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MT47H256M8, MT47H128M16, MT47H512M4 Datasheet

Micron Technology Inc.

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Datasheet

DDR2 SDRAM
MT47H512M4 – 64 Meg x 4 x 8 banks
MT47H256M8 – 32 Meg x 8 x 8 banks
MT47H128M16 – 16 Meg x 16 x 8 banks
Features
•V
DD = 1.8V ±0.1V, VDDQ = 1.8V ±0.1V
JEDEC-standard 1.8V I/O (SSTL_18-compatible)
Differential data strobe (DQS, DQS#) option
•4n-bit prefetch architecture
Duplicate output strobe (RDQS) option for x8
DLL to align DQ and DQS transitions with CK
8 internal banks for concurrent operation
Programmable CAS latency (CL)
Posted CAS additive latency (AL)
WRITE latency = READ latency - 1 tCK
Programmable burst lengths: 4 or 8
Adjustable data-output drive strength
64ms, 8192-cycle refresh
On-die termination (ODT)
Industrial temperature (IT) option
• RoHS-compliant
Supports JEDEC clock jitter specification
Options1Marking
Configuration
512 Meg x 4 (64 Meg x 4 x 8 banks) 512M4
256 Meg x 8 (32 Meg x 8 x 8 banks) 256M8
128 Meg x 16 (16 Meg x 16 x 8 banks) 128M16
FBGA package (Pb-free) – x16
84-ball FBGA (11.5mm x 14mm) Rev. A HG
FBGA package (Pb-free) – x4, x8
60-ball FBGA (11.5mm x 14mm) Rev. A HG
FBGA package (Pb-free) – x16
84-ball FBGA (9mm x 12.5mm) Rev. C RT
FBGA package (Pb-free) – x4, x8
60-ball FBGA (9mm x 11.5mm) Rev. C EB
FBGA package (Lead solder) – x16
84-ball FBGA (9mm x 12.5mm) Rev. C PK
Timing – cycle time
1.875ns @ CL = 7 (DDR2-1066) -187E
2.5ns @ CL = 5 (DDR2-800) -25E
2.5ns @ CL = 6 (DDR2-800) -25
3.0ns @ CL = 5 (DDR2-667) -3
Self refresh
– Standard None
Operating temperature
Commercial (0°C TC +85°C) None
Industrial (–40°C TC +95°C;
–40°C TA +85°C)
IT
• Revision :A/:C
Note: 1. Not all options listed can be combined to
define an offered product. Use the Part
Catalog Search on www.micron.com for
product offerings and availability.
2Gb: x4, x8, x16 DDR2 SDRAM
Features
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN 1Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2006 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
Table 1: Key Timing Parameters
Speed Grade
Data Rate (MHz)
tRC (ns)CL = 3 CL = 4 CL = 5 CL = 6 CL = 7
-187E 400 533 800 800 1066 54
-25E 400 533 800 800 n/a 55
-25 400 533 667 800 n/a 55
-3 400 533 667 n/a n/a 55
Table 2: Addressing
Parameter 512 Meg x 4 256 Meg x 8 128 Meg x 16
Configuration 64 Meg x 4 x 8 banks 32 Meg x 8 x 8 banks 16 Meg x 16 x 8 banks
Refresh count 8K 8K 8K
Row address A[14:0] (32K) A[14:0] (32K) A[13:0] (16K)
Bank address BA[2:0] (8) BA[2:0] (8) BA[2:0] (8)
Column address A[11, 9:0] (2K) A[9:0] (1K) A[9:0] (1K)
Part Numbers
Figure 1: 2Gb DDR2 Part Numbers
Example Part Number: MT47H256M8EB-25 :C
Configuration
512 Meg x 4
256 Meg x 8
128 Meg x 16
512M4
256M8
128M16
Speed Grade
tCK = 1.875ns, CL = 7
tCK = 2.5ns, CL = 5
tCK = 2.5ns, CL = 6
tCK = 3ns, CL = 5
-187E
-25E
-25
-3
-
Configuration
MT47H Package Speed
Revision
Revision
:A/:C
:
Industrial Temperature
IT
{
84-Ball 11.5mm x 14mm FBGA
60-Ball 11.5mm x 14mm FBGA
84-Ball 9.0mm x 12.5mm FBGA
60-Ball 9.0mm x 11.5mm FBGA
84-Ball 9.0mm x 12.5mm FBGA (lead solder)
Package
EB
RT
PK
HG
HG
Standard Blank
Power
Note: 1. Not all speeds and configurations are available.
FBGA Part Number System
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the
part number. For a quick conversion of an FBGA code, see the FBGA Part Marking Decoder on Micron’s Web site:
http://www.micron.com.
2Gb: x4, x8, x16 DDR2 SDRAM
Features
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN 2Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2006 Micron Technology, Inc. All rights reserved.
Contents
State Diagram .................................................................................................................................................. 8
Functional Description ..................................................................................................................................... 9
Industrial Temperature ................................................................................................................................. 9
General Notes ............................................................................................................................................ 10
Functional Block Diagrams ............................................................................................................................. 11
Ball Assignments and Descriptions ................................................................................................................. 14
Packaging ...................................................................................................................................................... 18
Package Dimensions ................................................................................................................................... 18
FBGA Package Capacitance ......................................................................................................................... 22
Electrical Specifications – Absolute Ratings ..................................................................................................... 23
Temperature and Thermal Impedance ........................................................................................................ 23
Electrical Specifications – IDD Parameters ........................................................................................................ 26
IDD Specifications and Conditions ............................................................................................................... 26
IDD7 Conditions .......................................................................................................................................... 26
AC Timing Operating Specifications ................................................................................................................ 32
AC and DC Operating Conditions .................................................................................................................... 44
ODT DC Electrical Characteristics ................................................................................................................... 44
Input Electrical Characteristics and Operating Conditions ............................................................................... 45
Output Electrical Characteristics and Operating Conditions ............................................................................. 48
Output Driver Characteristics ......................................................................................................................... 50
Power and Ground Clamp Characteristics ....................................................................................................... 54
AC Overshoot/Undershoot Specification ......................................................................................................... 55
Input Slew Rate Derating ................................................................................................................................ 57
Commands .................................................................................................................................................... 70
Truth Tables ............................................................................................................................................... 70
DESELECT ................................................................................................................................................. 74
NO OPERATION (NOP) ............................................................................................................................... 75
LOAD MODE (LM) ...................................................................................................................................... 75
ACTIVATE .................................................................................................................................................. 75
READ ......................................................................................................................................................... 75
WRITE ....................................................................................................................................................... 75
PRECHARGE .............................................................................................................................................. 76
REFRESH ................................................................................................................................................... 76
SELF REFRESH ........................................................................................................................................... 76
Mode Register (MR) ........................................................................................................................................ 76
Burst Length .............................................................................................................................................. 77
Burst Type .................................................................................................................................................. 78
Operating Mode ......................................................................................................................................... 78
DLL RESET ................................................................................................................................................. 78
Write Recovery ........................................................................................................................................... 79
Power-Down Mode ..................................................................................................................................... 79
CAS Latency (CL) ........................................................................................................................................ 80
Extended Mode Register (EMR) ....................................................................................................................... 81
DLL Enable/Disable ................................................................................................................................... 82
Output Drive Strength ................................................................................................................................ 82
DQS# Enable/Disable ................................................................................................................................. 82
RDQS Enable/Disable ................................................................................................................................. 82
Output Enable/Disable ............................................................................................................................... 82
On-Die Termination (ODT) ......................................................................................................................... 83
Off-Chip Driver (OCD) Impedance Calibration ............................................................................................ 83
2Gb: x4, x8, x16 DDR2 SDRAM
Features
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN 3Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2006 Micron Technology, Inc. All rights reserved.
Posted CAS Additive Latency (AL) ................................................................................................................ 83
Extended Mode Register 2 (EMR2) ................................................................................................................... 85
Extended Mode Register 3 (EMR3) ................................................................................................................... 86
Initialization .................................................................................................................................................. 87
ACTIVATE ...................................................................................................................................................... 90
READ ............................................................................................................................................................. 92
READ with Precharge .................................................................................................................................. 96
READ with Auto Precharge .......................................................................................................................... 98
WRITE .......................................................................................................................................................... 103
PRECHARGE ................................................................................................................................................. 113
REFRESH ...................................................................................................................................................... 114
SELF REFRESH .............................................................................................................................................. 115
Power-Down Mode ........................................................................................................................................ 117
Precharge Power-Down Clock Frequency Change ........................................................................................... 124
Reset ............................................................................................................................................................. 125
CKE Low Anytime ...................................................................................................................................... 125
ODT Timing .................................................................................................................................................. 127
MRS Command to ODT Update Delay ........................................................................................................ 129
2Gb: x4, x8, x16 DDR2 SDRAM
Features
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN 4Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2006 Micron Technology, Inc. All rights reserved.
List of Tables
Table 1: Key Timing Parameters ....................................................................................................................... 2
Table 2: Addressing ......................................................................................................................................... 2
Table 3: FBGA 84-Ball – x16 and 60-Ball – x4, x8 Descriptions .......................................................................... 16
Table 4: Input Capacitance ............................................................................................................................ 22
Table 5: Absolute Maximum DC Ratings ......................................................................................................... 23
Table 6: Temperature Limits .......................................................................................................................... 24
Table 7: Thermal Impedance ......................................................................................................................... 25
Table 8: General IDD Parameters ..................................................................................................................... 26
Table 9: IDD7 Timing Patterns (8-Bank Interleave READ Operation) ................................................................. 27
Table 10: DDR2 IDD Specifications and Conditions (Die Revision A) ................................................................. 28
Table 11: DDR2 IDD Specifications and Conditions (Die Revision C) ................................................................ 30
Table 12: AC Operating Specifications and Conditions .................................................................................... 32
Table 13: Recommended DC Operating Conditions (SSTL_18) ........................................................................ 44
Table 14: ODT DC Electrical Characteristics ................................................................................................... 44
Table 15: Input DC Logic Levels ..................................................................................................................... 45
Table 16: Input AC Logic Levels ...................................................................................................................... 45
Table 17: Differential Input Logic Levels ......................................................................................................... 46
Table 18: Differential AC Output Parameters ................................................................................................... 48
Table 19: Output DC Current Drive ................................................................................................................ 48
Table 20: Output Characteristics .................................................................................................................... 49
Table 21: Full Strength Pull-Down Current (mA) ............................................................................................. 50
Table 22: Full Strength Pull-Up Current (mA) .................................................................................................. 51
Table 23: Reduced Strength Pull-Down Current (mA) ...................................................................................... 52
Table 24: Reduced Strength Pull-Up Current (mA) .......................................................................................... 53
Table 25: Input Clamp Characteristics ............................................................................................................ 54
Table 26: Address and Control Balls ................................................................................................................ 55
Table 27: Clock, Data, Strobe, and Mask Balls ................................................................................................. 55
Table 28: AC Input Test Conditions ................................................................................................................ 55
Table 29: DDR2-400/533 Setup and Hold Time Derating Values (tIS and tIH) .................................................... 58
Table 30: DDR2-667/800/1066 Setup and Hold Time Derating Values (tIS and tIH) ........................................... 59
Table 31: DDR2-400/533 tDS, tDH Derating Values with Differential Strobe ...................................................... 62
Table 32: DDR2-667/800/1066 tDS, tDH Derating Values with Differential Strobe ............................................. 63
Table 33: Single-Ended DQS Slew Rate Derating Values Using tDSb and tDHb ................................................... 64
Table 34: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at VREF) at DDR2-667 ...................................... 64
Table 35: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at VREF) at DDR2-533 ...................................... 65
Table 36: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at VREF) at DDR2-400 ...................................... 65
Table 37: Truth Table – DDR2 Commands ...................................................................................................... 70
Table 38: Truth Table – Current State Bank n – Command to Bank n ................................................................ 71
Table 39: Truth Table – Current State Bank n – Command to Bank m ............................................................... 73
Table 40: Minimum Delay with Auto Precharge Enabled ................................................................................. 74
Table 41: Burst Definition .............................................................................................................................. 78
Table 42: READ Using Concurrent Auto Precharge .......................................................................................... 98
Table 43: WRITE Using Concurrent Auto Precharge ....................................................................................... 104
Table 44: Truth Table – CKE .......................................................................................................................... 119
2Gb: x4, x8, x16 DDR2 SDRAM
Features
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN 5Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2006 Micron Technology, Inc. All rights reserved.
List of Figures
Figure 1: 2Gb DDR2 Part Numbers ................................................................................................................... 2
Figure 2: Simplified State Diagram ................................................................................................................... 8
Figure 3: Functional Block Diagram – 512 Meg x 4 ........................................................................................... 11
Figure 4: Functional Block Diagram – 256 Meg x 8 ........................................................................................... 12
Figure 5: Functional Block Diagram – 128 Meg x 16 ......................................................................................... 13
Figure 6: 60-Ball FBGA – x4, x8 Ball Assignments (Top View) ........................................................................... 14
Figure 7: 84-Ball FBGA – x16 Ball Assignments (Top View) ............................................................................... 15
Figure 8: 84-Ball FBGA Package (11.5mm x 14mm) – x16 ................................................................................. 18
Figure 9: 84-Ball FBGA Package (9mm x 12.5mm) – x16 ................................................................................... 19
Figure 10: 60-Ball FBGA Package (11.5mm x 14mm) – x4, x8 ............................................................................ 20
Figure 11: 60-Ball FBGA Package (9mm x 11.5mm) – x4, x8 .............................................................................. 21
Figure 12: Example Temperature Test Point Location ...................................................................................... 24
Figure 13: Single-Ended Input Signal Levels ................................................................................................... 45
Figure 14: Differential Input Signal Levels ...................................................................................................... 46
Figure 15: Differential Output Signal Levels .................................................................................................... 48
Figure 16: Output Slew Rate Load .................................................................................................................. 49
Figure 17: Full Strength Pull-Down Characteristics ......................................................................................... 50
Figure 18: Full Strength Pull-Up Characteristics .............................................................................................. 51
Figure 19: Reduced Strength Pull-Down Characteristics .................................................................................. 52
Figure 20: Reduced Strength Pull-Up Characteristics ...................................................................................... 53
Figure 21: Input Clamp Characteristics .......................................................................................................... 54
Figure 22: Overshoot ..................................................................................................................................... 55
Figure 23: Undershoot ................................................................................................................................... 55
Figure 24: Nominal Slew Rate for tIS ............................................................................................................... 60
Figure 25: Tangent Line for tIS ........................................................................................................................ 60
Figure 26: Nominal Slew Rate for tIH .............................................................................................................. 61
Figure 27: Tangent Line for tIH ....................................................................................................................... 61
Figure 28: Nominal Slew Rate for tDS ............................................................................................................. 66
Figure 29: Tangent Line for tDS ...................................................................................................................... 66
Figure 30: Nominal Slew Rate for tDH ............................................................................................................. 67
Figure 31: Tangent Line for tDH ..................................................................................................................... 67
Figure 32: AC Input Test Signal Waveform Command/Address Balls ................................................................ 68
Figure 33: AC Input Test Signal Waveform for Data with DQS, DQS# (Differential) ............................................ 68
Figure 34: AC Input Test Signal Waveform for Data with DQS (Single-Ended) ................................................... 69
Figure 35: AC Input Test Signal Waveform (Differential) .................................................................................. 69
Figure 36: MR Definition ............................................................................................................................... 77
Figure 37: CL ................................................................................................................................................. 80
Figure 38: EMR Definition ............................................................................................................................. 81
Figure 39: READ Latency ............................................................................................................................... 84
Figure 40: WRITE Latency .............................................................................................................................. 84
Figure 41: EMR2 Definition ........................................................................................................................... 85
Figure 42: EMR3 Definition ........................................................................................................................... 86
Figure 43: DDR2 Power-Up and Initialization ................................................................................................. 87
Figure 44: Example: Meeting tRRD (MIN) and tRCD (MIN) .............................................................................. 90
Figure 45: Multibank Activate Restriction ....................................................................................................... 91
Figure 46: READ Latency ............................................................................................................................... 93
Figure 47: Consecutive READ Bursts .............................................................................................................. 94
Figure 48: Nonconsecutive READ Bursts ........................................................................................................ 95
Figure 49: READ Interrupted by READ ............................................................................................................ 96
Figure 50: READ-to-WRITE ............................................................................................................................ 96
2Gb: x4, x8, x16 DDR2 SDRAM
Features
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN 6Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2006 Micron Technology, Inc. All rights reserved.
Figure 51: READ-to-PRECHARGE – BL = 4 ...................................................................................................... 97
Figure 52: READ-to-PRECHARGE – BL = 8 ...................................................................................................... 97
Figure 53: Bank Read – Without Auto Precharge .............................................................................................. 99
Figure 54: Bank Read – with Auto Precharge .................................................................................................. 100
Figure 55: x4, x8 Data Output Timing – tDQSQ, tQH, and Data Valid Window .................................................. 101
Figure 56: x16 Data Output Timing – tDQSQ, tQH, and Data Valid Window ..................................................... 102
Figure 57: Data Output Timing – tAC and tDQSCK ......................................................................................... 103
Figure 58: Write Burst ................................................................................................................................... 105
Figure 59: Consecutive WRITE-to-WRITE ...................................................................................................... 106
Figure 60: Nonconsecutive WRITE-to-WRITE ................................................................................................ 106
Figure 61: WRITE Interrupted by WRITE ....................................................................................................... 107
Figure 62: WRITE-to-READ ........................................................................................................................... 108
Figure 63: WRITE-to-PRECHARGE ................................................................................................................ 109
Figure 64: Bank Write – Without Auto Precharge ............................................................................................ 110
Figure 65: Bank Write – with Auto Precharge .................................................................................................. 111
Figure 66: WRITE – DM Operation ................................................................................................................ 112
Figure 67: Data Input Timing ........................................................................................................................ 113
Figure 68: Refresh Mode ............................................................................................................................... 114
Figure 69: Self Refresh .................................................................................................................................. 116
Figure 70: Power-Down ................................................................................................................................ 118
Figure 71: READ-to-Power-Down or Self Refresh Entry .................................................................................. 120
Figure 72: READ with Auto Precharge-to-Power-Down or Self Refresh Entry ................................................... 120
Figure 73: WRITE-to-Power-Down or Self Refresh Entry ................................................................................. 121
Figure 74: WRITE with Auto Precharge-to-Power-Down or Self Refresh Entry .................................................. 121
Figure 75: REFRESH Command-to-Power-Down Entry .................................................................................. 122
Figure 76: ACTIVATE Command-to-Power-Down Entry ................................................................................. 122
Figure 77: PRECHARGE Command-to-Power-Down Entry ............................................................................. 123
Figure 78: LOAD MODE Command-to-Power-Down Entry ............................................................................. 123
Figure 79: Input Clock Frequency Change During Precharge Power-Down Mode ............................................ 124
Figure 80: RESET Function ........................................................................................................................... 126
Figure 81: ODT Timing for Entering and Exiting Power-Down Mode ............................................................... 128
Figure 82: Timing for MRS Command to ODT Update Delay .......................................................................... 129
Figure 83: ODT Timing for Active or Fast-Exit Power-Down Mode .................................................................. 129
Figure 84: ODT Timing for Slow-Exit or Precharge Power-Down Modes .......................................................... 130
Figure 85: ODT Turn-Off Timings When Entering Power-Down Mode ............................................................ 130
Figure 86: ODT Turn-On Timing When Entering Power-Down Mode .............................................................. 131
Figure 87: ODT Turn-Off Timing When Exiting Power-Down Mode ................................................................ 132
Figure 88: ODT Turn-On Timing When Exiting Power-Down Mode ................................................................. 133
2Gb: x4, x8, x16 DDR2 SDRAM
Features
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN 7Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2006 Micron Technology, Inc. All rights reserved.
State Diagram
Figure 2: Simplified State Diagram
Automatic Sequence
Command Sequence
PRE
Initialization
sequence
Self
refreshing
CKE_L
Refreshing
Precharge
power-
down
Setting
MRS
EMRS
SR
CKE_H
REFRESH
Idle
all banks
precharged
CKE_L
CKE_L
CKE_L
(E)MRS
OCD
default
Activating
ACT
Bank
active
Reading
READ
Writing
WRITE
Active
power-
down
CKE_L
CKE_L
CKE_H
CKE_L
Writing
with
auto
precharge
Reading
with
auto
precharge
READ A
WRITE A
PRE, PRE_A
WRITE A
WRITE A
READ A
PRE , PRE_A
READ A
READ
WRITE
Precharging
CKE_H
WRITE READ
PRE, PRE_A
ACT = ACTIVATE
CKE_H = CKE HIGH, exit power-down or self refresh
CKE_L = CKE LOW, enter power-down
(E)MRS = (Extended) mode register set
PRE = PRECHARGE
PRE_A = PRECHARGE ALL
READ = READ
READ A = READ with auto precharge
REFRESH = REFRESH
SR = SELF REFRESH
WRITE = WRITE
WRITE A = WRITE with auto precharge
Note: 1. This diagram provides the basic command flow. It is not comprehensive and does not
identify all timing requirements or possible command restrictions such as multibank in-
teraction, power down, entry/exit, etc.
2Gb: x4, x8, x16 DDR2 SDRAM
State Diagram
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN 8Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2006 Micron Technology, Inc. All rights reserved.
Functional Description
The DDR2 SDRAM uses a double data rate architecture to achieve high-speed opera-
tion. The double data rate architecture is essentially a 4n-prefetch architecture, with an
interface designed to transfer two data words per clock cycle at the I/O balls. A single
READ or WRITE operation for the DDR2 SDRAM effectively consists of a single 4n-bit-
wide, two-clock-cycle data transfer at the internal DRAM core and four corresponding
n-bit-wide, one-half-clock-cycle data transfers at the I/O balls.
A bidirectional data strobe (DQS, DQS#) is transmitted externally, along with data, for
use in data capture at the receiver. DQS is a strobe transmitted by the DDR2 SDRAM
during READs and by the memory controller during WRITEs. DQS is edge-aligned with
data for READs and center-aligned with data for WRITEs. The x16 offering has two data
strobes, one for the lower byte (LDQS, LDQS#) and one for the upper byte (UDQS,
UDQS#).
The DDR2 SDRAM operates from a differential clock (CK and CK#); the crossing of CK
going HIGH and CK# going LOW will be referred to as the positive edge of CK. Com-
mands (address and control signals) are registered at every positive edge of CK. Input
data is registered on both edges of DQS, and output data is referenced to both edges of
DQS as well as to both edges of CK.
Read and write accesses to the DDR2 SDRAM are burst-oriented; accesses start at a se-
lected location and continue for a programmed number of locations in a programmed
sequence. Accesses begin with the registration of an ACTIVATE command, which is then
followed by a READ or WRITE command. The address bits registered coincident with
the ACTIVATE command are used to select the bank and row to be accessed. The ad-
dress bits registered coincident with the READ or WRITE command are used to select
the bank and the starting column location for the burst access.
The DDR2 SDRAM provides for programmable read or write burst lengths of four or
eight locations. DDR2 SDRAM supports interrupting a burst read of eight with another
read or a burst write of eight with another write. An auto precharge function may be en-
abled to provide a self-timed row precharge that is initiated at the end of the burst ac-
cess.
As with standard DDR SDRAM, the pipelined, multibank architecture of DDR2 SDRAM
enables concurrent operation, thereby providing high, effective bandwidth by hiding
row precharge and activation time.
A self refresh mode is provided, along with a power-saving, power-down mode.
All inputs are compatible with the JEDEC standard for SSTL_18. All full drive-strength
outputs are SSTL_18-compatible.
Industrial Temperature
The industrial temperature (IT) option, if offered, has two simultaneous requirements:
ambient temperature surrounding the device cannot be less than –40°C or greater than
85°C, and the case temperature cannot be less than –40°C or greater than 95°C. JEDEC
specifications require the refresh rate to double when TC exceeds 85°C; this also requires
use of the high-temperature self refresh option. Additionally, ODT resistance, input/
output impedance and IDD values must be derated when TC is < 0°C or > 85°C.
2Gb: x4, x8, x16 DDR2 SDRAM
Functional Description
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN 9Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2006 Micron Technology, Inc. All rights reserved.
General Notes
The functionality and the timing specifications discussed in this data sheet are for the
DLL-enabled mode of operation.
Throughout the data sheet, the various figures and text refer to DQs as “DQ.” The DQ
term is to be interpreted as any and all DQ collectively, unless specifically stated oth-
erwise. Additionally, the x16 is divided into 2 bytes: the lower byte and the upper byte.
For the lower byte (DQ[7:0]), DM refers to LDM and DQS refers to LDQS. For the up-
per byte (DQ[15:8]), DM refers to UDM and DQS refers to UDQS.
A x16 device's DQ bus is comprised of two bytes. If only one of the bytes needs to be
used, use the lower byte for data transfers and terminate the upper byte as noted:
Connect UDQS to ground via 1kΩ* resistor
Connect UDQS# to VDD via 1kΩ* resistor
Connect UDM to VDD via 1kΩ* resistor
Connect DQ[15:8] individually to either VSS or VDD via 1kΩ* resistors, or float
DQ[15:8].
*If ODT is used, 1kΩ resistor should be changed to 4x that of the selected ODT.
Complete functionality is described throughout the document, and any page or dia-
gram may have been simplified to convey a topic and may not be inclusive of all re-
quirements.
Any specific requirement takes precedence over a general statement.
2Gb: x4, x8, x16 DDR2 SDRAM
Functional Description
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN 10 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2006 Micron Technology, Inc. All rights reserved.
Functional Block Diagrams
The DDR2 SDRAM is a high-speed CMOS, dynamic random access memory. It is inter-
nally configured as a multibank DRAM.
