Sil-Pad 900S Datasheet

Bergquist

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Datasheet

Thermally Conductive
Interface Materials for
Cooling Electronic Assemblies
Sil-Pad
®
SELECTION GUIDE
Table of Contents
1
Introduction 1
Thermal Properties & Testing 4
Interface Material Selection Guide 5
Gap Pad®Thermally Conductive Materials 6
Gap Pad Comparison Data 7
Frequently Asked Questions 8
Gap Pad VO®9
Gap Pad VO Soft®10
Gap Pad VO Ultra Soft 11
Gap Pad 1000SF 12
Gap Pad HC1000 13
Gap Pad 1500 14
Gap Pad 1500R 15
Gap Pad A2000 16
Gap Pad 2000S40 17
Gap Pad 2500S20 18
Gap Pad 2500 19
Gap Pad A3000 20
Gap Pad 3000S30 21
Gap Filler 1000 22
Gap Filler 1100SF 23
Gap Filler 2000 24
TIC- Thermal Interface Compound 25
Comparison Data & FAQ’s 25
TIC 1000G 26
TIC 1000A 27
TIC 2000A 28
TIC 4000 29
Hi-Flow®Phase Change Interface Materials 30
Hi-Flow Comparison Data 31
Frequently Asked Questions 32
Hi-Flow 105 33
Hi-Flow 115-AC 34
Hi-Flow 225F-AC 35
Hi-Flow 225FT 36
Hi-Flow 225UF 37
Hi-Flow 225UT 38
Hi-Flow 225U 39
Hi-Flow 625 40
Hi-Flow 300P 41
Hi-Flow 300G 42
Sil-Pad®Thermally Conductive Insulators 43
Sil-Pad Comparison Data 44
Frequently Asked Questions 45
Choosing Sil-Pad Thermally Conductive Insulators 46
Mechanical, Electrical and Thermal Properties 48
Sil-Pad Applications 50
Selection Guide 50
Sil-Pad 400 52
Sil-Pad 800 53
Sil-Pad 900S 54
Sil-Pad 980 55
Sil-Pad A1500 56
Sil-Pad 1500ST 57
Sil-Pad 1750 58
Sil-Pad 2000 59
Sil-Pad A2000 60
Sil-Pad K-4 61
Sil-Pad K-6 62
Sil-Pad K-10 63
Q-Pad®II 64
Q-Pad 3 65
Poly-Pad®1000 66
Poly-Pad K-4 67
Poly-Pad K-10 68
Sil-Pad Tubes 69
Sil-Pad Shield 70
Bond-Ply®& Liqui-BondAdhesives 71
Bond-Ply & Liqui-Bond Comparison Data 72
Frequently Asked Questions 72
Bond-Ply 100 73
Bond-Ply 400 74
Bond-Ply 660B 75
Liqui-Bond SA 2000 76
Solutions for Surface Mount Applications 78
Ordering Information 80
Sil-Pad Configurations - Imperial 82
Hi-Flow Configurations - Imperial 85
Sil-Pad Configurations - Metric 86
Hi-Flow Configurations - Metric 89
Sil-Pad Shield 90
2
INTRODUCTION
At Bergquist, developing high quality
components for the electronics
industry is our first priority. As a
world-leading manufacturer with
state-of-the-art facilities, we serve a
multitude of industries worldwide
including automotive, computer,
consumer electronics, military, motor
control, power conversion,
telecommunications and more.
We make it our business to know
your business. We understand your
problems. We also know that there
will always be a better way to help
you reach your goals and objectives.
To that end, our company continually
invests considerable time and money
into research and development. The
Bergquist Company is focused on a
single purpose – discovering the
need, then developing and delivering
technologically advanced solutions
backed by superior service.
World Leader in
Thermal Management Through
Technology, Innovation & Service
Bergquist Takes
the Heat
Thermal Management Products
Bergquist's Thermal Products Group is a world
leading developer and manufacturer of thermal
management materials which provide product
solutions to control and manage heat in
electronic assemblies and printed circuit
boards. Used by many of the world’s largest
OEMs in various industries including auto-
motive, computer, power supply, military and
motor control, these materials include:
Sil-Pad®Thermally Conductive Insulators
Bond-Ply®& Liqui-Bond– Thermally
Conductive Adhesives
Gap Pad®– Thermally Conductive
Gap Filling Materials
Hi-Flow®– Phase Change Interface Materials
TICThermal Interface Compound
Thermal Clad®– Insulated Metal Substrates
World Class Operations
Around the Globe
Worldwide Locations
In the United States, the Thermal Products
Group’s 90,000 square foot manufacturing
facility is located in Cannon Falls, Minnesota.
A 40,000 square foot facility in Prescott,
Wisconsin houses the Thermal Clad printed
circuit board operations. A 130,000 square
foot facility in Chanhassen, Minnesota is the
location for Bergquist’s corporate headquarters
and state of the art research and development
facilities.Worldwide, Bergquist has facilities in
The Netherlands, Germany, the United
Kingdom,Taiwan, Korea, Hong Kong and
China with sales representatives in 30
countries to support worldwide growth.
3
INTRODUCTION GAP PAD TIC HI--FLOW SIL-PAD BOND-PLY ORDERING
A Legacy of Industry-
Leading Technology
New Product Innovation
For over 35 years, outstanding quality,
innovation and engineering have been hall-
marks of The Bergquist Company. Today,
developing innovative products for the
electronics industry remains our first priority.
Bergquist has developed over 260 materials
which provide thermal solutions for a wide
variety of electronic applications. Many of our
products were originally developed to satisfy
acustomer request for a specific material
designed to perform to their particular
specifications.This “can do” attitude and
customized technology has earned The
Bergquist Company its QS 9000 certification
ahead of competitors, and will position the
company as an industry leader by early
certification to ISO 9001: 2000.
Research & Development
at the Speed of Change
R&D Facilities
Keeping pace in today’s aggressive electronics
industry demands continual anticipation of
change and the ability to develop customer-
driven solutions quickly and efficiently. Our
Chanhassen headquarters features a
state-of-the-art development laboratory and
engineering department staffed with highly
skilled chemical engineers, laboratory
technicians and manufacturing engineers – all
dedicated to researching, developing and
testing new materials. From such dedication
has come many industry-standard proprietary
products including Thermal Clad, Sil-Pad, Gap
Pad, Bond-Ply and Hi-Flow materials.
Thermal Properties & Testing
4
INTRODUCTION
Thermal Conductivity
The time rate of heat flow through a unit area producing a unit
temperature difference across a unit thickness.
Thermal conductivity is an inherent or absolute property of the material.
Thermal Impedance
A property of a particular assembly measured by the ratio of the
temperature difference between two surfaces to the steady state heat
flow through them.
Factors affecting thermal impedance include:
Area: Increasing the area of thermal contact decreases
thermal impedance.
Thickness: Increasing the insulator thickness increases
thermal impedance.
Pressure: Increasing mounting pressure under ideal conditions
decreases thermal impedance.
Time: Thermal impedance decreases over time.
Measurement: Thermal impedance is affected by the method of
temperature measurement.
Thermal Impedance Per Bergquist TO-220 Thermal
Performance (25˚C Cold Plate Testing)
Thermal Resistance
The opposition to the flow of heat through a unit area of material
across an undefined thickness.
Thermal resistance varies with thickness.
Test Methods – ASTM D5470
2 in. diameter stack (ref. 3.14 in2) – 10-500* psi, 1 hour per layer
* Bergquist modified
i
Interface Material Selection Guide
5
INTRODUCTION
Market Applications Products
Discrete Power Devices for
Power Supplies, Computers,
Telecom (Thru-Hole)
Active Power Compensators:
Capacitors, Inductors, Resistors
Electronic Modules for
Automotive: Motor & wiper
Controls, Anti-Lock, et.
Electronic Modules for Telecom
and Power Supplies
Computer Applications: CPU,
GPU, ASICs, Hard Drives
Electrical Insulator
Clip, Low Pressure
Screw/Rivets, High Pressure
Not Applicable
Sheet Stock
Roll-Form Continuous
Standard Configurations
Custom External Shapes
Custom Internal Features
Standard PSA Offerings
Q-Pad II T T T T T T AAAAAA
Q-Pad3 TTTT TT AAAAAA
Hi-Flow 105 T AS AS T AAAAAA
Hi-Flow 115-AC T T T T AAAAAA
Hi-Flow 300G T T T T AS AAAAAA
Hi-Flow 225F-AC T T T A A A AS NA
Hi-Flow 225FT T T T A A A AS NA
Hi-Flow 225UT T T A A A AS NA
Hi-Flow 225U T T A A A AS
Hi-Flow 225UF T T A A A AS
Hi-Flow 625 T T T AAAAAA
Hi-Flow 300P T T T AAAAAA
Bonding - Thin-Film Bond-Ply 660B T T T T T AAAAAA
Bonding - Fiberglass Bond-Ply 100 T T T T T AAAAAA
Bonding -
Unreinforced Bond-Ply 400 T T T T T AAAAAA
Sil-Pad - Fiberglass Sil-Pad 400 T T T T T T AAAAAA
Sil-Pad 800 T T T T T AAAAAA
Sil-Pad 900S T T T T T T AAAAAA
Sil-Pad 980 T T T T AAAAAA
Sil-Pad A1500 T T T T T T AAAAAA
Sil-Pad 1500ST T T T T T T AAAAAA
Sil-Pad 1750 T T T T T T AAAAAA
Sil-Pad 2000 T T T T AS T AAAAAA
Sil-Pad A2000 T T T T AS T AAAAAA
Sil-Pad K-4 T T T T T T AAAAAA
Sil-Pad K-6 T T T T T T AAAAAA
Sil-Pad K-10 T T T T T T AAAAAA
Gap Pad Gap Pad VO T T T T T T T A A* A A AS A
Gap Pad VO Soft T T T T T T T A A* A A AS A
Gap Pad VO Ultra Soft T T T T T T T A A* A A AS A
Gap Pad 1000SF T T T T T T T A A* A A AS A
Gap Pad HC1000 T T T T T A A* A A A
Gap Pad1500 T T T T T A A* A A AS
Gap Pad 1500R T T T T T T A A* A A A
Gap Pad A2000 T T T AS T T A A* A A A
Gap Pad 2000S40 T T T AS T T A A* A A A
Gap Pad 2500S20 T T T AS T T A A* A A A
Gap Pad 2500 T T T AS T T A A* A A A
Gap Pad A3000 T T T T AS T T A A* A A A
Gap Pad 3000S30 T T T T AS T T A A* A A A
Gap Filler Gap Filler 1000 T T T T AS T A
Gap Filler 1100SF T T T T T AS T A
Gap Filler 2000 T T T T AS T A
Liquid Adhesive Liqui-Bond SA 2000 T T AS T A
T = Typical, AS = Application-Specific (contact Bergquist Sales); A = Available, * = up to 40 mil only.
Note: For Hi-Flow 225UT, Hi-Flow 225FT, and Hi-Flow 225F-AC, the adhesive is not a PSA.
