LT4320(-1) Datasheet

Linear Technology/Analog Devices

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Datasheet

LT4320/LT4320-1
1
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For more information www.linear.com/LT4320
Features Description
Ideal Diode Bridge
Controller
The LT
®
4320/LT4320-1 are ideal diode bridge controllers
that drive four N-channel MOSFETs, supporting voltage
rectification from DC to 600Hz typical. By maximizing
available voltage and reducing power dissipation (see
thermograph comparison below), the ideal diode bridge
simplifies power supply design and reduces power supply
cost, especially in low voltage applications.
An ideal diode bridge also eliminates thermal design
problems, costly heat sinks, and greatly reduces PC board
area. The LT4320’s internal charge pump supports an all-
NMOS design, which eliminates larger and more costly
PMOS switches. If the power source fails or is shorted, a
fast turn-off minimizes reverse current transients.
The LT4320 is designed for DC to 60Hz typical voltage
rectification, while the LT4320-1 is designed for DC to
600Hz typical voltage rectification. Higher frequencies of
operation are possible depending on MOSFET size and
operating load current.
applications
n Maximizes Power Efficiency
n Eliminates Thermal Design Problems
n DC to 600Hz
n 9V to 72V Operating Voltage Range
n IQ = 1.5mA (Typical)
n Maximizes Available Voltage
n Available in 8-Lead (3mm × 3mm) DFN, 12-Lead
MSOP and 8-Lead PDIP Packages
n Security Cameras
n Terrestrial or Airborne Power Distribution Systems
n Power-over-Ethernet Powered Device with a
Secondary Input
n Polarity-Agnostic Power Input
n Diode Bridge Replacement
L, LT , LT C , LT M , Linear Technology and the Linear logo are registered trademarks of Linear
Technology Corporation. All other trademarks are the property of their respective owners.
Patent pending.
+
~
~
TG1
IN1
LT4320
BG2
IN2
BG1
TG2
OUTN
OUTP
4320 TA01a
OUTPUT
9V TO 72V
INPUT
DC TO 600Hz (TYP)
Thermograph of Passive Diode Bridge
Thermograph of LT4320
Driving Four MOSFETs
SBM1040 (×4) 4320 TA01b
typical application
Temperature Rise
CURRENT
MOSFET
2.5mΩ
DIODE
SBM
1040
2A 0.6°C 15°C
4A 3.5°C 32°C
6A 6.7°C 49°C
8A 11°C 66°C
10A 16°C 84°C
DC Input, On Same PCB
LT4320+2.5mΩ FET (×4)
CONDITIONS: 24V ACIN, 9.75A DC LOAD ON SAME PCB
4320 TA01c
LT4320/LT4320-1
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For more information www.linear.com/LT4320
pin conFiguration
absolute MaxiMuM ratings
Supply Voltages
IN1, IN2 .................................................... –3V to 80V
OUTP ..................................................... 0.3V to 80V
Output Voltages (Note 3)
BG1, BG2, TG1, TG2 ............................... 0.3V to 80V
TG1-IN1, TG2-IN2 ....................................0.3V to 12V
(Notes 1, 2)
TOP VIEW
9
DD PACKAGE
8-LEAD (3mm × 3mm) PLASTIC DFN
5
6
7
8
4
3
2
1IN2
TG2
BG2
BG1
IN1
TG1
OUTP
OUTN
TJMAX = 150°C, θJC = 5.5°C/W
EXPOSED PAD (PIN 9) MUST BE
CONNECTED TO OUTN (PIN 5)
1
2
3
4
5
6
IN2
TG2
NC
NC
BG2
BG1
12
11
10
9
8
7
IN1
TG1
NC
OUTP
NC
OUTN
TOP VIEW
13
MSE PACKAGE
12-LEAD PLASTIC MSOP
TJMAX = 150°C, θJC = 10°C/W
EXPOSED PAD (PIN 13) MUST BE
CONNECTED TO OUTN (PIN 7)
1
2
3
4
8
7
6
5
TOP VIEW
IN2
TG2
BG2
BG1
IN1
TG1
OUTP
OUTN
N8 PACKAGE
8-LEAD PLASTIC DIP
TJMAX = 150°C, θJC = 45°C/W
orDer inForMation
