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BNX02x-01x Ref Sheet

Murata Electronics North America

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Spec.No. JENF243H-0008M-01 P 1/ 14
MURATA MFG.CO.,LTD.
Reference Only
SMD Block Type EMIFIL ® BNX02-01 Reference Specification
1.Scope
This reference specification applies to SMD Block Type EMIFIL®.
2.Part Numbering
BN X 022 -01 L
Product ID Type Serial No. Features Packaging Code
(L :Taping(
φ178mm reel) / K :Taping(φ330mm reel) / B :Bulk)
3.Rating
Customer’s
Part Number Part Number Capacitance Rated
Voltage
Withstanding
Voltage
Rated
Current
DC
Resistance
Insulation
Resistance Insertion Loss Voltage
Drop
BNX022-01L
1.0µF±15% 50V
(DC)
125V
(DC)
20A
(DC)
0.43mΩ
±0.20mΩ
500MΩ
min.
35dB min.
(1MHz to
1GHz)
30 mV
max.
BNX022-01K
BNX022-01B
BNX023-01L
1.0µF±15% 100V
(DC)
250V
(DC)
20A
(DC)
0.43m
±0.20m
500M
min.
35dB min.
(1MHz to
1GHz)
45mV
max.
BNX023-01K
BNX023-01B
BNX028-01L
47μ20
50% 16V
(DC)
40V
(DC)
20A
(DC)
0.43m
±0.20m
1.1M
min.
35dB min.
30KHz
1GHz
45mV
max.
BNX028-01K
BNX028-01B
BNX029-01L
100μ20
50% 6.3V
(DC)
15.8V
(DC)
20A
(DC)
0.43m
±0.20m
0.5M
min.
35dB min.
15KHz
1GHz
45mV
max.
BNX029-01K
BNX029-01B
Rated current is derated according to operating temperature.
BNX022-01
BNX023-01
BNX029-01
Operating Temperature : - 40 °C to + 125 °C (BNX022-01/ BNX023-01/ BNX029-01)
- 40 °C to + 105 °C (
BNX028-01
Storage Temperature : - 55 °C to + 125 °C
4.Standard Testing Condition
<Unless otherwise specified> <In case of doubt>
Temperature : Ordinary Temp. 15 °C to 35 ºC Temperature : 20 °C ± 2 °C
Humidity : Ordinary Humidity 25 %(RH) to 85 %(RH) Humidity : 60 %(RH) to 70 %(RH)
Atmospheric pressure : 86kPa to 106kPa
15
85 125
1
Operating Temperature (°C)
Rated Current (A)
BNX028-01
15
85 125
1
Operating Temperature (°C)
Rated Current (A)
65 105
20
20
Spec.No. JENF243H-0008M-01 P 2/ 14
MURATA MFG.CO.,LTD.
Reference Only
5.Style and Dimensions
Coplanarity 0.10mm max
Equivalent Circuit
L1 L3
L2 C1
C2
Unit Mass (Typical value)
0.80g
6.Marking
Filter shall be marked as follows.
(1) Murata Mark :
(2) Part Number : BNX022-01:( BNX022
BNX023-01:( BNX023
BNX028-01:( BNX028
BNX029-01:( BNX029
(3) Polarity Marking :
B Bias
CB Circuit + Bias
PSG Power Supply Ground
CG Circuit Ground
Spec.No. JENF243H-0008M-01 P 3/ 14
MURATA MFG.CO.,LTD.
Reference Only
7.Electrical Performance
No. Item Specification Test Method
7.1 Insertion
Loss
Meet item 3.
Insertion Loss = -20 log E1/E0 (dB)
E0 : Level without FILTER (short)
E1: Level with FILTER
7.2 Capacitance Measured by the following condition between
Terminal ①② and ③④. (see item 5.)
Frequency : 1 ± 0.1kHzBNX022/BNX023
120±24Hz (BNX028/BNX029)
Voltage : 1 V(rms) max. BNX022/BNX023
0.5±0.1V(rms). BNX028/BNX029
Measuring Equipment : Agilent4278A or the
equivalentBNX022/BNX023
Agilent4284A or the equivalentBNX028/BNX029
7.3 DC
Resistance
Measured by the way of 4 terminal method between
and and between and . (see item 5.)
7.4 Insulation
Resistance
Measured at DC rated voltage between terminal
①② and ③④. (see item 5.)
Time : 60 s max
Charging current : 50 mA max.
Measuring Equipment : R8340A or the equivalent
7.5 Withstanding
Voltage
Filter shall be no failure. Withstanding voltage shall be applied between
terminal ①② and ③④. (see item 5.)