Sil-Pad - Thin Film
Polyimide
Grease Replacement
Materials - Insulated
Grease Replacement
Materials
TYPICAL CONVERTED
OPTIONS
MOUNTING
METHODS
PRODUCT OVERVIEW
INTERFACE APPLICATIONS
Gap Pad
®
Thermally Conductive Materials
6
GAP PAD
Solution-Driven Thermal Management Products for Electronic Devices
The Bergquist Company, a world leader in thermal interface materials,
developed the Gap Pad family to meet the electronics industry’s
growing need for interface materials with greater conformability,
higher thermal performance and easier application.
The extensive Gap Pad family provides an effective thermal interface
between heat sinks and electronic devices where uneven surface
topography, air gaps and rough surface textures are present. Bergquist
application specialists work closely with customers to specify the proper
Gap Pad material for each unique thermal management requirement.
A Complete Range of Choices for Filling Air Gaps and Enhancing Thermal Conductivity
Features
Each of the many products within
the Gap Pad family is unique in
its construction, properties and
performance. Following is an
overview of the important
features offered by the
Gap Pad family.
• Low-modulus polymer material
Available with fiberglass/rubber
carriers or in a non-reinforced
version
• Special fillers to achieve specific
thermal and conformability
characteristics
• Highly conformable to uneven
and rough surfaces
• Electrically isolating
• Naturally tacky one-side or
tacky on both sides with
protective liner
Variety of thicknesses and
hardnesses
• Range of thermal conductivities
Available in sheets and
die-cut parts
Benefits
Gap Pad thermal products are
designed to improve an assembly’s
thermal performance and reliability
while saving time and money.
Specifically:
• Eliminates air gaps to reduce
thermal resistance
• High conformability reduces
interfacial resistance
• Low-stress vibration dampening
• Shock absorbing
• Easy material handling
• Simplified application
• Puncture, shear and tear
resistance
• Improved performance for
high-heat assemblies
• Compatible with automated
dispensing equipment
Options
Some Gap Pad products have
special features for particular
applications, including:
Available with or without
adhesive
• Rubber-coated fiberglass
reinforcement
Thicknesses from 0.010''
to 0.250''
Available in custom die-cut
parts, sheets and rolls
(converted or unconverted)
• Custom thicknesses and
constructions
Adhesive or natural
inherent tack
We produce thousands of specials.
Tooling charges vary depending
on tolerance and complexity of
the part.
Applications
Gap Pad products are well suited
to a wide variety of electronics,
automotive, medical, aerospace
and military applications such as:
• Between an IC and a heat sink
or chassis.Typical packages
include BGA’s, QFP, SMT power
components and magnetics
• Between a semiconductor and
heat sink
• CD-ROM/DVD cooling
• Heat pipe assemblies
• RDRAM memory modules
• DDR SDRAM
• Hard drive cooling
• Power supply
• Signal amplifiers
• Between other heat generating
devices and chassis
Gap Pad
®
Comparison Data
7
GAP PAD
Conductivity, Hardness and General Overview
8
GAP PAD
Frequently Asked Questions
Q: What thermal conductivity test method was used to
achieve the values given on the data sheets?
A: The Anter Quickline 10 was used to run this test. Bergquist has
published an application note about the modifications to the
ASTM D5470 test method to appropriately test Gap Pad materials
at low 10 pressure (see Bergquist Application Note #112).
Q: Is Gap Pad offered with an adhesive?
A: Currently the standard Gap Pads, which include Gap Pad VO,
Gap Pad VO Soft, and Gap Pad VO Ultra Soft are offered with or
without an adhesive on the Sil-Pad 800/900 carrier side of the
material.The remaining surface has natural inherent tack. All other
Gap Pads have inherent tack.
Q: Is the adhesive repositionable?
A: Depending on the surface being applied to, if care is taken, the
pad may be repositioned. Special care should be taken when
removing the pad from aluminum or anodized surfaces to avoid
tearing or delamination.
Q: What is meant by “naturally tacky”?
A: The characteristic of the rubber itself has a natural inherent tack,
without the addition of an adhesive. As with adhesive backed
products, the naturally tacky surfaces may help in the assembly
process to temporarily hold the pad in place while the application
is being assembled. Unlike adhesive backed products, inherent tack
does not have a thermal penalty since the rubber itself has the
tack.Tack strength varies from one Gap Pad product to the next.
Q: Is the naturally tacky side of the Gap Pad reposition-
able?
A: Again, depending on the material that the pad is applied to, in
most cases they are repositionable. Again, care should be taken
when removing the pad from aluminum or anodized surfaces as
to avoid tearing or delaminating the pad.The naturally tacky side
is always easier to reposition than an adhesive side.
Q: Is Gap Pad reworkable?
A: Depending on the application and the pad being used, Gap Pad
has been reworked in the past. Bergquist has customers that are
currently using the same pad for reassembling their applications
after burn-in processes and after fieldwork repairs. However, this
is left up to the design engineer’s judgment as to whether or not
the Gap Pad will withstand reuse.
Q: Is liquid Gap Filler reworkable?
A: It is highly dependent on the strength of the application and its
surface topography. Liquid Gap Filler will cure with low adhesive
strength to the application surfaces.
Q: Will heat make the material softer?
A: In the temperature range of -60°C to 200°C, there is no
significant variance in hardness, for silicone Gap Pads and
Gap Fillers.
Q: What is the life expectancy of Gap Pad?
A: The silicone rubber industry recognizes a 20-year life for
silicone rubber when used within specified operation parameters.
Bergquist has made pad material that has been in applications for
some 30 years without any known signs of deterioration.
Q: What is the shelf life of Gap Pad?
A: Shelf life for Gap Pad is one (1) year after date of manufacture.
For Gap Pad with adhesive, the shelf life is six (6) months after
the date of manufacture. After these dates, inherent tack and
adhesive properties should be recharacterized.
Q: What are the upper processing temperature limits for
Gap Pad and for how long?
A: Gap Pads that are pink, mauve or gold in color are more stable at
elevated temperatures. Gap Pad in general can be exposed to
temporary processing temperatures of 250°C for five minutes
and 300°C for one minute.
Q: Is Gap Pad electrically isolating?
A: Yes, all Gap Pad materials are electrically isolating. However, keep
in mind that Gap Pad is designed to FILL gaps, not for
guaranteeing them in high stress applications.
Q: How much force will the pad place on my device?
A: Refer to the Pressure vs. Deflection charts in Bergquist
Application Note #116.
Q: Will Gap Pad and Gap Filler work in my application?
What size gaps will Gap Pad and Gap Filler
accommodate?
A: Gap Pad and Gap Filler can be used wherever air can be
replaced, such as between a heat generating device and a heat
sink, heat spreader or housing.This can be done using one sheet
of Gap Pad or individual pieces of appropriate thicknesses, or by
using Gap Filler if stack-up tolerances and height variations
are significant.
Q: What is meant by “compliance” and “conformability,
and why is this important?
A: The better a Gap Pad complies and conforms to a rough or
stepped surface, the less interfacial resistance will be present due
to air voids and air gaps.This leads to a lower overall thermal
resistance of the pad between the two interfaces.
Q: Is anything given off by the material (i.e. extractables,
outgassing)?
A: 1) Gap Pad and Gap Filler, like all silicone pads, can extract silicone
fluid (refer to Bergquist Application Note #56). Also note that
Gap Pad and Gap Filler have the lowest extraction value for
silicone-based gap filling products on the market.
2) Primarily for aerospace applications, outgassing data is detailed
in Bergquist Application Note #117, tested per ASTM E595.
Q: How is extraction testing performed?
A: The test method used is the Bellcore Extraction method
#TR-NWT-000930; refer to Bergquist Application Note #56.
9
GAP PAD
Gap Pad VO
®
Features and Benefits
Thermal conductivity = 0.8W/mK
• Enhanced puncture, shear, & tear resistance
• Conformable gap filling material
• Electrically isolating
Gap Pad VO is a cost effective thermally
conductive interface.The material is a filled
thermally conductive polymer supplied on a
rubber-coated fiberglass carrier allowing for
easy material handling.The conformable
nature of Gap Pad VO allows the pad to fill in
air gaps between PC boards and heat sinks
or a metal chassis.
Note: Resultant thickness is defined as the final gap
thickness of the application.
Conformable,Thermally Conductive Material for Filling Air Gaps
Typical Applications Include:
• Telecommunications
• Computer and peripherals
• Power conversion
• Between heat generating semiconductors and a heat sink
Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader
• Between heat generating magnetic components and a heat sink
Configurations Available:
• Sheet form and die-cut parts
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Gap Pad®:U.S. Patent 5,679,457 and others.
0
50
100
150
200
250
135791113
Thermal Resistance (°C-in2/W)
Resultant Thickness (mils)
GPVO - 0.040 - AC - 0816 - NA
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
0816 = Standard Sheet Size 8" X 16",
00 = Custom Configuration
AC = Adhesive one side,
00 = No pressure sensitive adhesive
Standard Thicknesses Available: 0.020", 0.040",
0.060", 0.080", 0.100", 0.125", 0.160", 0.200", 0.250"
GPVO = Gap Pad VO Material
Section A
Section B
Section C
Section E
Section D
TYPICAL PROPERTIES OF GAP PAD VO
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Gold/Pink Gold/Pink Visual
Reinforcement Carrier Sil-Pad Sil-Pad
Thickness (inch) / (mm) 0.020 to 0.250 0.508 to 6.350 ASTM D374
Inherent Surface Tack (1 or 2 sided) 1 1 —
Density (g/cc) 1.6 1.6 ASTM D792
Heat Capacity (J/g-K) 1.0 1.0 ASTM C351
Hardness, Bulk Rubber (Shore00) (1) 40 40 ASTM D2240
Young’s Modulus (psi) / (kPa) (2) 100 689 ASTM D575
Continuous Use Temp (°F) / (°C) -76 to 392 -60 to 200
ELECTRICAL
Dielectric Breakdown Voltage (Vac) >6000 >6000 ASTM D149
Dielectric Constant (1000 Hz) 5.5 5.5 ASTM D150
Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257
Flame Rating 94 V-O 94 V-O U.L.
THERMAL
Thermal Conductivity (W/m-K) 0.8 0.8 ASTM D5470
1) One second delay value Shore 00 hardness scale.
2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2.For more information on Gap Pad
modulus, refer to Bergquist Application Note #116.
10
GAP PAD
Features and Benefits
Thermal conductivity = 0.8W/mK
• Conformable low hardness
• Enhanced puncture, shear, & tear resistance
• Electrically isolating
Gap Pad VO Soft is recommended for
applications that require a minimum amount
of stress on components. Gap Pad VO Soft
is a highly conformable, low modulus filled
silicone polymer on a rubber coated fiberglass
carrier.The material can be used as an
interface where one side is in contact with
a leaded device.
Note: Resultant thickness is defined as the final gap
thickness of the application.
Gap Pad VO Soft
®
Highly Conformable,Thermally Conductive Material for Filling Air Gaps
Thickness vs. Thermal Resistance
Gap Pad VO Soft
20
40
60
80
100
120
140
160
180
200
12345678910
Thermal Resistance (°C-in2/W)
ResultantThickness(mils)
Typical Applications Include:
• Telecommunications
• Computer and peripherals
• Power conversion
• Between heat-generating semiconductors or magnetic components and a heat sink
Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader
Configurations Available:
• Sheet form and die-cut parts
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Gap Pad®:U.S. Patent 5,679,457 and others.
