052207 Series Drawing

Molex, LLC

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THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
CURRENT REV DESC: REVISED
EC NO: 600129
DRWN:
YCHEN128
2018/04/11
CHK'D:
KTAKAHASHI
2018/04/12
APPR:
NUKITA
2018/04/13
INITIAL REVISION:
DRWN:
NASANUMA
2012/09/21
APPR:
KMORIKAWA
2013/03/15
THIRD ANGLE PROJECTION
DRAWING SERIES
A3-SIZE
52207
DIMENSION UNITS
SCALE
mm
8:1
GENERAL TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL
±
3.0 °
4 PLACES
±
0.2
3 PLACES
±
0.25
2 PLACES
±
0.3
1 PLACE
±
0 PLACES
±
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
1.0 MM FPC CONN. ZIF R/A
HOUSING ASSY (UPPER CONTACT)
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
DOC TYPE
DOC PART
REVISION
SD-52207-069
PSD
001
C
MATERIAL NUMBER CUSTOMER SHEET NUMBER
SEE TABLE GENERAL MARKET 1 OF 2
FORMAT: master-tb-prod-A3
REVISION: H
DATE: 2018/01/18
DOCUMENT STATUS P1 RELEASE DATE 2018/04/13 03:50:55
6
5
注記(NOTE):
6
3
5
1.材質 MATERIAL
 ハウジング:ポリアミド(PA),ナチュラル(白色),ガラス充填,UL94V-0 
  HOUSING:POLYAMIDE, NATURAL(WHITE), GLASS FILLED, UL94V-0
 アクチュエータ:ポリフェニレンサルファイド(PPS),ナチュラル(茶色),ガラス充填,UL94-V0
  ACTUATOR:POLYPHENYLENE SULFIDE, NATURAL(BROWN), GLASS FILLED, UL94V-0
  ターミナル:リン青銅(t=0.32)
  TERMINAL:PHOSPHOR BRONZE(t=0.32)
  ネイル(補強金具):リン青銅(t=0.25)
  FITTING NAIL:PHOSPHOR BRONZE(t=0.25)
2.めっき仕様 PLATING
 ターミナル TERMINAL
錫銀ビスマスめっき(1.0μm以上)
TIN SILVER BISMUTH PLATING (1.0 MICROMETER MINIMUM)
下地:ニッケルめっき(1.0μm以上)
UNDER PLATE:NICKEL PLATING (1.0 MICROMETER MINIMUM)
 ネイル(補強金具) FITTING NAIL
錫めっき(1.0μm以上)
TIN PLATING (1.0 MICROMETER MINIMUM)
下地:ニッケルめっき(1.0μm以上)
UNDER PLATE:NICKEL PLATING (1.0 MICROMETER MINIMUM
 .C0.3はFPC/FFCの導体部にかからないこと
C0.3 MUST NOT BE OVERLAPED TO PATTERN OF FPC/FFC.
4.エンボステープ梱包時は、アクチュエータがロックした状態とする。
  IN THE PACKAGE, ACTUATOR SHOULD BE LOCKED.
パターン剥離止め用金具
  FITTTING NAIL FOR PREVENTION OF PEELING OF P.C.B. PATTERN.
ソルダーテール半田付け面、及び金具半田付け面の平坦度:0.15mm MAX.
COPLANARITY OF SOLDER TAILS AND FITTING NAILS
TO BE 0.15mm MAX.
7.ELV及びRoHS適合品
ELV AND RoHS COMPLIANT
GENERAL TOLERANCES
(UNLESS SPECIFIED)
10 UNDER ± 0.2
10 OVER 30 UNDER ± 0.25
30 OVER ± 0.3
ANGULAR   ± 3 °
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
38.7 35.2 33 52207-3433 34
34.7 31.2 29 52207-3033 30
33.7 30.2 28 52207-2933 29
32.7 29.2 27 52207-2833 28
31.7 28.2 26 52207-2733 27
30.7 27.2 25 52207-2633 26
29.7 26.2 24 52207-2533 25
28.7 25.2 23 52207-2433 24
27.7 24.2 22 52207-2333 23
26.7 23.2 21 52207-2233 22
25.7 22.2 20 52207-2133 21
24.7 21.2 19 52207-2033 20
23.7 20.2 18 52207-1933 19
22.7 19.2 17 52207-1833 18
21.7 18.2 16 52207-1733 17
20.7 17.2 15 52207-1633 16
19.7 16.2 14 52207-1533 15
18.7 15.2 13 52207-1433 14
17.7 14.2 12 52207-1333 13
16.7 13.2 11 52207-1233 12
15.7 12.2 10 52207-1133 11
14.7 11.2 9 52207-1033 10
13.7 10.2 8 52207-0933 9
12.7 9.2 752207-0833 8
11.7 8.2 6 52207-0733 7
10.7 7.2 552207-0633 6
9.7 6.2 452207-0533 5