Test Voltage : BNX022-01 125V(DC)
BNX023-01 250 V(DC)
BNX028-01 40 V(DC)
BNX029-01 15.8 V(DC)
Time : 5 ± 1 s
Charging current : 50 mA max.
7.6 Voltage
Drop
Meet item 3. After soldering the part on the test substrate,
measure the voltage with passing the rated current
as shown in the schematic below.
Where the terminals of the part shall be connected
as follows:
Referring to the terminal No. shown in item 5,
connect terminal No. and by soldering
copper wire with diameter more than 1mm /
length less than 6mm.
Then connect terminal No. as (1) and terminal
No. as (2) the measurement circuit as
mentioned above.
The probe for measuring the voltage shall be
touched on the solder fillet of ①③.
A
V
Specimen
(1)
(2)
50
Ω
10dB
E
Method of measurement based on MIL- STD-220
50
Ω
SG
50
Ω
50
Ω
10dB
Attenuator
Balun
Specimen Attenuator
(1) (2)
(3) (4)
Spec.No. JENF243H-0008M-01 P 4/ 14
MURATA MFG.CO.,LTD.
Reference Only
8.Mechanical Performance
No. Item Specification Test Method
8.1 Appearance and
Dimensions
Meet item 5. Visual Inspection and measured with Micrometer
caliper and Slide Caliper.
8.2 Marking Meet item 5. Visual Inspection
8.3 Reflow
Solderability
Appropriate solder fillet is formed. It shall be soldered with the Standard Profile condition as
shown No.13.6(2) Soldering Condition.
thickness of solder paste : 150 to 200 µm
Land dimension : see No.13.5.
8.4 Resistance to
soldering iron
Meet Table 1.
Table 1
Soldering iron : 100 W max.
Tip Temperature : 450 °C ± 5 °C
Soldering Time : 5 s , 2 Times
Do not touch the products directly with the tip of the
soldering iron.
<About BNX028,BNX029>
· Initial values: measured after heat treatment (15010 °C,
1hour) and exposure in the room condition for 24±2 hours.
·Values After Testing:measured after heat treatment (150±
010 °C, 1hour) and exposure in the room condition for 24±2
hours.
8.5 Bending
Strength
It shall be soldered on the glass-epoxy substrate.
(100mm×40mm×1.6mm)
Deflection : 2 mm
Keeping Time : 30 s
Speed : 0.5 mm/s
<About BNX028,BNX029>
· Initial values: measured after heat treatment (15010 °C,
1hour) and exposure in the room condition for 24±2 hours.
·Values After Testing:measured after heat treatment (150±
010 °C, 1hour) and exposure in the room condition for 24±2
hours.
8.6 Drop Meet Table 2.
Table 2
It shall be dropped on concrete or steel board.
Method : free fall
Height : 1 m
The Number of Time : 10 times
<About BNX028,BNX029>
· Initial values: measured after heat treatment (15010 °C,
1hour) and exposure in the room condition for 24±2 hours.
·Values After Testing:measured after heat treatment (150±
010 °C, 1hour) and exposure in the room condition for 24±2
hours.
45
R230
F
Deflection
45 Product
Pressure jig
Appearance No damaged
Cap.Change BNX022 within
±7.5%
BNX023
BNX028 within
±15%
BNX029
I.R. meet item 3
Dielectric
Strength No failure
Appearance No damaged
Cap.Change within ±15%
I.R. meet item 3
Dielectric
Strength No failure
Spec.No. JENF243H-0008M-01 P 5/ 14
MURATA MFG.CO.,LTD.
Reference Only
No. Item Specification Test Method
8.7 Vibration Meet Table 2.
It shall be soldered on the glass-epoxy substrate.
Oscillation Frequency : 10 to 2000 to 10Hz for
20 minutes
Total amplitude 3.0 mm or Acceleration amplitude 196 m/s2
whichever is smaller.
Time : A period of 3 hours in each of 3 mutually
perpendicular directions. (Total 9 hours)
<About BNX028,BNX029>
· Initial values: measured after heat treatment (15010 °C,
1hour) and exposure in the room condition for 24±2 hours.
·Values After Testing:measured after heat treatment (150±
010 °C, 1hour) and exposure in the room condition for 24±2
hours.
