(6) Amount of Adhesive
If too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderability.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
become detached during flow soldering. Apply the
adhesive in accordance with the conditions shown in
Typical Application Amount (in:mg)
The following conditions should be observed when
cleaning chip inductors (chip coils):
(1) Cleaning Temperature: 60°C max. (40°C max. for
alcohol cleaning agents)
Output: 20W/l max.
Duration: 5 minutes max.
Frequency: 28 to 40kHz
Care should be taken not to cause resonance of the
PCB and mounted products.
(3) Cleaning agent
The following cleaning agents have been tested on
individual components. Evaluation in complete assembly
should be done prior to production.
(a) Alcohol cleaning agents
Isopropyl alcohol (IPA)
(b) Aqueous cleaning agents
Pine Alpha ST-100S
LQH66S series: Aqueous agents should not be used
because they may cause quality deterioration or
damage to appearance.
(4) Ensure that flux residue is completely removed.
Component should be thoroughly dried after aqueous
agents have been removed with deionized water.
For additional cleaning methods, please contact Murata.
(5) Amount of Solder Paste
Excessive solder causes electrode corrosion, while
insufficient solder causes low electrode bonding strength.
Adjust the amount of solder paste as shown on the right
so that solder is applied.
" Guideline of solder paste thickness
· LQW15C: 50 to 100μm
· LQM, LQW18C, LQH2MC/2HP, LQH3NP/32P,
LQH44P/5BP/55P: 100 to 150μm
· LQH31C/32C, LQH43C/43P, LQH55D,
LQH66S: 200 to 300μm
Inductor for Power Lines (Power Inductor) Soldering and Mounting