GPVOS - 0.060 - AC - 00 - ACME10256 Rev. a
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
0816 = Standard Sheet Size 8" X 16",
00 = Custom Configuration
AC = Pressure sensitive adhesive one side,
00 = No pressure sensitive adhesive
Standard Thicknesses Available: 0.020", 0.040",
0.060", 0.080", 0.100", 0.125", 0.160", 0.200"
GPVOS = Gap Pad VO Soft Material
SectionA
SectionB
Section C
Section E
SectionD
TYPICAL PROPERTIES OF GAP PAD VO SOFT
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Mauve/Pink Mauve/Pink Visual
Reinforcement Carrier Sil-Pad Sil-Pad
Thickness (inch) / (mm) 0.020 to 0.200 0.508 to 5.000 ASTM D374
Inherent Surface Tack (1 or 2 sided) 1 1 —
Density (g/cc) 1.6 1.6 ASTM D792
Heat Capacity (J/g-K) 1.0 1.0 ASTM C351
Hardness, Bulk Rubber (Shore00) (1) 25 25 ASTM D2240
Young’s Modulus (psi) / (kPa) (2) 40 275 ASTM D575
Continuous Use Temp (°F) / (°C) -76 to 392 -60 to 200
ELECTRICAL
Dielectric Breakdown Voltage (Vac) >6000 >6000 ASTM D149
Dielectric Constant (1000 Hz) 5.5 5.5 ASTM D150
Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257
Flame Rating 94 V-O 94 V-O U.L.
THERMAL
Thermal Conductivity (W/m-K) 0.8 0.8 ASTM D5470
1) One second delay value Shore 00 hardness scale.
2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2.For more information on Gap Pad
modulus, refer to Bergquist Application Note #116.
11
GAP PAD
Gap Pad
®
VO Ultra Soft
Ultra Conformable,Thermally Conductive Material for Filling Air Gaps
Features and Benefits
Thermal conductivity = 1.0 W/mK
• Highly conformable low hardness
• Gel-like modulus
• Designed for low stress applications
• Puncture, shear, & tear resistant
Gap Pad VO Ultra Soft is recommended for
applications that require a minimum amount
of stress on components.The viscoelastic nature
of the material also gives excellent low stress
vibration dampening and shock absorbing
characteristics. Gap Pad VO Ultra Soft is an
electrically isolating material, which allows its use
in applications requiring isolation between heat
sinks and high voltage, bare leaded devices.
Note: Resultant thickness is defined as the final gap
thickness of the application.
Typical Applications Include:
• Telecommunications
• Computer and peripherals
• Power conversion
• Between heat generating semiconductors or magnetic components and a heat sink
Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader
Configurations Available:
• Sheet form and die-cut parts
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Gap Pad®:U.S. Patent 5,679,457 and others.
Thickness vs. Thermal Resistance
Gap Pad VO Ultra Soft
0
50
100
150
200
250
135791113
Thermal Resistance (°C-in2/W)
ResultantThickness(mils)
GPVOUS - 0.100 - AC - 0816 - NA
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
0816 = Standard Sheet Size 8" X 16",
00 = Custom Configuration
AC = Pressure sensitive adhesive one side,
00 = No pressure sensitive adhesive
Standard Thicknesses Available: 0.020", 0.040",
0.060", 0.080", 0.100", 0.125", 0.160", 0.200", 0.250"
GPVOUS = Gap Pad VO Ultra Soft Material
Section A
Section B
Section C
Section E
Section D
TYPICAL PROPERTIES OF GAP PAD VO ULTRA SOFT
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Mauve/Pink Mauve/Pink Visual
Reinforcement Carrier Sil-Pad Sil-Pad
Thickness (inch) / (mm) 0.020 to 0.250 0.508 to 6.350 ASTM D374
Inherent Surface Tack (1 or 2 sided) 1 1 —
Density (g/cc) 1.6 1.6 ASTM D792
Heat Capacity (J/g-K) 1.0 1.0 ASTM C351
Hardness, Bulk Rubber (Shore 00) (1) 5 5 ASTM D2240
Young’s Modulus (psi) / (kPa) (2) 855 ASTM D575
Continuous Use Temp (°F) / (°C) -76 to 392 -60 to 200
ELECTRICAL
Dielectric Breakdown Voltage (Vac) >6000 >6000 ASTM D149
Dielectric Constant (1000 Hz) 5.5 5.5 ASTM D150
Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257
Flame Rating 94 V-O 94 V-O U.L.
THERMAL
Thermal Conductivity (W/m-K) 1.0 1.0 ASTM D5470
1) One second delay value Shore 00 hardness scale.
2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2.For more information on Gap Pad
modulus, refer to Bergquist Application Note #116.
12
GAP PAD
Gap Pad
®
1000SF
Thermally Conductive Silicone-Free Gap Filling Material
Features and Benefits
Thermal conductivity = 0.9 W/mK
• No silicone outgassing
• No silicone extraction
• Reduced tack on one side to aid in
application assembly
The new GapPad 1000SF is a thermally
conductive, electrically insulating, silicone-free
polymer specially designed for silicone-
sensitive applications.The material is ideal
for applications with high standoff and
flatness tolerances. Gap Pad 1000SF is rein-
forced for easy material handling and added
durability during assembly.The material is
available with a protective liner on both
sides of the material.
Note: Resultant thickness is defined as the final gap
thickness of the application.
Thickness vs. Thermal Resistance
Gap Pad 1000SF
0
25
50
75
100
125
012345
Thermal Resistance (°C-in2/W)
ResultantThickness(mils)
Typical Applications Include:
• Digital disk drives / CD-ROM
• Automotive modules
• Fiber optics modules
Configurations Available:
• Sheet form
• Die-cut parts
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Gap Pad®:U.S. Patent 5,679,457 and others.
GP1000SF - 0.010 - 01 - 0816 - NA
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
0816 = Standard Sheet Size 8" X 16",
00 = Custom Configuration
01 = Naturally tacky one side
Standard Thicknesses Available: 0.010", 0.015",
0.020", 0.040", 0.060", 0.080", 0.100", 0.125"
GP1000SF = Gap Pad 1000SF Material
Section A
Section B
Section C
Section E
Section D
TYPICAL PROPERTIES OF GAP PAD 1000SF
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Green Green Visual
Reinforcement Carrier Fiberglass Fiberglass
Thickness (inch) / (mm) 0.010 to 0.125 0.254 to 3.175 ASTM D374
Inherent Surface Tack (1 or 2 sided) 2 2 —
Density (g/cc) 2.0 2.0 ASTM D792
Heat Capacity (J/g-K) 1.1 1.1 ASTM C351
Hardness, Bulk Rubber (Shore 00) (1) 35 35 ASTM D2240
Young’s Modulus (psi) / (kPa) (2) 34 234 ASTM D575
Continuous Use Temp (°F) / (°C) -76 to 257 -60 to 125
ELECTRICAL
Dielectric Breakdown Voltage (Vac) >5000 >5000 ASTM D149
Dielectric Constant (1000 Hz) 5.0 5.0 ASTM D150
Volume Resistivity (Ohm-meter) 1010 1010 ASTM D257
Flame Rating 94 V-1 94 V-1 U.L.
THERMAL
Thermal Conductivity (W/m-K) 0.9 0.9 ASTM D5470
1) One second delay value Shore 00 hardness scale.
2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2.For more information on Gap Pad
modulus, refer to Bergquist Application Note #116.
13
GAP PAD
Gap Pad
®
HC1000
“Gel-Like” Modulus Gap Filling Material
Features and Benefits
Thermal conductivity = 1.0 W/mK
• Highly conformable low hardness
• “Gel-like” modulus
• Fiberglass reinforced for puncture, shear,
and tear resistance
Gap Pad HC 1000 is an extremely conformable
low modulus polymer that acts as a thermal
interface and electrical insulator between
electrical components and heat sinks.The
“Gel-Like” modulus allows this material to fill
air gaps to enhance the thermal performance
of electrical systems. Gap Pad HC1000 is
offered with removable protective liners on
both sides of the material.
Note: Resultant thickness is defined as the final gap
thickness of the application.
Thickness vs. Thermal Resistance
Gap Pad HC1000
10
12
14
16
18
20
0.25 0.30 0.35 0.40 0.45 0.50 0.55
Thermal Resistance (°C-in2/W)
ResultantThickness(mils)
Typical Applications Include:
• Computer and peripherals
• Telecommunications
• Heat interfaces to frames, chassis, or other heat spreading devices
• RDRAM™ memory modules / chip scale packages
• CDROM / DVD cooling
Area where irregular surfaces need to make a thermal interface to a heat sink
Configurations Available:
• Sheet form, die-cut parts, and roll form (converted or unconverted)
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Gap Pad®:U.S. Patent 5,679,457 and others.
HC1000 - 0.015 - 02 - 0816 - NA
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
0816 = Standard Sheet Size 8" X 16",
00 = Custom Configuration
02 = Natural tack, both sides
Standard Thicknesses Available: 0.010", 0.015", 0.020"
HC1000 = High Compliance 1000 Material
Section A
Section B
Section C
Section E
Section D
TYPICAL PROPERTIES OF GAP PAD HC1000
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Gray Gray Visual
Reinforcement Carrier Fiberglass Sil-Fiberglass
Thickness (inch) / (mm) 0.010 to 0.020 0.254 to 0.508 ASTM D374
Inherent Surface Tack (1 or 2 sided) 1 1 —
Density (g/cc) 1.6 1.6 ASTM D792
Heat Capacity (J/g-K) 1.0 1.0 ASTM C351
Hardness, Bulk Rubber (Shore 00) (1) 25 25 ASTM D2240
Young’s Modulus (psi) / (kPa) (2) 40 275 ASTM D575
Continuous Use Temp (°F) / (°C) -76 to 392 -60 to 200
ELECTRICAL
Dielectric Breakdown Voltage (Vac) >6000 >6000 ASTM D149
Dielectric Constant (1000 Hz) 5.5 5.5 ASTM D150
Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257
Flame Rating 94 V-O 94 V-O U.L.
THERMAL
Thermal Conductivity (W/m-K) 1.0 1.0 ASTM D5470
1) One second delay value Shore 00 hardness scale.
2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2and 0.020 inches thick. For more
information on Gap Pad modulus, refer to Bergquist Application Note #116.
14
GAP PAD
Gap Pad
®
1500
Thermally Conductive, Unreinforced Gap Filling Material
Features and Benefits
Thermal conductivity = 1.5 W/mK
• Unreinforced construction for additional
compliancy
• Conformable low hardness
• Electrically isolating
Gap Pad 1500 has an ideal filler blend that
gives its low modulus characteristic that main-
tains optimal thermal performance yet still
allows for easy handling.The tacky nature of
both sides of the material allows for good
compliance to adjacent surfaces of compo-
nents, minimizing interfacial resistance.
Note: Resultant thickness is defined as the final gap
thickness of the application.
Thickness vs. Thermal Resistance
Gap Pad 1500
0
50
100
150
200
0123456
Thermal Resistance (°C-in2/W)
ResultantThickness(mils)
Typical Applications Include:
• Telecommunications
• Computer and peripherals
• Power conversion
• RDRAM™ memory modules / chip scale packages
Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader
Configurations Available:
• Sheet form and die-cut parts
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Gap Pad®:U.S. Patent 5,679,457 and others.
