2.5M min. (BNX025)
1M min. (BNX026)
0.1M min. (BNX027)
Table C
Appearance No damaged
Capacitance Change Within +/-15%
I.R.
100M min. (BNX024)
50M min. (BNX025)
10M min. (BNX026)
1M min. (BNX027)
Withstanding Voltage No damaged
Table D
Appearance No damaged
Capacitance Change Within +/-7.5% (BNX024/BNX025)
Within +/-15% (BNX026/BNX027)
I.R.
100M min. (BNX024)
50M min. (BNX025)
10M min. (BNX026)
1M min. (BNX027)
Withstanding Voltage No damaged
<About BNX026,BNX027>
· Initial values: measured after heat treatment (150± 010 °C, 1hour) and exposure in the room condition for 24±2 hours.
·Values After Testing:measured after heat treatment (150± 010 °C, 1hour) and exposure in the room condition for 24±2 hours.
Spec.No. JENF243H-9101C-01 P 6/ 13
MURATA MFG.CO.,LTD.
Reference Onl
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0.1
0
Sprocket Hole
Direction of feed (in:mm)
9.4±0.1
12.4±0.1
12.0±0.1
φ
1.5±
0.5
0
φ
1.5±
1.75±0.1
11.5±0.1
0.3±0.1
3.3±0.1
24.0±0.2
4.0×10pich=40.0±0.2
4.0±0.1
2.0±0.1 Cavity
3.6±0.1
4.0×10pitch=40.0±0.2
9.Insertion Loss Characteristics (I.L.) (Typ.)
10. Specification of Packaging
10.1 Appearance and Dimensions (24mm-wide plastic tape)
(1) plastic tape
*Dimension of the Cavity is measured at the bottom side.
BNX024H01
BNX025H01BNX026H01
BNX027H01
Spec.No. JENF243H-9101C-01 P 7/ 13
MURATA MFG.CO.,LTD.
Reference Onl
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160 min. 210 min
.
Empty tape
190 min
.
Leader
Direction of feed
Trailer
2.0±0.5
φ
13.0±0.2
φ
21.0±0.8
φ
178±0.5
φ
62±
24.8
26.5
2.2±0.1
(in:mm)
0.5
Cover tape
Label
BNX024
BNX024
BNX024
MURATA lo
g
o mark
(2)Direction of the product
10.2 Specification of Taping
(1) Packing quantity (standard quantity)
φ178mm reel : 400 pcs. / reel
φ330mm reel : 1500 pcs. / reel
(2) Packing Method
Products shall be packaged in the cavity of the plastic tape and sealed with cover tape.
(3) Spliced point
The cover tape have no spliced point.
(4) Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
10.3 Pull Strength of Plastic Tape and Cover Tape
Plastic tape
10N min.
Cover tape
10.4 Peeling off force of Cover tape
0.2N to 0.7N (minimum value is typical)
Speed of Peeling off : 300 mm / min
10.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (top tape and empty tape) and trailer-tape (empty tape) as follows.
[ Packaging Code:L (φ178mm reel) ]
165 to 180 degree FCover tape
Plastic tape
Spec.No. JENF243H-9101C-01 P 8/ 13
MURATA MFG.CO.,LTD.
Reference Onl
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160 min. 210 min
.
Empty tape
190 min
.
Leader
Direction of feed
Trailer
2.0±0.5
φ
13.0±0.2
φ
21.0±0.8
φ
330±2.0
φ
100±
0.2
(in:mm)
1.0
Cover tape
25.5±0.5
Label
[ Packaging Code:K (φ330mm reel) ]
10.6 Marking for reel
Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity, etc
1) « Expression of Inspection No. » □□ OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O,N,D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking » ROHS – Y ()
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
10.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS discrimination(2) , Quantity , etc
10.8 Specification of Outer Case
Reel
Outer Case Dimensions
(mm) Standard Reel Quantity
in Outer Case (Reel)
W D H
φ178mm 186 186 93 3
φ330mm 340 340 85 2
Above Outer Case size is typical. It depends on a quantity of an order.