Figure 3: Functional Block Diagram – 512 Meg x 4
Bank 5
Bank 6
Bank 7
Bank 4
Bank 7
Bank 4
Bank 5
Bank 6
15
Row-
address
MUX
Control
logic
Column-
address
counter/
latch
Mode
registers
11
A[14:0],
BA[2:0]
15
Address
register
18
512
(x16)
8192
Column
decoder
Bank 0
Memory array
(
32,768
x 512 x 16)
Bank 0
row-
address
latch
and
decoder
32,768
Sense amplifiers
Bank
control
logic
18
Bank 1
Bank 2
Bank 3
15
9
3
2
Refresh
counter
4
44
2
RCVRS
16
16
16
CK out
DATA
DQS, DQS#
CK, CK#
CK, CK#
COL0, COL1
COL0, COL1
CK in
DRVRS
DLL
MUX
DQS
generator
4
4
4
4
4
2
Read
latch
Write
FIFO
and
drivers
Data
4
4
4
4
16
1
1
1
1
Mask
1
1
1
1
1
4
4
4
2
Bank 1
Bank 2
Bank 3
Input
registers
DM
DQ[13:0]
RAS#
CAS#
CK
CS#
WE#
CK#
Command
decode
CKE
ODT
I/O gating
DM mask logic DQS, DQS#
V
DDQ
R1
R1
R2
R2
sw1 sw2
VSSQ
sw1 sw2
ODT control
sw3
R3
R3
sw3
R1
R1
R2
R2
sw1 sw2
R3
R3
sw3
R1
R1
R2
R2
sw1 sw2
R3
R3
sw3
2Gb: x4, x8, x16 DDR2 SDRAM
Functional Block Diagrams
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN 11 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2006 Micron Technology, Inc. All rights reserved.
Figure 4: Functional Block Diagram – 256 Meg x 8
Bank 5
Bank 6
Bank 7
Bank 4
Bank 7
Bank 4
Bank 5
Bank 6
15
Row-
address
MUX
Control
logic
Column-
address
counter/
latch
Mode
registers
10
A[14:0],
BA[2:0]
15
Address
register
18
256
(x32)
8192
Column
decoder
Bank 0
Memory array
(
32,768
x 256 x 32)
Bank 0
row-
address
latch
and
decoder
32,768
Sense amplifers
Bank
control
logic
18
Bank 1
Bank 2
Bank 3
15
8
3
2
Refresh
counter
8
88
2
32
32
32
CK out
Data
UDQS, UDQS#
LDQS, LDQS#
CK,CK#
CK, CK#
COL0, COL1
COL0, COL1
CK in
DRVRS
DLL
MUX
DQS
generator
8
8
8
8
8
2
Read
latch
Write
FIFO
and
drivers
Data
8
8
8
8
32
2
2
2
2
Mask
2
2
2
2
2
4
8
8
2
Bank 1
Bank 2
Bank 3
Input
registers
DM
DQ[7:0]
RAS#
CAS#
CK
CS#
WE#
CK#
Command
decode
CKE
ODT
I/O gating
DM mask logic DQS, DQS#
RDQS#
RDQS
V
DDQ
R1
R1
R2
R2
sw1 sw2
VSSQ
sw1 sw2
ODT control
sw3
R3
R3
sw3
R1
R1
R2
R2
sw1 sw2
R3
R3
sw3
R1
R1
R2
R2
sw1 sw2
R3
R3
sw3
RCVRS
2Gb: x4, x8, x16 DDR2 SDRAM
Functional Block Diagrams
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN 12 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2006 Micron Technology, Inc. All rights reserved.
Figure 5: Functional Block Diagram – 128 Meg x 16
Bank 5
Bank 6
Bank 7
Bank 4
Bank 7
Bank 4
Bank 5
Bank 6
14
Row-
address
MUX
Control
logic
Column-
address
counter/
latch
Mode
registers
10
A[13:0],
BA[2:0]
14
Address
register 256
(x64)
16,384
Column
decoder
Bank 0
Memory array
(16,384 x 256 x 64)
Bank 0
row-
address
latch
and
decoder
16,384
Sense amplifier
Bank
control
logic
16
Bank 1
Bank 2
Bank 3
14
8
3
2
Refresh
counter
16
16 16
4
64
64
64
CK out
DATA
UDQS, UDQS#
LDQS, LDQS#
CK, CK#
CK, CK#
COL0, COL1
COL0, COL1
CK in
DRVRS
DLL
MUX
DQS
generator
16
16
16
16
16
UDQS, UDQS#
LDQS, LDQS#
4
Read
latch
WRITE
FIFO
and
drivers
Data
16
16
16
16
64
2
2
2
2
Mask
2
2
2
2
2
8
16
16
2
Bank 1
Bank 2
Bank 3
Input
registers
UDM, LDM
DQ[15:0]
VDDQ
R1
R1
R2
R2
sw1 sw2
VSSQ
sw1 sw2
ODT control
RAS#
CAS#
CK
CS#
WE#
CK#
Command
decode
CKE
ODT
I/O gating
DM mask logic
16
sw3
R3
R3
sw3
R1
R1
R2
R2
sw1 sw2
R3
R3
sw3
R1
R1
R2
R2
sw1 sw2
R3
R3
sw3
RCVRS
2Gb: x4, x8, x16 DDR2 SDRAM
Functional Block Diagrams
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN 13 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2006 Micron Technology, Inc. All rights reserved.
Ball Assignments and Descriptions
Figure 6: 60-Ball FBGA – x4, x8 Ball Assignments (Top View)
1234 67895
VDD
NF, DQ6
VDDQ
NF, DQ4
VDDL
BA2
VSS
VDD
NF, RDQS#/NU
VSSQ
DQ1
VSSQ
VREF
CKE
BA0
A10
A3
A7
A12
VSS
DM, DM/RDQS
VDDQ
DQ3
VSS
WE#
BA1
A1
A5
A9
A14
VSSQ
DQS
VDDQ
DQ2
VSSDL
RAS#
CAS#
A2
A6
A11
RFU
VDDQ
NF, DQ7
VDDQ
NF, DQ5
VDD
ODT
VDD
VSS
DQS#/NU
VSSQ
DQ0
VSSQ
CK
CK#
CS#
A0
A4
A8
A13
A
B
C
D
E
F
G
H
J
K
L
2Gb: x4, x8, x16 DDR2 SDRAM
Ball Assignments and Descriptions
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN 14 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2006 Micron Technology, Inc. All rights reserved.
Figure 7: 84-Ball FBGA – x16 Ball Assignments (Top View)
1234 67895
VDD
DQ14
VDDQ
DQ12
VDD
DQ6
VDDQ
DQ4
VDDL
BA2
VSS
VDD
NC
VSSQ
DQ9
VSSQ
NC
VSSQ
DQ1
VSSQ
VREF
CKE
BA0
A10
A3
A7
A12
VSS
UDM
VDDQ
DQ11
VSS
LDM
VDDQ
DQ3
VSS
WE#
BA1
A1
A5
A9
RFU
VSSQ
UDQS
VDDQ
DQ10
VSSQ
LDQS
VDDQ
DQ2
VSSDL
RAS#
CAS#
A2
A6
A11
RFU
VDDQ
DQ15
VDDQ
DQ13
VDDQ
DQ7
VDDQ
DQ5
VDD
ODT
VDD
VSS
UDQS#/NU
VSSQ
DQ8
VSSQ
LDQS#/NU
VSSQ
DQ0
VSSQ
CK
CK#
CS#
A0
A4
A8
A13
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
2Gb: x4, x8, x16 DDR2 SDRAM
Ball Assignments and Descriptions
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN 15 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2006 Micron Technology, Inc. All rights reserved.
Table 3: FBGA 84-Ball – x16 and 60-Ball – x4, x8 Descriptions
Symbol Type Description
A[13:0] (x16)
A[14:0] (x4, x8)
Input Address inputs: Provide the row address for ACTIVE commands, and the column ad-
dress and auto precharge bit (A10) for READ/WRITE commands, to select one location out
of the memory array in the respective bank. A10 sampled during a PRECHARGE com-
mand determines whether the PRECHARGE applies to one bank (A10 LOW, bank selected
by BA[2:0]) or all banks (A10 HIGH). The address inputs also provide the op-code during a
LOAD MODE command.
BA[2:0] Input Bank address inputs: BA[2:0] define to which bank an ACTIVE, READ, WRITE, or PRE-
CHARGE command is being applied. BA[2:0] define which mode register, including MR,
EMR, EMR(2), and EMR(3), is loaded during the LOAD MODE command.
CK, CK# Input Clock: CK and CK# are differential clock inputs. All address and control input signals are
sampled on the crossing of the positive edge of CK and negative edge of CK#. Output
data (DQ and DQS/DQS#) is referenced to the crossings of CK and CK#.
CKE Input Clock enable: CKE (registered HIGH) activates and CKE (registered LOW) deactivates
clocking circuitry on the DDR2 SDRAM. The specific circuitry that is enabled/disabled is
dependent on the DDR2 SDRAM configuration and operating mode. CKE LOW provides
precharge power-down and SELF REFRESH operation (all banks idle), or ACTIVATE power-
down (row active in any bank). CKE is synchronous for power-down entry, power-down
exit, output disable, and for self refresh entry. CKE is asynchronous for SELF REFRESH exit.
Input buffers (excluding CK, CK#, CKE, and ODT) are disabled during power-down. Input
buffers (excluding CKE) are disabled during self refresh. CKE is an SSTL_18 input but will
detect a LVCMOS LOW level once VDD is applied during first power-up. After VREF has be-
come stable during the power on and initialization sequence, it must be maintained for
proper operation of the CKE receiver. For proper SELF REFRESH operation, VREF must be
maintained.
CS# Input Chip select: CS# enables (registered LOW) and disables (registered HIGH) the command
decoder. All commands are masked when CS# is registered high. CS# provides for exter-
nal bank selection on systems with multiple ranks. CS# is considered part of the com-
mand code.
LDM, UDM (DM) Input Input data mask: DM is an input mask signal for write data. Input data is masked when
DM is concurrently sampled HIGH during a WRITE access. DM is sampled on both edges
of DQS. Although DM balls are input-only, the DM loading is designed to match that of
DQ and DQS balls. LDM is DM for lower byte DQ[7:0] and UDM is DM for upper byte
DQ[15:8].
ODT Input On-die termination: ODT (registered HIGH) enables termination resistance internal to
the DDR2 SDRAM. When enabled, ODT is only applied to each of the following balls:
DQ[15:0], LDM, UDM, LDQS, LDQS#, UDQS, and UDQS# for the x16; DQ[7:0], DQS, DQS#,
RDQS, RDQS#, and DM for the x8; DQ[3:0], DQS, DQS#, and DM for the x4. The ODT input
will be ignored if disabled via the LOAD MODE command.
RAS#, CAS#, WE# Input Command inputs: RAS#, CAS#, and WE# (along with CS#) define the command being
entered.
DQ[15:0] (x16)
DQ[3:0] (x4)
DQ[7:0] (x8)
I/O Data input/output: Bidirectional data bus for 128 Meg x 16.
Bidirectional data bus for 512 Meg x 4.
Bidirectional data bus for 256 Meg x 8.
2Gb: x4, x8, x16 DDR2 SDRAM
Ball Assignments and Descriptions
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN 16 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2006 Micron Technology, Inc. All rights reserved.
Table 3: FBGA 84-Ball – x16 and 60-Ball – x4, x8 Descriptions (Continued)
Symbol Type Description
DQS, DQS# I/O Data strobe: Output with read data, input with write data for source synchronous oper-
ation. Edge-aligned with read data, center-aligned with write data. DQS# is only used
when differential data strobe mode is enabled via the LOAD MODE command.
LDQS, LDQS# I/O Data strobe for lower byte: Output with read data, input with write data for source
synchronous operation. Edge-aligned with read data, center-aligned with write data.
LDQS# is only used when differential data strobe mode is enabled via the LOAD MODE
command.
UDQS, UDQS# I/O Data strobe for upper byte: Output with read data, input with write data for source
synchronous operation. Edge-aligned with read data, center-aligned with write data.
UDQS# is only used when differential data strobe mode is enabled via the LOAD MODE
command.
RDQS, RDQS# Output Redundant data strobe: For x8 only. RDQS is enabled/disabled via the LOAD MODE
command to the extended mode register (EMR). When RDQS is enabled, RDQS is output
with read data only and is ignored during write data. When RDQS is disabled, ball B3 be-
comes data mask (see DM ball). RDQS# is only used when RDQS is enabled and differen-
tial data strobe mode is enabled.
VDD Supply Power supply: 1.8V ±0.1V.
VDDQ Supply DQ power supply: 1.8V ±0.1V. Isolated on the device for improved noise immunity.
VDDL Supply DLL power supply: 1.8V ±0.1V.
VREF Supply SSTL_18 reference voltage.
VSS Supply Ground.
VSSDL Supply DLL ground: Isolated on the device from VSS and VSSQ.
VSSQ Supply DQ ground: Isolated on the device for improved noise immunity.
NC No connect: These balls should be left unconnected.
NF No function: Not used only on x4. These are data lines on the x8.
NU Not used: Not used only on x16. If EMR[E10] = 0, A8 and E8 are UDQS# and LDQS#. If
EMR[E10] = 1, then A8 and E8 are not used.
NU Not used: For x4: Not used. For x8: If EMR[E10] = 0, E2 and E8 are RDQS# and DQS#; if
EMR[E10] = 1, then E2 and E8 are not used.
RFU Reserved for future use: Row address bits A14 (R3), A15 (R7) on the x16, and A15 (L7)
on the x4/x8.
2Gb: x4, x8, x16 DDR2 SDRAM
Ball Assignments and Descriptions
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN 17 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2006 Micron Technology, Inc. All rights reserved.
Packaging
Package Dimensions
Figure 8: 84-Ball FBGA Package (11.5mm x 14mm) – x16
0.8 ±0.1
0.12
Seating
plane
AA
11.2 CTR
Ball A1 ID Ball A1 ID
0.8 TYP
11.5 ±0.15
6.4 CTR
14 ±0.15
0.8 TYP
84X Ø0.45
Solder ball
material: SAC305.
Dimensions apply
to solder balls post-
reflow on Ø0.33
NSMD ball
pads.
1.2 MAX
0.25 MIN
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
9 8 7 3 2 1
Notes: 1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu).
2Gb: x4, x8, x16 DDR2 SDRAM
Packaging
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN 18 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2006 Micron Technology, Inc. All rights reserved.
Figure 9: 84-Ball FBGA Package (9mm x 12.5mm) – x16
Ball A1 ID
Seating
plane
0.8 ±0.05
Solder ball material:
SAC305 (96.5% Sn,
3% Ag, 0.5% Cu).
Dimensions apply to
solder balls post-reflow
on Ø0.35 SMD ball
pads.
0.12 AA
12.5 ±0.1
0.8 TYP
1.2 MAX
11.2 CTR
Ball A1 ID
0.8 TYP
9 ±0.1
0.25 MIN6.4 CTR
84X Ø0.45
9 8 7 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
1.8 CTR
Nonconductive overmold
0.155
Notes: 1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) or leaded Eutectic (62% Sn,
36%Pb, 2% Ag).
2Gb: x4, x8, x16 DDR2 SDRAM
Packaging
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN 19 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2006 Micron Technology, Inc. All rights reserved.
Figure 10: 60-Ball FBGA Package (11.5mm x 14mm) – x4, x8
0.8 ±0.1
0.12 AA
8 CTR
A
B
C
D
E
F
G
H
J
K
L
Ball A1 ID
Ball A1 ID
0.8 TYP
11.5 ±0.15
6.4 CTR
Seating
plane
14 ±0.15
0.8 TYP
60X Ø0.45
Solder ball
material: SAC305.
Dimensions
apply to solder
balls post-reflow
on Ø0.33 NSMD
ball pads.
1.2 MAX
0.25 MIN
9 8 7 3 2 1
Notes: 1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu).
2Gb: x4, x8, x16 DDR2 SDRAM
Packaging
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN 20 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2006 Micron Technology, Inc. All rights reserved.
Figure 11: 60-Ball FBGA Package (9mm x 11.5mm) – x4, x8
Ball A1 ID
Seating
plane
0.12 AA
0.8 ±0.05
0.155
1.2 MAX
0.25 MIN
9 8 7 3 2 1
A
B
C
D
E
F
G
H
J
K
L
9 ±0.1
Ball A1 ID
8 CTR
Solder ball material:
SAC305 (96.5% Sn,
3% Ag, 0.5% Cu).
Dimensions apply to
solder balls post-
reflow on Ø0.35
SMD ball pads.
60X Ø0.45
11.5 ±0.1
0.8 TYP
6.4 CTR
1.8 CTR
0.8 TYP
Note: 1. All dimensions are in millimeters.
2Gb: x4, x8, x16 DDR2 SDRAM
Packaging
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN 21 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2006 Micron Technology, Inc. All rights reserved.
FBGA Package Capacitance
Table 4: Input Capacitance
Parameter Symbol Min Max Units Notes
Input capacitance: CK, CK# CCK 1.0 2.0 pF 1
Delta input capacitance: CK, CK# CDCK 0.25 pF 2, 3
Input capacitance: BA[2:0], A[14:0] (A[13:0] on
x16), CS#, RAS#, CAS#, WE#, CKE, ODT
CI1.0 2.0 pF 1
Delta input capacitance: Address balls, bank
address balls, CS#, RAS#, CAS#, WE#, CKE, ODT
CDI 0.25 pF 2, 3
Input/output capacitance: DQ, DQS, DM, NF CIO 2.5 4.0 pF 1, 4
Delta input/output capacitance: DQ, DQS, DM,
NF
CDIO 0.5 pF 2, 3
Notes: 1. This parameter is sampled. VDD = 1.8V ±0.1V, VDDQ = 1.8V ±0.1V, VREF = VSS, f = 100 MHz,
TC = 25°C, VOUT(DC) = VDDQ/2, VOUT (peak-to-peak) = 0.1V. DM input is grouped with I/O
balls, reflecting the fact that they are matched in loading.
2. The capacitance per ball group will not differ by more than this maximum amount for
any given device.
3. ΔC are not pass/fail parameters; they are targets.
4. Reduce MAX limit by 0.25pF for -3/-3E speed devices.
2Gb: x4, x8, x16 DDR2 SDRAM
Packaging
PDF: 09005aef824f87b6
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© 2006 Micron Technology, Inc. All rights reserved.
Electrical Specifications – Absolute Ratings
Stresses greater than those listed may cause permanent damage to the device. This is a
stress rating only, and functional operation of the device at these or any other condi-
tions outside those indicated in the operational sections of this specification is not im-
plied. Exposure to absolute maximum rating conditions for extended periods may affect
reliability.
Table 5: Absolute Maximum DC Ratings
Parameter Symbol Min Max Units Notes
VDD supply voltage relative to VSS VDD –1.0 2.3 V 1
VDDQ supply voltage relative to VSSQ VDDQ –0.5 2.3 V 1, 2
VDDL supply voltage relative to VSSL VDDL –0.5 2.3 V 1
Voltage on any ball relative to VSS VIN, VOUT –0.5 2.3 V 3
Input leakage current; any input 0V VIN
VDD; all other balls not under test = 0V)
II–5 5 μA
Output leakage current; 0V VOUT VDDQ; DQ
and ODT disabled
IOZ –5 5 μA
VREF leakage current; VREF = valid VREF level IVREF –2 2 μA
Notes: 1. VDD, VDDQ, and VDDL must be within 300mV of each other at all times; this is not re-
quired when power is ramping down.
2. VREF 0.6 x VDDQ; however, VREF may be VDDQ provided that VREF 300mV.
3. Voltage on any I/O may not exceed voltage on VDDQ.
Temperature and Thermal Impedance
It is imperative that the DDR2 SDRAM device’s temperature specifications, shown in
Table 6 (page 24), be maintained in order to ensure the junction temperature is in the
proper operating range to meet data sheet specifications. An important step in main-
taining the proper junction temperature is using the device’s thermal impedances cor-
rectly. The thermal impedances are listed in Table 7 (page 25) for the applicable and
available die revision and packages.
Incorrectly using thermal impedances can produce significant errors. Read Micron
technical note TN-00-08, “Thermal Applications,” prior to using the thermal impedan-
ces listed in Table 7. For designs that are expected to last several years and require the
flexibility to use several designs, consider using final target theta values, rather than ex-
isting values, to account for larger thermal impedances.
The DDR2 SDRAM device’s safe junction temperature range can be maintained when
the TC specification is not exceeded. In applications where the device’s ambient tem-
perature is too high, use of forced air and/or heat sinks may be required in order to sat-
isfy the case temperature specifications.
2Gb: x4, x8, x16 DDR2 SDRAM
Electrical Specifications – Absolute Ratings
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN 23 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2006 Micron Technology, Inc. All rights reserved.
Table 6: Temperature Limits
Parameter Symbol Min Max Units Notes
Storage temperature TSTG –55 150 °C 1
Operating temperature – commercial TC0 85 °C 2, 3
Operating temperature – industrial TC–40 95 °C 2, 3, 4
TAMB –40 85 °C 4, 5
Notes: 1. MAX storage case temperature TSTG is measured in the center of the package, as shown
in Figure 12. This case temperature limit is allowed to be exceeded briefly during pack-
age reflow, as noted in Micron technical note TN-00-15, “Recommended Soldering Pa-
rameters.”
2. MAX operating case temperature TC is measured in the center of the package, as shown
in Figure 12.
3. Device functionality is not guaranteed if the device exceeds maximum TC during opera-
tion.
4. Both temperature specifications must be satisfied.
5. Operating ambient temperature surrounding the package.
Figure 12: Example Temperature Test Point Location
2Gb: x4, x8, x16 DDR2 SDRAM
Electrical Specifications – Absolute Ratings
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN 24 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2006 Micron Technology, Inc. All rights reserved.
Table 7: Thermal Impedance
Die Rev Package Substrate
θ
θ
JA (°C/W)
Airflow = 0m/s
θ
JA (°C/W)
Airflow = 1m/s
θ
JA (°C/W)
Airflow = 2m/s
θ
JB (°C/W)
θ
JC (°C/W)
A160-ball 2-layer 48.0 34.4 29.3 21.6 1.6
4-layer 33.7 26.7 23.8 19.7
84-ball 2-layer 48.0 34.4 29.3 21.6 1.6
4-layer 33.7 26.7 23.8 19.7
C160-ball 2-layer 63.8 46.9 40.8 29.9 4.3
4-layer 46.9 38.1 34.4 29.2
84-ball 2-layer 60.0 43.5 37.9 26.0 4.1
4-layer 43.2 34.7 31.5 25.5
Note: 1. Thermal resistance data is based on a number of samples from multiple lots and should
be viewed as a typical number.
2Gb: x4, x8, x16 DDR2 SDRAM
Electrical Specifications – Absolute Ratings
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN 25 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2006 Micron Technology, Inc. All rights reserved.
Electrical Specifications – IDD Parameters
IDD Specifications and Conditions
Table 8: General IDD Parameters
IDD Parameters -187E -25E -25 -3E -3 -37E -5E Units
CL (IDD) 7564543
tCK
tRCD (IDD) 13.125 12.5 15 12 15 15 15 ns
tRC (IDD) 58.125 57.5 60 57 60 60 55 ns
tRRD (IDD) - x4/x8 (1KB) 7.5 7.5 7.5 7.5 7.5 7.5 7.5 ns
tRRD (IDD) - x16 (2KB) 10 10 10 10 10 10 10 ns
tCK (IDD) 1.875 2.5 2.5 3 3 3.75 5 ns
tRAS MIN (IDD) 45454545454540ns
tRAS MAX (IDD) 70,000 70,000 70,000 70,000 70,000 70,000 70,000 ns
tRP (IDD) 13.125 12.5 15 12 15 15 15 ns
tRFC (IDD - 256Mb) 75 75 75 75 75 75 75 ns
tRFC (IDD - 512Mb) 105 105 105 105 105 105 105 ns
tRFC (IDD - 1Gb) 127.5 127.5 127.5 127.5 127.5 127.5 127.5 ns
tRFC (IDD - 2Gb) 195 195 195 195 195 195 195 ns
tFAW (IDD) - x4/x8 (1KB) Defined by pattern in Table 9 (page 27) ns
tFAW (IDD) - x16 (2KB) Defined by pattern in Table 9 (page 27) ns
IDD7 Conditions
The detailed timings are shown below for IDD7. Changes will be required if timing pa-
rameter changes are made to the specification. Where general IDD parameters in Table 8
conflict with pattern requirements of Table 9 (page 27), then Table 9 requirements
take precedence.
2Gb: x4, x8, x16 DDR2 SDRAM
Electrical Specifications – IDD Parameters
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN 26 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2006 Micron Technology, Inc. All rights reserved.