LEAD FREE FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION OPERATING JUNCTION
TEMPERATURE RANGE
LT4320IDD#PBF LT4320IDD#TRPBF LGCV 8-Lead (3mm × 3mm) Plastic DFN –40°C to 85°C
LT4320HDD#PBF LT4320HDD#TRPBF LGCV 8-Lead (3mm × 3mm) Plastic DFN –40°C to 125°C
LT4320IDD-1#PBF LT4320IDD-1#TRPBF LGCW 8-Lead (3mm × 3mm) Plastic DFN –40°C to 85°C
LT4320HDD-1#PBF LT4320HDD-1#TRPBF LGCW 8-Lead (3mm × 3mm) Plastic DFN –40°C to 125°C
LT4320IMSE#PBF LT4320IMSE#TRPBF 4320 12-Lead Plastic MSOP –40°C to 85°C
LT4320HMSE#PBF LT4320HMSE#TRPBF 4320 12-Lead Plastic MSOP –40°C to 125°C
LT4320MPMSE#PBF LT4320MPMSE#TRPBF 4320 12-Lead Plastic MSOP –55°C to 125°C
LT4320IMSE-1#PBF LT4320IMSE-1#TRPBF 43201 12-Lead Plastic MSOP –40°C to 85°C
LT4320HMSE-1#PBF LT4320HMSE-1#TRPBF 43201 12-Lead Plastic MSOP –40°C to 125°C
LT4320MPMSE-1#PBF LT4320MPMSE-1#TRPBF 43201 12-Lead Plastic MSOP –55°C to 125°C
LT4320IN8#PBF NA LT4320N8 8-Lead PDIP –40°C to 85°C
LT4320HN8#PBF NA LT4320N8 8-Lead PDIP –40°C to 125°C
LT4320IN8-1#PBF NA LT4320N8-1 8-Lead PDIP –40°C to 85°C
LT4320HN8-1#PBF NA LT4320N8-1 8-Lead PDIP –40°C to 125°C
Consult LT C Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Consult LT C Marketing for information on nonstandard lead based finish parts.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
Operating Junction Temperature Range
LT4320I ................................................40°C to 8C
LT4320H ............................................ 40°C to 125°C
LT4320MP ......................................... 55°C to 125°C
Storage Temperature Range .................. 6C to 150°C
Lead Temperature (Soldering, 10 sec)
MSE, PDIP Packages ........................................ 300°C
LT4320/LT4320-1
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For more information www.linear.com/LT4320
electrical characteristics
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. (Note 2)
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
OUTP Voltage Range l9 72 V
OUTP Undervoltage Lockout (UVLO) Threshold INn = OUTP, Other IN = 0V l6.2 6.6 7.0 V
VINT INn Turn-On/Off Threshold OUTP = 9V, Other IN = 0V l1.3 3.7 V
IOUTP OUTP Pin Current INn = OUTP+ VSD(MAX) + 5mV, Other IN = 0Vl 1.0 1.5 mA
IINn INn Pin Current
at 9V
at 72V
INn = OUTP+ VSD(MAX) + 5mV, Other IN = 0V
l
l
44
0.3
63
0.4
µA
mA
VSD Topside Source-Drain Regulation Voltage (INn – OUTP)
LT4320
LT4320-1
l
l
8
26
20
40
35
55
mV
mV
VTGATE Top Gate Drive (TGn – INn) INn = OUTP+ VSD(MAX) + 5mV, 10μA Out of
TGn, Other IN = 0V
l6.6 10.8 V
VBGATE Bottom Gate Drive (BGn) INn = OUTP, 10μA Out of BGn, Other IN = 0V l7.0 12 V
ITGUn Top Gate Pull-Up Current TGn – INn = 0V, INn = OUTP + 0.1V
TGn – INn = 5V, INn = OUTP + 0.1V
Current Flows Out of TGn, Other IN = 0V
l
l
425
120
µA
µA
ITGSn Top Gate Pull-Down Current to INn TGn – INn = 5V, INn = OUTP – 0.25V
Current Flows Into TGn, Other IN = 0V
l1.25 mA
ITGGn Top Gate Pull-Down Current to OUTN INn = 0V, Other IN = OUTP = 9.0V, TGn = 5V
Current Flows Into TGn
l6.0 mA
IBGUn Bottom Gate Pull-Up Current BGn = 5V; INn = OUTP = 9.0V, Other IN = 0V
Current Flows Out of BGn
l1.9 mA
IBGDn Bottom Gate Pull-Down Current BGn = 5V; INn = 0V, Other IN = OUTP = 9.0V
Current Flows Into BGn
l12.5 mA
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Unless otherwise specified,
exposure to any Absolute Maximum Rating condition for extended periods
may affect device reliability and lifetime.