8.8 Shock It shall be soldered on the glass-epoxy substrate.
Acceleration : 14700 m/s2
Normal duration: 0.5 ms
Waveform : Half-sine wave
Direction : 6 direction
Testing Time : 3 times for each direction
<About BNX028,BNX029>
· Initial values: measured after heat treatment (15010 °C,
1hour) and exposure in the room condition for 24±2 hours.
·Values After Testing:measured after heat treatment (150±
010 °C, 1hour) and exposure in the room condition for 24±2
hours.
9.Environmental Performance (It shall be soldeared on the substrate.)
No. Item Specification Test Method
9.1 Heat
Shock
BNX022/BNX023:Meet Table 1.
BNX028/BNX029:Meet Table 3.
1 Cycle
1 step : -55°C(+0°C,-3°C) / 30 min. (+3,-0) min.
2 step : Room Temperature / within 0.5 min.
3 step :
125(+3°C,-0°C) / 30 min. (+3,-0) min.
(for BNX028: 105(+3°C,-0°C) / 30 min. (+3,-0) min.)
4 step : Room Temperature / within 0.5 min.
Total cycles
BNX022 1000cycles
BNX023
BNX028
BNX029
100cycles
Then measure values after exposure in the room
condition for 48 ± 4 hours.
<About BNX028,BNX029>
· Initial values: measured after heat treatment (150± 010 °C,
1hour) and exposure in the room condition for 24±2 hours.
·Values After Testing:measured after heat treatment (150±
010 °C, 1hour) and exposure in the room condition for 24±2
hours.
Spec.No. JENF243H-0008M-01 P 6/ 14
MURATA MFG.CO.,LTD.
Reference Only
No. Item Specification Test Method
9.2 Humidity
Life
Meet Table 3.
Table 3
Temperature : 60 ± 2 °C
Humidity : 90 95 %(RH)
Voltage : Rated Voltage
Time : 1000 h (+ 48h , - 0h)
Then measure values after exposure in the room condition
for 48 ± 4 hours.
<About BNX028,BNX029>
· Initial values: measured after heat treatment (150± 010 °C,
1hour) and exposure in the room condition for 24±2 hours.
·Values After Testing:measured after heat treatment (150±
010 °C, 1hour) and exposure in the room condition for 24±2
hours.
Humidity
Life
Temperature : 85 ± 2 °C
Humidity : 80 85 %(RH)
Voltage : Rated Voltage
Time : 1000 h (+ 48h , - 0h)
Then measure values after exposure in the room condition
for 48 ± 4 hours.
<About BNX028,BNX029>
· Initial values: measured after heat treatment (150± 010 °C,
1hour) and exposure in the room condition for 24±2 hours.
·Values After Testing:measured after heat treatment (150±
010 °C, 1hour) and exposure in the room condition for 24±2
hours.
9.3 Heat Life
Meet Table 4.
Table 4
Temperature : 125 ± 2 °C
Voltage : Rated Voltage × 2
Time : 1000 h (+ 48h , - 0h)
Then measure values after exposure in the room condition
for 48 ± 4 hours.
<About BNX028,BNX029>
· Initial values: measured after heat treatment (150± 010 °C,
1hour) and exposure in the room condition for 24±2 hours.
·Values After Testing:measured after heat treatment (150±
010 °C, 1hour) and exposure in the room condition for 24±2
hours.
Appearance No damaged
Cap.Change BNX022 within
±12.5%
BNX023
BNX028 within
±15%
BNX029
I.R. BNX022
50MΩ
min.
BNX023
BNX028 0.11M Ω
min.
BNX029 0.05MΩ
min.
Appearance No damaged
Cap.Change BNX022 within
±12.5%
BNX023
BNX028 within
±15%
BNX029
I.R. BNX022
25MΩ
min.
BNX023
BNX028 0.11M Ω
min.
BNX029 0.05MΩ
min.
Spec.No. JENF243H-0008M-01 P 7/ 14
MURATA MFG.CO.,LTD.
Reference Only
10.Insertion Loss Characteristics (I.L.) (Typ.)
11. Specification of Packaging
11.1 Appearance and Dimensions (24mm-wide plastic tape)
(1) plastic tape
(in:mm)
*Dimension of the Cavity is measured at the bottom side.
BNX022-01BNX023-01
BNX028-01
BNX029-01
0.1
0
Sprocket Hole
Direction of feed (in:mm)
9.4±0.1
12.4±0.1
12.0±0.1
φ
1.
0.5
0
φ
1.5±
1.75±0.1
11.5±0.1
0.3±0.1
3.3±0.1
24.0±0.2
4.0×10pich=40.0±0.2
4.0±0.1
2.0±0.1 Cavity
T
T:3.5±0.1BNX022/BNX023
3.6±0.1BNX028/BNX029
Spec.No. JENF243H-0008M-01 P 8/ 14
MURATA MFG.CO.,LTD.