8.7 5.2 3 52207-0433 4
7.7 4.2 2 52207-0333 3
CBAEMBOSSED PACKAGE ORDER NO.
オーダー番号
極数
CKT.
CONNECTOR SERIES NO.: 52207-**22
1
A
1
A
2
B
2
B
3
C
3
C
4
D
4
D
5
E
5
E
6
F
6
F
7
7
8
8
9
9
10
10
ケーブル挿入深さ
適合FPC/FFC推奨寸法
マスク厚 :100μm
マスク開口率 :100%
パターン書き込み禁止エリア
(マウント面)
接点部までの嵌合長さ
推奨基板レイアウト
INSERTION DEPTH OF CABLE
(MOUNT SIDE)
APPLICABLE FPC/FFC
RECOMMENDED DIMENSION
RECOMMENDED P.C.BOARD
PATTERN DIMENSION.(REF.)
NO FOOT PRINT AREA
SCREEN THICKNESS :100 MICROMETER
SCREEN OPEN RATIO :100%
LENGTH TO
CONTACT POINT
3
DOCUMENT STATUS P1 RELEASE DATE 2018/04/13 03:50:55
FORMAT: master-tb-prod-A3
REVISION: H
DATE: 2018/01/18
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
CURRENT REV DESC: REVISED
EC NO: 600129
DRWN:
YCHEN128
2018/04/11
CHK'D:
KTAKAHASHI
2018/04/12
APPR:
NUKITA
2018/04/13
INITIAL REVISION:
DRWN:
NASANUMA
2012/09/21
APPR:
KMORIKAWA
2013/03/15
THIRD ANGLE PROJECTION
DRAWING SERIES
A3-SIZE
52207
DIMENSION UNITS
SCALE
mm
5:1
GENERAL TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL
±
3.0 °
4 PLACES
±
0.2
3 PLACES
±
0.25
2 PLACES
±
0.3
1 PLACE
±
0 PLACES
±
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
1.0 MM FPC CONN. ZIF R/A
HOUSING ASSY (UPPER CONTACT)
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
DOC TYPE
DOC PART
REVISION
SD-52207-069
PSD
001
C
MATERIAL NUMBER CUSTOMER SHEET NUMBER
SEE TABLE GENERAL MARKET 2 OF 2
0.3
±
0.05
補強板:ポリイミド
REINFORCE BOARD: POLYMIDE
仕上がり厚さ
THICKNESS
めっき:錫めっき(0.5-1.2μm) 
 下地ニッケル(1-5μm)
PLATING: TIN(0.5-1.2μm)     
NICKEL UNDER(1-5μm)
導体部: 銅箔(35 or 50μm)
COPPER FOIL (35 or 50μm)
接着剤(難燃ポリエステル系)
ADHESIVE(FLAME-RETARDANT
POLYESTER ADHESIVE)
接着剤(難燃ポリエステル系)
ADHESIVE(FLAME-RETARDANT
POLYESTER ADHESIVE)
絶縁テープ:ポリエステル系(25μm)
INSULATING FILM: PET(25μm)
絶縁テープ:ポリエステル系(25μm)
INSULATING FILM: PET(25μm)
0.3
±
0.05
仕上がり厚さ
THICKNESS
接着剤(難燃ポリエステル系)
ADHESIVE(FLAME-RETARDANT
POLYESTER ADHESIVE)
補強板:ポリエステル系
REINFORCE BOARD: PET
カバーレイ : ポリイミド(25μm)
COVER FILM: POLYIMIDE(25μm)
熱硬化接着剤
THERMOSETTING ADHESIVE
ベースフィルム:ポリイミド(25μm)
BASE FILM: POLYIMIDE(25μm)
熱硬化接着剤
THERMOSETTING ADHESIVE
めっき:錫めっき(0.5-1.2μm) 
 下地ニッケル(1-5μm)
PLATING: TIN(0.5-1.2μm)     
NICKEL UNDER(1-5μm)
導体部: 銅箔(35 or 50μm)
COPPER FOIL (35 or 50μm)
熱硬化接着剤
THERMOSETTING ADHESIVE
FFC構成推奨仕様
RECOMMENDED STRUCTURE OF FFC
FPC構成推奨仕様
RECOMMENDED STRUCTURE OF FPC
FPC/FFCについて:
  抜き方向は、導体側から補強板側を推奨致します。
  尚、接着剤の接点部への付着は導通不良の原因になりますので、
  染み出しが無い様お願い致します。
ABOUT FPC/FFC:
RECOMMENDED PUNCHER DIRECTION:
FROM CONDUCTOR SIDE TO STIFFNER SIDE
PLEASE PUT APPROPRIATE AMOUNT OF ADHESIVE ON ADHEREND
BECAUSE THERE IS A POSSIBILITY THAT THE EXTRA ADHESIVE 
CAUSES THE DEFECT IN ELECTRICAL CONTINUITY.
GENERAL TOLERANCES
(UNLESS SPECIFIED)
10 UNDER ± 0.2
10 OVER 30 UNDER ± 0.25
30 OVER ± 0.3
ANGULAR   ± 3 °
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
1
A
1
A
2
B
2
B
3
C
3
C
4
D
4
D
5
E
5
E
6
F
6
F
7
7
8
8
9
9
10
10

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