Table 9: IDD7 Timing Patterns (8-Bank Interleave READ Operation)
Speed
Grade IDD7 Timing Patterns
Timing patterns for 8-bank x4/x8 devices
-5E A0 RA0 A1 RA1 A2 RA2 A3 RA3 A4 RA4 A5 RA5 A6 RA6 A7 RA7
-37E A0 RA0 A1 RA1 A2 RA2 A3 RA3 D D A4 RA4 A5 RA5 A6 RA6 A7 RA7 D D
-3 A0 RA0 D A1 RA1 D A2 RA2 D A3 RA3 D D A4 RA4 D A5 RA5 D A6 RA6 D A7 RA7 D D
-3E A0 RA0 D A1 RA1 D A2 RA2 D A3 RA3 D D A4 RA4 D A5 RA5 D A6 RA6 D A7 RA7 D D
-25 A0 RA0 D A1 RA1 D A2 RA2 D A3 RA3 D D D A4 RA4 D A5 RA5 D A6 RA6 D A7 RA7 D D D
-25E A0 RA0 D A1 RA1 D A2 RA2 D A3 RA3 D D D A4 RA4 D A5 RA5 D A6 RA6 D A7 RA7 D D D
-187E A0 RA0 D D A1 RA1 D D A2 RA2 D D A3 RA3 D D D D D A4 RA4 D D A5 RA5 D D A6 RA6 D D A7 RA7 D D D D
D
Timing patterns for 8-bank x16 devices
-5E A0 RA0 A1 RA1 A2 RA2 A3 RA3 D D A4 RA4 A5 RA5 A6 RA6 A7 RA7 D D
-37E A0 RA0 D A1 RA1 D A2 RA2 D A3 RA3 D D D A4 RA4 D A5 RA5 D A6 RA6 D A7 RA7 D D D
-3 A0 RA0 D D A1 RA1 D D A2 RA2 D D A3 RA3 D D D A4 RA4 D D A5 RA5 D D A6 RA6 D D A7 RA7 D D D
-3E A0 RA0 D D A1 RA1 D D A2 RA2 D D A3 RA3 D D D A4 RA4 D D A5 RA5 D D A6 RA6 D D A7 RA7 D D D
-25 A0 RA0 D D A1 RA1 D D A2 RA2 D D A3 RA3 D D D D A4 RA4 D D A5 RA5 D D A6 RA6 D D A7 RA7 D D D D
-25E A0 RA0 D D A1 RA1 D D A2 RA2 D D A3 RA3 D D D D A4 RA4 D D A5 RA5 D D A6 RA6 D D A7 RA7 D D D D
-187E A0 RA0 D D D D A1 RA1 D D D D A2 RA2 D D D D A3 RA3 D D D D A4 RA4 D D D D A5 RA5 D D D D A6 RA6 D
D D D A7 RA7 D D D D
Notes: 1. A = active; RA = read auto precharge; D = deselect.
2. All banks are being interleaved at minimum tRC (IDD) without violating tRRD (IDD) using
a BL = 4.
3. Control and address bus inputs are STABLE during DESELECTs.
2Gb: x4, x8, x16 DDR2 SDRAM
Electrical Specifications – IDD Parameters
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN 27 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2006 Micron Technology, Inc. All rights reserved.
Table 10: DDR2 IDD Specifications and Conditions (Die Revision A)
Notes 1–7 apply to the entire table
Parameter/Condition Symbol Configuration -25E/-25 -3 Units
Operating one bank active-precharge current:
tCK = tCK (IDD), tRC = tRC (IDD), tRAS = tRAS MIN (IDD); CKE is
HIGH, CS# is HIGH between valid commands; Address bus in-
puts are switching; Data bus inputs are switching
IDD0 x4, x8 115 100 mA
x16 150 135
Operating one bank active-read-precharge current:
Iout = 0mA; BL = 4, CL = CL (IDD), AL = 0; tCK = tCK (IDD), tRC =
tRC (IDD), tRAS = tRAS MIN (IDD), tRCD = tRCD (IDD); CKE is HIGH,
CS# is HIGH between valid commands; Address bus inputs are
switching; Data pattern is same as IDD4W
IDD1 x4, x8 165 145 mA
x16 180 160
Precharge power-down current: All banks idle; tCK = tCK
(IDD); CKE is LOW; Other control and address bus inputs are sta-
ble; Data bus inputs are floating
IDD2P x4, x8, x16 12 12 mA
Precharge quiet standby current: All banks idle; tCK = tCK
(IDD); CKE is HIGH, CS# is HIGH; Other control and address bus
inputs are stable; Data bus inputs are floating
IDD2Q x4, x8 65 55 mA
x16 75 65
Precharge standby current: All banks idle; tCK = tCK (IDD);
CKE is HIGH, CS# is HIGH; Other control and address bus inputs
are switching; Data bus inputs are switching
IDD2N x4, x8 70 60 mA
x16 80 70
Active power-down current: All banks open; tCK = tCK (IDD);
CKE is LOW; Other control and address bus inputs are stable;
Data bus inputs are floating
IDD3Pf Fast PDN exit
MR[12] = 0
45 40 mA
IDD3Ps Slow PDN exit
MR[12] = 1
14 14
Active standby current: All banks open; tCK = tCK (IDD), tRAS
= tRAS MAX (IDD), tRP = tRP (IDD); CKE is HIGH, CS# is HIGH be-
tween valid commands; Other control and address bus inputs
are switching; Data bus inputs are switching
IDD3N x4, x8 65 55 mA
x16 85 75
Operating burst write current: All banks open, continuous
burst writes; BL = 4, CL = CL (IDD), AL = 0; tCK = tCK (IDD), tRAS =
tRAS MAX (IDD), tRP = tRP (IDD); CKE is HIGH, CS# is HIGH be-
tween valid commands; Address bus inputs are switching; Data
bus inputs are switching
IDD4W x4, x8 180 160 mA
x16 270 250
Operating burst read current: All banks open, continuous
burst reads, IOUT = 0mA; BL = 4, CL = CL (IDD), AL = 0; tCK = tCK
(IDD), tRAS = tRAS MAX (IDD), tRP = tRP (IDD); CKE is HIGH, CS# is
HIGH between valid commands; Address bus inputs are switch-
ing; Data bus inputs are switching
IDD4R x4, x8 190 170 mA
x16 295 275
Burst refresh current: tCK = tCK (IDD); refresh command at
every tRFC (IDD) interval; CKE is HIGH, CS# is HIGH between val-
id commands; Other control and address bus inputs are switch-
ing; Data bus inputs are switching
IDD5 x4, x8 300 280 mA
x16 300 280
Self refresh current: CK and CK# at 0V; CKE 0.2V; Other
control and address bus inputs are floating; Data bus inputs
are floating
IDD6 x4, x8, x16 12 12 mA
IDD6L 88
2Gb: x4, x8, x16 DDR2 SDRAM
Electrical Specifications – IDD Parameters
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN 28 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2006 Micron Technology, Inc. All rights reserved.
Table 10: DDR2 IDD Specifications and Conditions (Die Revision A) (Continued)
Notes 1–7 apply to the entire table
Parameter/Condition Symbol Configuration -25E/-25 -3 Units
Operating bank interleave read current: All bank interleav-
ing reads, IOUT = 0mA; BL = 4, CL = CL (IDD), AL = tRCD (IDD) - 1 x
tCK (IDD); tCK = tCK (IDD), tRC = tRC (IDD), tRRD = tRRD (IDD), tRCD
= tRCD (IDD); CKE is HIGH, CS# is HIGH between valid com-
mands; Address bus inputs are stable during deselects; Data
bus inputs are switching (see Table 9 (page 27) for details)
IDD7 x4, x8 390 340 mA
x16 445 395
Notes: 1. IDD specifications are tested after the device is properly initialized. 0°C TC +85°C.
2. VDD = 1.8V ±0.1V, VDDQ = 1.8V ±0.1V, VDDL = 1.8V ±0.1V, VREF = VDDQ/2.
3. IDD parameters are specified with ODT disabled.
4. Data bus consists of DQ, DM, DQS, DQS#, RDQS, RDQS#, LDQS, LDQS#, UDQS, and
UDQS#. IDD values must be met with all combinations of EMR bits 10 and 11.
5. Definitions for IDD conditions:
LOW VIN VIL(AC)max
HIGH VIN VIH(AC)min
Stable Inputs stable at a HIGH or LOW level
Floating Inputs at VREF = VDDQ/2
Switching Inputs changing between HIGH and LOW every other clock cycle (once per
two clocks) for address and control signals
Switching Inputs changing between HIGH and LOW every other data transfer (once
per clock) for DQ signals, not including masks or strobes
6. IDD1, IDD4R, and IDD7 require A12 in EMR1 to be enabled during testing.
7. The following IDD values must be derated (IDD limits increase) on IT-option devices when
operated outside of the range 0°C TC 85°C:
When
TC
0°C
IDD2P and IDD3P(SLOW) must be derated by 4%; IDD4R and IDD4W
must be derated by 2%; and IDD6 and IDD7 must be derated by
7%.
When
TC
85°C
IDD0, IDD1, IDD2N, IDD2Q, IDD3N, IDD3P(FAST), IDD4R, IDD4W, and IDD5
must be derated by 2%; IDD2P must be derated by 20%; IDD3P
slow must be derated by 30%; and IDD6 must be derated by
80% (IDD6 will increase by this amount if TC < 85°C and the 2x
refresh option is still enabled).
2Gb: x4, x8, x16 DDR2 SDRAM
Electrical Specifications – IDD Parameters
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN 29 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2006 Micron Technology, Inc. All rights reserved.
Table 11: DDR2 IDD Specifications and Conditions (Die Revision C)
Notes 1–7 apply to the entire table
Parameter/Condition Symbol Configuration -187E -25E/-25 -3 Units
Operating one bank active-precharge cur-
rent: tCK = tCK (IDD), tRC = tRC (IDD), tRAS = tRAS
MIN (IDD); CKE is HIGH, CS# is HIGH between valid
commands; Address bus inputs are switching; Da-
ta bus inputs are switching
IDD0 x4, x8 85 75 70 mA
x16 100 90 85
Operating one bank active-read-precharge
current: Iout = 0mA; BL = 4, CL = CL (IDD), AL = 0;
tCK = tCK (IDD), tRC = tRC (IDD), tRAS = tRAS MIN
(IDD), tRCD = tRCD (IDD); CKE is HIGH, CS# is HIGH
between valid commands; Address bus inputs are
switching; Data pattern is same as IDD4W
IDD1 x4, x8 95 85 80 mA
x16 110 105 100
Precharge power-down current: All banks
idle; tCK = tCK (IDD); CKE is LOW; Other control
and address bus inputs are stable; Data bus in-
puts are floating
IDD2P x4, x8, x16 12 12 12 mA
Precharge quiet standby current: All banks
idle; tCK = tCK (IDD); CKE is HIGH, CS# is HIGH;
Other control and address bus inputs are stable;
Data bus inputs are floating
IDD2Q x4, x8 35 30 25 mA
x16 50 45 40
Precharge standby current: All banks idle; tCK
= tCK (IDD); CKE is HIGH, CS# is HIGH; Other con-
trol and address bus inputs are switching; Data
bus inputs are switching
IDD2N x4, x8 40 35 30 mA
x16 55 50 45
Active power-down current: All banks open;
tCK = tCK (IDD); CKE is LOW; Other control and
address bus inputs are stable; Data bus inputs are
floating
IDD3Pf Fast PDN exit
MR[12] = 0
25 25 25 mA
IDD3Ps Slow PDN exit
MR[12] = 1
14 14 14
Active standby current: All banks open; tCK =
tCK (IDD), tRAS = tRAS MAX (IDD), tRP = tRP (IDD);
CKE is HIGH, CS# is HIGH between valid com-
mands; Other control and address bus inputs are
switching; Data bus inputs are switching
IDD3N x4, x8 60 50 45 mA
x16 60 50 45
Operating burst write current: All banks
open, continuous burst writes; BL = 4, CL = CL
(IDD), AL = 0; tCK = tCK (IDD), tRAS = tRAS MAX
(IDD), tRP = tRP (IDD); CKE is HIGH, CS# is HIGH be-
tween valid commands; Address bus inputs are
switching; Data bus inputs are switching
IDD4W x4, x8 160 130 110 mA
x16 210 190 170
Operating burst read current: All banks open,
continuous burst reads, IOUT = 0mA; BL = 4, CL =
CL (IDD), AL = 0; tCK = tCK (IDD), tRAS = tRAS MAX
(IDD), tRP = tRP (IDD); CKE is HIGH, CS# is HIGH be-
tween valid commands; Address bus inputs are
switching; Data bus inputs are switching
IDD4R x4, x8 160 130 110 mA
x16 210 190 170
2Gb: x4, x8, x16 DDR2 SDRAM
Electrical Specifications – IDD Parameters
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN 30 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2006 Micron Technology, Inc. All rights reserved.
Table 11: DDR2 IDD Specifications and Conditions (Die Revision C) (Continued)
Notes 1–7 apply to the entire table
Parameter/Condition Symbol Configuration -187E -25E/-25 -3 Units
Burst refresh current: tCK = tCK (IDD); refresh
command at every tRFC (IDD) interval; CKE is
HIGH, CS# is HIGH between valid commands;
Other control and address bus inputs are switch-
ing; Data bus inputs are switching
IDD5 x4, x8 175 170 165 mA
x16 175 170 165
Self refresh current: CK and CK# at 0V; CKE
0.2V; Other control and address bus inputs are
floating; Data bus inputs are floating
IDD6 x4, x8, x16 12 12 12 mA
IDD6L 888
Operating bank interleave read current: All
bank interleaving reads, IOUT = 0mA; BL = 4, CL =
CL (IDD), AL = tRCD (IDD) - 1 x tCK (IDD); tCK = tCK
(IDD), tRC = tRC (IDD), tRRD = tRRD (IDD), tRCD =
tRCD (IDD); CKE is HIGH, CS# is HIGH between val-
id commands; Address bus inputs are stable dur-
ing deselects; Data bus inputs are switching (see
Table 9 (page 27) for details)
IDD7 x4, x8 230 220 200 mA
x16 290 280 250
Notes: 1. IDD specifications are tested after the device is properly initialized. 0°C TC +85°C.
2. VDD = +1.8V ±0.1V, VDDQ = +1.8V ±0.1V, VDDL = +1.8V ±0.1V, VREF = VDDQ/2.
3. IDD parameters are specified with ODT disabled.
4. Data bus consists of DQ, DM, DQS, DQS#, RDQS, RDQS#, LDQS, LDQS#, UDQS, and
UDQS#. IDD values must be met with all combinations of EMR bits 10 and 11.
5. Definitions for IDD conditions:
LOW VIN VIL(AC)max
HIGH VIN VIH(AC)min
Stable Inputs stable at a HIGH or LOW level
Floating Inputs at VREF = VDDQ/2
Switching Inputs changing between HIGH and LOW every other clock cycle (once per
two clocks) for address and control signals
Switching Inputs changing between HIGH and LOW every other data transfer (once
per clock) for DQ signals, not including masks or strobes
6. IDD1, IDD4R, and IDD7 require A12 in EMR1 to be enabled during testing.
7. The following IDD values must be derated (IDD limits increase) on IT-option devices when
operated outside of the range 0°C TC 85°C:
When
TC
0°C
IDD2P and IDD3P(SLOW) must be derated by 4%; IDD4R and IDD4W
must be derated by 2%; and IDD6 and IDD7 must be derated by
7%.
When
TC
85°C
IDD0, IDD1, IDD2N, IDD2Q, IDD3N, IDD3P(FAST), IDD4R, IDD4W, and IDD5
must be derated by 2%; IDD2P must be derated by 20%; IDD3P
slow must be derated by 30%; and IDD6 must be derated by
80% (IDD6 will increase by this amount if TC < 85°C and the 2x
refresh option is still enabled).
2Gb: x4, x8, x16 DDR2 SDRAM
Electrical Specifications – IDD Parameters
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN 31 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2006 Micron Technology, Inc. All rights reserved.
AC Timing Operating Specifications
Table 12: AC Operating Specifications and Conditions
Not all speed grades listed may be supported for this device; refer to the title page for speeds supported; Notes: 1–5 apply to the entire table;
VDDQ = 1.8V ±0.1V, VDD = 1.8V ±0.1V
AC Characteristics -187E -25E -25 -3E -3 -37E -5E
Units NotesParameter Symbol Min Max Min Max Min Max Min Max Min Max Min Max Min Max
Clock
Clock
cycle time
CL = 7 tCK (avg) 1.875 8.0 ns 6, 7, 8,
9
CL = 6 tCK (avg) 2.5 8.0 2.5 8.0 2.5 8.0
CL = 5 tCK (avg) 2.5 8.0 2.5 8.0 3.0 8.0 3.0 8.0 3.0 8.0
CL = 4 tCK (avg) 3.75 8.0 3.75 8.0 3.75 8.0 3.0 8.0 3.75 8.0 3.75 8.0 5.0 8.0
CL = 3 tCK (avg) 5.0 8.0 5.0 8.0 5.0 8.0 5.0 8.0 5.0 8.0 5.0 8.0 5.0 8.0
CK high-level
width
tCH (avg) 0.48 0.52 0.48 0.52 0.48 0.52 0.48 0.52 0.48 0.52 0.48 0.52 0.48 0.52 tCK 10
CK low-level width tCL (avg) 0.48 0.52 0.48 0.52 0.48 0.52 0.48 0.52 0.48 0.52 0.48 0.52 0.48 0.52 tCK
Half clock period tHP MIN = lesser of tCH and tCL
MAX = n/a
ps 11
Absolute tCK tCK (abs) MIN = tCK (AVG) MIN + tJITper (MIN)
MAX = tCK (AVG) MAX + tJITper (MAX)
ps
Absolute CK
high-level width
tCH (abs) MIN = tCK (AVG) MIN × tCH (AVG) MIN + tJITdty (MIN)
MAX = tCK (AVG) MAX × tCH (AVG) MAX + tJITdty (MAX)
ps
Absolute CK
low-level width
tCL (abs) MIN = tCK (AVG) MIN × tCL (AVG) MIN + tJITdty (MIN)
MAX = tCK (AVG) MAX × tCL (AVG) MAX + tJITdty (MAX)
ps
2Gb: x4, x8, x16 DDR2 SDRAM
AC Timing Operating Specifications
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN 32 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2006 Micron Technology, Inc. All rights reserved.
Table 12: AC Operating Specifications and Conditions (Continued)
Not all speed grades listed may be supported for this device; refer to the title page for speeds supported; Notes: 1–5 apply to the entire table;
VDDQ = 1.8V ±0.1V, VDD = 1.8V ±0.1V
AC Characteristics -187E -25E -25 -3E -3 -37E -5E
Units NotesParameter Symbol Min Max Min Max Min Max Min Max Min Max Min Max Min Max
Clock Jitter
Period jitter tJITper –90 90 –100 100 –100 100 –125 125 –125 125 –125 125 –125 125 ps 12
Half period tJITdty –75 75 –100 100 –100 100 –125 125 –125 125 –125 125 –150 150 ps 13
Cycle to cycle tJITcc 180 200 200 250 250 250 250 ps 14
Cumulative error,
2 cycles
tERR2per –132 132 –150 150 –150 150 –175 175 –175 175 –175 175 –175 175 ps 15
Cumulative error,
3 cycles
tERR3per –157 157 –175 175 –175 175 –225 225 –225 225 –225 225 –225 225 ps 15
Cumulative error,
4 cycles
tERR4per –175 175 –200 200 –200 200 –250 250 –250 250 –250 250 –250 250 ps 15
Cumulative error,
5 cycles
tERR5per –188 188 –200 200 –200 200 –250 250 –250 250 –250 250 –250 250 ps 15, 16
Cumulative error,
6–10 cycles
tERR6–
10per
–250 250 –300 300 –300 300 –350 350 –350 350 –350 350 –350 350 ps 15, 16
Cumulative error,
11–50 cycles
tERR11–
50per
–425 425 –450 450 –450 450 –450 450 –450 450 –450 450 –450 450 ps 15
Data Strobe-Out
DQS output access
time from CK/CK#
tDQSCK –300 300 –350 350 –350 350 –400 400 –400 400 –450 450 –500 500 ps 19
DQS read pream-
ble
tRPRE MIN = 0.9 × tCK
MAX = 1.1 × tCK
tCK 17, 18,
19
DQS read
postamble
tRPST MIN = 0.4 × tCK
MAX = 0.6 × tCK
tCK 17, 18,
19, 20
CK/CK# to DQS
Low-Z
tLZ1MIN = tAC (MIN)
MAX = tAC (MAX)
ps 19, 21,
22
2Gb: x4, x8, x16 DDR2 SDRAM
AC Timing Operating Specifications
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN 33 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2006 Micron Technology, Inc. All rights reserved.
Table 12: AC Operating Specifications and Conditions (Continued)
Not all speed grades listed may be supported for this device; refer to the title page for speeds supported; Notes: 1–5 apply to the entire table;
VDDQ = 1.8V ±0.1V, VDD = 1.8V ±0.1V
AC Characteristics -187E -25E -25 -3E -3 -37E -5E
Units NotesParameter Symbol Min Max Min Max Min Max Min Max Min Max Min Max Min Max
Data Strobe-In
DQS rising edge to
CK rising edge
tDQSS MIN = –0.25 × tCK
MAX = 0.25 × tCK
tCK 18
DQS input-high
pulse width
tDQSH MIN = 0.35 × tCK
MAX = n/a
tCK 18
DQS input-low
pulse width
tDQSL MIN = 0.35 × tCK
MAX = n/a
tCK 18
DQS falling to CK
rising: setup time
tDSS MIN = 0.2 × tCK
MAX = n/a
tCK 18
DQS falling from
CK rising:
hold time
tDSH MIN = 0.2 × tCK
MAX = n/a
tCK 18
Write preamble
setup time
tWPRES MIN = 0
MAX = n/a
ps 23, 24
DQS write
preamble
tWPRE MIN = 0.35 × tCK
MAX = n/a
tCK 18
DQS write
postamble
tWPST MIN = 0.4 × tCK
MAX = 0.6 × tCK
tCK 18, 25
WRITE command
to first DQS
transition
MIN = WL - tDQSS
MAX = WL + tDQSS
tCK
2Gb: x4, x8, x16 DDR2 SDRAM
AC Timing Operating Specifications
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN 34 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2006 Micron Technology, Inc. All rights reserved.