Note 2: All voltages are referenced to OUTN = 0V unless otherwise specified.
Note 3: Externally forced voltage absolute maximums. The LT4320 may
exceed these limits during normal operation.
LT4320/LT4320-1
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For more information www.linear.com/LT4320
typical perForMance characteristics
VBGATE vs OUTP TGn Pull-Up Strength TGn Pull-Down Strength to INn
TGn Pull-Down Strength to OUTN BGn Pull-Up Strength BGn Pull-Down Strength
IINn and IOUTP vs OUTP IOUTP vs OUTP VTGATE vs OUTP
INn = OUTP (V)
0
0
CURRENT (µA)
200
400
600
800
1000
1200
20 40 60 80
4320 G01
OUTP
INn
OTHER IN = 0V
OUTP (V)
0
0
IOUTP (µA)
200
400
600
800
1000
1200
20 40 60 80
4320 G02
IN1 AND IN2 FLOATING
OUTP (V)
9
∆VTGATE (V)
8
9
25
4320 G03
7
613 17 21
11
10
VSD = 100mV
VSD = 40mV
OTHER IN = 0V
OUTP (V)
9
6
VBGATE (V)
7
8
9
10
11
12
13 17 21 25
4320 G04
OTHER IN = 0V
∆VTGATE (V)
0
0
ITGn (µA)
200
400
600
246 8
4320 G05
10
800
1000
100
300
500
700
900
12
OUTP = 9V
OUTP = 12V
OUTP = 72V
INn = OUTP + 100mV
OTHER IN = 0V
∆VTGATE (V)
0
0
ITGSn (mA)
1
2
3
4
5
24 6 8
4320 G06
10 12
OUTP = 9V
OUTP = 72V
INn = OUTP – 250mV
OTHER IN = 0V
TGn (V)
0
0
ITGGn (mA)
10
20
30
40
60
24 6 8
4320 G07
10 12
50
INn = 0V
OTHER IN = OUTP
OUTP = 9V
OUTP = 12V
OUTP = 72V
VBGATE (V)
0
0
IBGUn (mA)
2
5
4810 12
4320 G08
1
4
3
2614
OTHER IN = 0V
VINn = 9V
VINn = 12V
VINn = 72V
VBGATE (V)
0
35
30
25
20
15
10
5
06 10
4320 G09
2 4 8 12
IBGDn (mA)
LT4320/LT4320-1
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For more information www.linear.com/LT4320
pin Functions
(DFN, PDIP/MSOP)
IN2 (Pin 1/Pin 1): Bridge Rectifier Input. IN2 connects to
the external NMOS transistors MTG2 source, MBG1 drain
and the power input.
TG2 (Pin 2/Pin 2): Topside Gate Driver Output. TG2 pin
drives MTG2 gate.
BG2 (Pin 3/Pin 5): Bottom-Side Gate Driver Output. BG2
pin drives MBG2 gate.
BG1 (Pin 4/Pin 6): Bottom-Side Gate Driver Output. BG1
pin drives MBG1 gate.
OUTN (Pin 5/Pin 7): OUTN is the rectified negative output
voltage, and connects to the sources of MBG1 and MBG2.