Reference Only
(2)Direction of the product
11.2 Specification of Taping
(1) Packing quantity (standard quantity)
φ178mm reel : 400 pcs. / reel
φ330mm reel : 1500 pcs. / reel
(2) Packing Method
Products shall be packaged in the cavity of the plastic tape and sealed with cover tape.
(3) Spliced point
The cover tape have no spliced point.
(4) Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
11.3 Pull Strength of Plastic Tape and Cover Tape
Plastic tape
10N min.
Cover tape
11.4 Peeling off force of Cover tape
0.2N to 0.7N (minimum value is typical)
Speed of Peeling off : 300 mm / min
MURATA logo mark
165 to 180 degree FCover tape
Plastic tape
Spec.No. JENF243H-0008M-01 P 9/ 14
MURATA MFG.CO.,LTD.
Reference Only
160 min. 210 min
.
Empty tape
190 min
.
Leader
Direction of feed
Trailer
2.0±0.5
φ
13.0±0.2
φ
21.0±0.8
φ
178±0.5
φ
62±
24.8
26.5
2.2±0.1
(in:mm)
0.5
Cover tape
Label
160 min. 210 min
.
Empty tape
190 min
.
Leader
Direction of feed
Trailer
2.0±0.5
φ
13.0±0.2
φ
21.0±0.8
φ
330±2.0
φ
100±
0.2
(in:mm)
1.0
Cover tape
25.5±0.5
Label
11.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (top tape and empty tape) and trailer-tape (empty tape) as follows.
[ Packaging Code:L (φ178mm reel) ]
[ Packaging Code:K (φ330mm reel) ]
11.6 Marking for reel
Customer part number, MURATA part number, Inspection number(1), RoHS marking (2), Quantity, etc
1) « Expression of Inspection No. » □□ OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O,N,D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking » ROHS – Y ()
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
Spec.No. JENF243H-0008M-01 P 10/ 14
MURATA MFG.CO.,LTD.
Reference Only
11.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS discrimination(2) , Quantity , etc
11.8 Specification of Outer Case
Reel
Outer Case Dimensions
(mm) Standard Reel Quantity
in Outer Case (Reel)
W D H
φ178mm 186 186 93 3
φ330mm 340 340 85 2
Above Outer Case size is typical. It depends on a quantity of an order.
12. ! Caution
12.1.Direction of mounting
Please make sure of the direction of mounting and connect to the circuit properly.
As shown in the equivalent circuit shown in item 5, this product has a directionality.
Wrong connection to the circuit may cause open/short circuit of the part, burnout and serious accidents.
12.2.Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party’s life,body or property.
(1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment
(5)Medical equipment (6)Transportation equipment(automobiles,trains,ships,etc.) (7)Traffic signal equipment
(8)Disaster prevention / crime prevention equipment (9)Data-processing equipment
(10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
12.3.ESD
ESD to this product, exceeding condition of IEC61000-4-2 with 30kV, may cause short circuit and fuming or firing.
13.Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
13.1. Flux and Solder
Flux Use rosin-based flux, Do not use highly acidic flux (with chlorine content
exceeding 0.2(wt)%).
Do not use water soluble flux.
Solder Use Sn-3.0Ag-0.5Cu solder
Other flux (except above) Please contact us for details, then use.
13.2. Note for Assembling
<Exclusive Use of Reflow Soldering>
When installing by the flow soldering, the degradation of the insulation resistance sometimes occurs.
Products can only be soldered with reflow.
The use in flow soldering be reserved.
< Thermal Shock >
Pre-heating should be in such a way that the temperature difference between solder and products
surface is limited to 100 °C max. Also cooling into solvent after soldering should be in such a way
that the temperature difference is limited to 100 °C max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
W
D
Label
H
Spec.No. JENF243H-0008M-01 P 11/ 14
MURATA MFG.CO.,LTD.
Reference Only
13.3. Attention Regarding P.C.B. Bending
The following shall be considered when designing P.C.B.'s and laying out products.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
Products direction
Products shall be locatedin the sideways
direction (Length:a<b) to the mechanical
stress.
(2) Products location on P.C.B. near seam for separation.
Products (A,B,C,D) shall be located carefully
so that products are not subjected to the
mechanical stress due to warping the board.
Because they may be subjecte the mechanical
stress in order of A > C > B D.