Table 12: AC Operating Specifications and Conditions (Continued)
Not all speed grades listed may be supported for this device; refer to the title page for speeds supported; Notes: 1–5 apply to the entire table;
VDDQ = 1.8V ±0.1V, VDD = 1.8V ±0.1V
AC Characteristics -187E -25E -25 -3E -3 -37E -5E
Units NotesParameter Symbol Min Max Min Max Min Max Min Max Min Max Min Max Min Max
Data-Out
DQ output access
time from CK/CK#
tAC –350 350 –400 400 –400 400 –450 450 –450 450 –500 500 –600 600 ps 19
DQS–DQ skew,
DQS to last DQ
valid, per group,
per access
tDQSQ 175 200 200 240 240 300 350 ps 26, 27
DQ hold from next
DQS strobe
tQHS 250 – 300 – 300 – 340 – 340 – 400 – 450 ps 28
DQ–DQS hold, DQS
to first DQ not val-
id
tQH MIN = tHP - tQHS
MAX = n/a
ps 26, 27,
28
CK/CK# to DQ, DQS
High-Z
tHZ MIN = n/a
MAX = tAC (MAX)
ps 19, 21,
29
CK/CK# to DQ
Low-Z
tLZ2MIN = 2 × tAC (MIN)
MAX = tAC (MAX)
ps 19, 21,
22
Data valid output
window
DVW MIN = tQH - tDQSQ
MAX = n/a
ns 26, 27
Data-In
DQ and DM input
setup time to DQS
tDSb 0 50 50 100 100 100 150 ps 26, 30,
31
DQ and DM input
hold time to DQS
tDHb 75 125 125 175 175 225 275 ps 26, 30,
31
DQ and DM input
setup time to DQS
tDSa 200 250 250 300 300 350 400 ps 26, 30,
31
DQ and DM input
hold time to DQS
tDHa 200 250 250 300 300 350 400 ps 26, 30,
31
DQ and DM input
pulse width
tDIPW MIN = 0.35 × tCK
MAX = n/a
tCK 18, 32
2Gb: x4, x8, x16 DDR2 SDRAM
AC Timing Operating Specifications
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Table 12: AC Operating Specifications and Conditions (Continued)
Not all speed grades listed may be supported for this device; refer to the title page for speeds supported; Notes: 1–5 apply to the entire table;
VDDQ = 1.8V ±0.1V, VDD = 1.8V ±0.1V
AC Characteristics -187E -25E -25 -3E -3 -37E -5E
Units NotesParameter Symbol Min Max Min Max Min Max Min Max Min Max Min Max Min Max
Command and Address
Input setup time tISb 125 175 175 200 200 250 350 ps 31, 33
Input hold time tIHb 200 250 250 275 275 375 475 ps 31, 33
Input setup time tISa 325 375 375 400 400 500 600 ps 31, 33
Input hold time tIHa 325 375 375 400 400 500 600 ps 31, 33
Input pulse width tIPW 0.6 0.6 – 0.6 – 0.6 – 0.6 – 0.6 – 0.6 – tCK 18, 32
ACTIVATE-to-
ACTIVATE delay,
same bank
tRC 54 55 55 54 55 55 55 ns 18, 34,
51
ACTIVATE-to-READ
or WRITE delay
tRCD 13.125 12.5 – 15 – 12 – 15 – 15 – 15 – ns 18
ACTIVATE-to-
PRECHARGE delay
tRAS 40 70K 40 70K 40 70K 40 70K 40 70K 40 70K 40 70K ns 18, 34,
35
PRECHARGE period tRP 13.125 12.5 15 12 15 15 15 ns 18, 36
PRE-
CHARGE
ALL period
<1Gb tRPA 13.125 12.5 15 12 15 15 15 ns 18, 36
1Gb tRPA 15 15 17.5 15 18 18.75 20 ns 18, 36
ACTIVATE
-to-
ACTIVATE
delay
different
bank
x4, x8 tRRD 7.5 7.5 7.5 7.5 7.5 7.5 7.5 ns 18, 37
x16 tRRD 10 10 10 10 10 10 10 ns 18, 37
4-bank
activate
period
(1Gb)
x4, x8 tFAW 35 35 35 37.5 37.5 37.5 37.5 ns 18, 38
x16 tFAW 45 45 45 50 50 50 50 ns 18, 38
2Gb: x4, x8, x16 DDR2 SDRAM
AC Timing Operating Specifications
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Table 12: AC Operating Specifications and Conditions (Continued)
Not all speed grades listed may be supported for this device; refer to the title page for speeds supported; Notes: 1–5 apply to the entire table;
VDDQ = 1.8V ±0.1V, VDD = 1.8V ±0.1V
AC Characteristics -187E -25E -25 -3E -3 -37E -5E
Units NotesParameter Symbol Min Max Min Max Min Max Min Max Min Max Min Max Min Max
Command and Address
Internal READ-to-
PRECHARGE delay
tRTP 7.5 7.5 7.5 7.5 7.5 7.5 7.5 ns 18, 37,
39
CAS#-to-CAS#
delay
tCCD2 – 2–2–2–2–2–2–
tCK 18
Write recovery
time
tWR 15 15 15 15 15 15 15 ns 18, 37
Write AP recovery
+ precharge time
tDAL tWR +
tRP
tWR +
tRP
tWR +
tRP
tWR +
tRP
tWR +
tRP
tWR +
tRP
tWR +
tRP
–ns 40
Internal WRITE-to-
READ delay
tWTR 7.5 7.5 7.5 7.5 7.5 7.5 10 ns 18, 37
LOAD MODE cycle
time
tMRD2 – 2–2–2–2–2–2–
tCK 18
Refresh
REFRESH-
to-
ACTIVATE
or to
-REFRESH
interval
256Mb tRFC 75 75 75 75 75 75 75 ns 18, 41
512Mb 105 105 – 105 – 105 – 105 – 105 – 105 –
1Gb 127.5 127.5 – 127.5 – 127.5 – 127.5 – 127.5 – 127.5 –
2Gb 195 195 – 195 – 195 – 195 – 195 – 195 –
Average periodic
refresh
(commercial)
tREFI 7.8 7.8 7.8 7.8 7.8 7.8 7.8 μs 18, 41
Average periodic
refresh
(industrial)
tREFIIT 3.9 3.9 3.9 3.9 3.9 3.9 3.9 μs 18, 41
Average periodic
refresh
(automotive)
tREFIAT 3.9 3.9 3.9 3.9 3.9 3.9 3.9 μs 18, 41
CKE LOW to CK,
CK# uncertainty
tDELAY MIN limit = tIS + tCK + tIH
MAX limit = n/a
ns 42
2Gb: x4, x8, x16 DDR2 SDRAM
AC Timing Operating Specifications
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Table 12: AC Operating Specifications and Conditions (Continued)
Not all speed grades listed may be supported for this device; refer to the title page for speeds supported; Notes: 1–5 apply to the entire table;
VDDQ = 1.8V ±0.1V, VDD = 1.8V ±0.1V
AC Characteristics -187E -25E -25 -3E -3 -37E -5E
Units NotesParameter Symbol Min Max Min Max Min Max Min Max Min Max Min Max Min Max
Self Refresh
Exit SELF REFRESH
to nonREAD
command
tXSNR MIN limit = tRFC (MIN) + 10
MAX limit = n/a
ns
Exit SELF REFRESH
to READ command
tXSRD MIN limit = 200
MAX limit = n/a
tCK 18
Exit SELF REFRESH
timing reference
tISXR MIN limit = tIS
MAX limit = n/a
ps 33, 43
Power-Down
Exit active
power-
down to
READ
command
MR12
= 0
tXARD 3 2 – 2 – 2 – 2 – 2 – 2 – tCK 18
MR12
= 1
10 -
AL
8 - AL 8 - AL 7 - AL 7 - AL 6 - AL 6 - AL tCK 18
Exit precharge
power-down and
active power-down
to any
nonREAD
command
tXP 3 – 2–2–2–2–2–2–
tCK 18
CKE MIN
HIGH/LOW time
tCKE MIN = 3
MAX = n/a
tCK 18, 44
2Gb: x4, x8, x16 DDR2 SDRAM
AC Timing Operating Specifications
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Table 12: AC Operating Specifications and Conditions (Continued)
Not all speed grades listed may be supported for this device; refer to the title page for speeds supported; Notes: 1–5 apply to the entire table;
VDDQ = 1.8V ±0.1V, VDD = 1.8V ±0.1V
AC Characteristics -187E -25E -25 -3E -3 -37E -5E
Units NotesParameter Symbol Min Max Min Max Min Max Min Max Min Max Min Max Min Max
ODT
ODT to power-
down entry latency
tANPD 4 3 – 3 – 3 – 3 – 3 – 3 – tCK 18
ODT power-down
exit latency
tAXPD 11 8 – 8 – 8 – 8 – 8 – 8 – tCK 18
ODT turn-on delay tAOND 2 tCK 18
ODT turn-off delay tAOFD 2.5 tCK 18, 45
ODT turn-on tAON tAC
(MIN)
tAC
(MAX)
+
2575
MIN = tAC (MIN)
MAX = tAC (MAX) + 600
MIN = tAC (MIN)
MAX = tAC (MAX) + 700
MIN = tAC (MIN)
MAX = tAC (MAX) + 1000
ps 19, 46
ODT turn-off tAOF MIN = tAC (MIN)
MAX = tAC (MAX) + 600
ps 47, 48
ODT turn-on
(power-down
mode)
tAONPD tAC
(MIN)
+ 2000
2 ×
tCK +
tAC
(MAX)
+
1000
MIN = tAC (MIN) + 2000
MAX = 2 × tCK + tAC (MAX) + 1000
ps 49
ODT turn-off
(power-down
mode)
tAOFPD MIN = tAC (MIN) + 2000
MAX = 2.5 × tCK + tAC (MAX) + 1000
ps
ODT enable from
MRS command
tMOD MIN = 12
MAX = n/a
ns 18, 50
2Gb: x4, x8, x16 DDR2 SDRAM
AC Timing Operating Specifications
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Notes: 1. All voltages are referenced to VSS.
2. Tests for AC timing, IDD, and electrical AC and DC characteristics may be conducted at nominal reference/supply
voltage levels, but the related specifications and the operation of the device are warranted for the full voltage
range specified. ODT is disabled for all measurements that are not ODT-specific.
3. Outputs measured with equivalent load (see Figure 16 (page 49)).
4. AC timing and IDD tests may use a VIL-to-VIH swing of up to 1.0V in the test environment, and parameter specifica-
tions are guaranteed for the specified AC input levels under normal use conditions. The slew rate for the input
signals used to test the device is 1.0 V/ns for signals in the range between VIL(AC) and VIH(AC). Slew rates other than
1.0 V/ns may require the timing parameters to be derated as specified.
5. The AC and DC input level specifications are as defined in the SSTL_18 standard (that is, the receiver will effective-
ly switch as a result of the signal crossing the AC input level and will remain in that state as long as the signal
does not ring back above [below] the DC input LOW [HIGH] level).
6. CK and CK# input slew rate is referenced at 1 V/ns (2 V/ns if measured differentially).
7. Operating frequency is only allowed to change during self refresh mode (see Figure 79 (page 124)), precharge
power-down mode, or system reset condition (see Reset (page 125)). SSC allows for small deviations in operating
frequency, provided the SSC guidelines are satisfied.
8. The clock’s tCK (AVG) is the average clock over any 200 consecutive clocks and tCK (AVG) MIN is the smallest clock
rate allowed (except for a deviation due to allowed clock jitter). Input clock jitter is allowed provided it does not
exceed values specified. Also, the jitter must be of a random Gaussian distribution in nature.
9. Spread spectrum is not included in the jitter specification values. However, the input clock can accommodate
spread spectrum at a sweep rate in the range 8–60 kHz with an additional one percent tCK (AVG); however, the
spread spectrum may not use a clock rate below tCK (AVG) MIN or above tCK (AVG) MAX.
10. MIN (tCL, tCH) refers to the smaller of the actual clock LOW time and the actual clock HIGH time driven to the
device. The clock’s half period must also be of a Gaussian distribution; tCH (AVG) and tCL (AVG) must be met with
or without clock jitter and with or without duty cycle jitter. tCH (AVG) and tCL (AVG) are the average of any 200
consecutive CK falling edges. tCH limits may be exceeded if the duty cycle jitter is small enough that the absolute
half period limits (tCH [ABS], tCL [ABS]) are not violated.
11. tHP (MIN) is the lesser of tCL and tCH actually applied to the device CK and CK# inputs; thus, tHP (MIN) the lesser
of tCL (ABS) MIN and tCH (ABS) MIN.
12. The period jitter (tJITper) is the maximum deviation in the clock period from the average or nominal clock allowed
in either the positive or negative direction. JEDEC specifies tighter jitter numbers during DLL locking time. During
DLL lock time, the jitter values should be 20 percent less those than noted in the table (DLL locked).
13. The half-period jitter (tJITdty) applies to either the high pulse of clock or the low pulse of clock; however, the two
cumulatively can not exceed tJITper.
14. The cycle-to-cycle jitter (tJITcc) is the amount the clock period can deviate from one cycle to the next. JEDEC speci-
fies tighter jitter numbers during DLL locking time. During DLL lock time, the jitter values should be 20 percent
less than those noted in the table (DLL locked).
15. The cumulative jitter error (tERRnper), where n is 2, 3, 4, 5, 6–10, or 11–50 is the amount of clock time allowed to
consecutively accumulate away from the average clock over any number of clock cycles.
16. JEDEC specifies using tERR6–10per when derating clock-related output timing (see notes 19 and 48). Micron requires
less derating by allowing tERR5per to be used.
17. This parameter is not referenced to a specific voltage level but is specified when the device output is no longer
driving (tRPST) or beginning to drive (tRPRE).
2Gb: x4, x8, x16 DDR2 SDRAM
AC Timing Operating Specifications
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18. The inputs to the DRAM must be aligned to the associated clock, that is, the actual clock that latches it in. Howev-
er, the input timing (in ns) references to the tCK (AVG) when determining the required number of clocks. The fol-
lowing input parameters are determined by taking the specified percentage times the tCK (AVG) rather than tCK:
tIPW, tDIPW, tDQSS, tDQSH, tDQSL, tDSS, tDSH, tWPST, and tWPRE.
19. The DRAM output timing is aligned to the nominal or average clock. Most output parameters must be derated by
the actual jitter error when input clock jitter is present; this will result in each parameter becoming larger. The
following parameters are required to be derated by subtracting tERR5per (MAX): tAC (MIN), tDQSCK (MIN), tLZDQS
(MIN), tLZDQ (MIN), tAON (MIN); while the following parameters are required to be derated by subtracting
tERR5per (MIN): tAC (MAX), tDQSCK (MAX), tHZ (MAX), tLZDQS (MAX), tLZDQ (MAX), tAON (MAX). The parameter
tRPRE (MIN) is derated by subtracting tJITper (MAX), while tRPRE (MAX), is derated by subtracting tJITper (MIN).
The parameter tRPST (MIN) is derated by subtracting tJITdty (MAX), while tRPST (MAX), is derated by subtracting
tJITdty (MIN). Output timings that require tERR5per derating can be observed to have offsets relative to the clock;
however, the total window will not degrade.
20. When DQS is used single-ended, the minimum limit is reduced by 100ps.
21. tHZ and tLZ transitions occur in the same access time windows as valid data transitions. These parameters are not
referenced to a specific voltage level, but specify when the device output is no longer driving (tHZ) or begins driv-
ing (tLZ).
22. tLZ (MIN) will prevail over a tDQSCK (MIN) + tRPRE (MAX) condition.
23. This is not a device limit. The device will operate with a negative value, but system performance could be degra-
ded due to bus turnaround.
24. It is recommended that DQS be valid (HIGH or LOW) on or before the WRITE command. The case shown (DQS go-
ing from High-Z to logic LOW) applies when no WRITEs were previously in progress on the bus. If a previous
WRITE was in progress, DQS could be HIGH during this time, depending on tDQSS.
25. The intent of the “Don’t Care” state after completion of the postamble is that the DQS-driven signal should either
be HIGH, LOW, or High-Z, and that any signal transition within the input switching region must follow valid input
requirements. That is, if DQS transitions HIGH (above VIH[DC]min), then it must not transition LOW (below VIH[DC])
prior to tDQSH (MIN).
26. Referenced to each output group: x4 = DQS with DQ[3:0]; x8 = DQS with DQ[7:0]; x16 = LDQS with DQ[7:0]; and
UDQS with DQ[15:8].
27. The data valid window is derived by achieving other specifications: tHP (tCK/2), tDQSQ, and tQH (tQH = tHP - tQHS).
The data valid window derates in direct proportion to the clock duty cycle and a practical data valid window can
be derived.
28. tQH = tHP - tQHS; the worst case tQH would be the lesser of tCL (ABS) MAX or tCH (ABS) MAX times tCK (ABS) MIN
- tQHS. Minimizing the amount of tCH (AVG) offset and value of tJITdty will provide a larger tQH, which in turn
will provide a larger valid data out window.
29. This maximum value is derived from the referenced test load. tHZ (MAX) will prevail over tDQSCK (MAX) + tRPST
(MAX) condition.
30. The values listed are for the differential DQS strobe (DQS and DQS#) with a differential slew rate of 2 V/ns (1 V/ns
for each signal). There are two sets of values listed: tDSa, tDHa and tDSb, tDHb. The tDSa, tDHa values (for reference
only) are equivalent to the baseline values of tDSb, tDHb at VREF when the slew rate is 2 V/ns, differentially. The
baseline values, tDSb, tDHb, are the JEDEC-defined values, referenced from the logic trip points. tDSb is referenced
from VIH(AC) for a rising signal and VIL(AC) for a falling signal, while tDHb is referenced from VIL(DC) for a rising sig-
nal and VIH(DC) for a falling signal. If the differential DQS slew rate is not equal to 2 V/ns, then the baseline values
must be derated by adding the values from Table 31 (page 62) and Table 32 (page 63). If the DQS differential
strobe feature is not enabled, then the DQS strobe is single-ended and the baseline values must be derated using
2Gb: x4, x8, x16 DDR2 SDRAM
AC Timing Operating Specifications
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© 2006 Micron Technology, Inc. All rights reserved.
Table 33 (page 64). Single-ended DQS data timing is referenced at DQS crossing VREF. The correct timing values
for a single-ended DQS strobe are listed in Table 34 (page 64)–Table 36 (page 65) on Table 34 (page 64),
Table 35 (page 65), and Table 36 (page 65); listed values are already derated for slew rate variations and con-
verted from baseline values to VREF values.
31. VIL/VIH DDR2 overshoot/undershoot. See AC Overshoot/Undershoot Specification (page 55).
32. For each input signal—not the group collectively.
33. There are two sets of values listed for command/address: tISa, tIHa and tISb, tIHb. The tISa, tIHa values (for reference
only) are equivalent to the baseline values of tISb, tIHb at VREF when the slew rate is 1 V/ns. The baseline values,
tISb, tIHb, are the JEDEC-defined values, referenced from the logic trip points. tISb is referenced from VIH(AC) for a
rising signal and VIL(AC) for a falling signal, while tIHb is referenced from VIL(DC) for a rising signal and VIH(DC) for a
falling signal. If the command/address slew rate is not equal to 1 V/ns, then the baseline values must be derated
by adding the values from Table 29 (page 58) and Table 30 (page 59).
34. This is applicable to READ cycles only. WRITE cycles generally require additional time due to tWR during auto pre-
charge.
35. READs and WRITEs with auto precharge are allowed to be issued before tRAS (MIN) is satisfied because tRAS lock-
out feature is supported in DDR2 SDRAM.
36. When a single-bank PRECHARGE command is issued, tRP timing applies. tRPA timing applies when the PRE-
CHARGE (ALL) command is issued, regardless of the number of banks open. For 8-bank devices (1Gb), tRPA (MIN)
= tRP (MIN) + tCK (AVG) (Table 12 (page 32) lists tRP [MIN] + tCK [AVG] MIN).
37. This parameter has a two clock minimum requirement at any tCK.
38. The tFAW (MIN) parameter applies to all 8-bank DDR2 devices. No more than four bank-ACTIVATE commands may
be issued in a given tFAW (MIN) period. tRRD (MIN) restriction still applies.
39. The minimum internal READ-to-PRECHARGE time. This is the time from which the last 4-bit prefetch begins to
when the PRECHARGE command can be issued. A 4-bit prefetch is when the READ command internally latches the
READ so that data will output CL later. This parameter is only applicable when tRTP/(2 × tCK) > 1, such as frequen-
cies faster than 533 MHz when tRTP = 7.5ns. If tRTP/(2 × tCK) 1, then equation AL + BL/2 applies. tRAS (MIN) has
to be satisfied as well. The DDR2 SDRAM will automatically delay the internal PRECHARGE command until tRAS
(MIN) has been satisfied.
40. tDAL = (nWR) + (tRP/tCK). Each of these terms, if not already an integer, should be rounded up to the next integer.
tCK refers to the application clock period; nWR refers to the tWR parameter stored in the MR9–MR11. For exam-
ple, -37E at tCK = 3.75ns with tWR programmed to four clocks would have tDAL = 4 + (15ns/3.75ns) clocks = 4 + (4)
clocks = 8 clocks.
41. The refresh period is 64ms (commercial) or 32ms (industrial and automotive). This equates to an average refresh
rate of 7.8125μs (commercial) or 3.9607μs (industrial and automotive). To ensure all rows of all banks are properly
refreshed, 8192 REFRESH commands must be issued every 64ms (commercial) or 32ms (industrial and automotive).
The JEDEC tRFC MAX of 70,000ns is not required as bursting of AUTO REFRESH commands is allowed.
42. tDELAY is calculated from tIS + tCK + tIH so that CKE registration LOW is guaranteed prior to CK, CK# being re-
moved in a system RESET condition (see Reset (page 125)).
43. tISXR is equal to tIS and is used for CKE setup time during self refresh exit, as shown in Figure 69 (page 116).
44. tCKE (MIN) of three clocks means CKE must be registered on three consecutive positive clock edges. CKE must re-
main at the valid input level the entire time it takes to achieve the three clocks of registration. Thus, after any
CKE transition, CKE may not transition from its valid level during the time period of tIS + 2 × tCK + tIH.
2Gb: x4, x8, x16 DDR2 SDRAM
AC Timing Operating Specifications
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45. The half-clock of tAOFD’s 2.5 tCK assumes a 50/50 clock duty cycle. This half-clock value must be derated by the
amount of half-clock duty cycle error. For example, if the clock duty cycle was 47/53, tAOFD would actually be 2.5 -
0.03, or 2.47, for tAOF (MIN) and 2.5 + 0.03, or 2.53, for tAOF (MAX).
46. ODT turn-on time tAON (MIN) is when the device leaves High-Z and ODT resistance begins to turn on. ODT turn-
on time tAON (MAX) is when the ODT resistance is fully on. Both are measured from tAOND.
47. ODT turn-off time tAOF (MIN) is when the device starts to turn off ODT resistance. ODT turn off time tAOF (MAX)
is when the bus is in High-Z. Both are measured from tAOFD.
48. Half-clock output parameters must be derated by the actual tERR5per and tJITdty when input clock jitter is present;
this will result in each parameter becoming larger. The parameter tAOF (MIN) is required to be derated by sub-
tracting both tERR5per (MAX) and tJITdty (MAX). The parameter tAOF (MAX) is required to be derated by subtract-
ing both tERR5per (MIN) and tJITdty (MIN).
49. The -187E maximum limit is 2 × tCK + tAC (MAX) + 1000 but it will likely be 3 x tCK + tAC (MAX) + 1000 in the
future.
50. Should use 8 tCK for backward compatibility.
51. DRAM devices should be evenly addressed when being accessed. Disproportionate accesses to a particular row ad-
dress may result in reduction of the product lifetime.
2Gb: x4, x8, x16 DDR2 SDRAM
AC Timing Operating Specifications
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AC and DC Operating Conditions
Table 13: Recommended DC Operating Conditions (SSTL_18)
All voltages referenced to VSS
Parameter Symbol Min Nom Max Units Notes
Supply voltage VDD 1.7 1.8 1.9 V 1, 2
VDDL supply voltage VDDL 1.7 1.8 1.9 V 2, 3
I/O supply voltage VDDQ 1.7 1.8 1.9 V 2, 3
I/O reference voltage VREF(DC) 0.49 × VDDQ 0.50 × VDDQ 0.51 × VDDQ V4
I/O termination voltage (system) VTT VREF(DC) - 40 VREF(DC) VREF(DC) + 40 mV 5
Notes: 1. VDD and VDDQ must track each other. VDDQ must be VDD.
2. VSSQ = VSSL = VSS.
3. VDDQ tracks with VDD; VDDL tracks with VDD.
4. VREF is expected to equal VDDQ/2 of the transmitting device and to track variations in the
DC level of the same. Peak-to-peak noise (noncommon mode) on VREF may not exceed
±1 percent of the DC value. Peak-to-peak AC noise on VREF may not exceed ±2 percent
of VREF(DC). This measurement is to be taken at the nearest VREF bypass capacitor.
5. VTT is not applied directly to the device. VTT is a system supply for signal termination re-
sistors, is expected to be set equal to VREF, and must track variations in the DC level of
VREF.
ODT DC Electrical Characteristics
Table 14: ODT DC Electrical Characteristics
All voltages are referenced to VSS
Parameter Symbol Min Nom Max Units Notes
RTT effective impedance value for 75Ω setting
EMR (A6, A2) = 0, 1
RTT1(EFF) 60 75 90 Ω1, 2
RTT effective impedance value for 150Ω setting
EMR (A6, A2) = 1, 0
RTT2(EFF) 120 150 180 Ω1, 2
RTT effective impedance value for 50Ω setting
EMR (A6, A2) = 1, 1
RTT3(EFF) 40 50 60 Ω1, 2
Deviation of VM with respect to VDDQ/2 ΔVM –6 – 6 % 3
Notes: 1. RTT1(EFF) and RTT2(EFF) are determined by separately applying VIH(AC) and VIL(DC) to the ball
being tested, and then measuring current, I(VIH[AC]), and I(VIL[AC]), respectively.
RTT(EFF) = VIH(AC) - VIL(AC)
I(VIH(AC)) - I(VIL(AC))
2. Minimum IT and AT device values are derated by six percent less when the devices oper-
ate between –40°C and 0°C (TC ).
3. Measure voltage (VM) at tested ball with no load.
ΔVM = 2 × VM
VDDQ - 1 × 100
2Gb: x4, x8, x16 DDR2 SDRAM
AC and DC Operating Conditions
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Input Electrical Characteristics and Operating Conditions
Table 15: Input DC Logic Levels
All voltages are referenced to VSS
Parameter Symbol Min Max Units
Input high (logic 1) voltage VIH(DC) VREF(DC) + 125 VDDQ1mV
Input low (logic 0) voltage VIL(DC) –300 VREF(DC) - 125 mV
Note: 1. VDDQ + 300mV allowed provided 1.9V is not exceeded.
Table 16: Input AC Logic Levels
All voltages are referenced to VSS
Parameter Symbol Min Max Units
Input high (logic 1) voltage (-37E/-5E) VIH(AC) VREF(DC) + 250 VDDQ1mV
Input high (logic 1) voltage (-187E/-25E/-25/-3E/-3) VIH(AC) VREF(DC) + 200 VDDQ1mV
Input low (logic 0) voltage (-37E/-5E) VIL(AC) –300 VREF(DC) - 250 mV
Input low (logic 0) voltage (-187E/-25E/-25/-3E/-3) VIL(AC) –300 VREF(DC) - 200 mV
Note: 1. Refer to AC Overshoot/Undershoot Specification (page 55).
Figure 13: Single-Ended Input Signal Levels
650mV
775mV
864mV
882mV
900mV
918mV
936mV
1,025mV
1,150mV
VIL(AC)
VIL(DC)
VREF - AC noise
VREF - DC error
VREF + DC error
VREF + AC noise
VIH(DC)
VIH(AC)
Note: 1. Numbers in diagram reflect nominal DDR2-400/DDR2-533 values.
2Gb: x4, x8, x16 DDR2 SDRAM
Input Electrical Characteristics and Operating Conditions
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Table 17: Differential Input Logic Levels
All voltages referenced to VSS
Parameter Symbol Min Max Units Notes
DC input signal voltage VIN(DC) –300 VDDQ mV 1, 6
DC differential input voltage VID(DC) 250 VDDQ mV 2, 6
AC differential input voltage VID(AC) 500 VDDQ mV 3, 6
AC differential cross-point voltage VIX(AC) 0.50 × VDDQ - 175 0.50 × VDDQ + 175 mV 4
Input midpoint voltage VMP(DC) 850 950 mV 5
Notes: 1. VIN(DC) specifies the allowable DC execution of each input of differential pair such as CK,
CK#, DQS, DQS#, LDQS, LDQS#, UDQS, UDQS#, and RDQS, RDQS#.
2. VID(DC) specifies the input differential voltage |VTR - VCP| required for switching, where
VTR is the true input (such as CK, DQS, LDQS, UDQS) level and VCP is the complementary
input (such as CK#, DQS#, LDQS#, UDQS#) level. The minimum value is equal to VIH(DC) -
VIL(DC). Differential input signal levels are shown in Figure 14.
3. VID(AC) specifies the input differential voltage |VTR - VCP| required for switching, where
VTR is the true input (such as CK, DQS, LDQS, UDQS, RDQS) level and VCP is the comple-
mentary input (such as CK#, DQS#, LDQS#, UDQS#, RDQS#) level. The minimum value is
equal to VIH(AC) - VIL(AC), as shown in Table 16 (page 45).
4. The typical value of VIX(AC) is expected to be about 0.5 × VDDQ of the transmitting device
and VIX(AC) is expected to track variations in VDDQ. VIX(AC) indicates the voltage at which
differential input signals must cross, as shown in Figure 14.