11. ! Caution
11.1 Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the performance, such as
insulation resistance may result from the use.
(1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where dust rises.
(4) in the atmosphere where rapidly thermal change occurs.
W
D
Label
H
Spec.No. JENF243H-9101C-01 P 9/ 13
MURATA MFG.CO.,LTD.
Reference Onl
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11.2.Direction of mounting
Please make sure of the direction of mounting and connect to the circuit properly.
As shown in the equivalent circuit shown in item 5, this product has a directionality.
Wrong connection to the circuit may cause open/short circuit of the part, burnout and serious accidents.
11.3.Caution (Rating)
< Self-heating >
Though this product has a large rated current,following attention should be paid.
(1) Do not use this product beyond the ratings such as rated voltage and rated current/derating condition.
Then burnout may occurred by self-heating.
(2)After installing this product in your product, please make sure of the self-heating with the rated current.
11.4. Attention regarding product's lay out
< Attention regarding the heat generated by other products >
Please provide special attention when mounting products in close proximity to other products that radiate heat.
Failure to follow the above cautions may result, worst case, in a short circuit and cause fuming or firing when the
product is used.
11.5. Fail-safe
Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused
by the abnormal function or the failure of our product.
11.6.ESD
ESD to this product, exceeding condition of IEC61000-4-2 with 30kV, may cause short circuit and fuming or firing.
11.7.Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party’s life,body or property.
(1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment
(5)Medical equipment (6)Transportation equipment(trains,ships,etc.) (7)Traffic signal equipment
(8)Disaster prevention / crime prevention equipment (9)Data-processing equipment
(10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
12.Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
12.1. Flux and Solder
Flux Use rosin-based flux, Do not use highly acidic flux (with chlorine content
exceeding 0.2(wt)%).
Do not use water soluble flux.
Solder Use Sn-3.0Ag-0.5Cu solder
Other flux (except above) Please contact us for details, then use.
Spec.No. JENF243H-9101C-01 P 10/ 13
MURATA MFG.CO.,LTD.
Reference Onl
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12.2. Note for Assembling
<Exclusive Use of Reflow Soldering>
When installing by the flow soldering, the degradation of the insulation resistance sometimes occurs.
Products can only be soldered with reflow.
The use in flow soldering be reserved.
< Thermal Shock >
Pre-heating should be in such a way that the temperature difference between solder and products
surface is limited to 100 °C max. Also cooling into solvent after soldering should be in such a way
that the temperature difference is limited to 100 °C max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
12.3. Attention Regarding P.C.B. Bending
The following shall be considered when designing P.C.B.'s and laying out products.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
Products direction
Products shall be locatedin the sideways
direction (Length:a<b) to the mechanical
stress.
(2) Products location on P.C.B. near seam for separation.
Products (A,B,C,D) shall be located carefully
so that products are not subjected to the
mechanical stress due to warping the board.
Because they may be subjecte the mechanical
stress in order of A > C > B D.
12.4. Attention Regarding P.C.B. Design
< The Arrangement of Products >
P.C.B. shall be designed so that products are
far from the portion of perforation.
The portion of perforation shall be designed
as narrow as possible, and shall be designed
so as not to be applied the stress in the
case of P.C.B. separation.
Products shall not be arranged on the line
of a series of holes when there are big
holes in P.C.B.
(Because the stress concentrate on the
line of holes.)
< Products Placing >
Support pins shall be set under P.C.B .
to prevent causing a warp to P.C.B.
during placing the products on the other
side of P.C.B.
Seam
Slit
AD
BC
b
a
Lengh:a<b
Poor example
Good example
b
a
Product
P.C.B.
Hole
×
Pick up nozzle
P.C.B.
Support pin
×
×
P.C.B.