GP1500 - 0.100 - 02 - 0816 - NA
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
0816 = Standard sheet size 8" X 16",
00 = Custom configuration
02 = Naturally tacky both sides
Standard Thicknesses Available: 0.020", 0.040",
0.060", 0.080", 0.100", 0.125", 0.160", 0.200"
GP1500 = Gap Pad 1500
Section A
Section B
Section C
Section E
Section D
TYPICAL PROPERTIES OF GAP PAD 1500
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Black Black Visual
Reinforcement Carrier — — —
Thickness (inch) / (mm) 0.020 to 0.200 0.508 to 5.080 ASTM D374
Inherent Surface Tack (1 or 2 sided) 2 2 —
Density (g/cc) 2.1 2.1 ASTM D792
Heat Capacity (J/g-K) 1.0 1.0 ASTM C351
Hardness, Bulk Rubber (Shore 00) (1) 40 40 ASTM D2240
Young’s Modulus (psi) / (kPa) (2) 45 310 ASTM D575
Continuous Use Temp (°F) / (°C) -76 to 392 -60 to 200
ELECTRICAL
Dielectric Breakdown Voltage (Vac) >6000 >6000 ASTM D149
Dielectric Constant (1000 Hz) 5.5 5.5 ASTM D150
Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257
Flame Rating 94 V-O 94 V-O U.L.
THERMAL
Thermal Conductivity (W/m-K) 1.5 1.5 ASTM D5470
1) One second delay value Shore 00 hardness scale.
2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2.For more information on Gap Pad
modulus, refer to Bergquist Application Note #116.
15
GAP PAD
Gap Pad
®
1500R
Features and Benefits
Thermal conductivity = 1.5 W/mK
• Fiberglass reinforced for puncture, shear,
and tear resistance
• Easy release construction
• Electrically isolating
Gap Pad 1500R has the same highly
conformable low modulus polymer as the
standard Gap Pad 1500.The fiberglass rein-
forcement allows for easy material handling and
enhances puncture, shear, and tear
resistance.The tacky nature of both sides of
thematerial allows for good compliance to
mating surfaces of components, further
reducing thermal resistance.
Note: Resultant thickness is defined as the final gap
thickness of the application.
Thermally Conductive, Reinforced Gap Filling Material
Thickness vs. Thermal Resistance
Gap Pad 1500R
10
12
14
16
18
20
0.25 0.30 0.35 0.40 0.45 0.50 0.55
Thermal Resistance (°C-in2/W)
ResultantThickness(mils)
Typical Applications Include:
• Telecommunications
• Computer and peripherals
• Power conversion
• RDRAM™ memory modules / chip scale packages
Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader
Configurations Available:
• Sheet form, die-cut parts, and roll form (converted or unconverted)
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Gap Pad®:U.S. Patent 5,679,457 and others.
GP1500R - 0.020 - 02 - 00 - ACME10256 Rev. a
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
0816 = Standard sheet size 8" X 16",
00 = Custom configuration
02 = Naturally tacky both sides
Standard thicknesses available: 0.010", 0.015", 0.020"
GP1500R = Gap Pad 1500R
SectionA
Section B
Section C
Section E
Section D
TYPICAL PROPERTIES OF GAP PAD 1500R
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Black Black Visual
Reinforcement Carrier — — —
Thickness (inch) / (mm) 0.010 to 0.020 0.254 to 0.508 ASTM D374
Inherent Surface Tack (1 or 2 sided) 2 2 —
Density (g/cc) 2.1 2.1 ASTM D792
Heat Capacity (J/g-K) 1.3 1.3 ASTM C351
Hardness, Bulk Rubber (Shore 00) (1) 40 40 ASTM D2240
Young’s Modulus (psi) / (kPa) (2) 45 310 ASTM D575
Continuous Use Temp (°F) / (°C) -76 to 392 -60 to 200
ELECTRICAL
Dielectric Breakdown Voltage (Vac) >6000 >6000 ASTM D149
Dielectric Constant (1000 Hz) 6.0 6.0 ASTM D150
Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257
Flame Rating 94 V-O 94 V-O U.L.
THERMAL
Thermal Conductivity (W/m-K) 1.5 1.5 ASTM D5470
1) One second delay value Shore 00 hardness scale.
2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2.For more information on Gap Pad
modulus, refer to Bergquist Application Note #116.
16
GAP PAD
Gap Pad
®
A2000
High Performance,Thermally Conductive Gap Filling Material
Features and Benefits
Thermal conductivity = 2.0 W/mK
• Fiberglass reinforced for puncture, shear,
and tear resistance
• Electrically isolating
Gap Pad A2000 acts as a thermal interface
and electrical insulator between electronic
components and heat sinks. In the thickness
range of 10 to 40 mil, Gap Pad A2000 is
supplied with natural tack on both sides,
allowing for excellent compliance to the
adjacent surfaces of components.The 40 mil
material thickness is supplied with lower tack
on one side, allowing for burn-in processes
and easy rework.
Note: Resultant thickness is defined as the final gap
thickness of the application.
Typical Applications Include:
• Computer and peripherals; between CPU and heat spreader
• Telecommunications
• Heat pipe assemblies
• RDRAM™ memory modules
• CDROM / DVD cooling
Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader
Configurations Available:
• Sheet form, die-cut parts, and roll form (converted or unconverted)
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Gap Pad®:U.S. Patent 5,679,457 and others.
Thickness vs. Thermal Resistance
Gap Pad A2000
10
15
20
25
30
35
40
0.20 0.30 0.40 0.50 0.60 0.70 0.80
Thermal Resistance (°C-in2/W)
ResultantThickness(mils)
GPA2000 - 0.010 - 02 - 0816 - NA
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
0816 = Standard sheet size 8" X 16",
00 = Custom configuration
02 = Naturally tacky both sides
Standard thicknesses available: 0.010", 0.015", 0.020",
0.040"
GPA2000 = Gap Pad A2000
Section A
Section B
Section C
Section E
Section D
TYPICAL PROPERTIES OF GAP PAD A2000
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Gray Gray Visual
Reinforcement Carrier Fiberglass Fiberglass
Thickness (inch) / (mm) 0.010 to 0.040 0.254 to 1.016 ASTM D374
Inherent Surface Tack (1 or 2 sided) 2 2 —
Density (g/cc) 2.9 2.9 ASTM D792
Heat Capacity (J/g-K) 1.0 1.0 ASTM C351
Hardness, Bulk Rubber (Shore 00) (1) 80 80 ASTM D2240
Young’s Modulus (psi) / (kPa) (2) 55 379 ASTM D575
Continuous Use Temp (°F) / (°C) -76 to 392 -60 to 200
ELECTRICAL
Dielectric Breakdown Voltage (Vac) >3000 >3000 ASTM D149
Dielectric Constant (1000 Hz) 5.0 5.0 ASTM D150
Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257
Flame Rating 94 V-O 94 V-O U.L.
THERMAL
Thermal Conductivity (W/m-K) 2.0 2.0 ASTM D5470
1) One second delay value Shore 00 hardness scale.
2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2.For more information on Gap Pad
modulus, refer to Bergquist Application Note #116.
17
GAP PAD
Gap Pad
®
2000S40
Highly Conformable,Thermally Conductive “S-Class” Gap Filling Material
Features & Benefits
Thermal conductivity = 2.0 W/mK
• Low S-Class thermal resistance at very
low pressures
• Highly conformable low hardness
• Designed for low stress applications
• Fiberglass reinforced for puncture, shear,
and tear resistance
Gap Pad 2000S40 is recommended for low-
stress applications that require a mid- to high-
thermally conductive interface material.The
highly conformable nature of the material
allows the pad to fill in air voids and air gaps
between PC boards and heat sinks or metal
chassis with stepped topography, rough
surfaces, and high stack-up tolerances.
Gap Pad 2000S40 is electrically isolating, thus
well-suited for applications requiring electrical
isolation between heat sinks and high voltage,
bare leaded devices. Gap Pad 2000S40 is a
filled, thermally conductive polymer reinforced
with a fiberglass carrier on one side, allowing
for easy material handling and enhanced
puncture, shear, and tear resistance.
Note: Resultant thickness is defined as the final gap
thickness of the application.
Typical Applications Include:
• Power electronics DC/DC, 1/4, 1/2, full bricks, etc.
• Mass storage devices
• Graphics card/processor
Wireline/wireless communications hardware
• Automotive engine/transmission controls
Configurations Available:
• Die cut parts in any shape or size, separated or in sheet form.
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Gap Pad®:U.S. Patent 5,679,457 and others.
GP2000S40 - 0.020 - 02 - 0816 - NA
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
0816 = Standard sheet size 8" X 16",
00 = Custom configuration
02 = Naturally tacky both sides
Standard thicknesses available: 0.020", 0.040", 0.060",
0.080", 0.100", 0.125"
GP2000S40 = Gap Pad 2000S40
Section A
Section B
Section C
Section E
Section D
TYPICAL PROPERTIES OF GAP PAD 2000S40
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Gray Gray Visual
Reinforcement Carrier Fiberglass Fiberglass
Thickness (inch) / (mm) 0.020 to 0.125 0.508 to 3.175 ASTM D374
Inherent Surface Tack (1 or 2 sided) 2 2 —
Density (g/cc) 2.9 2.9 ASTM D792
Heat Capacity (J/g-K) 0.6 0.6 ASTM C351
Hardness, Bulk Rubber (Shore 00) (1) 35 35 ASTM D2240
Young’s Modulus (psi) / (kPa) (2) 45 310 ASTM D575
Continuous Use Temp (°F) / (°C) -76 to 392 -60 to 200
ELECTRICAL
Dielectric Breakdown Voltage (Vac) 340 13.4 kVac/mm ASTM D149
Dielectric Constant (1000 Hz) 6.0 6.0 ASTM D150
Volume Resistivity (Ohm-meter) 4.2 x 1011 4.2 x 1011 ASTM D257
Flame Rating V-O V-O U.L.
THERMAL
Thermal Conductivity (W/m-K) 2.0 2.0 ASTM D5470
1) One second delay value Shore 00 hardness scale.
2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2.For more information on Gap Pad
modulus, refer to Bergquist Application Note #116.
Thickness vs. Thermal Resistance
Gap Pad 2000S40
0
25
50
75
100
125
0.0 0.5 1.0 1.5 2.0 2.5
Thermal Resistance (°C-in2/W)
ResultantThickness(mils)
18
GAP PAD
Gap Pad
®
2500S20
Features and Benefits
Thermal conductivity = 2.4 W/mK
• Low S-Class thermal resistance at ultra
low pressures
• Ultra conformable “gel-like” modulus
• Designed for low stress applications
• Fiberglass reinforced for puncture, shear,
and tear resistance
Gap Pad 2500S20 is a thermally conductive,
reinforced material rated at a thermal
conductivity of 2.4 W/mK.The material is a
filled polymer material yielding extremely soft,
elastic characteristics.The material is reinforced
to provide easy handling and converting, added
electrical isolation, and tear resistance. Gap
Pad 2500S20 is well suited for low pressure
applications that typically use fixed stand-off or
clip mounting.The material maintains a
conformable yet elastic nature that allows for
excellent interfacing and wet-out character-
istics, even to surfaces with high roughness
and/or topography.