5. VMP(DC) specifies the input differential common mode voltage (VTR + VCP)/2 where VTR is
the true input (CK, DQS) level and VCP is the complementary input (CK#, DQS#). VMP(DC)
is expected to be approximately 0.5 × VDDQ.
6. VDDQ + 300mV allowed provided 1.9V is not exceeded.
Figure 14: Differential Input Signal Levels
TR2
CP2
2.1V
VDDQ = 1.8V
VIN(DC)max1
VIN(DC)min1
–0.30V
0.9V
1.075V
0.725V
VID(AC)6
VID(DC)5
X
VMP(DC)3VIX(AC)4
X
Notes: 1. TR and CP may not be more positive than VDDQ + 0.3V or more negative than VSS - 0.3V.
2. TR represents the CK, DQS, RDQS, LDQS, and UDQS signals; CP represents CK#, DQS#,
RDQS#, LDQS#, and UDQS# signals.
3. This provides a minimum of 850mV to a maximum of 950mV and is expected to be
VDDQ/2.
4. TR and CP must cross in this region.
5. TR and CP must meet at least VID(DC)min when static and is centered around VMP(DC).
6. TR and CP must have a minimum 500mV peak-to-peak swing.
2Gb: x4, x8, x16 DDR2 SDRAM
Input Electrical Characteristics and Operating Conditions
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7. Numbers in diagram reflect nominal values (VDDQ = 1.8V).
2Gb: x4, x8, x16 DDR2 SDRAM
Input Electrical Characteristics and Operating Conditions
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Output Electrical Characteristics and Operating Conditions
Table 18: Differential AC Output Parameters
Parameter Symbol Min Max Units Notes
AC differential cross-point voltage VOX(AC) 0.50 × VDDQ - 125 0.50 × VDDQ + 125 mV 1
AC differential voltage swing Vswing 1.0 mV
Note: 1. The typical value of VOX(AC) is expected to be about 0.5 × VDDQ of the transmitting de-
vice and VOX(AC) is expected to track variations in VDDQ. VOX(AC) indicates the voltage at
which differential output signals must cross.
Figure 15: Differential Output Signal Levels
Crossing point
VOX
VSSQ
Vswing
VDDQ
VTR
VCP
Table 19: Output DC Current Drive
Parameter Symbol Value Units Notes
Output MIN source DC current IOH –13.4 mA 1, 2, 4
Output MIN sink DC current IOL 13.4 mA 2, 3, 4
Notes: 1. For IOH(DC); VDDQ = 1.7V, VOUT = 1,420mV. (VOUT - VDDQ)/IOH must be less than 21Ω for val-
ues of VOUT between VDDQ and VDDQ - 280mV.
2. For IOL(DC); VDDQ = 1.7V, VOUT = 280mV. VOUT/IOL must be less than 21Ω for values of VOUT
between 0V and 280mV.
3. The DC value of VREF applied to the receiving device is set to VTT.
4. The values of IOH(DC) and IOL(DC) are based on the conditions given in Notes 1 and 2. They
are used to test device drive current capability to ensure VIH,min plus a noise margin and
VIL,max minus a noise margin are delivered to an SSTL_18 receiver. The actual current val-
ues are derived by shifting the desired driver operating point (see output IV curves)
along a 21Ω load line to define a convenient driver current for measurement.
2Gb: x4, x8, x16 DDR2 SDRAM
Output Electrical Characteristics and Operating Conditions
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Table 20: Output Characteristics
Parameter Min Nom Max Units Notes
Output impedance See Output Driver Characteristics (page 50) Ω1, 2
Pull-up and pull-down mismatch 0 4 Ω1, 2, 3
Output slew rate 1.5 5 V/ns 1, 4, 5, 6
Notes: 1. Absolute specifications: 0°C TC +85°C; VDDQ = 1.8V ±0.1V, VDD = 1.8V ±0.1V.
2. Impedance measurement conditions for output source DC current: VDDQ = 1.7V; VOUT =
1420mV; (VOUT - VDDQ)/IOH must be less than 23.4Ω for values of VOUT between VDDQ and
VDDQ - 280mV. The impedance measurement condition for output sink DC current: VDDQ
= 1.7V; VOUT = 280mV; VOUT/IOL must be less than 23.4Ω for values of VOUT between 0V
and 280mV.
3. Mismatch is an absolute value between pull-up and pull-down; both are measured at
the same temperature and voltage.
4. Output slew rate for falling and rising edges is measured between VTT - 250mV and VTT
+ 250mV for single-ended signals. For differential signals (DQS, DQS#), output slew rate
is measured between DQS - DQS# = –500mV and DQS# - DQS = 500mV. Output slew rate
is guaranteed by design but is not necessarily tested on each device.
5. The absolute value of the slew rate as measured from VIL(DC)max to VIH(DC)min is equal to
or greater than the slew rate as measured from VIL(AC)max to VIH(AC)min. This is guaran-
teed by design and characterization.
6. IT and AT devices require an additional 0.4 V/ns in the MAX limit when TC is between –
40°C and 0°C.
Figure 16: Output Slew Rate Load
Output
(VOUT)
Reference
point
25Ω
VTT = VDDQ/2
2Gb: x4, x8, x16 DDR2 SDRAM
Output Electrical Characteristics and Operating Conditions
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Output Driver Characteristics
Figure 17: Full Strength Pull-Down Characteristics
VOUT (V)
0.0 0.5 1.0 1.5
120
100
80
60
40
20
0
IOUT (mA)
Table 21: Full Strength Pull-Down Current (mA)
Voltage (V) Min Nom Max
0.0 0.00 0.00 0.00
0.1 4.30 5.63 7.95
0.2 8.60 11.30 15.90
0.3 12.90 16.52 23.85
0.4 16.90 22.19 31.80
0.5 20.40 27.59 39.75
0.6 23.28 32.39 47.70
0.7 25.44 36.45 55.55
0.8 26.79 40.38 62.95
0.9 27.67 44.01 69.55
1.0 28.38 47.01 75.35
1.1 28.96 49.63 80.35
1.2 29.46 51.71 84.55
1.3 29.90 53.32 87.95
1.4 30.29 54.9 90.70
1.5 30.65 56.03 93.00
1.6 30.98 57.07 95.05
1.7 31.31 58.16 97.05
1.8 31.64 59.27 99.05
1.9 31.96 60.35 101.05
2Gb: x4, x8, x16 DDR2 SDRAM
Output Driver Characteristics
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Figure 18: Full Strength Pull-Up Characteristics
VDDQ - VOUT (V)
0
–20
–40
–60
–80
–100
–120
0 0.5 1.0 1.5
IOUT (mA)
Table 22: Full Strength Pull-Up Current (mA)
Voltage (V) Min Nom Max
0.0 0.00 0.00 0.00
0.1 –4.30 –5.63 –7.95
0.2 –8.60 –11.30 –15.90
0.3 –12.90 –16.52 –23.85
0.4 –16.90 –22.19 –31.80
0.5 –20.40 –27.59 –39.75
0.6 –23.28 –32.39 –47.70
0.7 –25.44 –36.45 –55.55
0.8 –26.79 –40.38 –62.95
0.9 –27.67 –44.01 –69.55
1.0 –28.38 –47.01 –75.35
1.1 –28.96 –49.63 –80.35
1.2 –29.46 –51.71 –84.55
1.3 –29.90 –53.32 –87.95
1.4 –30.29 –54.90 –90.70
1.5 –30.65 –56.03 –93.00
1.6 –30.98 –57.07 –95.05
1.7 –31.31 –58.16 –97.05
1.8 –31.64 –59.27 –99.05
1.9 –31.96 –60.35 –101.05
2Gb: x4, x8, x16 DDR2 SDRAM
Output Driver Characteristics
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Figure 19: Reduced Strength Pull-Down Characteristics
70
60
50
40
30
20
10
0
0.0 0.5 1.0 1.5
VOUT (V)
IOUT (mV)
Table 23: Reduced Strength Pull-Down Current (mA)
Voltage (V) Min Nom Max
0.0 0.00 0.00 0.00
0.1 1.72 2.98 4.77
0.2 3.44 5.99 9.54
0.3 5.16 8.75 14.31
0.4 6.76 11.76 19.08
0.5 8.16 14.62 23.85
0.6 9.31 17.17 28.62
0.7 10.18 19.32 33.33
0.8 10.72 21.40 37.77
0.9 11.07 23.32 41.73
1.0 11.35 24.92 45.21
1.1 11.58 26.30 48.21
1.2 11.78 27.41 50.73
1.3 11.96 28.26 52.77
1.4 12.12 29.10 54.42
1.5 12.26 29.70 55.80
1.6 12.39 30.25 57.03
1.7 12.52 30.82 58.23
1.8 12.66 31.41 59.43
1.9 12.78 31.98 60.63
2Gb: x4, x8, x16 DDR2 SDRAM
Output Driver Characteristics
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Figure 20: Reduced Strength Pull-Up Characteristics
0
–10
–20
–30
–40
–50
–60
–70
0.0 0.5 1.0 1.5
VDDQ - VOUT (V)
IOUT (mV)
Table 24: Reduced Strength Pull-Up Current (mA)
Voltage (V) Min Nom Max
0.0 0.00 0.00 0.00
0.1 –1.72 –2.98 –4.77
0.2 –3.44 –5.99 –9.54
0.3 –5.16 –8.75 –14.31
0.4 –6.76 –11.76 –19.08
0.5 –8.16 –14.62 –23.85
0.6 –9.31 –17.17 –28.62
0.7 –10.18 –19.32 –33.33
0.8 –10.72 –21.40 –37.77
0.9 –11.07 –23.32 –41.73
1.0 –11.35 –24.92 –45.21
1.1 –11.58 –26.30 –48.21
1.2 –11.78 –27.41 –50.73
1.3 –11.96 –28.26 –52.77
1.4 –12.12 –29.10 –54.42
1.5 –12.26 –29.69 –55.8
1.6 –12.39 –30.25 –57.03
1.7 –12.52 –30.82 –58.23
1.8 –12.66 –31.42 –59.43
1.9 –12.78 –31.98 –60.63
2Gb: x4, x8, x16 DDR2 SDRAM
Output Driver Characteristics
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Power and Ground Clamp Characteristics
Power and ground clamps are provided on the following input-only balls: Address balls,
bank address balls, CS#, RAS#, CAS#, WE#, ODT, and CKE.
Table 25: Input Clamp Characteristics
Voltage Across Clamp (V)
Minimum Power Clamp Current
(mA)
Minimum Ground Clamp Current
(mA)
0.0 0.0 0.0
0.1 0.0 0.0
0.2 0.0 0.0
0.3 0.0 0.0
0.4 0.0 0.0
0.5 0.0 0.0
0.6 0.0 0.0
0.7 0.0 0.0
0.8 0.1 0.1
0.9 1.0 1.0
1.0 2.5 2.5
1.1 4.7 4.7
1.2 6.8 6.8
1.3 9.1 9.1
1.4 11.0 11.0
1.5 13.5 13.5
1.6 16.0 16.0
1.7 18.2 18.2
1.8 21.0 21.0
Figure 21: Input Clamp Characteristics
Voltage Across Clamp (V)
Minimum Clamp Current (mA)
25
20
15
10
5
0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8
2Gb: x4, x8, x16 DDR2 SDRAM
Power and Ground Clamp Characteristics
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AC Overshoot/Undershoot Specification
Table 26: Address and Control Balls
Applies to address balls, bank address balls, CS#, RAS#, CAS#, WE#, CKE, and ODT
Parameter
Specification
-187E -25/-25E -3/-3E -37E -5E
Maximum peak amplitude allowed for overshoot area
(see Figure 22) 0.50V 0.50V 0.50V 0.50V 0.50V
Maximum peak amplitude allowed for undershoot area
(see Figure 23) 0.50V 0.50V 0.50V 0.50V 0.50V
Maximum overshoot area above VDD (see Figure 22) 0.5 Vns 0.66 Vns 0.80 Vns 1.00 Vns 1.33 Vns
Maximum undershoot area below VSS (see Figure 23) 0.5 Vns 0.66 Vns 0.80 Vns 1.00 Vns 1.33 Vns
Table 27: Clock, Data, Strobe, and Mask Balls
Applies to DQ, DQS, DQS#, RDQS, RDQS#, UDQS, UDQS#, LDQS, LDQS#, DM, UDM, and LDM
Parameter
Specification
-187E -25/-25E -3/-3E -37E -5E
Maximum peak amplitude allowed for overshoot area
(see Figure 22)
0.50V 0.50V 0.50V 0.50V 0.50V
Maximum peak amplitude allowed for undershoot area
(see Figure 23)
0.50V 0.50V 0.50V 0.50V 0.50V
Maximum overshoot area above VDDQ (see Figure 22) 0.19 Vns 0.23 Vns 0.23 Vns 0.28 Vns 0.38 Vns
Maximum undershoot area below VSSQ (see Figure 23) 0.19 Vns 0.23 Vns 0.23 Vns 0.28 Vns 0.38 Vns
Figure 22: Overshoot
Maximum amplitude
Overshoot area
VDD/VDDQ
VSS/VSSQ
Volts (V)
Time (ns)
Figure 23: Undershoot
VSS/VSSQ
Maximum amplitude
Undershoot area
Time (ns)
Volts (V)
Table 28: AC Input Test Conditions
Parameter Symbol Min Max Units Notes
Input setup timing measurement reference level address
balls, bank address balls, CS#, RAS#, CAS#, WE#, ODT,
DM, UDM, LDM, and CKE
VRS See Note 2 1, 2, 3, 4
2Gb: x4, x8, x16 DDR2 SDRAM
AC Overshoot/Undershoot Specification
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Table 28: AC Input Test Conditions (Continued)
Parameter Symbol Min Max Units Notes
Input hold timing measurement reference level address
balls, bank address balls, CS#, RAS#, CAS#, WE#, ODT,
DM, UDM, LDM, and CKE
VRH See Note 5 1, 3, 4, 5
Input timing measurement reference level (single-ended)
DQS for x4, x8; UDQS, LDQS for x16
VREF(DC) VDDQ × 0.49 VDDQ × 0.51 V 1, 3, 4, 6
Input timing measurement reference level (differential)
CK, CK# for x4, x8, x16; DQS, DQS# for x4, x8; RDQS,
RDQS# for x8; UDQS, UDQS#, LDQS, LDQS# for x16
VRD VIX(AC) V 1, 3, 7, 8, 9
Notes: 1. All voltages referenced to VSS.
2. Input waveform setup timing (tISb) is referenced from the input signal crossing at the
VIH(AC) level for a rising signal and VIL(AC) for a falling signal applied to the device under
test, as shown in Figure 32 (page 68).
3. See Input Slew Rate Derating (page 57).
4. The slew rate for single-ended inputs is measured from DC level to AC level, VIL(DC) to
VIH(AC) on the rising edge and VIL(AC) to VIH(DC) on the falling edge. For signals referenced
to VREF, the valid intersection is where the “tangent” line intersects VREF, as shown in
Figure 25 (page 60), Figure 27 (page 61), Figure 29 (page 66), and Figure 31
(page 67).
5. Input waveform hold (tIHb) timing is referenced from the input signal crossing at the
VIL(DC) level for a rising signal and VIH(DC) for a falling signal applied to the device under
test, as shown in Figure 32 (page 68).
6. Input waveform setup timing (tDS) and hold timing (tDH) for single-ended data strobe is
referenced from the crossing of DQS, UDQS, or LDQS through the Vref level applied to
the device under test, as shown in Figure 34 (page 69).
7. Input waveform setup timing (tDS) and hold timing (tDH) when differential data strobe
is enabled is referenced from the cross-point of DQS/DQS#, UDQS/UDQS#, or LDQS/
LDQS#, as shown in Figure 33 (page 68).
8. Input waveform timing is referenced to the crossing point level (VIX) of two input signals
(VTR and VCP) applied to the device under test, where VTR is the true input signal and VCP
is the complementary input signal, as shown in Figure 35 (page 69).
9. The slew rate for differentially ended inputs is measured from twice the DC level to
twice the AC level: 2 × VIL(DC) to 2 × VIH(AC) on the rising edge and 2 × VIL(AC) to 2 ×
VIH(DC) on the falling edge. For example, the CK/CK# would be –250mV to 500mV for CK
rising edge and would be 250mV to –500mV for CK falling edge.
2Gb: x4, x8, x16 DDR2 SDRAM
AC Overshoot/Undershoot Specification
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Input Slew Rate Derating
For all input signals, the total tIS (setup time) and tIH (hold time) required is calculated
by adding the data sheet tIS (base) and tIH (base) value to the ΔtIS and ΔtIH derating
value, respectively. Example: tIS (total setup time) = tIS (base) + ΔtIS.
tIS, the nominal slew rate for a rising signal, is defined as the slew rate between the last
crossing of VREF(DC) and the first crossing of VIH(AC)min. Setup nominal slew rate (tIS) for
a falling signal is defined as the slew rate between the last crossing of VREF(DC) and the
first crossing of VIL(AC)max.
If the actual signal is always earlier than the nominal slew rate line between shaded
“VREF(DC) to AC region,” use the nominal slew rate for the derating value (Figure 24
(page 60)).
If the actual signal is later than the nominal slew rate line anywhere between the shaded
“VREF(DC) to AC region,” the slew rate of a tangent line to the actual signal from the AC
level to DC level is used for the derating value (see Figure 25 (page 60)).
tIH, the nominal slew rate for a rising signal, is defined as the slew rate between the last
crossing of VIL(DC)max and the first crossing of VREF(DC). tIH, nominal slew rate for a fall-
ing signal, is defined as the slew rate between the last crossing of VIH(DC)min and the first
crossing of VREF(DC).
If the actual signal is always later than the nominal slew rate line between shaded “DC
to VREF(DC) region,” use the nominal slew rate for the derating value (Figure 26
(page 61)).
If the actual signal is earlier than the nominal slew rate line anywhere between shaded
“DC to VREF(DC) region,” the slew rate of a tangent line to the actual signal from the DC
level to VREF(DC) level is used for the derating value (Figure 27 (page 61)).
Although the total setup time might be negative for slow slew rates (a valid input signal
will not have reached VIH[AC]/VIL[AC] at the time of the rising clock transition), a valid in-
put signal is still required to complete the transition and reach VIH(AC)/VIL(AC).
For slew rates in between the values listed in Table 29 (page 58) and Table 30
(page 59), the derating values may obtained by linear interpolation.
2Gb: x4, x8, x16 DDR2 SDRAM
Input Slew Rate Derating
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Table 29: DDR2-400/533 Setup and Hold Time Derating Values (tIS and tIH)
Command/Address Slew Rate (V/ns)
CK, CK# Differential Slew Rate
Units
2.0 V/ns 1.5 V/ns 1.0 V/ns
Δ
Δ
tIS
Δ
tIH
Δ
tIS
Δ
tIH
Δ
tIS
Δ
tIH
4.0 187 94 217 124 247 154 ps
3.5 179 89 209 119 239 149 ps
3.0 167 83 197 113 227 143 ps
2.5 150 75 180 105 210 135 ps
2.0 125 45 155 75 185 105 ps
1.5 83 21 113 51 143 81 ps
1.0 0 0 30 30 60 60 ps
0.9 –11 –14 19 16 49 46 ps
0.8 –25 –31 5 –1 35 29 ps
0.7 –43 –54 –13 –24 17 6 ps
0.6 –67 –83 –37 –53 –7 –23 ps
0.5 –110 –125 –80 –95 –50 –65 ps
0.4 –175 –188 –145 –158 –115 –128 ps
0.3 –285 –292 –255 –262 –225 –232 ps
0.25 –350 –375 –320 –345 –290 –315 ps
0.2 –525 –500 –495 –470 –465 –440 ps
0.15 –800 –708 –770 –678 –740 –648 ps
0.1 –1450 –1125 –1420 –1095 –1390 –1065 ps
2Gb: x4, x8, x16 DDR2 SDRAM
Input Slew Rate Derating
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Table 30: DDR2-667/800/1066 Setup and Hold Time Derating Values (tIS and tIH)
Command/
Address Slew
Rate (V/ns)
CK, CK# Differential Slew Rate
Units
2.0 V/ns 1.5 V/ns 1.0 V/ns
Δ
Δ
tIS
Δ
tIH
Δ
tIS
Δ
tIH
Δ
tIS
Δ
tIH
4.0 150 94 180 124 210 154 ps
3.5 143 89 173 119 203 149 ps
3.0 133 83 163 113 193 143 ps
2.5 120 75 150 105 180 135 ps
2.0 100 45 160 75 160 105 ps
1.5 67 21 97 51 127 81 ps
1.0 0 0 30 30 60 60 ps
0.9 –5 –14 25 16 55 46 ps
0.8 –13 –31 17 –1 47 29 ps
0.7 –22 –54 8 –24 38 6 ps
0.6 –34 –83 –4 –53 36 –23 ps
0.5 –60 –125 –30 –95 0 –65 ps
0.4 –100 –188 –70 –158 –40 –128 ps
0.3 –168 –292 –138 –262 –108 –232 ps
0.25 –200 –375 –170 –345 –140 –315 ps
0.2 –325 –500 –295 –470 –265 –440 ps
0.15 –517 –708 –487 –678 –457 –648 ps
0.1 –1000 –1125 –970 –1095 –940 –1065 ps
2Gb: x4, x8, x16 DDR2 SDRAM
Input Slew Rate Derating
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Figure 24: Nominal Slew Rate for tIS
VSS
CK#
CK
tIH
tIS tIH
Setup slew rate
rising signal
Setup slew rate
falling signal
ΔTF ΔTR
Δ
TF
=
V
IH(AC)min
-
V
REF
(DC)
Δ
TR
=
VDDQ
tIS
Nominal
slew rate
V
REF
to AC
region
V
REF
to AC
region
V
REF
(DC)
- V
IL(AC)max
VIH(DC)min
VREF(DC)
VIL(AC)max
VIL(DC)max
VIH(AC)min
Nominal
slew rate
Figure 25: Tangent Line for tIS
Setup slew rate
rising signal
Δ
TF
Δ
TR
Tangent line (V
IH[AC]min
- V
REF[DC]
)
ΔTR
=
Tangent
line
Tangent
line
V
REF
to AC
region
Nominal
line
tIH
tIS tIH tIS
VSS
CK#
CK
VDDQ
VIH(AC)min
VIH(DC)min
VREF(DC)
VIL(DC)max
VIL(AC)max
V
REF
to AC
region
Nominal
line
2Gb: x4, x8, x16 DDR2 SDRAM
Input Slew Rate Derating
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Figure 26: Nominal Slew Rate for tIH
ΔTR ΔTF
Nominal
slew rate DC to V
REF
region
tIH
tIS tIS
VSS
CK#
CK
VDDQ
VIH(DC)min
VREF(DC)
VIL(AC)max
VIL(DC)max
VIH(AC)min
DC to V
REF
region
Nominal
slew rate
tIH
Figure 27: Tangent Line for tIH
Tangent
line DC to V
REF
region
tIH
tIS tIS
VSS
VDDQ
VIH(DC)min
VREF(DC)
VIL(AC)max
VIL(DC)max
VIH(AC)min
DC to V
REF
region Tangent
line
tIH
CK
CK#
Hold slew rate
falling signal
ΔTFΔTR
Tangent line (V
IH[DC]min
- V
REF[DC]
)
Δ
TF
=
Nominal
line
Hold slew rate
rising signal
Tangent line (V
REF[DC]
- V
IL[DC]max
)
Δ
TR
=
Nominal
line
2Gb: x4, x8, x16 DDR2 SDRAM
Input Slew Rate Derating
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Table 31: DDR2-400/533 tDS, tDH Derating Values with Differential Strobe
All units are shown in picoseconds
DQ
Slew
Rate
(V/ns)
DQS, DQS# Differential Slew Rate
4.0 V/ns 3.0 V/ns 2.0 V/ns 1.8 V/ns 1.6 V/ns 1.4 V/ns 1.2 V/ns 1.0 V/ns 0.8 V/ns
Δ
Δ
tDS
Δ
tDH
Δ
tDS
Δ
tDH
Δ
tDS
Δ
tDH
Δ
tDS
Δ
tDH
Δ
tDS
Δ
tDH
Δ
tDS
Δ
tDH
Δ
tDS
Δ
tDH
Δ
tDS
Δ
tDH
Δ
tDS
Δ
tDH
2.0 125 45 125 45 125 45 – – – – – – – – – – – –
1.5 83 21 83 21 83 21 95 33 – – – – – – – – – –
1.0 0 0 0 0 0 0 12 12 24 24 – – – – – – – –
0.9 – –11 –14 –11 –14 1 –2 13 10 25 22
0.8 –25 –31 –13 –19 –1 –7 11 5 23 17
0.7 –31 –42 –19 –30 –7 –18 5 –6 17 6
0.6 –43 –59 –31 –47 –19 –35 –7 –23 5 –11
0.5 –74 –89 –62 –77 –50 –65 –38 –53
0.4 – – – – – – – – – –127 –140 –115 –128 –103 –116
Notes: 1. For all input signals, the total tDS and tDH required is calculated by adding the data
sheet value to the derating value listed in Table 31.
2. tDS nominal slew rate for a rising signal is defined as the slew rate between the last
crossing of VREF(DC) and the first crossing of VIH(AC)min. tDS nominal slew rate for a falling
signal is defined as the slew rate between the last crossing of VREF(DC) and the first cross-
ing of VIL(AC)max. If the actual signal is always earlier than the nominal slew rate line be-
tween the shaded “VREF(DC) to AC region,” use the nominal slew rate for the derating
value (see Figure 28 (page 66)). If the actual signal is later than the nominal slew rate
line anywhere between the shaded “VREF(DC) to AC region,” the slew rate of a tangent
line to the actual signal from the AC level to DC level is used for the derating value (see
Figure 29 (page 66)).