OUTP (Pin 6/Pin 9): OUTP is the rectified positive output
voltage that powers the LT4320 and connects to the drains
of MTG1 and MTG2.
TG1 (Pin 7/Pin 11): Topside Gate Driver Output. TG1 pin
drives MTG1 gate.
IN1 (Pin 8/Pin 12): Bridge Rectifier Input. IN1 connects
to the external NMOS transistors MTG1 source, MBG2
drain, and the power input.
NC (Pins 3, 4, 8, 10, MSOP Only): No Connections. Not
internally connected.
Exposed Pad (Pin 9/Pin 13): Exposed Pad, DFN and MSOP.
Must be connected to OUTN.
OUTP
LT4320 BD
MTG1
OUTN
BG1
IN1
LT4320
IN2
MBG1
BG2
MTG2
MBG2
TG1
+
~
~
TG2
CONTROL
block DiagraM
LT4320/LT4320-1
6
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For more information www.linear.com/LT4320
operation
Electronic systems that receive power from an AC power
source or a DC polarity-agnostic power source often em-
ploy a 4-diode rectifier. The traditional diode bridge comes
with an efficiency loss due to the voltage drop generated
across two conducting diodes. The voltage drop reduces
the available supply voltage and dissipates significant
power especially in low voltage applications.
By maximizing available voltage and reducing power dis-
sipation, the ideal diode bridge simplifies power supply
design and reduces power supply cost. An ideal diode
bridge also eliminates thermal design problems, costly
heat sinks, and greatly reduces PC board area.
The LT4320 is designed for DC to 60Hz typical voltage
rectification, while the LT4320-1 is designed for DC to
600Hz typical voltage rectification. Higher frequencies of
operation are possible depending on MOSFET size and
operating load current.
Figure 2 presents sample waveforms illustrating the gate
pins in an AC voltage rectification design.
TG2
IN1
CLOAD
TO LOADINPUT
LT4320
IN2
+
~
~
OUTP
OUTN
BG2
TG1
MTG1
MTG2
MBG2
MBG1
BG1
4320 F01
40V
30V
20V
10V
0V 4320 F02
VTG1
VTG2
VBG1
VBG2
VIN1
VOUTP
VIN2
Figure 1. LT4320 with Four N-Channel MOSFETS, Illustrating Current
Flow When IN1 Is Positive
Figure 2. 24V AC Sample Waveform
LT4320/LT4320-1
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For more information www.linear.com/LT4320
applications inForMation
MOSFET Selection
A good starting point is to reduce the voltage drop of the
ideal bridge to 30mV per MOSFET with the LT4320 (50mV
per MOSFET with the LT4320-1). Given the average output
load current, IAVG, select RDS(ON) to be:
RDS(ON) =
30mV
IAVG
for a DC power input
or
RDS(ON) =30mV
3 •IAVG
for an AC power input
In the AC power input calculation, 3 • IAVG assumes the
duration of current conduction occupies 1/3 of the AC
period.
Select the maximum allowable drain-source voltage, VDSS,
to be higher than the maximum input voltage.
Design Example
For a 24W, 12V DC/24V AC application, IAVG = 2A for 12V
DC. To cover the 12V DC case:
RDS(ON) =
30mV
2A
=15m
For the 24V AC operation, IAVG = 1A. To cover the 24V
AC case:
RDS(ON) =
30mV
3 1A
=10m
This provides a starting range of RDS(ON) values to choose
from.
Ensure the MOSFET can handle a continuous current of
3 • IAVG to cover the expected peak currents during AC rec-
tification. That is, select ID ≥ 3A. Since a 24V AC waveform
can reach 34V peak, select a MOSFET with VDSS >>34V.
A good choice of VDSS is 60V in a 24V AC application.
Other Considerations in MOSFET Selection
Practical MOSFET considerations for the LT4320-based
ideal bridge application include selecting the lowest avail-
able total gate charge (Qg) for the desired RDS(ON). Avoid
oversizing the MOSFET, since an oversized MOSFET limits
the maximum operating frequency, creates unintended
efficiency losses, adversely increases turn-on/turn-off
times, and increases the total solution cost. The LT4320
gate pull-up/pull-down current strengths specified in the
Electrical Characteristics section, and the MOSFET total
gate charge (Qg), determine the MOSFET turn-on/off times
and the maximum operating frequency in an AC applica-
tion. Choosing the lowest gate capacitance while meeting
RDS(ON) speeds up the response time for full enhancement,
regulation, turn-off and input shorting events.