Gap Pad 2500S20 is offered with inherent
natural tack on both sides of the material
allowing for stick-in-place characteristics during
application assembly.The material is supplied
with protective liners on both sides.
Note: Resultant thickness is defined as the final gap
thickness of the application.
Typical Applications
• Between processors and heat sinks
• Between graphics chips and heat sinks
• Hard drive, DVD, & CDROM electronics cooling
Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader.
Configurations Available:
• Sheet form and die-cut parts
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Gap Pad®:U.S. Patent 5,679,457 and others.
Thermally Conductive, Reinforced “S-Class” Gap Filling Material
GP2500S20 - 0.100 - 02 - 00 - ACME 89302Rev.a
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
0816 = Standard sheet size 8" X 16",
00 = Custom configuration
02 = Naturally tacky both sides
Standard Thicknesses Available: 0.010", 0.015",
0.020", 0.040", 0.060", 0.080", 0.100", 0.125"
GP2500S20 = Gap Pad 2500S20
SectionA
Section B
SectionC
Section E
SectionD
TYPICAL PROPERTIES OF GAP PAD 2500S20
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Light Yellow Light Yellow Visual
Reinforcement Carrier Fiberglass Fiberglass
Thickness (inch) / (mm) 0.010 to 0.125 0.254 to 3.175 ASTM D374
Inherent Surface Tack (1 or 2 sided) 2 2 —
Density (g/cc) 3.1 3.1 ASTM D792
Heat Capacity (J/g-K) 1.0 1.0 ASTM C351
Hardness, Bulk Rubber (Shore 00) (1) 20 20 ASTM D2240
Young’s Modulus (psi) / (kPa) (2) 5 35 ASTM D575
Continuous Use Temp (°F) / (°C) -76 to 392 -60 to 200
ELECTRICAL
Dielectric Breakdown Voltage (Vac) 3000 3000 ASTM D149
Dielectric Constant (1000 Hz) 6.6 6.6 ASTM D150
Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257
Flame Rating V-O V-O U.L.
THERMAL
Thermal Conductivity (W/m-K) 2.4 2.4 ASTM D5470
1) One second delay value Shore 00 hardness scale.
2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2.For more information on Gap Pad
modulus, refer to Bergquist Application Note #116.
Thickness vs. Thermal Resistance
GP2500S20
10
30
50
70
90
110
130
0.18 0.43 0.68 0.93 1.18 1.43 1.68 1.93 2.18
Thermal Resistance (°C-in2/W)
ResultantThickness(mils)
19
GAP PAD
Gap Pad
®
2500
Features and Benefits
Thermal conductivity = 2.7 W/mK
• High thermal performance cost effective
solution
• Unreinforced construction for additional
compliancy
• Medium compliancy and conformability
Gap Pad 2500 is a thermally conductive, elec-
trically insulating, un-reinforced gap filling
material. Gap Pad 2500 is a filled polymer
material yielding a soft yet elastic polymer
that allows for easy handling and converting
without the need for reinforcement. Gap Pad
2500 material is conformable yet elastic,
allowing for good wet-out and interfacing
characteristics to surfaces with high rough-
ness and/or topography. All these character-
istics make this material ideal for mid-pres-
sure applications that use either clip or screw
mounted assembly.
Gap Pad 2500 is offered with inherent natural
tack on both sides of the material allowing for
stick-in-place characteristics during application
assembly.The material is supplied with protec-
tive liners on both sides.
Note: Resultant thickness is defined as the final gap
thickness of the application.
Thermally Conductive, Unreinforced Gap Filling Material
Typical Applications Include:
• Multiple heat generating components to a common heat sink
• Graphics chips to heat sinks
• Processors to heat sinks
• Mass storage drives
Wireline / wireless communications hardware
Configurations Available:
• Sheet form and die-cut parts
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Gap Pad®:U.S. Patent 5,679,457 and others.
GP2500 - 0.100 - 02 - 00 - ACME 89302Rev.a
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
0816 = Standard sheet size 8" X 16",
00 = Custom configuration
02 = Naturally tacky both sides
Standard Thicknesses Available: 0.020", 0.040",
0.060", 0.080", 0.100", 0.125"
GP2500 = Gap Pad 2500
Section A
SectionB
SectionC
Section E
Section D
TYPICAL PROPERTIES OF GAP PAD 2500
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Light Brown Light Brown Visual
Reinforcement Carrier — — —
Thickness (inch) / (mm) 0.020 to 0.125 0.508 to 3.175 ASTM D374
Inherent Surface Tack (1 or 2 sided) 2 2 —
Density (g/cc) 3.1 3.1 ASTM D792
Heat Capacity (J/g-K) 1.0 1.0 ASTM C351
Hardness, Bulk Rubber (Shore 00) (1) 80 80 ASTM D2240
Young’s Modulus (psi) / (kPa) (2) 113 779 ASTM D575
Continuous Use Temp (°F) / (°C) -76 to 392 -60 to 200
ELECTRICAL
Dielectric Breakdown Voltage (Vac) >6000 >6000 ASTM D149
Dielectric Constant (1000 Hz) 6.8 6.8 ASTM D150
Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257
Flame Rating V-O V-O U.L.
THERMAL
Thermal Conductivity (W/m-K) 2.7 2.7 ASTM D5470
1) One second delay value Shore 00 hardness scale.
2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2.For more information on Gap Pad
modulus, refer to Bergquist Application Note #116.
Thickness vs. Thermal Resistance
Gap Pad 2500S80
0
20
40
60
80
100
120
0.20 0.60 1.00 1.40 1.80
Thermal Resistance (°C-in2/W)
ResultantThickness(mils)
20
GAP PAD
Gap Pad
®
A3000
Features and Benefits
Thermal conductivity = 3.0 W/mK
• Fiberglass reinforced for puncture, shear,
and tear resistance
• Reduced tack on one side to aid in
application assembly
• Electrically isolating
Gap Pad A3000 is a thermally conductive
filled polymer laminate, supplied on a rein-
forcing mesh for added electrical isolation,
easy material handling and enhanced puncture,
shear, and tear resistance. Gap Pad A3000 has
a reinforcement layer on the dark gold side
of the material that assists in burn-in and
rework processes while the light gold and
soft side of the material allows for added
compliance.
Note: Resultant thickness is defined as the final gap
thickness of the application.
Typical Applications Include:
• Computer and peripherals Telecommunications
• Heat pipe assemblies • RDRAM™ memory modules
• CDROM / DVD cooling • Between CPU and heat spreader
Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader
Configurations Available:
• Sheet form, die-cut parts and roll form (converted or unconverted)
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Gap Pad®:U.S. Patent 5,679,457 and others.
Thermally Conductive, Reinforced Gap Filling Material
Thickness vs. Thermal Resistance
Gap Pad A3000
15
25
35
45
55
65
75
85
95
105
115
125
0.10 0.30 0.50 0.70 0.90 1.10 1.30 1.50 1.70
Thermal Resistance (°C-in2/W)
ResultantThickness(mils)
GPA3000 - 0.010 - 01 - 0816 - NA
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
0816 = Standard sheet size 8" X 16",
00 = Custom configuration
01 = Naturally tacky one side
Standard Thicknesses Available: 0.015", 0.020",
0.040", 0.060", 0.080", 0.100", 0.125"
GPA3000 = Gap Pad A3000
Section A
Section B
Section C
Section E
Section D
TYPICAL PROPERTIES OF GAP PAD A3000
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Gold Gold Visual
Reinforcement Carrier Fiberglass Fiberglass
Thickness (inch) / (mm) 0.015 to 0.125 0.381 to 3.175 ASTM D374
Inherent Surface Tack (1 or 2 sided) 1 1 —
Density (g/cc) 3.2 3.2 ASTM D792
Heat Capacity (J/g-K) 1.0 1.0 ASTM C351
Hardness, Bulk Rubber (Shore 00) (1) 80 80 ASTM D2240
Young’s Modulus (psi) / (kPa) (2) 50 344 ASTM D575
Continuous Use Temp (°F) / (°C) -76 to 392 -60 to 200
ELECTRICAL
Dielectric Breakdown Voltage (Vac) >5000 >5000 ASTM D149
Dielectric Constant (1000 Hz) 7.0 7.0 ASTM D150
Volume Resistivity (Ohm-meter) 1010 1010 ASTM D257
Flame Rating 94 V-O 94 V-O U.L.
THERMAL
Thermal Conductivity (W/m-K) 3.0 3.0 ASTM D5470
1) One second delay value Shore 00 hardness scale.
2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2.For more information on Gap Pad
modulus, refer to Bergquist Application Note #116.
21
GAP PAD
Gap Pad
®
3000S30
Features and Benefits
Thermal conductivity = 3.0 W/mK
• Low S-Class thermal resistance at very low
pressures
• Conformable low hardness
• Designed for low pressure applications
• Fiberglass reinforced for puncture, shear,
and tear resistance
Gap Pad 3000S30 is an all-new, high
performance (3W/m-K) thermally conductive
gap filling material. In addition to a high thermal
conductivity value, Gap Pad 3000S30 offers
exceptionally low interfacial resistances to
adjacent surfaces. Featuring a soft, very low
hardness specifically designed to comply to
unique contours and topography, Gap Pad
3000S30 is ideal for fragile components.The
material is reinforced allowing for easy part
placement and handling. Gap Pad 3000S30 is
supplied with protective liners on both sides.
Note: Resultant thickness is defined as the final gap
thickness of the application.
Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material
Typical Applications:
• Processors • Notebook computers
• Server S-RAMs • BGA packages
• Mass storage drives • Power conversion
Wireline/wireless communications hardware
Configurations Available:
• Die cut parts in any shape or size, separated or in sheet form
• Custom sizes available — contact Bergquist Product Management
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Gap Pad®:U.S. Patent 5,679,457 and others.
GP3000S30 - 0.020 - 02 - 0816 - NA
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
0816 = Standard sheet size 8" X 16",
00 = Custom configuration
02 = Naturally tacky both sides
Standard thicknesses available: 0.010", 0.015", 0.020",
0.040", 0.060", 0.080", 0.100", 0.125"
GP3000S30 = Gap Pad 3000S30
Section A
Section B
Section C
Section E
Section D
Thickness vs. Thermal Resistance
GP3000S30
10
30
50
70
90
110
130
0.1 0.6 1.1 1.6
Thermal Resistance (°C-in2/W)
ResultantThickness(mils)
TYPICAL PROPERTIES OF GAP PAD 3000S30
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Light Blue Light Blue Visual
Reinforcement Carrier Fiberglass Fiberglass
Thickness (inch) / (mm) 0.010 to 0.125 0.254 to 3.175 ASTM D374
Inherent Surface Tack (1 or 2 sided) 2 2
Density (g/cc) 3.2 3.2 ASTM D792
Heat Capacity (J/g-K) 1.0 1.0 ASTM C351
Hardness 10-20 mil (Shore 00) (1) 55 55 ASTM D2240
Hardness 40-125 mil (Shore 00) (1) 30 30 ASTM D575
Young’s Modulus (psi) / (kPa) (2) 26 180 ASTM D575
Continuous Use Temp (°F) / (°C) -76 to 392 -60 to 200
ELECTRICAL
Dielectric Breakdown Voltage (Vac) 2500 min 2500 min ASTM D149
Dielectric Constant (1000 Hz) 6.0 6.0 ASTM D150
Volume Resistivity (Ohm-meter) 8.510 8.510 ASTM D257
Flame Rating (pending) 94 V-O 94 V-O U.L.