3. tDH nominal slew rate for a rising signal is defined as the slew rate between the last
crossing of VIL(DC)max and the first crossing of VREF(DC). tDH nominal slew rate for a falling
signal is defined as the slew rate between the last crossing of VIH(DC)min and the first
crossing of VREF(DC). If the actual signal is always later than the nominal slew rate line
between the shaded “DC level to VREF(DC) region,” use the nominal slew rate for the de-
rating value (see Figure 30 (page 67)). If the actual signal is earlier than the nominal
slew rate line anywhere between shaded “DC to VREF(DC) region,” the slew rate of a tan-
gent line to the actual signal from the DC level to VREF(DC) level is used for the derating
value (see Figure 31 (page 67)).
4. Although the total setup time might be negative for slow slew rates (a valid input signal
will not have reached VIH[AC]/VIL[AC] at the time of the rising clock transition), a valid in-
put signal is still required to complete the transition and reach VIH(AC)/VIL(AC).
5. For slew rates between the values listed in this table, the derating values may be ob-
tained by linear interpolation.
6. These values are typically not subject to production test. They are verified by design and
characterization.
7. Single-ended DQS requires special derating. The values in Table 33 (page 64) are the
DQS single-ended slew rate derating with DQS referenced at VREF and DQ referenced at
the logic levels tDSb and tDHb. Converting the derated base values from DQ referenced
to the AC/DC trip points to DQ referenced to VREF is listed in Table 35 (page 65) and
Table 36 (page 65). Table 35 provides the VREF-based fully derated values for the DQ
(tDSa and tDHa) for DDR2-533. Table 36 provides the VREF-based fully derated values for
the DQ (tDSa and tDHa) for DDR2-400.
2Gb: x4, x8, x16 DDR2 SDRAM
Input Slew Rate Derating
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Table 32: DDR2-667/800/1066 tDS, tDH Derating Values with Differential Strobe
All units are shown in picoseconds
DQ
Slew
Rate
(V/ns)
DQS, DQS# Differential Slew Rate
2.8 V/ns 2.4 V/ns 2.0 V/ns 1.8 V/ns 1.6 V/ns 1.4 V/ns 1.2 V/ns 1.0 V/ns 0.8 V/ns
Δ
Δ
tDS
Δ
tDH
Δ
tDS
Δ
tDH
Δ
tDS
Δ
tDH
Δ
tDS
Δ
tDH
Δ
tDS
Δ
tDH
Δ
tDS
Δ
tDH
Δ
tDS
Δ
tDH
Δ
tDS
Δ
tDH
Δ
tDS
Δ
tDH
2.0 100 63 100 63 100 63 112 75 124 87 136 99 148 111 160 123 172 135
1.5 67 42 67 42 67 42 79 54 91 66 103 78 115 90 127 102 139 114
1.0000000121224243636484860607272
0.9 –5 –14 –5 –14 –5 –14 7 –2 19 10 31 22 43 34 55 46 67 58
0.8 –13 –31 –13 –31 –13 –31 –1 –19 11 –7 23 5 35 17 47 29 59 41
0.7 –22 –54 –22 –54 –22 –54 –10 –42 2 –30 14 –18 26 –6 38 6 50 18
0.6 –34 –83 –34 –83 –34 –83 –22 –71 –10 –59 2 –47 14 –35 26 –23 38 –11
0.5 –60 –125 –60 –125 –60 –125 –48 –113 –36 –101 –24 –89 –12 –77 0 –65 12 –53
0.4 –100 –188 –100 –188 –100 –188 –88 –176 –76 –164 –64 –152 –52 –140 –40 –128 –28 –116
Notes: 1. For all input signals the total tDS and tDH required is calculated by adding the data
sheet value to the derating value listed in Table 32.
2. tDS nominal slew rate for a rising signal is defined as the slew rate between the last
crossing of VREF(DC) and the first crossing of VIH(AC)min. tDS nominal slew rate for a falling
signal is defined as the slew rate between the last crossing of VREF(DC) and the first cross-
ing of VIL(AC)max. If the actual signal is always earlier than the nominal slew rate line be-
tween the shaded “VREF(DC) to AC region,” use the nominal slew rate for the derating
value (see Figure 28 (page 66)). If the actual signal is later than the nominal slew rate
line anywhere between shaded “VREF(DC) to AC region,” the slew rate of a tangent line
to the actual signal from the AC level to DC level is used for the derating value (see Fig-
ure 29 (page 66)).
3. tDH nominal slew rate for a rising signal is defined as the slew rate between the last
crossing of VIL(DC)max and the first crossing of VREF(DC). tDH nominal slew rate for a falling
signal is defined as the slew rate between the last crossing of VIH(DC)min and the first
crossing of VREF(DC). If the actual signal is always later than the nominal slew rate line
between the shaded “DC level to VREF(DC) region,” use the nominal slew rate for the de-
rating value (see Figure 30 (page 67)). If the actual signal is earlier than the nominal
slew rate line anywhere between the shaded “DC to VREF(DC) region,” the slew rate of a
tangent line to the actual signal from the DC level to VREF(DC) level is used for the derat-
ing value (see Figure 31 (page 67)).
4. Although the total setup time might be negative for slow slew rates (a valid input signal
will not have reached VIH[AC]/VIL[AC] at the time of the rising clock transition), a valid in-
put signal is still required to complete the transition and reach VIH(AC)/VIL(AC).
5. For slew rates between the values listed in this table, the derating values may be ob-
tained by linear interpolation.
6. These values are typically not subject to production test. They are verified by design and
characterization.
7. Single-ended DQS requires special derating. The values in Table 33 (page 64) are the
DQS single-ended slew rate derating with DQS referenced at VREF and DQ referenced at
the logic levels tDSb and tDHb. Converting the derated base values from DQ referenced
to the AC/DC trip points to DQ referenced to VREF is listed in Table 34 (page 64). Ta-
ble 34 provides the VREF-based fully derated values for the DQ (tDSa and tDHa) for
2Gb: x4, x8, x16 DDR2 SDRAM
Input Slew Rate Derating
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DDR2-667. It is not advised to operate DDR2-800 and DDR2-1066 devices with single-
ended DQS; however, Table 33 would be used with the base values.
Table 33: Single-Ended DQS Slew Rate Derating Values Using tDSb and tDHb
Reference points indicated in bold; Derating values are to be used with base tDSb- and tDHb--specified values
DQ (V/ns)
DQS Single-Ended Slew Rate Derated (at VREF)
2.0 V/ns 1.8 V/ns 1.6 V/ns 1.4 V/ns 1.2 V/ns 1.0 V/ns 0.8 V/ns 0.6 V/ns 0.4 V/ns
tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH
2.0 130 53 130 53 130 53 130 53 130 53 145 48 155 45 165 41 175 38
1.5 97 32 97 32 97 32 97 32 97 32 112 27 122 24 132 20 142 17
1.0 30 –10 30 –10 30 –10 30 –10 30 –10 45 –15 55 –18 65 –22 75 –25
0.9 25 –24 25 –24 25 –24 25 –24 25 –24 40 –29 50 –32 60 –36 70 –39
0.8 17 –41 17 –41 17 –41 17 –41 17 –41 32 –46 42 –49 52 –53 61 –56
0.7 5 –64 5 –64 5 –64 5 –64 5 –64 20 –69 30 –72 40 –75 50 –79
0.6 –7 –93 –7 –93 –7 –93 –7 –93 –7 –93 8 –98 18 –102 28 –105 38 –108
0.5 –28 –135 –28 –135 –28 –135 –28 –135 –28 –135 –13 –140 –3 –143 7 –147 17 –150
0.4 –78 –198 –78 –198 –78 –198 –78 –198 –78 –198 –63 –203 –53 –206 –43 –210 –33 –213
Table 34: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at VREF) at DDR2-667
Reference points indicated in bold
DQ (V/ns)
DQS Single-Ended Slew Rate Derated (at VREF)
2.0 V/ns 1.8 V/ns 1.6 V/ns 1.4 V/ns 1.2 V/ns 1.0 V/ns 0.8 V/ns 0.6 V/ns 0.4 V/ns
tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH
2.0 330 291 330 291 330 291 330 291 330 291 345 286 355 282 365 29 375 276
1.5 330 290 330 290 330 290 330 290 330 290 345 285 355 282 365 279 375 275
1.0 330 290 330 290 330 290 330 290 330 290 345 285 355 282 365 278 375 275
0.9 347 290 347 290 347 290 347 290 347 290 362 285 372 282 382 278 392 275
0.8 367 290 367 290 367 290 367 290 367 290 382 285 392 282 402 278 412 275
0.7 391 290 391 290 391 290 391 290 391 290 406 285 416 281 426 278 436 275
0.6 426 290 426 290 426 290 426 290 426 290 441 285 451 282 461 278 471 275
0.5 472 290 472 290 472 290 472 290 472 290 487 285 497 282 507 278 517 275
0.4 522 289 522 289 522 289 522 289 522 289 537 284 547 281 557 278 567 274
2Gb: x4, x8, x16 DDR2 SDRAM
Input Slew Rate Derating
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Table 35: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at VREF) at DDR2-533
Reference points indicated in bold
DQ (V/ns)
DQS Single-Ended Slew Rate Derated (at VREF)
2.0 V/ns 1.8 V/ns 1.6 V/ns 1.4 V/ns 1.2 V/ns 1.0 V/ns 0.8 V/ns 0.6 V/ns 0.4 V/ns
tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH
2.0 355 341 355 341 355 341 355 341 355 341 370 336 380 332 390 329 400 326
1.5 364 340 364 340 364 340 364 340 364 340 379 335 389 332 399 329 409 325
1.0 380 340 380 340 380 340 380 340 380 340 395 335 405 332 415 328 425 325
0.9 402 340 402 340 402 340 402 340 402 340 417 335 427 332 437 328 447 325
0.8 429 340 429 340 429 340 429 340 429 340 444 335 454 332 464 328 474 325
0.7 463 340 463 340 463 340 463 340 463 340 478 335 488 331 498 328 508 325
0.6 510 340 510 340 510 340 510 340 510 340 525 335 535 332 545 328 555 325
0.5 572 340 572 340 572 340 572 340 572 340 587 335 597 332 607 328 617 325
0.4 647 339 647 339 647 339 647 339 647 339 662 334 672 331 682 328 692 324
Table 36: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at VREF) at DDR2-400
Reference points indicated in bold
DQ (V/ns)
DQS Single-Ended Slew Rate Derated (at VREF)
2.0 V/ns 1.8 V/ns 1.6 V/ns 1.4 V/ns 1.2 V/ns 1.0 V/ns 0.8 V/ns 0.6 V/ns 0.4 V/ns
tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH
2.0 405 391 405 391 405 391 405 391 405 391 420 386 430 382 440 379 450 376
1.5 414 390 414 390 414 390 414 390 414 390 429 385 439 382 449 379 459 375
1.0 430 390 430 390 430 390 430 390 430 390 445 385 455 382 465 378 475 375
0.9 452 390 452 390 452 390 452 390 452 390 467 385 477 382 487 378 497 375
0.8 479 390 479 390 479 390 479 390 479 390 494 385 504 382 514 378 524 375
0.7 513 390 513 390 513 390 513 390 513 390 528 385 538 381 548 378 558 375
0.6 560 390 560 390 560 390 560 390 560 390 575 385 585 382 595 378 605 375
0.5 622 390 622 390 622 390 622 390 622 390 637 385 647 382 657 378 667 375
0.4 697 389 697 389 697 389 697 389 697 389 712 384 722 381 732 378 742 374
2Gb: x4, x8, x16 DDR2 SDRAM
Input Slew Rate Derating
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Figure 28: Nominal Slew Rate for tDS
V
REF
to AC
region
V
REF
to AC
region
Setup slew rate
rising signal
Setup slew rate
falling signal
Δ
TF
Δ
TR
VREF(DC)
- V
IL(AC)max
ΔTF
=
V
IH(AC)min
-
VREF(DC)
ΔTR
=
Nominal
slew rate
VSS
DQS#1
DQS1
VDDQ
VIH(DC)min
VREF(DC)
VIL(AC)max
VIL(DC)max
VIH(AC)min
tDH
tDS
Nominal
slew rate
tDH
tDS
Note: 1. DQS, DQS# signals must be monotonic between VIL(DC)max and VIH(DC)min.
Figure 29: Tangent Line for tDS
Δ
TF
Δ
TR
Setup slew rate
rising signal
Setup slew rate
falling signal
Tangent line (VREF[DC] - VIL[AC]max
)
ΔTF
=
Tangent line (V
IH[AC]min
- VREF[DC])
ΔTR
=
tDH
tDS
tDH
tDS
VSS
DQS#1
DQS1
VDDQ
VIH(DC)min
VREF(DC)
VIL(AC)max
VIL(DC)max
VIH(AC)min
Nominal line
Tangent line
Nominal
line
Tangent line
V
REF
to AC
region
V
REF
to AC
region
Note: 1. DQS, DQS# signals must be monotonic between VIL(DC)max and VIH(DC)min.
2Gb: x4, x8, x16 DDR2 SDRAM
Input Slew Rate Derating
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Figure 30: Nominal Slew Rate for tDH
Hold slew rate
falling signal
Hold slew rate
rising signal
VREF(DC) -
V
IL(DC)max
Δ
TR
=
V
IH(DC)min
-
VREF(DC)
Δ
TF
=
ΔTR ΔTF
Nominal
slew rate DC to V
REF
region
tIH
tIS tIS
VSS
DQS#1
DQS1
VDDQ
VIH(DC)min
VREF(DC)
VIL(AC)max
VIL(DC)max
VIH(AC)min
DC to V
REF
region
Nominal
slew rate
tIH
Note: 1. DQS, DQS# signals must be monotonic between VIL(DC)max and VIH(DC)min.
Figure 31: Tangent Line for tDH
Tangent
line DC to V
REF
region
tIH
tIS tIS
VSS
VDDQ
VIH(DC)min
VREF(DC)
VIL(AC)max
VIL(DC)max
VIH(AC)min
DC to V
REF
region Tangent
line
tIH
DQS1
DQS#1
Hold slew rate
falling signal
ΔTF
ΔTR
Tangent line (V
IH[DC]min
- V
REF[DC]
)
ΔTF
=
Nominal
line
Hold slew rate
rising signal
Tangent line (V
REF[DC]
- V
IL[DC]max
)
ΔTR
=
Nominal
line
Note: 1. DQS, DQS# signals must be monotonic between VIL(DC)max and VIH(DC)min.
2Gb: x4, x8, x16 DDR2 SDRAM
Input Slew Rate Derating
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Figure 32: AC Input Test Signal Waveform Command/Address Balls
tISa
Logic levels
VREF levels
tIHatISatIHa
tISbtIHbtISbtIHb
CK#
CK
VDDQ
VIH(AC)min
VIH(DC)min
VREF(DC)
VIL(DC)min
VIL(AC)min
VSSQ
Vswing (MAX)
Figure 33: AC Input Test Signal Waveform for Data with DQS, DQS# (Differential)
DQS#
DQS
tDSatDHatDSatDHa
tDSbtDHbtDSbtDHb
Logic levels
VREF levels
VREF(DC)
VIL(DC)max
VIL(AC)max
VSSQ
VIH(DC)min
VIH(AC)min
VDDQ
Vswing (MAX)
2Gb: x4, x8, x16 DDR2 SDRAM
Input Slew Rate Derating
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Figure 34: AC Input Test Signal Waveform for Data with DQS (Single-Ended)
DQS
VREF
V
REF(DC)
V
IL(DC)max
V
IL(AC)max
V
SSQ
V
IH(DC)min
V
IH(AC)min
V
DDQ
Vswing (MAX)
Logic levels
VREF levels
tDSatDHatDSatDHa
tDSbtDHbtDSbtDHb
Figure 35: AC Input Test Signal Waveform (Differential)
VTR
Vswing
VCP
VDDQ
VSSQ
VIX
Crossing point
2Gb: x4, x8, x16 DDR2 SDRAM
Input Slew Rate Derating
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Commands
Truth Tables
The following tables provide a quick reference of available DDR2 SDRAM commands,
including CKE power-down modes and bank-to-bank commands.
Table 37: Truth Table – DDR2 Commands
Notes: 1–3 apply to the entire table
Function
CKE
CS# RAS# CAS# WE#
BA2–
BA0 An–A11 A10 A9–A0 Notes
Previous
Cycle
Current
Cycle
LOAD MODE H H L L L L BA OP code 4, 6
REFRESH H H L L L H X X X X
SELF REFRESH entry H L L L L H X X X X
SELF REFRESH exit L H H X X X X X X X 4, 7
LHHH
Single bank
PRECHARGE
HHLLHLBAXLX6
All banks PRECHARGE H H L L H L X X H X
Bank ACTIVATE H H L L H H BA Row address 4
WRITE H H L H L L BA Column
address
L Column
address
4, 5, 6,
8
WRITE with auto
precharge
H H L H L L BA Column
address
H Column
address
4, 5, 6,
8
READ H H L H L H BA Column
address
L Column
address
4, 5, 6,
8
READ with auto
precharge
H H L H L H BA Column
address
H Column
address
4, 5, 6,
8
NO OPERATION H X L H H H X X X X
Device DESELECT H X H X X X X X X X
Power-down entry H L H X X X X X X X 9
LHHH
Power-down exit L H H X X X X X X X 9
LHHH
Notes: 1. All DDR2 SDRAM commands are defined by states of CS#, RAS#, CAS#, WE#, and CKE at
the rising edge of the clock.
2. The state of ODT does not affect the states described in this table. The ODT function is
not available during self refresh. See ODT Timing (page 127) for details.
3. “X” means “H or L” (but a defined logic level) for valid IDD measurements.
4. BA2 is only applicable for densities 1Gb.
5. An n is the most significant address bit for a given density and configuration. Some larg-
er address bits may be “Don’t Care” during column addressing, depending on density
and configuration.
2Gb: x4, x8, x16 DDR2 SDRAM
Commands
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6. Bank addresses (BA) determine which bank is to be operated upon. BA during a LOAD
MODE command selects which mode register is programmed.
7. SELF REFRESH exit is asynchronous.
8. Burst reads or writes at BL = 4 cannot be terminated or interrupted. See Figure 49
(page 96) and Figure 61 (page 107) for other restrictions and details.
9. The power-down mode does not perform any REFRESH operations. The duration of
power-down is limited by the refresh requirements outlined in the AC parametric sec-
tion.
Table 38: Truth Table – Current State Bank n – Command to Bank n
Notes: 1–6 apply to the entire table
Current
State CS# RAS# CAS# WE# Command/Action Notes
Any H X X X DESELECT (NOP/continue previous operation)
L H H H NO OPERATION (NOP/continue previous operation)
Idle L L H H ACTIVATE (select and activate row)
L L L H REFRESH 7
L L L L LOAD MODE 7
Row active L H L H READ (select column and start READ burst) 8
L H L L WRITE (select column and start WRITE burst) 8
L L H L PRECHARGE (deactivate row in bank or banks) 9
Read (auto
precharge
disabled)
L H L H READ (select column and start new READ burst) 8
L H L L WRITE (select column and start WRITE burst) 8, 10
L L H L PRECHARGE (start PRECHARGE) 9
Write
(auto pre-
charge disa-
bled)
L H L H READ (select column and start READ burst) 8
L H L L WRITE (select column and start new WRITE burst) 8
L L H L PRECHARGE (start PRECHARGE) 9
Notes: 1. This table applies when CKEn - 1 was HIGH and CKEn is HIGH and after tXSNR has been
met (if the previous state was self refresh).
2. This table is bank-specific, except where noted (the current state is for a specific bank
and the commands shown are those allowed to be issued to that bank when in that
state). Exceptions are covered in the notes below.
3. Current state definitions:
Idle: The bank has been precharged, tRP has been met, and any READ burst is com-
plete.
Row
active:
A row in the bank has been activated, and tRCD has been met. No data bursts/
accesses and no register accesses are in progress.
Read: A READ burst has been initiated, with auto precharge disabled and has not yet
terminated.
Write: A WRITE burst has been initiated with auto precharge disabled and has not yet
terminated.
4. The following states must not be interrupted by a command issued to the same bank.
Issue DESELECT or NOP commands, or allowable commands to the other bank, on any
clock edge occurring during these states. Allowable commands to the other bank are
determined by its current state and this table, and according to Table 39 (page 73).
2Gb: x4, x8, x16 DDR2 SDRAM
Commands
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Precharge: Starts with registration of a PRECHARGE command and ends when
tRP is met. After tRP is met, the bank will be in the idle state.
Read with auto
precharge
enabled:
Starts with registration of a READ command with auto precharge
enabled and ends when tRP has been met. After tRP is met, the
bank will be in the idle state.
Row activate: Starts with registration of an ACTIVATE command and ends when
tRCD is met. After tRCD is met, the bank will be in the row active
state.
Write with auto
precharge
enabled:
Starts with registration of a WRITE command with auto precharge
enabled and ends when tRP has been met. After tRP is met, the
bank will be in the idle state.
5. The following states must not be interrupted by any executable command (DESELECT or
NOP commands must be applied on each positive clock edge during these states):
Refresh: Starts with registration of a REFRESH command and ends when tRFC is
met. After tRFC is met, the DDR2 SDRAM will be in the all banks idle
state.
Accessing
mode
register:
Starts with registration of the LOAD MODE command and ends when
tMRD has been met. After tMRD is met, the DDR2 SDRAM will be in the
all banks idle state.
Precharge
all:
Starts with registration of a PRECHARGE ALL command and ends when
tRP is met. After tRP is met, all banks will be in the idle state.
6. All states and sequences not shown are illegal or reserved.
7. Not bank-specific; requires that all banks are idle and bursts are not in progress.
8. READs or WRITEs listed in the Command/Action column include READs or WRITEs with
auto precharge enabled and READs or WRITEs with auto precharge disabled.
9. May or may not be bank-specific; if multiple banks are to be precharged, each must be
in a valid state for precharging.
10. A WRITE command may be applied after the completion of the READ burst.
2Gb: x4, x8, x16 DDR2 SDRAM
Commands
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Table 39: Truth Table – Current State Bank n – Command to Bank m
Notes: 1–6 apply to the entire table
Current State CS# RAS# CAS# WE# Command/Action Notes
Any H X X X DESELECT (NOP/continue previous operation)
L H H H NO OPERATION (NOP/continue previous operation)
Idle X X X X Any command otherwise allowed to bank m
Row
active, active,
or precharge
L L H H ACTIVATE (select and activate row)
L H L H READ (select column and start READ burst) 7
L H L L WRITE (select column and start WRITE burst) 7
L L H L PRECHARGE
Read (auto
precharge
disabled)
L L H H ACTIVATE (select and activate row)
L H L H READ (select column and start new READ burst) 7
L H L L WRITE (select column and start WRITE burst) 7, 8
L L H L PRECHARGE
Write (auto
precharge
disabled)
L L H H ACTIVATE (select and activate row)
L H L H READ (select column and start READ burst) 7, 9, 10
L H L L WRITE (select column and start new WRITE burst) 7
L L H L PRECHARGE
Read (with
auto
precharge)
L L H H ACTIVATE (select and activate row)
L H L H READ (select column and start new READ burst) 7
L H L L WRITE (select column and start WRITE burst) 7, 8
L L H L PRECHARGE
Write (with
auto
precharge)
L L H H ACTIVATE (select and activate row)
L H L H READ (select column and start READ burst) 7, 10
L H L L WRITE (select column and start new WRITE burst) 7
L L H L PRECHARGE
Notes: 1. This table applies when CKEn - 1 was HIGH and CKEn is HIGH and after tXSNR has been
met (if the previous state was self refresh).
2. This table describes an alternate bank operation, except where noted (the current state
is for bank n and the commands shown are those allowed to be issued to bank m, as-
suming that bank m is in such a state that the given command is allowable). Exceptions
are covered in the notes below.
3. Current state definitions:
Idle: The bank has been precharged, tRP has been met, and any READ
burst is complete.
Row active: A row in the bank has been activated and tRCD has been met.
No data bursts/accesses and no register accesses are in progress.
Read: A READ burst has been initiated with auto precharge disabled
and has not yet terminated.
Write: A WRITE burst has been initiated with auto precharge disabled
and has not yet terminated.
2Gb: x4, x8, x16 DDR2 SDRAM
Commands
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READ with auto
precharge enabled/
WRITE with auto
precharge enabled:
The READ with auto precharge enabled or WRITE with auto pre-
charge enabled states can each be broken into two parts: the ac-
cess period and the precharge period. For READ with auto pre-
charge, the precharge period is defined as if the same burst was
executed with auto precharge disabled and then followed with
the earliest possible PRECHARGE command that still accesses all
of the data in the burst. For WRITE with auto precharge, the pre-
charge period begins when tWR ends, with tWR measured as if
auto precharge was disabled. The access period starts with regis-
tration of the command and ends where the precharge period
(or tRP) begins. This device supports concurrent auto precharge
such that when a READ with auto precharge is enabled or a
WRITE with auto precharge is enabled, any command to other
banks is allowed, as long as that command does not interrupt
the read or write data transfer already in process. In either case,
all other related limitations apply (contention between read da-
ta and write data must be avoided).
The minimum delay from a READ or WRITE command with auto precharge enabled to
a command to a different bank is summarized in Table 40 (page 74).
4. REFRESH and LOAD MODE commands may only be issued when all banks are idle.
5. Not used.
6. All states and sequences not shown are illegal or reserved.
7. READs or WRITEs listed in the Command/Action column include READs or WRITEs with
auto precharge enabled and READs or WRITEs with auto precharge disabled.