VGS(th) must be a minimum of 2V or higher. A gate thresh-
old voltage lower than 2V is not recommended since too
much time is needed to discharge the gate below the
threshold and halt current conduction during a hot plug
or input short event.
CLOAD Selection
AF ceramic and a 10μF minimum electrolytic capacitor
must be placed across the OUTP and OUTN pins with the
1µF ceramic placed as close to the LT4320 as possible.
Downstream power needs and voltage ripple tolerance
determine how much additional capacitance between
OUTP and OUTN is required. CLOAD in the hundreds to
thousands of microfarads is common.
A good starting point is selecting CLOAD such that:
CLOAD ≥ IAVG/(VRIPPLE • 2 • Freq)
where IAVG is the average output load current, VRIPPLE is
the maximum tolerable output ripple voltage, and Freq
is the frequency of the input AC source. For example, in
a 60Hz, 24VAC application where the load current is 1A
and the tolerable ripple is 15V, choose CLOAD ≥ 1A/(15V
• 2 • 60Hz) = 556µF.
CLOAD must also be selected so that the rectified output
voltage, OUTP-OUTN, must be within the LT4320/LT4320-1
specified OUTP voltage range.
Transient Voltage Suppressor
For applications that may encounter brief overvoltage
events higher than the LT4320 absolute maximum rating,
install a unidirectional transient voltage suppressor (TVS)
between the OUTP and OUTN pins as close as possible
to the LT4320.
LT4320/LT4320-1
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For more information www.linear.com/LT4320
typical applications
CONDITION: 13VDCIN, 3A LOAD ON SAME PCB
B360B 4 COMPACT FETs*
*19mΩ, 60V EACH FET
Figure 3. Thermograph: B360B vs LT4320 +4 Compact FETs
LT4320/LT4320-1
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For more information www.linear.com/LT4320
typical applications
Figure 4. Demonstration Circuit 1902A Used in Figure 3 Thermograph
LT4320/LT4320-1
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For more information www.linear.com/LT4320
package Description
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
3.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
0.40 ±0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ±0.10
(2 SIDES)
0.75 ±0.05
R = 0.125
TYP
2.38 ±0.10
14
85
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(DD8) DFN 0509 REV C
0.25 ±0.05
2.38 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
1.65 ±0.05
(2 SIDES)2.10 ±0.05
0.50
BSC
0.70 ±0.05
3.5 ±0.05
PACKAGE
OUTLINE
0.25 ±0.05
0.50 BSC
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698 Rev C)
LT4320/LT4320-1
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For more information www.linear.com/LT4320
package Description
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
MSOP (MSE12) 0213 REV G
0.53 ±0.152
(.021 ±.006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.22 –0.38
(.009 – .015)
TYP
0.86
(.034)
REF
0.650
(.0256)
BSC
12
12 11 10 9 8 7
7
DETAIL “B”
16
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD SHALL
NOT EXCEED 0.254mm (.010") PER SIDE.
0.254
(.010) 0° – 6° TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
RECOMMENDED SOLDER PAD LAYOUT
BOTTOM VIEW OF
EXPOSED PAD OPTION
2.845 ±0.102
(.112 ±.004)
2.845 ±0.102
(.112 ±.004)
4.039 ±0.102
(.159 ±.004)
(NOTE 3)
1.651 ±0.102
(.065 ±.004)
1.651 ±0.102
(.065 ±.004)
0.1016 ±0.0508
(.004 ±.002)
1 2 3 4 5 6
3.00 ±0.102
(.118 ±.004)
(NOTE 4)
0.406 ±0.076
(.016 ±.003)
REF
4.90 ±0.152
(.193 ±.006)
DETAIL “B”
CORNER TAIL IS PART OF
THE LEADFRAME FEATURE.