THERMAL
Thermal Conductivity (W/m-K) 3.0 3.0 ASTM D5470
1) One second delay value Shore 00 hardness scale.
2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2.For more information on Gap Pad
modulus, refer to Bergquist Application Note #116.
22
GAP PAD
Gap Filler 1000
Features and Benefits
Thermal conductivity = 1.0 W/mK
• Ultra conforming, designed for fragile and
low stress applications
Ambient & accelerated cure schedules
• 100% solids – no cure by-products
• Excellent low & high temperature
mechanical & chemical stability
Gap Filler 1000 is a thermally conductive liquid
gap filling material. It is supplied as a two-
component, room or elevated temperature
curing system.The material is formulated to
provide a balance of cured material properties
highlighted by “gel-like” modulus and good
compression set (memory).The result is a
soft, thermally conductive, form-in-place
elastomer ideal for coupling “hot” electronic
components mounted on PC boards with an
adjacent metal case or heat sink. Before cure,
Gap Filler 1000 flows under pressure like a
grease. After cure, it does not pump from the
interface as a result of thermal cycling. Unlike
thermal grease, the cured product is dry to
the touch.
The mixed system (1:1 ratio) will cure at
either ambient or elevated temperature to
form a soft, thermally conductive interface
material. Unlike cured gap filling materials, the
liquid approach offers infinite thickness with
little or no stress during displacement and
eliminates the need for specific pad thickness
and die-cut shapes for individual applications.
Gap Filler 1000 is intended for use in thermal
interface applications when a strong structural
bond is not required. Gap Filler 1000 is formu-
lated for low modulus,“gel-like” properties.
Note: Resultant thickness is defined as the final gap
thickness of the application.
Typical Applications Include:
• Automotive electronics Telecommunications
• Computer and peripherals Thermally conductive vibration-dampening
• Between any heat generating semiconductor and a heat sink
Configurations Available:
• For smaller quantity packaging, please contact Bergquist sales.
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Gap Pad®:U.S. Patent 5,679,457 and others.
Thermally Conductive Liquid Gap Filling Material
0
50
100
150
200
250
300
01234567891011
Thermal Resistance (°C-in2/W)
ResultantThickness(mils)
GF1000 - 05 - 15 - 50cc - NA
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
50cc = 50cc cartridges, 400cc = 400cc cartridges,
1200cc = 1200cc kits 10G = 10 gallon kits
Pot Life: 15 = 15 min
00 = No spacer beads, 05 = 0.005" spacer beads,
07 = 0.007 spacer beads
GF1000 = Gap Filler 1000
Section A
Section B
Section C
Section E
Section D
TYPICAL PROPERTIES OF GAP FILLER 1000
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color / Part A Gray Gray Visual
Color / Part B White White
Viscosity as Mixed (cps) (1) 100,000 100,000 ASTM D2195
Density (g/cc) 1.63 1.63 ASTM D792
Mix Ratio 1:1 1:1
Shelf Life @ 25°C (months) 6 6 —
PROPERTY AS CURED
Color Gray Gray Visual
Hardness (Shore 00) (2) 30 30 ASTM D2240
Heat Capacity (J/g-K) 1.0 1.0 ASTM D150
Continuous Use Temp (°F) / (°C) -76 to 347 -60 to 175
ELECTRICAL AS CURED
Dielectric Strength (V/ml) 500 500 ASTM D149
Dielectric Constant (1000 Hz) 5 5 ASTM D150
Volume Resistivity (Ohm-meter) 1012 1012 ASTM D257
Flame Rating 94 V-O 94 V-O U.L.
THERMAL AS CURED
Thermal Conductivity (W/m-K) 1.0 1.0 ASTM D5470
CURE SCHEDULE
Pot Life @ 25°C (min) (3) 15 15
Cure @ 25°C (min) (4) 60 - 120 60 - 120
Cure @ 100°C (min) (4) 5 5 —
1) Brookfield RV, Heli-Path, Spindle TF @ 20 rpm, 25°C.
2) One second delay value Shore 00 hardness scale.
3) Time for viscosity to double.
4) Cure schedule (rheometer - time to read 90% cure)
Features and Benefits
Thermal conductivity = 1.1 W/mK
• No silicone outgassing or extraction
• Ultra conforming, designed for fragile and
low stress applications
Ambient & accelerated cure schedules
•100% solids – no cure by-products
Gap Filler 1100SF is the thermal solution for
silicone-sensitive applications.The material is
supplied as a two-part component curing at
room or elevated temperatures.The material
exhibits gel-like properties then cures to a
soft, flexible elastomer, helping reduce thermal
cycling stresses during operation and virtually
eliminating stress during assembly of pressure
sensitive applications.
The two components are colored to assist as
a mix indicator (1:1 by volume or weight).
The mixed system will cure at ambient tem-
perature. Unlike cured thermal pad materials,
the liquid approach offers infinite thickness
variations with little or no stress during
assembly displacement. Gap Filler 1100SF,
although exhibiting some natural tack charac-
teristics, is not intended for use in thermal
interface applications requiring a mechanical
structural bond.
Application
Gap Filler 1100SF can be mixed and dispensed
using dual tube cartridge packs with static
mixers and manual or pneumatic gun, or high
volume mixing and dispensing equipment
(application of heat may be used to
reduce viscosity).
23
Typical Applications Include:
• Silicone-sensitive optics components • Silicone-sensitive disk drives
• Silicone-sensitive electronics Thermal potting compound
Thermal vibration dampening compound • Dielectric for bare leaded devices
• Filling various gaps between heat generating devices to heatsinks and housings
Configurations Available:
• Supplied in cartridge or kit form
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Gap Pad®:U.S. Patent 5,679,457 and others.
GAP PAD
Gap Filler 1100SF
Thermally Conductive, Silicone-Free Liquid Gap Filling Material
GF1100SF - 00 - 00 - 400cc - NA
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
400cc = 400cc cartridges, 1200cc = 1200cc kits 10G
= 10 gallon kits
Pot Life: 15 = 15 min
00 = No spacer beads, 05 = 0.005" spacer beads,
07 = 0.007 spacer beads
GF1100SF = Gap Filler 1100SF
SectionA
Section B
Section C
Section E
SectionD
TYPICAL PROPERTIES OF GAP FILLER 1100SF
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color / Part A Yellow Yellow Visual
Color / Part B Red Red
Viscosity as Mixed (cps) (1) 450,000 450,000 ASTM D2195
Density (g/cc) 2.03 2.03 ASTM D792
Mix Ratio 1:1 1:1
Shelf Life @ 25°C (months) 6 6 —
PROPERTY AS CURED
Color Orange Orange Visual
Hardness (Shore 00) (2) 60 60 ASTM D2240
Heat Capacity (J/g-K) 0.9 0.9 ASTM D150
Continuous Use Temp (°F) / (°C) -76 to 248 -60 to 120
ELECTRICAL AS CURED
Dielectric Strength (V/ml) 400 400 ASTM D149
Dielectric Constant (1000 Hz) 5 5 ASTM D150
Volume Resistivity (Ohm-meter) 1010 1010 ASTM D257
Flame Rating 94 V-O 94 V-O U.L.
THERMAL AS CURED
Thermal Conductivity (W/m-K) 1.0 1.0 ASTM D5470
CURE SCHEDULE
Pot Life @ 25°C (min) (3) 10-15 10-15
Cure @ 25°C (hrs) (4) 4 4 —
Cure @ 100°C (min) (4) 45 45
1) Brookfield RV, Heli-Path, Spindle TF @ 2 rpm, 25°C.
2) One second delay value Shore 00 hardness scale.
3) Time for viscosity to double.
4) Cure schedule (rheometer - time to read 90% cure)
TEMPERATURE DEPENDENCE OF VISCOSITY
The viscosity of the Gap Filler 1100SF material is tempera-
ture dependent.The table below provides the multiplication
factor to obtain viscosity at various temperatures.To obtain
the viscosity at a given temperature, look up the multiplica-
tion factor at that temperature and multiply the correspon-
ding viscosity at 25°C.
Te mperature Multiplication Factor
°C Part A Part B
20 1.43 1.57
25 1.00 1.00
35 0.58 0.50
45 0.39 0.30
50 0.32 0.24
Example - Viscosity of Part A @ 45°:
Viscosity of Part A at 25°C is 450,000 cp. The multipli-
cation factor for part A at 45°C is 0.39. Therefore:
(450,000) x (0.39) = 175,500 cp
24
GAP PAD
Gap Filler 2000
Features and Benefits
Thermal conductivity = 2.0 W/mK
• Ultra conforming, designed for fragile and
low stress applications
Ambient & accelerated cure schedules
•100% solids – no cure by-products
• Excellent low & high temperature
mechanical & chemical stability
Gap Filler 2000 is a high performance, thermally
conductive liquid gap filling material supplied
as a two-component, room or elevated
temperature curing system.The material
provides a balance of cured material properties
and good compression set (memory).The
result is a soft, thermally conductive, form-in-
place elastomer ideal for coupling “hot”
electronic components mounted on PC
boards with an adjacent metal case or heat
sink. Before cure, it flows under pressure like a
grease. After cure, it does not pump from the
interface as a result of thermal cycling. Unlike
thermal grease, the cured product is dry to
the touch.
The mixed system (1:1 ratio) will cure at either
ambient or elevated temperature to form a
soft, thermally conductive interface material.
Unlike cured Gap Filling materials, the liquid
approach offers infinite thickness with little or no
stress during displacement and assembly. It also
eliminates the need for specific pad thickness
and die-cut shapes for individual applications.
Gap Filler 2000 is intended for use in thermal
interface applications when a strong structural
bond is not required. Gap Filler 2000 is for-
mulated for low modulus,“gel-like” properties.
Note: Resultant thickness is defined as the final gap
thickness of the application.
High Thermally Conductive Liquid Gap Filling Material
Typical Applications Include:
• Automotive electronics Telecommunications
• Computer and peripherals Thermally conductive vibration dampening
• Between any heat generating semiconductor and a heat sink
Configurations Available:
• For smaller quantity packaging, please contact Bergquist sales.
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Gap Pad®:U.S. Patent 5,679,457 and others.
0
50
100
150
200
250
300
0123456
Thermal Resistance (°C-in2/W)
ResultantThickness(mils)
GF2000 - 00 - 60 - 10G - NA
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
50cc = 50cc cartridges, 400 = 400cc cartridges,
1200cc = 1200cc kits, 10G = 10 gallon kits
Pot Life: 15 = 15 min, 60 = 60 min
00 = No spacer beads, 05 = 0.005" spacer beads,
07 = 0.007 spacer beads
GF2000= Gap Filler 2000
Section A
Section B
Section C
Section E
Section D
TYPICAL PROPERTIES OF GAP FILLER 2000
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color / Part A Pink Pink Visual
Color / Part B White White
Viscosity as Mixed (cps) (1) 300,000 300,000 ASTM
Density (g/cc) 2.8 2.8 ASTM D792
Mix Ratio 1:1 1:1
Shelf Life @ 25°C (months) 6 6 —
PROPERTY AS CURED
Color Pink Pink Visual
Hardness (Shore 00) (2) 70 70 ASTM D2240
Heat Capacity (J/g-K) 1.0 1.0 ASTM D150
Continuous Use Temp (°F) / (°C) -76 to 392 -60 to 200
ELECTRICAL AS CURED
Dielectric Strength (V/ml) 500 500 ASTM D149
Dielectric Constant (1000 Hz) 7 7 ASTM D150
Volume Resistivity (Ohm-meter) 1012 1012 ASTM D257
Flame Rating 94 V-O 94 V-O U.L.