8. A WRITE command may be applied after the completion of the READ burst.
9. Requires appropriate DM.
10. The number of clock cycles required to meet tWTR is either two or tWTR/tCK, whichever
is greater.
Table 40: Minimum Delay with Auto Precharge Enabled
From Command (Bank n) To Command (Bank m)
Minimum Delay
(with Concurrent Auto Precharge) Units
WRITE with auto precharge READ or READ with auto precharge (CL - 1) + (BL/2) + tWTR tCK
WRITE or WRITE with auto precharge (BL/2) tCK
PRECHARGE or ACTIVATE 1 tCK
READ with auto precharge READ or READ with auto precharge (BL/2) tCK
WRITE or WRITE with auto precharge (BL/2) + 2 tCK
PRECHARGE or ACTIVATE 1 tCK
DESELECT
The DESELECT function (CS# HIGH) prevents new commands from being executed by
the DDR2 SDRAM. The DDR2 SDRAM is effectively deselected. Operations already in
progress are not affected. DESELECT is also referred to as COMMAND INHIBIT.
2Gb: x4, x8, x16 DDR2 SDRAM
Commands
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NO OPERATION (NOP)
The NO OPERATION (NOP) command is used to instruct the selected DDR2 SDRAM to
perform a NOP (CS# is LOW; RAS#, CAS#, and WE are HIGH). This prevents unwanted
commands from being registered during idle or wait states. Operations already in pro-
gress are not affected.
LOAD MODE (LM)
The mode registers are loaded via bank address and address inputs. The bank address
balls determine which mode register will be programmed. See Mode Register (MR)
(page 76). The LM command can only be issued when all banks are idle, and a subse-
quent executable command cannot be issued until tMRD is met.
ACTIVATE
The ACTIVATE command is used to open (or activate) a row in a particular bank for a
subsequent access. The value on the bank address inputs determines the bank, and the
address inputs select the row. This row remains active (or open) for accesses until a pre-
charge command is issued to that bank. A precharge command must be issued before
opening a different row in the same bank.
READ
The READ command is used to initiate a burst read access to an active row. The value
on the bank address inputs determine the bank, and the address provided on address
inputs A0–Ai (where Ai is the most significant column address bit for a given configura-
tion) selects the starting column location. The value on input A10 determines whether
or not auto precharge is used. If auto precharge is selected, the row being accessed will
be precharged at the end of the read burst; if auto precharge is not selected, the row will
remain open for subsequent accesses.
DDR2 SDRAM also supports the AL feature, which allows a READ or WRITE command
to be issued prior to tRCD (MIN) by delaying the actual registration of the READ/WRITE
command to the internal device by AL clock cycles.
WRITE
The WRITE command is used to initiate a burst write access to an active row. The value
on the bank select inputs selects the bank, and the address provided on inputs A0–Ai
(where Ai is the most significant column address bit for a given configuration) selects
the starting column location. The value on input A10 determines whether or not auto
precharge is used. If auto precharge is selected, the row being accessed will be pre-
charged at the end of the WRITE burst; if auto precharge is not selected, the row will
remain open for subsequent accesses.
DDR2 SDRAM also supports the AL feature, which allows a READ or WRITE command
to be issued prior to tRCD (MIN) by delaying the actual registration of the READ/WRITE
command to the internal device by AL clock cycles.
Input data appearing on the DQ is written to the memory array subject to the DM input
logic level appearing coincident with the data. If a given DM signal is registered LOW,
the corresponding data will be written to memory; if the DM signal is registered HIGH,
the corresponding data inputs will be ignored, and a WRITE will not be executed to that
byte/column location (see Figure 66 (page 112)).
2Gb: x4, x8, x16 DDR2 SDRAM
Commands
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PRECHARGE
The PRECHARGE command is used to deactivate the open row in a particular bank or
the open row in all banks. The bank(s) will be available for a subsequent row activation
a specified time (tRP) after the PRECHARGE command is issued, except in the case of
concurrent auto precharge, where a READ or WRITE command to a different bank is al-
lowed as long as it does not interrupt the data transfer in the current bank and does not
violate any other timing parameters. After a bank has been precharged, it is in the idle
state and must be activated prior to any READ or WRITE commands being issued to
that bank. A PRECHARGE command is allowed if there is no open row in that bank (idle
state) or if the previously open row is already in the process of precharging. However,
the precharge period will be determined by the last PRECHARGE command issued to
the bank.
REFRESH
REFRESH is used during normal operation of the DDR2 SDRAM and is analogous to
CAS#-before-RAS# (CBR) REFRESH. All banks must be in the idle mode prior to issuing
a REFRESH command. This command is nonpersistent, so it must be issued each time
a refresh is required. The addressing is generated by the internal refresh controller. This
makes the address bits a “Don’t Care” during a REFRESH command.
SELF REFRESH
The SELF REFRESH command can be used to retain data in the DDR2 SDRAM, even if
the rest of the system is powered down. When in the self refresh mode, the DDR2
SDRAM retains data without external clocking. All power supply inputs (including Vref)
must be maintained at valid levels upon entry/exit and during SELF REFRESH opera-
tion.
The SELF REFRESH command is initiated like a REFRESH command except CKE is
LOW. The DLL is automatically disabled upon entering self refresh and is automatically
enabled upon exiting self refresh.
Mode Register (MR)
The mode register is used to define the specific mode of operation of the DDR2 SDRAM.
This definition includes the selection of a burst length, burst type, CAS latency, operat-
ing mode, DLL RESET, write recovery, and power-down mode, as shown in Figure 36
(page 77). Contents of the mode register can be altered by re-executing the LOAD
MODE (LM) command. If the user chooses to modify only a subset of the MR variables,
all variables must be programmed when the command is issued.
The MR is programmed via the LM command and will retain the stored information un-
til it is programmed again or until the device loses power (except for bit M8, which is
self-clearing). Reprogramming the mode register will not alter the contents of the mem-
ory array, provided it is performed correctly.
The LM command can only be issued (or reissued) when all banks are in the precharged
state (idle state) and no bursts are in progress. The controller must wait the specified
time tMRD before initiating any subsequent operations such as an ACTIVATE com-
mand. Violating either of these requirements will result in an unspecified operation.
2Gb: x4, x8, x16 DDR2 SDRAM
Mode Register (MR)
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Burst Length
Burst length is defined by bits M0–M2, as shown in Figure 36. Read and write accesses
to the DDR2 SDRAM are burst-oriented, with the burst length being programmable to
either four or eight. The burst length determines the maximum number of column loca-
tions that can be accessed for a given READ or WRITE command.
When a READ or WRITE command is issued, a block of columns equal to the burst
length is effectively selected. All accesses for that burst take place within this block,
meaning that the burst will wrap within the block if a boundary is reached. The block is
uniquely selected by A2–Ai when BL = 4 and by A3–Ai when BL = 8 (where Ai is the most
significant column address bit for a given configuration). The remaining (least signifi-
cant) address bit(s) is (are) used to select the starting location within the block. The pro-
grammed burst length applies to both read and write bursts.
Figure 36: MR Definition
Burst Length
CAS#
BTPD
A9 A7 A6 A5 A4 A3A8 A2 A1 A0
Mode Register (Mx)
Address Bus
9 765438210
A10A12 A11BA0
BA1
101112n
0
0
14
Burst Length
Reserved
Reserved
4
8
Reserved
Reserved
Reserved
Reserved
M0
0
1
0
1
0
1
0
1
M1
0
0
1
1
0
0
1
1
M2
0
0
0
0
1
1
1
1
0
1
Burst Type
Sequential
Interleaved
M3
CAS Latency (CL)
Reserved
Reserved
Reserved
3
4
5
6
7
M4
0
1
0
1
0
1
0
1
M5
0
0
1
1
0
0
1
1
M6
0
0
0
0
1
1
1
1
0
1
Mode
Normal
Test
M7
15
DLL TM
0
1
DLL Reset
No
Yes
M8
Write Recovery
Reserved
2
3
4
5
6
7
8
M9
0
1
0
1
0
1
0
1
M10
0
0
1
1
0
0
1
1
M11
0
0
0
0
1
1
1
1
WR
An2
MR
M14
0
1
0
1
Mode Register Definition
Mode register (MR)
Extended mode register (EMR)
Extended mode register (EMR2)
Extended mode register (EMR3)
M15
0
0
1
1
M12
0
1
PD Mode
Fast exit
(normal)
Slow exit
(low power)
Latency
16
BA21
Notes: 1. M16 (BA2) is only applicable for densities 1Gb, reserved for future use, and must be
programmed to “0.”
2. Mode bits (Mn) with corresponding address balls (An) greater than M12 (A12) are re-
served for future use and must be programmed to “0.”
3. Not all listed WR and CL options are supported in any individual speed grade.
2Gb: x4, x8, x16 DDR2 SDRAM
Mode Register (MR)
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Burst Type
Accesses within a given burst may be programmed to be either sequential or inter-
leaved. The burst type is selected via bit M3, as shown in Figure 36. The ordering of ac-
cesses within a burst is determined by the burst length, the burst type, and the starting
column address, as shown in Table 41. DDR2 SDRAM supports 4-bit burst mode and 8-
bit burst mode only. For 8-bit burst mode, full interleaved address ordering is suppor-
ted; however, sequential address ordering is nibble-based.
Table 41: Burst Definition
Burst Length Starting Column Address
(A2, A1, A0)
Order of Accesses Within a Burst
Burst Type = Sequential Burst Type = Interleaved
4 0 0 0 0, 1, 2, 3 0, 1, 2, 3
0 0 1 1, 2, 3, 0 1, 0, 3, 2
0 1 0 2, 3, 0, 1 2, 3, 0, 1
0 1 1 3, 0, 1, 2 3, 2, 1, 0
8 0 0 0 0, 1, 2, 3, 4, 5, 6, 7 0, 1, 2, 3, 4, 5, 6, 7
0 0 1 1, 2, 3, 0, 5, 6, 7, 4 1, 0, 3, 2, 5, 4, 7, 6
0 1 0 2, 3, 0, 1, 6, 7, 4, 5 2, 3, 0, 1, 6, 7, 4, 5
0 1 1 3, 0, 1, 2, 7, 4, 5, 6 3, 2, 1, 0, 7, 6, 5, 4
1 0 0 4, 5, 6, 7, 0, 1, 2, 3 4, 5, 6, 7, 0, 1, 2, 3
1 0 1 5, 6, 7, 4, 1, 2, 3, 0 5, 4, 7, 6, 1, 0, 3, 2
1 1 0 6, 7, 4, 5, 2, 3, 0, 1 6, 7, 4, 5, 2, 3, 0, 1
1 1 1 7, 4, 5, 6, 3, 0, 1, 2 7, 6, 5, 4, 3, 2, 1, 0
Operating Mode
The normal operating mode is selected by issuing a command with bit M7 set to “0,”
and all other bits set to the desired values, as shown in Figure 36 (page 77). When bit M7
is “1,” no other bits of the mode register are programmed. Programming bit M7 to “1”
places the DDR2 SDRAM into a test mode that is only used by the manufacturer and
should not be used. No operation or functionality is guaranteed if M7 bit is “1.”
DLL RESET
DLL RESET is defined by bit M8, as shown in Figure 36. Programming bit M8 to “1” will
activate the DLL RESET function. Bit M8 is self-clearing, meaning it returns back to a
value of “0” after the DLL RESET function has been issued.
Anytime the DLL RESET function is used, 200 clock cycles must occur before a READ
command can be issued to allow time for the internal clock to be synchronized with the
external clock. Failing to wait for synchronization to occur may result in a violation of
the tAC or tDQSCK parameters.
2Gb: x4, x8, x16 DDR2 SDRAM
Mode Register (MR)
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Write Recovery
Write recovery (WR) time is defined by bits M9–M11, as shown in Figure 36 (page 77).
The WR register is used by the DDR2 SDRAM during WRITE with auto precharge opera-
tion. During WRITE with auto precharge operation, the DDR2 SDRAM delays the inter-
nal auto precharge operation by WR clocks (programmed in bits M9–M11) from the last
data burst. An example of WRITE with auto precharge is shown in Figure 65 (page 111).
WR values of 2, 3, 4, 5, 6, 7, or 8 clocks may be used for programming bits M9–M11. The
user is required to program the value of WR, which is calculated by dividing tWR (in
nanoseconds) by tCK (in nanoseconds) and rounding up a noninteger value to the next
integer; WR (cycles) = tWR (ns)/tCK (ns). Reserved states should not be used as an un-
known operation or incompatibility with future versions may result.
Power-Down Mode
Active power-down (PD) mode is defined by bit M12, as shown in Figure 36. PD mode
enables the user to determine the active power-down mode, which determines per-
formance versus power savings. PD mode bit M12 does not apply to precharge PD
mode.
When bit M12 = 0, standard active PD mode, or “fast-exit” active PD mode, is enabled.
The tXARD parameter is used for fast-exit active PD exit timing. The DLL is expected to
be enabled and running during this mode.
When bit M12 = 1, a lower-power active PD mode, or “slow-exit” active PD mode, is en-
abled. The tXARDS parameter is used for slow-exit active PD exit timing. The DLL can
be enabled but “frozen” during active PD mode because the exit-to-READ command
timing is relaxed. The power difference expected between IDD3P normal and IDD3P low-
power mode is defined in the DDR2 IDD Specifications and Conditions table.
2Gb: x4, x8, x16 DDR2 SDRAM
Mode Register (MR)
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CAS Latency (CL)
The CAS latency (CL) is defined by bits M4–M6, as shown in Figure 36 (page 77). CL is
the delay, in clock cycles, between the registration of a READ command and the availa-
bility of the first bit of output data. The CL can be set to 3, 4, 5, 6, or 7 clocks, depending
on the speed grade option being used.
DDR2 SDRAM does not support any half-clock latencies. Reserved states should not be
used as an unknown operation otherwise incompatibility with future versions may re-
sult.
DDR2 SDRAM also supports a feature called posted CAS additive latency (AL). This fea-
ture allows the READ command to be issued prior to tRCD (MIN) by delaying the inter-
nal command to the DDR2 SDRAM by AL clocks. The AL feature is described in further
detail in Posted CAS Additive Latency (AL) (page 83).
Examples of CL = 3 and CL = 4 are shown in Figure 37; both assume AL = 0. If a READ
command is registered at clock edge n, and the CL is m clocks, the data will be available
nominally coincident with clock edge n + m (this assumes AL = 0).
Figure 37: CL
DO
n + 3
DO
n + 2
DO
n + 1
CK
CK#
Command
DQ
DQS, DQS#
CL = 3 (AL = 0)
READ
T0 T1 T2
Don’t careTransitioning data
NOP NOP NOP
DO
n
T3 T4 T5
NOP NOP
T6
NOP
DO
n + 3
DO
n + 2
DO
n + 1
CK
CK#
Command
DQ
DQS, DQS#
CL = 4 (AL = 0)
READ
T0 T1 T2
NOP NOP NOP
DO
n
T3 T4 T5
NOP NOP
T6
NOP
Notes: 1. BL = 4.
2. Posted CAS# additive latency (AL) = 0.
3. Shown with nominal tAC, tDQSCK, and tDQSQ.
2Gb: x4, x8, x16 DDR2 SDRAM
Mode Register (MR)
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Extended Mode Register (EMR)
The extended mode register controls functions beyond those controlled by the mode
register; these additional functions are DLL enable/disable, output drive strength, on-
die termination (ODT), posted AL, off-chip driver impedance calibration (OCD), DQS#
enable/disable, RDQS/RDQS# enable/disable, and output disable/enable. These func-
tions are controlled via the bits shown in Figure 38. The EMR is programmed via the LM
command and will retain the stored information until it is programmed again or the de-
vice loses power. Reprogramming the EMR will not alter the contents of the memory ar-
ray, provided it is performed correctly.
The EMR must be loaded when all banks are idle and no bursts are in progress, and the
controller must wait the specified time tMRD before initiating any subsequent opera-
tion. Violating either of these requirements could result in an unspecified operation.
Figure 38: EMR Definition
DLLPosted CAS# R
TT
Out
A9 A7 A6 A5 A4 A3A8 A2 A1 A0
Extended mode
register (Ex)
Address bus
9765438210
A10A12BA0BA1
101112n
0
14
E1
0
1
Output Drive St rength
Full
Reduced
Posted CAS# Additive Latency (AL) 3
0
1
2
3
4
5
6
Reserved
E3
0
1
0
1
0
1
0
1
E4
0
0
1
1
0
0
1
1
E5
0
0
0
0
1
1
1
1
0
1
DLL Enable
Enable (normal)
Disable (test/debug)
E0
15
E11
0
1
RDQS Enable
No
Yes
OCD Program
An2
ODS
R
TT
DQS#
E10
0
1
DQS# Enable
Enable
Disable
RDQS
R
TT
(Nominal)
R
TT
disabled
75Ω
150Ω
50Ω
E2
0
1
0
1
E6
0
0
1
1
0
1
Outputs
Enabled
Disabled
E12
0
1
0
1
Mode Register Set
Mode register (MR)
Extended mode register (EMR)
Extended mode register (EMR2)
Extended mode register (EMR3)
E15
0
0
1
1
E14
MRS
BA21
16
0
OCD Operation 4
OCD exit
Reserved
Reserved
Reserved
Enable OCD defaults
E7
0
1
0
0
1
E8
0
0
1
0
1
E9
0
0
0
1
1
Notes: 1. E16 (BA2) is only applicable for densities 1Gb, reserved for future use, and must be pro-
grammed to 0.
2. Mode bits (En) with corresponding address balls (An) greater than E12 (A12) are re-
served for future use and must be programmed to 0.
3. Not all listed AL options are supported in any individual speed grade.
4. As detailed in the Initialization section notes, during initialization of the OCD operation,
all three bits must be set to 1 for the OCD default state, then set to 0 before initializa-
tion is finished.
2Gb: x4, x8, x16 DDR2 SDRAM
Extended Mode Register (EMR)
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DLL Enable/Disable
The DLL may be enabled or disabled by programming bit E0 during the LM command,
as shown in Figure 38 (page 81). These specifications are applicable when the DLL is en-
abled for normal operation. DLL enable is required during power-up initialization and
upon returning to normal operation after having disabled the DLL for the purpose of
debugging or evaluation. Enabling the DLL should always be followed by resetting the
DLL using the LM command.
The DLL is automatically disabled when entering SELF REFRESH operation and is auto-
matically re-enabled and reset upon exit of SELF REFRESH operation.
Anytime the DLL is enabled (and subsequently reset), 200 clock cycles must occur be-
fore a READ command can be issued to allow time for the internal clock to synchronize
with the external clock. Failing to wait for synchronization to occur may result in a vio-
lation of the tAC or tDQSCK parameters.
Anytime the DLL is disabled and the device is operated below 25 MHz, any AUTO RE-
FRESH command should be followed by a PRECHARGE ALL command.
Output Drive Strength
The output drive strength is defined by bit E1, as shown in Figure 38. The normal drive
strength for all outputs is specified to be SSTL_18. Programming bit E1 = 0 selects nor-
mal (full strength) drive strength for all outputs. Selecting a reduced drive strength op-
tion (E1 = 1) will reduce all outputs to approximately 45 to 60 percent of the SSTL_18
drive strength. This option is intended for the support of lighter load and/or point-to-
point environments.
DQS# Enable/Disable
The DQS# ball is enabled by bit E10. When E10 = 0, DQS# is the complement of the dif-
ferential data strobe pair DQS/DQS#. When disabled (E10 = 1), DQS is used in a single-
ended mode and the DQS# ball is disabled. When disabled, DQS# should be left float-
ing; however, it may be tied to ground via a 20Ω to 10kΩ resistor. This function is also
used to enable/disable RDQS#. If RDQS is enabled (E11 = 1) and DQS# is enabled (E10 =
0), then both DQS# and RDQS# will be enabled.
RDQS Enable/Disable
The RDQS ball is enabled by bit E11, as shown in Figure 38. This feature is only applica-
ble to the x8 configuration. When enabled (E11 = 1), RDQS is identical in function and
timing to data strobe DQS during a READ. During a WRITE operation, RDQS is ignored
by the DDR2 SDRAM.
Output Enable/Disable
The OUTPUT ENABLE function is defined by bit E12, as shown in Figure 38. When ena-
bled (E12 = 0), all outputs (DQ, DQS, DQS#, RDQS, RDQS#) function normally. When
disabled (E12 = 1), all outputs (DQ, DQS, DQS#, RDQS, RDQS#) are disabled, thus re-
moving output buffer current. The output disable feature is intended to be used during
IDD characterization of read current.
2Gb: x4, x8, x16 DDR2 SDRAM
Extended Mode Register (EMR)
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On-Die Termination (ODT)
ODT effective resistance, RTT(EFF), is defined by bits E2 and E6 of the EMR, as shown in
Figure 38 (page 81). The ODT feature is designed to improve signal integrity of the
memory channel by allowing the DDR2 SDRAM controller to independently turn on/off
ODT for any or all devices. RTT effective resistance values of 50ΩΩ, and 150Ω are se-
lectable and apply to each DQ, DQS/DQS#, RDQS/RDQS#, UDQS/UDQS#, LDQS/
LDQS#, DM, and UDM/LDM signal. Bits (E6, E2) determine what ODT resistance is en-
abled by turning on/off sw1, sw2, or sw3. The ODT effective resistance value is selected
by enabling switch sw1, which enables all R1 values that are 150Ω each, enabling an ef-
fective resistance of 75Ω (RTT2 [EFF] = R2/2). Similarly, if sw2 is enabled, all R2 values that
are 300Ω each, enable an effective ODT resistance of 150Ω (RTT2[EFF] = R2/2). Switch sw3
enables R1 values of 100Ω, enabling effective resistance of 50Ω. Reserved states should
not be used, as an unknown operation or incompatibility with future versions may re-
sult.
The ODT control ball is used to determine when RTT(EFF) is turned on and off, assuming
ODT has been enabled via bits E2 and E6 of the EMR. The ODT feature and ODT input
ball are only used during active, active power-down (both fast-exit and slow-exit
modes), and precharge power-down modes of operation.
ODT must be turned off prior to entering self refresh mode. During power-up and initi-
alization of the DDR2 SDRAM, ODT should be disabled until the EMR command is is-
sued. This will enable the ODT feature, at which point the ODT ball will determine the
RTT(EFF) value. Anytime the EMR enables the ODT function, ODT may not be driven
HIGH until eight clocks after the EMR has been enabled (see Figure 81 (page 128) for
ODT timing diagrams).
Off-Chip Driver (OCD) Impedance Calibration
The OFF-CHIP DRIVER function is an optional DDR2 JEDEC feature not supported by
Micron and thereby must be set to the default state. Enabling OCD beyond the default
settings will alter the I/O drive characteristics and the timing and output I/O specifica-
tions will no longer be valid (see Initialization section for proper setting of OCD de-
faults).
Posted CAS Additive Latency (AL)
Posted CAS additive latency (AL) is supported to make the command and data bus effi-
cient for sustainable bandwidths in DDR2 SDRAM. Bits E3–E5 define the value of AL, as
shown in Figure 38. Bits E3–E5 allow the user to program the DDR2 SDRAM with an AL
of 0, 1, 2, 3, 4, 5, or 6 clocks. Reserved states should not be used as an unknown opera-
tion or incompatibility with future versions may result.
In this operation, the DDR2 SDRAM allows a READ or WRITE command to be issued
prior to tRCD (MIN) with the requirement that AL tRCD (MIN). A typical application
using this feature would set AL = tRCD (MIN) - 1 × tCK. The READ or WRITE command
is held for the time of the AL before it is issued internally to the DDR2 SDRAM device.
RL is controlled by the sum of AL and CL; RL = AL + CL. WRITE latency (WL) is equal to
RL minus one clock; WL = AL + CL - 1 × tCK. An example of RL is shown in Figure 39
(page 84). An example of a WL is shown in Figure 40 (page 84).
2Gb: x4, x8, x16 DDR2 SDRAM
Extended Mode Register (EMR)
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Figure 39: READ Latency
DO
n + 3
DO
n + 2
DO
n + 1
CK
CK#
Command
DQ
DQS, DQS#
AL = 2
ACTIVE n
T0 T1 T2
Don’t CareTransitioning Data
READ n NOP NOP
DO
n
T3 T4 T5
NOP
T6
NOP
T7 T8
NOP NOP
CL = 3
RL = 5
tRCD (MIN)
NOP
Notes: 1. BL = 4.
2. Shown with nominal tAC, tDQSCK, and tDQSQ.
3. RL = AL + CL = 5.
Figure 40: WRITE Latency
CK
CK#
Command
DQ
DQS, DQS#
ACTIVE n
T0 T1 T2
Don’t CareTransitioning Data
NOP NOP
T3 T4 T5
NOP
T6
NOP
DI
n + 3
DI
n + 2
DI
n + 1
WL = AL + CL - 1 = 4
T7
NOP
DI
n
tRCD (MIN)
NOP
AL = 2 CL - 1 = 2
WRITE n
Notes: 1. BL = 4.
2. CL = 3.
3. WL = AL + CL - 1 = 4.
2Gb: x4, x8, x16 DDR2 SDRAM
Extended Mode Register (EMR)
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Extended Mode Register 2 (EMR2)
The extended mode register 2 (EMR2) controls functions beyond those controlled by
the mode register. Currently all bits in EMR2 are reserved, except for E7, which is used
in commercial or high-temperature operations, as shown in Figure 41. The EMR2 is pro-
grammed via the LM command and will retain the stored information until it is pro-
grammed again or until the device loses power. Reprogramming the EMR will not alter
the contents of the memory array, provided it is performed correctly.