Portion of
Perforation
Portion of
Perforation
Product
Spec.No. JENF243H-9101C-01 P 11/ 13
MURATA MFG.CO.,LTD.
Reference Onl
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< P.C.B. Separation >
P.C.B. shall not be separated with hand.
P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.
12.5. Standard Land Dimensions
0
2.3
2.8
5.3
6.2
7.1
9.6
9.9
10.2
12.5
03.8 5.8 10.3 13.2 13.7 17.5
Copper foil pattern
Copper foil pattern+Resist
Etchedarea
Through hole
in
mm
CG
CG
CG
CB
B
PSG
(1)Design the land pads for this part as shown above on both side printed circuit board ( or a multiple layered
substrate ).
(2) This product is designed to meet large current.
Please design PCB pattern which is connected to this product not to become too hot by applied large current.
(3)Ground area of CG should be connected to ground layer on the other side (or ground layer of multiple layered
substrate) with through holes as shown above.
It is recommended to take the ground area as wide as possible.
(4)It is recommended to use the connection to the ground layer with through holes and the ground layer to be circuit
board wide.
(5)Even in case that it isn't possible to use a both side printed circuit board ( or a multiple layered substrate ), the land
pads for CG should be designed as wide as possible.
12.6. Reflow Soldering
1) Solder paste printing for reflow soldering
· Standard thickness of solder paste should be 150 to 200 µm.
Incidentally, depending on the reflow condition and the way of heat conduction, the solder would not wet up
the terminal, being possible to lead to not enough connection between terminals and lands on the circuit
board / open circuit in the circuit board. In case of use, always evaluate this part in your products with actual
use condition.
· For the solder paste printing pattern, use standard land dimensions.
· For the resist and copper foil pattern, use standard land dimensions.
· Use Sn-3.0Ag-0.5Cu solder
Spec.No. JENF243H-9101C-01 P 12/ 13
MURATA MFG.CO.,LTD.
Reference Onl
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2) Soldering Conditions
Standard soldering profile and the limit soldering profile is as follows.
The excessive soldering conditions may cause leaching of the electrode and/or resulting in the deterioration
of product quality.
Standard Profile Limit Profile
Pre-heating 150°C ~ 180°C , 90s ± 30s
Heating above 220°C , 30s ~ 60s above 230°C , 60s max.
Peak temperature 25C ± 3°C 260°C , 10s
Cycle of reflow 2 times 2 times
12.7. Reworking with Soldering iron
· The following conditions shall be strictly followed when using a soldering iron.
Soldering iron : 100W max.
Tip temperature/ Soldering time : 450°C ± 5°C, 5s
Note : Do not touch the products directly with the tip of the soldering iron.
12.8. Cleaning Conditions
Don't cleaning product due to non-waterproof construction.
12.9Moisture-proof coat material
Moisture–proof coating is made on inner parts of this product.
The Moisture–proof coat material might appear on the surface of product,which doesn’t affect on the product
performance.
12.10. Resin coating
The capacitance value may change and/or it may affect on the product's performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to
use, please make the reliability evaluation with the product mounted in your application set.
1211. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or
twisting to the substrate when cropping the substrate, inserting and removing a connector from the
substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
Limit Profile
Standard Profile
90s±30s
230°C
260°C
245°C±3°C
220°C
30s
60s
60s max.
180
150
Temp.
Time.(s)
C)
Spec.No. JENF243H-9101C-01 P 13/ 13
MURATA MFG.CO.,LTD.
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12.12 Storage condition
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment condition
· Products should be stored in the warehouse on the following conditions.
Temperature : - 10 °C to + 40 °C
Humidity : 15 % to 85% relative humidity No rapid change on temperature and humidity
· Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of
electrode, resulting in poor solderability.
· Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
· Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
· Products should be stored under the airtight packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or
mechanical shock.
13. ! Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the agreed specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.

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