THERMAL AS CURED
Thermal Conductivity (W/m-K) 1.0 1.0 ASTM D5470
CURE SCHEDULE
Pot Life @ 25°C (min) (3) 15 15
Cure @ 25°C (min) (4) 60 - 120 60 - 120
Cure @ 100°C (min) (4) 5 5 —
1) Brookfield RV, Heli-Path, Spindle TF @ 20 rpm, 25°C.
2) One second delay value Shore 00 hardness scale.
3) Time for viscosity to double.
4) Cure schedule (rheometer - time to read 90% cure)
25
TIC
TIC
- Thermal Interface Compound
Thermally Conductive Grease Compounds
Bergquist’s line of thermally conductive thermal interface compounds
will flow under assembly pressure to wet out the thermal interface sur-
faces and produce very low thermal impedance. TIC products are
designed for use between a high-end computer processor and a heat
sink or other high watt density applications.
Features
The TIC portfolio has diverse ther-
mal and electrical characteristics. Key
criteria when selecting TIC products
include:
• Viscosity
• Volume resistivity
• Thermal conductivity
• Thermal performance
• Filler size
Benefits
TIC products are ideal for high
watt density applications. Primary
benefits include:
• Low interfacial resistance
• Low thermal impedance
• Resists dripping
• Ideally suited to screen printing
applications
• No post “cure” conditioning
required
Options
TIC products can be obtained
with application-specific options
such as:
• Gel form
• Containers
Applications
TIC has a variety of applications
such as:
• CPU
• GPU
• IGBT
• High power density
0.09
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.01
TIC
1000G TIC
1000A TIC
2000A TIC
4000
Thermal Impedance (°C/W)
Thermal Test Vehicle Performance Comparison
Comparison Data & FAQ’s
Q: What is the best fastening method for a TIC interface?
A: A constant-pressure fastener is preferred when using TIC for high
performance applications.The constant pressure from a clip or
spring washer will ensure adequate pressure is being applied with
varying bond line thickness.
Q: How should the TIC be applied?
A: Screen printing the TIC is a fast, low-cost method that delivers a
consistent and accurate amount of material on each application.
Alternate methods include stenciling, pin transfer and needle
dispensing.
Q: Will the grease stay in the interface?
A: All the TIC materials were specifically designed to resist pump-
out of the interface, even after many hours of thermal and
power cycling. If the device will be subjected to extreme vibra-
tion and micro-motion, then Bergquist’s TIG (a cure-in-place gel)
is available as an option for each TIC material.
26
TIC
TIC
1000G
Features and Benefits
Thermal performance: 0.29°C/W (@ 50 psi)
• Excellent screenability
• No post “cure” required
• Cost vs. performance leader
TIC-1000G is a high performance thermally
conductive compound intended for use as a
thermal interface material between a high-
end computer processor and a heat sink.
Other high watt density applications will
benefit from the extremely low thermal
impedance of TIC 1000G.
TIC 1000G compound wets out the thermal
interface surfaces and flows to produce the
lowest thermal impedance.The compound
requires pressure of the assembly to cause
flow.The compound will resist dripping.
For microprocessor applications, traditional
screw fastening or spring clamping methods
will provide adequate force to optimize the
thermal performance of TIC-1000G.
An optimized application would utilize the
minimum volume of TIC 1000G compound
necessary to ensure complete wet-out of
both mechanical interfaces.
Note: TIC 1000G is ideally suited to screen
printing applications. Please contact Bergquist
Sales for application notes related to screen
printing.
Assembly – No Post Screen Cure
TIC 1000G has excellent screenability. No
solvent is used to reduce the viscosity, so no
post “cure” conditioning is required.
High Performance,Value Compound for High-End Computer Processors
Application Cleanliness
Pre-clean heat sink and component interface with isopropyl alcohol prior to assembly or repair.
Be sure heat sink is dry before applying TIC 1000G.
Application Methods
1. Dispense and/or screen print TIC 1000G compound onto the processor or heat sink surface
like a thermal grease (see a Bergquist representative for application information).
2. Assemble the processor and heat sink with spring clips or constant pressure fasteners.
Typical Applications Include:
• High performance CPU's
• High performance GPU's
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
TIC1000G - 00 - 00 - 5cc - NA
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
5cc = 5.0cc, 25cc = 25.0cc, 200cc = 200.0 cc, 800cc
= 800.0cc, 1600cc = 1600.0cc (ml) cartridges
00 = No options
00 = No options
TIC1000G = Thermal Interface Compound 1000G
Section A
Section B
Section C
Section E
Section D
TYPICAL PROPERTIES OF TIC 1000G
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Black Black Visual
Density (g/cc) 1.2 1.2 ASTM D374
Continuous Use Temp (°F) / (°C) 302 150 TGA Kinetics
ELECTRICAL
Electrical Resistivity (Ohm-meter) (1) N/A N/A ASTM D257
THERMAL
Thermal Conductivity (W/m-K) 0.7 0.7 ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) (2) 0.32 0.30 0.29 0.27 0.26
1) The compound contains an electrically conductive filler surrounded by electrically non-conductive resin.
2) TO-220 performance data is provided as a reference to compare Sil-Pad material thermal performance.
27
TIC
TIC
1000A
High Performance Value Compound for High-End Computer Processors
Features and Benefits
• High thermal performance:
0.27°C/W (@ 50 psi)
• Good screenability
• Room temperature storage
• No post “cure” required
• Exceptional value
TIC 1000A is a high performance thermally
conductive compound intended for use as a
thermal interface material between a high-
end computer processor and a heat sink.
Other high watt density applications will also
benefit from the extremely low thermal
impedance of TIC 1000A.
TIC 1000A compound wets out the thermal
interface surfaces and flows to produce the
lowest thermal impedance.The compound
requires pressure of the assembly to cause
flow.The TIC 1000A compound will
resist dripping.
For microprocessor applications, traditional
screw fastening or spring clamping methods
will provide adequate force to optimize the
thermal performance of TIC 1000A.
An optimized application would utilize the
minimum volume of TIC 1000A material nec-
essary to ensure complete wet-out of both
mechanical interfaces.
Assembly – No Post Screen Cure
TIC 1000A has excellent screenability. No
solvent is used to reduce the viscosity, so no
post “cure” conditioning is required.
Application Cleanliness
1. Pre-clean heat sink and component interface with Isopropyl Alcohol prior to assembly or
repair. Ensure heat sink is dry before applying TIC 1000A.
Application Methods
1. Dispense and/or screen print TIC 1000A compound onto the processor or heat sink surface
like a thermal grease (see a Bergquist representative for application information).
2. Assemble the processor and heat sink with spring clips or constant pressure fasteners.
Typical Applications Include:
• High performance CPUs
• High performance GPUs
Configurations Available:
• Gel form
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
TIC1000A - 00 - 00 - 25cc - NA
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
5cc = 5.0cc, 25cc = 25.0cc, 200cc = 200.0 cc, 800cc
= 800.0cc, 1600cc = 1600.0cc (ml) cartridges
00 = No options
00 = No options
TIC1000A = Thermal Interface Compound 1000A
Section A
Section B
Section C
Section E
Section D
TYPICAL PROPERTIES OF TIC 1000A
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Gray Gray Visual
Density (g/cc) 2.1 2.1 ASTM D374
Continuous Use Temp (°F) / (°C) 302 150 TGA Kinetics
ELECTRICAL
Electrical Resistivity (Ohm-meter) (1) N/A N/A ASTM D257
THERMAL
Thermal Conductivity (W/m-K) 1.5 1.5 ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) (2) 0.32 0.32 0.32 0.31 0.28
1) The compound contains an electrically conductive filler surrounded by electrically non-conductive resin.
2) TO-220 performance data is provided as a reference to compare Sil-Pad material thermal performance.
TIC
2000A
Electrically Non-Conductive, High Performance Thermal Interface Compound
28
Features and Benefits
• High thermal performance:
0.45°C/W (@ 50 psi)
Thicker bondline application
• Electrically non-conductive
• No post “cure” required
• Exceptional value
TIC 2000A is a high performance, thermally
conductive compound intended for use as a
thermal interface material between a high
end computer processor and a heat sink.
Other high watt density applications will also
benefit from TIC 2000A’s low thermal imped-
ance.The compound is electrically non-con-
ductive helping to eliminate risk of electrical
shorts.
TIC 2000A compound wets out the thermal
interface surfaces. For microprocessor applica-
tions, traditional screw fastening or spring
clamping methods will provide adequate
force to cause flow and optimize the thermal
performance of TIC 2000A.
An optimized application would utilize the
minimum volume of TIC 2000A material
necessary to ensure complete wet-out of
both mechanical interfaces.
Assembly – No Post Screen Cure
TIC 2000A has good screenability. No solvent
is used to reduce the viscosity, so no post
“cure” conditioning is required.
Application Cleanliness
Pre-clean heat sink and component interface
with isopropyl alcohol prior to assembly or
repair. Ensure heat sink is dry before applying
TIC 2000A.
Application Methods
1. Dispense and/or screen print TIC 2000A compound onto processor or heat sink like a
thermal grease (see a Bergquist representative for application information).
2. Assemble the processor and heat sink with spring clips or constant pressure fasteners.
Typical Applications Include:
• High end power applications
Configurations Available:
• Gel form
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
TIC
TIC2000A - 00 - 00 - 5cc - NA
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
5cc = 5.0cc, 25cc = 25.0cc, 200cc = 200.0 cc, 800cc
= 800.0cc, 1600cc = 1600.0cc (ml) cartridges
00 = No options
00 = No options
TIC2000A = Thermal Interface Compound 2000A
Section A
Section B
Section C
SectionE
Section D
TYPICAL PROPERTIES OF TIC 2000A
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color White White Visual
Density (g/cc) 2.9 2.9 ASTM D374
Continuous Use Temp (°F) / (°C) 302 150 TGA Kinetics
ELECTRICAL
Electrical Resistivity (Ohm-meter) >1011 >1011 ASTM D257
THERMAL
Thermal Conductivity (W/m-K) 2.0 2.0 ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) (1) 0.22 0.21 0.21 0.20 0.20
1) TO-220 performance data is provided as a reference to compare Sil-Pad material thermal performance.
TIC
4000
Features and Benefits
• Thermal conductivity: 4.0 W/m-K
• Extremely low thermal impedance
• 0.19C/W @ 50 psi
TIC 4000 is a thermally conductive grease
compound designed for use as a thermal inter-
face material between a computer processor
and a copper-based heat sink. Other high
watt density applications will benefit from the
extremely low thermal impedance of TIC 4000.
TIC 4000 compound wets out the thermal
interface surfaces and flows to produce low
thermal impedance.The compound requires
pressure of the assembly to cause flow.