Bit E7 (A7) must be programmed as 1 to provide a faster refresh rate on IT and AT devi-
ces if TC exceeds 85°C.
EMR2 must be loaded when all banks are idle and no bursts are in progress, and the
controller must wait the specified time tMRD before initiating any subsequent opera-
tion. Violating either of these requirements could result in an unspecified operation.
Figure 41: EMR2 Definition
A9 A7 A6 A5 A4 A3A8 A2 A1 A0
Extended mode
register (Ex)
Address bus
9765438210
A10A12 A11BA0BA1
101112n
0
1415
An2
E14
0
1
0
1
Mode Register Set
Mode register (MR)
Extended mode register (EMR)
Extended mode register (EMR2)
Extended mode register (EMR3)
E15
0
0
1
1
MRS 000
00
SRT 0 00000 0
BA21
16
0
E7
0
1
SRT Enable
1X refresh rate (0°C to 85°C)
2X refresh rate (>85°C)
Notes: 1. E16 (BA2) is only applicable for densities 1Gb, reserved for future use, and must be pro-
grammed to 0.
2. Mode bits (En) with corresponding address balls (An) greater than E12 (A12) are re-
served for future use and must be programmed to 0.
2Gb: x4, x8, x16 DDR2 SDRAM
Extended Mode Register 2 (EMR2)
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Extended Mode Register 3 (EMR3)
The extended mode register 3 (EMR3) controls functions beyond those controlled by
the mode register. Currently all bits in EMR3 are reserved, as shown in Figure 42. The
EMR3 is programmed via the LM command and will retain the stored information until
it is programmed again or until the device loses power. Reprogramming the EMR will
not alter the contents of the memory array, provided it is performed correctly.
EMR3 must be loaded when all banks are idle and no bursts are in progress, and the
controller must wait the specified time tMRD before initiating any subsequent opera-
tion. Violating either of these requirements could result in an unspecified operation.
Figure 42: EMR3 Definition
E14
0
1
0
1
Mode Register Set
Mode register (MR)
Extended mode register (EMR)
Extended mode register (EMR2)
Extended mode register (EMR3)
E15
0
0
1
1
A9 A7 A6 A5 A4 A3A8 A2 A1 A0
Extended mode
register (Ex)
Address bus
9765438210
A10A12 A11
BA0BA1
101112n
0
1415
An2
MRS 0 0 0 0 0 0 0 0 0 0 00 0
BA21
16
0
Notes: 1. E16 (BA2) is only applicable for densities 1Gb, is reserved for future use, and must be
programmed to 0.
2. Mode bits (En) with corresponding address balls (An) greater than E12 (A12) are re-
served for future use and must be programmed to 0.
2Gb: x4, x8, x16 DDR2 SDRAM
Extended Mode Register 3 (EMR3)
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Initialization
Figure 43: DDR2 Power-Up and Initialization
DDR2 SDRAM must be powered up and initialized in a predefined manner. Operational procedures other than those specified may result in unde-
fined operation. Figure 43 illustrates, and the notes outline, the sequence required for power-up and initialization.
tVTD1
CKE
R
tt
Power-up:
V
DD
and stable
clock (CK, CK#)
T = 200μs (MIN)3
High-Z
DM15
DQS15 High-Z
Address16
CK
CK#
tCL
V
TT
1
V
REF
V
DDQ
Command
NOP3
PRE
T0 Ta0
Don’t care
tCL
tCK
V
DD
ODT
DQ15 High-Z
Tb0
200 cycles of CK are required before a READ command can be issued
MR with
DLL RESET
tRFC
LM8PRE9
LM7REF10 REF10 LM11
Tg0 Th0 Ti0 Tj0
MR without
DLL RESET
EMR with
OCD default
Tk0 Tl0 Tm0
Te0 Tf0
EMR(2) EMR(3)
tMRD
LM6
LM5
A10 = 1
tRPA
Tc0 Td0
SSTL_18
low level2
Valid14
Valid
Indicates a Break in
Time Scale
LM12
EMR with
OCD exit
LM13
Normal
operation
See no te 10
Code Code
A10 = 1
Code Code
Code Code Code
tMRD tMRD tMRD tMRD
tRPA tRFC
V
DDL
tMRD tMRD
EMR
T = 400ns (MIN)4
LVCMOS
low level2
2Gb: x4, x8, x16 DDR2 SDRAM
Initialization
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Notes: 1. Applying power; if CKE is maintained below 0.2 × VDDQ, outputs remain disabled. To
guarantee RTT (ODT resistance) is off, VREF must be valid and a low level must be applied
to the ODT ball (all other inputs may be undefined; I/Os and outputs must be less than
VDDQ during voltage ramp time to avoid DDR2 SDRAM device latch-up). VTT is not ap-
plied directly to the device; however, tVTD should be 0 to avoid device latch-up. At
least one of the following two sets of conditions (A or B) must be met to obtain a stable
supply state (stable supply defined as VDD, VDDL, VDDQ, VREF, and VTT are between their
minimum and maximum values as stated in Table 13 (page 44)):
A. Single power source: The VDD voltage ramp from 300mV to VDD,min must take no lon-
ger than 200ms; during the VDD voltage ramp, |VDD - VDDQ| 0.3V. Once supply voltage
ramping is complete (when VDDQ crosses VDD,min), Table 13 specifications apply.
•V
DD, VDDL, and VDDQ are driven from a single power converter output
•V
TT is limited to 0.95V MAX
•V
REF tracks VDDQ/2; VREF must be within ±0.3V with respect to VDDQ/2 during supply
ramp time; does not need to be satisfied when ramping power down
•V
DDQ VREF at all times
B. Multiple power sources: VDD VDDL VDDQ must be maintained during supply voltage
ramping, for both AC and DC levels, until supply voltage ramping completes (VDDQ
crosses VDD,min). Once supply voltage ramping is complete, Table 13 specifications apply.
Apply VDD and VDDL before or at the same time as VDDQ; VDD/VDDL voltage ramp time
must be 200ms from when VDD ramps from 300mV to VDD,min
Apply VDDQ before or at the same time as VTT; the VDDQ voltage ramp time from when
VDD,min is achieved to when VDDQ,min is achieved must be 500ms; while VDD is ramp-
ing, current can be supplied from VDD through the device to VDDQ
•V
REF must track VDDQ/2; VREF must be within ±0.3V with respect to VDDQ/2 during sup-
ply ramp time; VDDQ VREF must be met at all times; does not need to be satisfied
when ramping power down
Apply VTT; the VTT voltage ramp time from when VDDQ,min is achieved to when VTT,min
is achieved must be no greater than 500ms
2. CKE requires LVCMOS input levels prior to state T0 to ensure DQs are High-Z during de-
vice power-up prior to VREF being stable. After state T0, CKE is required to have SSTL_18
input levels. Once CKE transitions to a high level, it must stay HIGH for the duration of
the initialization sequence.
3. For a minimum of 200μs after stable power and clock (CK, CK#), apply NOP or DESELECT
commands, then take CKE HIGH.
4. Wait a minimum of 400ns then issue a PRECHARGE ALL command.
5. Issue a LOAD MODE command to the EMR(2). To issue an EMR(2) command, provide
LOW to BA0, and provide HIGH to BA1; set register E7 to “0” or “1” to select appropri-
ate self refresh rate; remaining EMR(2) bits must be “0” (see Extended Mode Register 2
(EMR2) (page 85) for all EMR(2) requirements).
6. Issue a LOAD MODE command to the EMR(3). To issue an EMR(3) command, provide
HIGH to BA0 and BA1; remaining EMR(3) bits must be “0.” Extended Mode Register 3
(EMR3) for all EMR(3) requirements.
7. Issue a LOAD MODE command to the EMR to enable DLL. To issue a DLL ENABLE com-
mand, provide LOW to BA1 and A0; provide HIGH to BA0; bits E7, E8, and E9 can be set
to “0” or “1;” Micron recommends setting them to “0;” remaining EMR bits must be
“0.” Extended Mode Register (EMR) (page 81) for all EMR requirements.
8. Issue a LOAD MODE command to the MR for DLL RESET. 200 cycles of clock input is re-
quired to lock the DLL. To issue a DLL RESET, provide HIGH to A8 and provide LOW to
BA1 and BA0; CKE must be HIGH the entire time the DLL is resetting; remaining MR bits
must be “0.” Mode Register (MR) (page 76) for all MR requirements.
9. Issue PRECHARGE ALL command.
2Gb: x4, x8, x16 DDR2 SDRAM
Initialization
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10. Issue two or more REFRESH commands.
11. Issue a LOAD MODE command to the MR with LOW to A8 to initialize device operation
(that is, to program operating parameters without resetting the DLL). To access the MR,
set BA0 and BA1 LOW; remaining MR bits must be set to desired settings. Mode Register
(MR) (page 76) for all MR requirements.
12. Issue a LOAD MODE command to the EMR to enable OCD default by setting bits E7, E8,
and E9 to “1,” and then setting all other desired parameters. To access the EMR, set BA0
HIGH and BA1 LOW (see Extended Mode Register (EMR) (page 81) for all EMR require-
ments.
13. Issue a LOAD MODE command to the EMR to enable OCD exit by setting bits E7, E8, and
E9 to “0,” and then setting all other desired parameters. To access the extended mode
registers, EMR, set BA0 HIGH and BA1 LOW for all EMR requirements.
14. The DDR2 SDRAM is now initialized and ready for normal operation 200 clock cycles af-
ter the DLL RESET at Tf0.
15. DM represents DM for the x4, x8 configurations and UDM, LDM for the x16 configura-
tion; DQS represents DQS, DQS#, UDQS, UDQS#, LDQS, LDQS#, RDQS, RDQS# for the ap-
propriate configuration (x4, x8, x16); DQ represents DQ[3:0] for x4, DQ[7:0] for x8 and
DQ[15:0] for x16.
16. A10 = PRECHARGE ALL, CODE = desired values for mode registers (bank addresses are
required to be decoded).
2Gb: x4, x8, x16 DDR2 SDRAM
Initialization
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ACTIVATE
Before any READ or WRITE commands can be issued to a bank within the DDR2
SDRAM, a row in that bank must be opened (activated), even when additive latency is
used. This is accomplished via the ACTIVATE command, which selects both the bank
and the row to be activated.
After a row is opened with an ACTIVATE command, a READ or WRITE command may
be issued to that row subject to the tRCD specification. tRCD (MIN) should be divided
by the clock period and rounded up to the next whole number to determine the earliest
clock edge after the ACTIVATE command on which a READ or WRITE command can be
entered. The same procedure is used to convert other specification limits from time
units to clock cycles. For example, a tRCD (MIN) specification of 20ns with a 266 MHz
clock (tCK = 3.75ns) results in 5.3 clocks, rounded up to 6. This is shown in Figure 44,
which covers any case where 5 < tRCD (MIN)/tCK 6. Figure 44 also shows the case for
tRRD where 2 < tRRD (MIN)/tCK 3.
Figure 44: Example: Meeting tRRD (MIN) and tRCD (MIN)
Command
Don’t Care
T1T0 T2 T3 T4 T5 T6 T7
tRRD tRRD
Row Row Col
Bank x Bank y
Row
Bank z Bank y
NOPACT NOP NOPACT NOP NOP RD/WR
tRCD
CK#
Address
Bank address
CK
T8 T9
NOP NOP
A subsequent ACTIVATE command to a different row in the same bank can only be is-
sued after the previous active row has been closed (precharged). The minimum time in-
terval between successive ACTIVATE commands to the same bank is defined by tRC.
A subsequent ACTIVATE command to another bank can be issued while the first bank is
being accessed, which results in a reduction of total row-access overhead. The mini-
mum time interval between successive ACTIVATE commands to different banks is de-
fined by tRRD.
DDR2 devices with 8 banks (1Gb or larger) have an additional requirement: tFAW. This
requires no more than four ACTIVATE commands may be issued in any given tFAW
(MIN) period, as shown in Figure 45 (page 91).
2Gb: x4, x8, x16 DDR2 SDRAM
ACTIVATE
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Figure 45: Multibank Activate Restriction
Command
Don’t Care
T1T0 T2 T3 T4 T5 T6 T7
tRRD (MIN)
Row Row
READACT ACT NOP
tFAW (MIN)
Bank address
CK#
Address
CK
T8 T9
Col
Bank a
ACTREAD READ READACT NOP
Row
Col Row
Col Col
Bank cBank b Bank dBank c Bank e
ACT
Row
T10
Bank dBank bBank a
Note: 1. DDR2-533 (-37E, x4 or x8), tCK = 3.75ns, BL = 4, AL = 3, CL = 4, tRRD (MIN) = 7.5ns, tFAW
(MIN) = 37.5ns.
2Gb: x4, x8, x16 DDR2 SDRAM
ACTIVATE
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READ
READ bursts are initiated with a READ command. The starting column and bank ad-
dresses are provided with the READ command, and auto precharge is either enabled or
disabled for that burst access. If auto precharge is enabled, the row being accessed is
automatically precharged at the completion of the burst. If auto precharge is disabled,
the row will be left open after the completion of the burst.
During READ bursts, the valid data-out element from the starting column address will
be available READ latency (RL) clocks later. RL is defined as the sum of AL and CL: RL =
AL + CL. The value for AL and CL are programmable via the MR and EMR commands,
respectively. Each subsequent data-out element will be valid nominally at the next posi-
tive or negative clock edge (at the next crossing of CK and CK#). Figure 46 (page 93)
shows examples of RL based on different AL and CL settings.
DQS/DQS# is driven by the DDR2 SDRAM along with output data. The initial LOW state
on DQS and the HIGH state on DQS# are known as the read preamble (tRPRE). The
LOW state on DQS and the HIGH state on DQS# coincident with the last data-out ele-
ment are known as the read postamble (tRPST).
Upon completion of a burst, assuming no other commands have been initiated, the DQ
will go High-Z. A detailed explanation of tDQSQ (valid data-out skew), tQH (data-out
window hold), and the valid data window are depicted in Figure 55 (page 101) and Fig-
ure 56 (page 102). A detailed explanation of tDQSCK (DQS transition skew to CK) and
tAC (data-out transition skew to CK) is shown in Figure 57 (page 103).
Data from any READ burst may be concatenated with data from a subsequent READ
command to provide a continuous flow of data. The first data element from the new
burst follows the last element of a completed burst. The new READ command should be
issued x cycles after the first READ command, where x equals BL/2 cycles (see Figure 47
(page 94)).
Nonconsecutive read data is illustrated in Figure 48 (page 95). Full-speed random read
accesses within a page (or pages) can be performed. DDR2 SDRAM supports the use of
concurrent auto precharge timing (see Table 42 (page 98)).
DDR2 SDRAM does not allow interrupting or truncating of any READ burst using BL = 4
operations. Once the BL = 4 READ command is registered, it must be allowed to com-
plete the entire READ burst. However, a READ (with auto precharge disabled) using BL =
8 operation may be interrupted and truncated only by another READ burst as long as
the interruption occurs on a 4-bit boundary due to the 4n prefetch architecture of
DDR2 SDRAM. As shown in Figure 49 (page 96), READ burst BL = 8 operations may
not be interrupted or truncated with any other command except another READ com-
mand.
Data from any READ burst must be completed before a subsequent WRITE burst is al-
lowed. An example of a READ burst followed by a WRITE burst is shown in Figure 50
(page 96). The tDQSS (NOM) case is shown (tDQSS [MIN] and tDQSS [MAX] are de-
fined in Figure 58 (page 105)).
2Gb: x4, x8, x16 DDR2 SDRAM
READ
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Figure 46: READ Latency
READ NOP NOP NOP NOP NOP
Bank a,
Col n
CK
CK#
Command
Address
DQ
DQS, DQS#
DO
n
DO
n
T0 T1 T2 T3 T4n T5nT4 T5
CK
CK#
Command READ NOP NOP NOP NOP NOP
Address Bank a,
Col n
RL = 3 (AL = 0, CL = 3)
DQ
DQS, DQS#
DO
n
T0 T1 T2 T3 T3n T4nT4 T5
CK
CK#
Command READ NOP NOP NOP NOP NOP
Address Bank a,
Col n
RL = 4 (AL = 0, CL = 4)
DQ
DQS, DQS#
T0 T1 T2 T3 T3n T4nT4 T5
AL = 1 CL = 3
RL = 4 (AL = 1 + CL = 3)
Don’t Care
Transitioning Data
Notes: 1. DO n = data-out from column n.
2. BL = 4.
3. Three subsequent elements of data-out appear in the programmed order following
DO n.
4. Shown with nominal tAC, tDQSCK, and tDQSQ.
2Gb: x4, x8, x16 DDR2 SDRAM
READ
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Figure 47: Consecutive READ Bursts
CK
CK#
Command READ NOP READ NOP NOP NOP NOP
Address Bank,
Col n Bank,
Col b
Command READ NOP READ NOP NOP NOP
Address Bank,
Col n Bank,
Col b
RL = 3
CK
CK#
DQ
DQS, DQS#
RL = 4
DQ
DQS, DQS#
DO
nDO
b
DO
nDO
b
T0 T1 T2 T3 T3n T4nT4 T5 T6
T5n T6n
T0 T1 T2 T3T2n
NOP
T3n T4nT4 T5 T6
T5n T6n
Don’t CareTransitioning Data
tCCD
tCCD
Notes: 1. DO n (or b) = data-out from column n (or column b).
2. BL = 4.
3. Three subsequent elements of data-out appear in the programmed order following
DO n.
4. Three subsequent elements of data-out appear in the programmed order following
DO b.
5. Shown with nominal tAC, tDQSCK, and tDQSQ.
6. Example applies only when READ commands are issued to same device.
2Gb: x4, x8, x16 DDR2 SDRAM
READ
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Figure 48: Nonconsecutive READ Bursts
Command READ NOP NOP NOP NOP NOP NOP NOPREAD
T0 T1 T2 T3 T3n T4 T5 T7 T8T6T4n T6n T7n
CK
CK#
T5 T7 T8T5n T6T4n T7n
Command NOP NOP NOP NOPREAD NOP NOP NOPREAD
T0 T1 T2 T3 T4
DQ DO
nDO
b
Don’t CareTransitioning Data
Address Bank,
Col n Bank,
Col b
Address Bank,
Col n Bank,
Col b
CK
CK#
CL = 4
CL = 3
DQ DO
nDO
b
DQS, DQS#
DQS, DQS#
Notes: 1. DO n (or b) = data-out from column n (or column b).
2. BL = 4.
3. Three subsequent elements of data-out appear in the programmed order following
DO n.
4. Three subsequent elements of data-out appear in the programmed order following
DO b.
5. Shown with nominal tAC, tDQSCK, and tDQSQ.
6. Example applies when READ commands are issued to different devices or nonconsecu-
tive READs.
2Gb: x4, x8, x16 DDR2 SDRAM
READ
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Figure 49: READ Interrupted by READ
T0 T1 T2
Don’t CareTransitioning Data
T3 T4 T5 T6
Command READ
1
NOP
2
NOP
2
Valid Valid Valid
READ
3
Valid Valid Valid
T7 T8 T9
CK
CK#
CL = 3 (AL = 0)
tCCD
Address Valid
4
Valid
4
CL = 3 (AL = 0)
DQ DO DO DO DO DO DO DO DO DO DO DO DO
A10 Valid
5
DQS, DQS#
Notes: 1. BL = 8 required; auto precharge must be disabled (A10 = LOW).
2. NOP or COMMAND INHIBIT commands are valid. PRECHARGE command cannot be is-
sued to banks used for READs at T0 and T2.
3. Interrupting READ command must be issued exactly 2 × tCK from previous READ.
4. READ command can be issued to any valid bank and row address (READ command at T0
and T2 can be either same bank or different bank).
5. Auto precharge can be either enabled (A10 = HIGH) or disabled (A10 = LOW) by the in-
terrupting READ command.
6. Example shown uses AL = 0; CL = 3, BL = 8, shown with nominal tAC, tDQSCK, and
tDQSQ.
Figure 50: READ-to-WRITE
CK
CK# T0 T1 T2
Don’t CareTransitioning Data
T3 T4 T5 T6 T7 T8 T9 T10 T11
AL = 2 CL = 3
RL = 5
WL = RL - 1 = 4
tRCD = 3
Command
ACT n NOP NOP NOP NOP NOP NOP
READ n NOP NOP NOPWRITE
DQS, DQS#
DQ DO
nDO
n + 1 DO
n + 2 DO
n + 3 DI
nDI
n + 1 DI
n + 2 DI
n + 3
Notes: 1. BL = 4; CL = 3; AL = 2.
2. Shown with nominal tAC, tDQSCK, and tDQSQ.
READ with Precharge
A READ burst may be followed by a PRECHARGE command to the same bank, provided
auto precharge is not activated. The minimum READ-to-PRECHARGE command spac-
ing to the same bank has two requirements that must be satisfied: AL + BL/2 clocks and
tRTP. tRTP is the minimum time from the rising clock edge that initiates the last 4-bit
prefetch of a READ command to the PRECHARGE command. For BL = 4, this is the time
from the actual READ (AL after the READ command) to PRECHARGE command. For BL
= 8, this is the time from AL + 2 × CK after the READ-to-PRECHARGE command. Follow-
2Gb: x4, x8, x16 DDR2 SDRAM
READ
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ing the PRECHARGE command, a subsequent command to the same bank cannot be
issued until tRP is met. However, part of the row precharge time is hidden during the
access of the last data elements.
Examples of READ-to-PRECHARGE for BL = 4 are shown in Figure 51 and in Figure 52
for BL = 8. The delay from READ-to-PRECHARGE period to the same bank is AL + BL/2 -
2CK + MAX (tRTP/tCK or 2 × CK) where MAX means the larger of the two.
Figure 51: READ-to-PRECHARGE – BL = 4
CK
CK#
T0 T1 T2
Don’t CareTransitioning Data
T3 T4 T5 T6 T7
Address Bank a Bank a Bank a
tRAS (MIN)
tRTP (MIN)
tRP (MIN)
AL + BL/2 - 2CK + MAX (tRTP/tCK or 2CK)
Command READ NOP
PRE
ACTNOP NOP NOP NOP
4-bit
prefetch
DQ DO DO DO DO
A10 Valid Valid
CL = 3AL = 1
DQS, DQS#
tRC (MIN)
Notes: 1. RL = 4 (AL = 1, CL = 3); BL = 4.
2. tRTP 2 clocks.
3. Shown with nominal tAC, tDQSCK, and tDQSQ.
Figure 52: READ-to-PRECHARGE – BL = 8
CK
CK# T0 T1 T2
Don’t CareTransitioning Data
T3 T4 T5 T6 T7 T8
CL = 3
AL = 1
DQS, DQS#
First 4-bit
prefetch
Second 4-bit
prefetch
tRTP (MIN) tRP (MIN)
Address
Bank a Bank a Bank a
tRC (MIN)
tRAS (MIN)
A10
Valid Valid
AL + BL/2 - 2CK + MAX (tRTP/tCK or 2CK)
DQ
DO DO DO DO DO DO DO DO
Command
READ NOP NOP NOPNOP NOPNOP ACTPRE
Notes: 1. RL = 4 (AL = 1, CL = 3); BL = 8.
2. tRTP 2 clocks.
3. Shown with nominal tAC, tDQSCK, and tDQSQ.
2Gb: x4, x8, x16 DDR2 SDRAM
READ
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READ with Auto Precharge
If A10 is high when a READ command is issued, the READ with auto precharge function
is engaged. The DDR2 SDRAM starts an auto precharge operation on the rising clock
edge that is AL + (BL/2) cycles later than the read with auto precharge command provi-
ded tRAS (MIN) and tRTP are satisfied. If tRAS (MIN) is not satisfied at this rising clock
edge, the start point of the auto precharge operation will be delayed until tRAS (MIN) is
satisfied. If tRTP (MIN) is not satisfied at this rising clock edge, the start point of the au-
to precharge operation will be delayed until tRTP (MIN) is satisfied. When the internal
precharge is pushed out by tRTP, tRP starts at the point where the internal precharge
happens (not at the next rising clock edge after this event).
When BL = 4, the minimum time from READ with auto precharge to the next ACTIVATE
command is AL + (tRTP + tRP)/tCK. When BL = 8, the minimum time from READ with
auto precharge to the next ACTIVATE command is AL + 2 clocks + (tRTP + tRP)/tCK. The
term (tRTP + tRP)/tCK is always rounded up to the next integer. A general purpose equa-
tion can also be used: AL + BL/2 - 2CK + (tRTP + tRP)/tCK. In any event, the internal pre-
charge does not start earlier than two clocks after the last 4-bit prefetch.
READ with auto precharge command may be applied to one bank while another bank is
operational. This is referred to as concurrent auto precharge operation, as noted in Ta-
ble 42. Examples of READ with precharge and READ with auto precharge with applica-
ble timing requirements are shown in Figure 53 (page 99) and Figure 54 (page 100),
respectively.
Table 42: READ Using Concurrent Auto Precharge
From Command (Bank n) To Command (Bank m)
Minimum Delay
(with Concurrent Auto Precharge) Units
READ with auto precharge READ or READ with auto precharge BL/2 tCK
WRITE or WRITE with auto precharge (BL/2) + 2 tCK
PRECHARGE or ACTIVATE 1 tCK
2Gb: x4, x8, x16 DDR2 SDRAM
READ
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Figure 53: Bank Read – Without Auto Precharge
CK
CK#
CKE
A10
Bank address
tCK tCH tCL
RA
tRCD
tRAS3
tRC
tRP
CL = 3
DM
T0 T1 T2 T3 T4 T5 T7n T8nT6 T7 T8
DQ8
DQS, DQS#
Case 1: tAC (MIN)
and