13.4. Attention Regarding P.C.B. Design
< The Arrangement of Products >
P.C.B. shall be designed so that products are
far from the portion of perforation.
The portion of perforation shall be designed
as narrow as possible, and shall be designed
so as not to be applied the stress in the
case of P.C.B. separation.
Products shall not be arranged on the line
of a series of holes when there are big
holes in P.C.B.
(Because the stress concentrate on the
line of holes.)
< Products Placing >
Support pins shall be set under P.C.B .
to prevent causing a warp to P.C.B.
during placing the products on the other
side of P.C.B.
< P.C.B. Separation >
P.C.B. shall not be separated with hand.
P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.
Seam
Slit
AD
BC
b
a
Lengh:a<b
Poor example
Good example
b
a
Product
P.C.B.
Hole
×
Pick up nozzle
P.C.B.
Support pin
×
×
P.C.B.
Portion of
Perforation
Portion of
Perforation
Product
Spec.No. JENF243H-0008M-01 P 12/ 14
MURATA MFG.CO.,LTD.
Reference Only
13.5. Standard Land Dimensions
0
2.3
2.8
5.3
6.2
7.1
9.6
9.9
10.2
12.5
03.8 5.8 10.3 13.2 13.7 17.5
Copper foil pattern
Copper foil pattern+Resist
Etchedarea
Through hole
in
mm
CG
CG
CG
CB
B
PSG
(1)Design the land pads for this part as shown above on both side printed circuit board ( or a multiple layered
substrate ).
(2) This product is designed to meet large current.
Please design PCB pattern which is connected to this product not to become too hot by applied large current.
(3)Ground area of CG should be connected to ground layer on the other side (or ground layer of multiple layered
substrate) with through holes as shown above.
It is recommended to take the ground area as wide as possible.
(4)It is recommended to use the connection to the ground layer with through holes and the ground layer to be circuit
board wide.
(5)Even in case that it isn't possible to use a both side printed circuit board ( or a multiple layered substrate ), the land
pads for CG should be designed as wide as possible.
13.6. Reflow Soldering
(1) Solder paste printing for reflow soldering
· Standard thickness of solder paste should be 150 to 200 µm.
Incidentally, depending on the reflow condition and the way of heat conduction, the solder would not wet up
the terminal, being possible to lead to not enough connection between terminals and lands on the circuit
board / open circuit in the circuit board. In case of use, always evaluate this part in your products with actual
use condition.
· For the solder paste printing pattern, use standard land dimensions.
· For the resist and copper foil pattern, use standard land dimensions.
· Use Sn / Pn = 60 / 40 or Sn-3.0Ag-0.5Cu solder
Spec.No. JENF243H-0008M-01 P 13/ 14
MURATA MFG.CO.,LTD.
Reference Only
(2) Soldering Conditions
Standard soldering profile and the limit soldering profile is as follows.
The excessive soldering conditions may cause leaching of the electrode and/or resulting in the deterioration
of product quality.
Standard Profile Limit Profile
Pre-heating 150°C ~ 180°C , 90s ± 30s
Heating above 220°C , 30s ~ 60s above 230°C , 60s max.
Peak temperature 245°C ± 3°C 260°C , 10s
Cycle of reflow 2 times 2 times
13.7. Reworking with Soldering iron
· The following conditions shall be strictly followed when using a soldering iron.
Pre-heating 150°C,1 min
Tip temperature 450°C max.
Soldering iron output 100W max.
Soldering time 5s
Time 2 times
Note : Do not touch the products directly with the tip of the soldering iron.
13.8. Cleaning Conditions
Don't cleaning product due to non-waterproof construction.
13.9. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the performance,
such as insulation resistance may result from the use.
(1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
13.10. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or
twisting to the substrate when cropping the substrate, inserting and removing a connector from the
substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
Limit Profile
Standard Profile
90s±30s
230°C
260°C
245°C±3°C
220°C
30s
60s
60s max.
180
150
Temp.
Time.(s)
C)
Spec.No. JENF243H-0008M-01 P 14/ 14
MURATA MFG.CO.,LTD.
Reference Only
13.11 Storage condition
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment condition
· Products should be stored in the warehouse on the following conditions.
Temperature : - 10 °C to + 40 °C
Humidity : 15 % to 85% relative humidity No rapid change on temperature and humidity
· Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of
electrode, resulting in poor solderability.
· Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
· Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
· Products should be stored under the airtight packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or
mechanical shock.
14. ! Notes
(1) Please make sure that your product has been evaluated in view of your specifications with our product
being mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.

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