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
0.12 REF
0.35
REF
5.10
(.201)
MIN
3.20 – 3.45
(.126 – .136)
0.889 ±0.127
(.035 ±.005)
0.42 ±0.038
(.0165 ±.0015)
TYP
0.65
(.0256)
BSC
MSE Package
12-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1666 Rev G)
LT4320/LT4320-1
12
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For more information www.linear.com/LT4320
package Description
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
N8 REV I 0711
.065
(1.651)
TYP
.045 – .065
(1.143 – 1.651)
.130 ±.005
(3.302 ±0.127)
.020
(0.508)
MIN
.018 ±.003
(0.457 ±0.076)
.120
(3.048)
MIN
.008 – .015
(0.203 – 0.381)
.300 – .325
(7.620 – 8.255)
.325 +.035
–.015
+0.889
–0.381
8.255
( )
1 2 34
87 65
.255 ±.015*
(6.477 ±0.381)
.400*
(10.160)
MAX
NOTE:
1. DIMENSIONS ARE INCHES
MILLIMETERS
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
.100
(2.54)
BSC
N Package
8-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510 Rev I)
LT4320/LT4320-1
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For more information www.linear.com/LT4320
revision history
REV DATE DESCRIPTION PAGE NUMBER
A 11/13 Clarified that input frequency ranges use typical numbers (60Hz, 600Hz)
Added PDIP package
Reduced MOSFET drop to 30mV from 70mV in “MOSFET Selection” and “Design Example” sections
Provided additional guidance in “Other Considerations in MOSFET Selection” section
Updated MSE package drawing
1, 6
2, 12
7
7
10
B 2/14 Added H- and MP-grade information 2
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
LT4320/LT4320-1
14
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For more information www.linear.com/LT4320
relateD parts
typical application
TG2
MTG2
MTG1
IN1
F C1
LT4320 TO LOADINPUT
IN2
+
~
~
OUTP
OUTN
BG2
MBG2
MBG1
TG1
BG1
4320 TA02
+
PART NUMBER DESCRIPTION COMMENTS
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LTC4353 Dual Low Voltage Ideal Diode Controller Dual N-Channel, 0V to 18V, MSOP-16 and DFN-16 Packages
LTC4354 Negative Voltage Diode-OR Controller and Monitor Controls Tw o N-Channel MOSFETs, 1μs Turn-Off, –80V Operation
LTC4355 Positive Voltage Diode-OR Controller and Monitor Controls Tw o N-Channel MOSFETs, 0.5μs Turn-Off, 9V to 80V Operation
LTC4357 Positive High Voltage Ideal Diode Controller Controls Single N-Channel MOSFETs, 0.5μs Turn-Off, 9V to 80V Operation
LTC4358 5A Ideal Diode Positive Voltage Ideal Diode with Integrated MOSFET, 9V to 26.5V Operation
LTC4359 Ideal Diode Controller with Reverse Input Protection N-Channel, 4V to 80V, MSOP-8 and DFN-6 Packages
LTC4370 2-Supply Diode-OR Current Balancing Controller Dual N-Channel, 0V to 18V, MSOP-16 and DFN-16 Packages
LTC4415 Dual 4A ideal Diodes with Adjustable Current Limit 1.7V to 5.5V Operating Range
LT4320 IDEAL BRIDGE
DIODE
BRIDGE
MTG1,MTG2
MBG1, MBG2
OPERATING
VOLTAGE
LOAD
CURRENT
C1
(MIN)
POWER
LOSS
POWER
LOSS
BSZ110N06NS3 55V DC 3.5A 10µF 0.22W 4.2W
24V AC 1.5A 560µF 0.13W 1.9W
BSC031N06NS3 55V DC 30A 10µF 4.5W 36W
24V AC 10A 3.3mF 1.6W 12W
PSMN040-100MSE 72V DC 2A 10µF 0.24W 2.4W
LINEAR TECHNOLOGY CORPORATION 2013
LT 0214 REV B • PRINTED IN USA
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 FAX: (408) 434-0507 www.linear.com/LT4320

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