TIC 4000 compound will not drip.
For a typical 0.5" x 0.5" application at 0.005"
thick, Bergquist estimates approximately
0.02 ml (cc) of TIC 4000.
Although Bergquist estimates a 0.02 ml (cc)
volumetric requirement for a 0.5" x 0.5"
component interface, dispensed at a thickness
of 0.005", Bergquist also recognizes that an
optimized application would utilize the
minimum volume of TIC 4000 material
necessary to ensure complete wet-out of
both mechanical interfaces.
High Performance Thermal Interface Compound for Copper-Based Heat Sinks
29
Application Methods
1. Pre-clean heat sink and component interface with isopropyl alcohol prior to
assembly or repair.
2. Dispense TIC 4000 compound onto the processor or heat sink surface like thermal grease.
3. Assemble the processor and heat sink with clip or constant-pressure fasteners.
Typical Applications Include:
• High performance computer processors (traditional screw fastening or clamping methods will
provide adequate force to optimize the thermal performance of TIC 4000)
• High watt density applications where the lowest thermal resistance interface is required
Configurations Available:
• Gel form
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
TIC™: U.S. Patent 6,339,129,662,4224.
TIC
TIC4000 - 00 - 00 - 200cc - NA
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
5cc = 5.0cc, 25cc = 25.0cc, 200cc = 200.0 cc, 800cc
= 800.0cc, 1600cc = 1600.0cc (ml) cartridges
00 = No options
00 = No options
TIC4000 = Thermal Interface Compound 4000
Section A
Section B
Section C
Section E
Section D
TYPICAL PROPERTIES OF TIC 4000
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Gray Gray Visual
Density (g/cc) 4.0 4.0 ASTM D374
Continuous Use Temp (°F) / (°C) 302 150 TGA Kinetics
ELECTRICAL
Electrical Resistivity (Ohm-meter) (1) N/A N/A ASTM D257
THERMAL
Thermal Conductivity (W/m-K) 4.0 4.0 ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) (2) 0.21 0.20 0.19 0.19 0.18
1) The compound contains an electrically conductive filler surrounded by electrically non-conductive resin.
2) TO-220 performance data is provided as a reference to compare Sil-Pad material thermal performance.
30
HI--FLOW
Hi-Flow
®
Phase Change Interface Materials
Solutions-Driven Thermal Management Products for Electronic Devices
Hi-Flow phase change materials are an excellent replacement for
grease as a thermal interface between a CPU or power device and a
heat sink.The materials change from a solid at specific phase change
temperatures and flow to assure a total wet-out of the interface –
without overflow.The result is a thermal interface comparable to
grease, without the mess, contamination and hassle.
The Hi-Flow family of phase change thermal interface materials covers a
wide range of applications.The Bergquist Company is a leader in thermal
management solutions and works closely with customers to ensure
that the proper Hi-Flow material is specified.
Use phase change materials for excellent thermal performance without the mess of grease.
U.S. Patent 5,679,457 and others.
Features
Hi-Flow handles like Bergquist’s
famed Sil-Pad materials at room
temperature, but flows like grease
at its designed phase change
temperature. Following is an
overview of the important features
shared by the Hi-Flow family.
• Comparable thermal
performance to grease in most
applications
• Thermally conductive phase
change compound
Aluminum, film or fiberglass
carriers and non-reinforced
versions
• Low volatility
• Easy to handle and apply in the
manufacturing environment
Tackified or tack-free at room
temperature
Benefits
Using Hi-Flow materials instead
of grease can save time and money
without sacrificing thermal
performance. Here are some
other benefits:
• No mess – thixotropic charac-
teristics of the materials keep it
from flowing out of the interface
• Easier handling – tackified or
tack-free at room temperature
• Does not require protective
liner
• High thermal performance
helps ensure CPU reliability
• Does not attract contaminants
• Easier material handling and
shipping
• Simplified application process
Options
The broad Hi-Flow family offers
a variety of choices to meet the
customer’s performance, handling
and process needs. Some of the
choices include:
Available with or without
adhesive
• Aluminum carrier for
applications not requiring
electrical isolation
• Film or fiberglass carrier for
electrical isolation
• Dry, non-reinforced material
Tackified or tack-free at room
temperature
• Tabbed parts, punch parts,
sheets or rolls
Adhesive specifically for cold
application without preheating
heat sink
We produce thousands of specials.
Tooling charges vary depending
on the complexity of the part.
Applications
Hi-Flow materials are suited for
consumer and industrial
electronics, automotive, medical,
aerospace and telecommunica-
tions applications such as:
UPS and SMPS AC/DC, DC/DC
or linear power supplies
• Between a CPU and heat sink
• Power conversion devices
• Fractional and integral motor
control
• Leaded, surface mount and
power module assemblies
Hi-Flow
®
Comparison Data
31
HI--FLOW
TO-220 Thermal Performance
Frequently Asked Questions
32
HI--FLOW
Q:
How is the ASTM D5470 test modified to characterize
phase change thermal performance?
A:
Bergquist uses the Anter Quickline 10 to characterize our ASTM
D5470 test results.The method is modified to condition the
phase change material to 5°C over the stated phase change
temperature. Understanding that time is also a key variable for
material displacement or flow.The over-temperature conditioning
is limited to 10 minutes and then allowed to cool, prior to initiating
the actual test at the given pressure.The 10-minute time has
been demonstrated to be an acceptable time period for the
thermal mass inherent in the Anter setup. Note: Actual
application testing may require more or less time to condition,
depending upon the heat transfer and associated thermal mass.
The performance values are recorded and published at 10, 25,
50, 100, and 200 psi to give the designer a broad-based under-
standing of Hi-Flow’s performance.
Q: What is the minimum pressure required to optimize the
thermal performance of the Hi-Flow material?
A:
Upon achieving phase change temperature (i.e. pre-conditioning),
Bergquist has demonstrated that 10 psi provides adequate
pressure to achieve exceptional thermal performance. Bergquist
continues to research lower pressure wet-out characteristics in
an effort to minimize interfacial losses associated with ultra-thin
material interfaces.
Q:
Will the Hi-Flow replace a mechanical fastener?
A:
Mechanical fasteners are required. Bergquist recommends the
use of spring clips to maintain consistent pressure over time.
Q:
Can I use screw mount devices with Hi-Flow material?
A:
Hi-Flow works best with a clip or spring washer-mounted
assembly.The continuous force applied by these devices allows
the Hi-Flow material to flow and reduce the cross sectional gap.
Bergquist suggests that design engineers evaluate whether a
screw mount assembly will have acceptable performance. See
TO-220 Technical Note.
Q: Is the adhesive in Hi-Flow 225F-AC repositionable?
A:
The adhesive in the current construction does adhere more to
the heat sink aluminum than to the Hi-Flow material.There is the
potential that the adhesive will be removed by the heat sink
surface when it is removed to reposition on the heat sink.Time
and/or pressure will increase the bond to the aluminum increasing
the potential for the adhesive to adhere to the heat sink.
Q: Is there any surface preparation required before apply-
ing the adhesive backed Hi-Flow to the heat sink?
A:
Standard electronics industry cleaning procedures apply. Remove
dirt or other debris. Best results are attained when the Hi-Flow
material is applied to a heat sink at a temperature of 25° +/- 10°C.
If the heat sink has been surface treated (i.e. anodized or
chromated), it is typically ready for assembly. For bare aluminum,
mild soap-and-water wash cleaning processes are typically used
to eliminate machine oils and debris.
Q: Is Hi-Flow material re-workable?
A:
If the material has not gone through phase change, the material
will readily release from the device surface. For this situation, the
Hi-Flow material will not likely have to be replaced.
If the material has gone through the phase change, it will adhere
very well to both surfaces. In this case, Bergquist suggests warming
the heat sink to soften the Hi-Flow compound for easier removal
from the processor. Replace with a new piece of Hi-Flow material.
Q:
What is meant by “easy to handle” in manufacturing?
A:
Insulated Hi-Flow products are manufactured with inner film
support.This film stiffens the material, allowing parts to be more
readily die-cut as well as making the material easier to handle in
manual or automated assembly.
Q:
What is meant by “tack free” and why is this important?
A:
Many Hi-Flow materials have no surface tack at room temperature.
The softer materials will pick up dirt more readily. Softer resins
are more difficult to clean if any dirt is on the surface. If you try
to rub the dirt away, the dirt is easily pushed into the soft phase
change materials. Hi-Flow coatings are typically hard at room
temperature rendering them easier to clean off without
embedding dirt.
Q:
What does more scratch resistance mean on
Hi-Flow 625?
A:
Hi-Flow 625 does not require a protective film during shipment.
There are two issues with competitors’ materials:
1) Melt point of the material is low enough that it can go
through phase change in shipment and be very tacky.
Hi-Flow has a higher phase change temperature and
remains hard to a higher temperature.
2) The Hi-Flow material is harder and is not as easy to
scratch or dent in shipping and handling.
Q:
Why is Hi-Flow phase change temperature 65˚C?
A:
The 65˚C phase change temperature was selected for two reasons.
First, it was a low enough temperature for the phase change to
occur in applications. Second, it would not phase change in
transport. Bergquist studies show that shipping containers can
reach 60˚C in domestic and international shipments.The higher
phase change temperature eliminates the possibility of a product
being ruined in shipment.We offer a standard line of Hi-Flow 225
and 300 series products with 55˚C phase change for those
customers wanting the lower phase change temperature.
Q:
What applications should I avoid using Hi-Flow?
A: Avoid using Hi-Flow in
applications in which the device will not
reach operation at or above phase change temperature. Also avoid
applications in which the operating temperature exceeds the max-
imum recommended operating temperature of the compound.
Hi-Flow
®
105
Features and Benefits
• Thermal impedance:
0.37°C-in2/W (@25 psi)
• Used where electrical isolation is
not required
• Low volatility – less than 1%
• Easy to handle in the manufacturing
environment
• Flows but doesn’t run like grease
Hi-Flow 105 is a phase change material coated
on both sides of an aluminum substrate. It is
designed specifically to replace grease as a
thermal interface, eliminating the mess,
contamination and difficult handling associated
with grease. Hi-Flow 105 is tack free and
scratch resistant at room temperature and
does not require a protective liner in shipment
when attached to a heat sink.
At 65°C (phase change temperature),
Hi-Flow 105 changes from a solid and flows,
thereby assuring total wet-out of the interface.
The thixotropic characteristics of Hi-Flow 105
reduces the pump-out from the interface.
Hi-Flow 105 has thermal performance equal
to grease with 0.10°C-in2/W contact thermal
resistance.
Phase Change Coated Aluminum
33
Typical Applications Include:
• Power semiconductors
• Microprocessors mounted on a heat sink
• Power conversion modules
• Spring or clip mount applications where thermal grease is used
Configurations Available:
• Sheet form, die-cut parts , and roll form
With or without pressure sensitive adhesive
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Hi- Flow®:U.S. Patent 5,950,066 and others
HI--FLOW
HF105 - 0.0055 - AC - 12/250 - NA
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
1212 = 12" X 12" sheets, 12/250 = 12" X 250' rolls,
00= custom configuration
AC = Adhesive one side, 00 = no adhesive
Standard thicknesses available: 0.0055"
HF105 = Hi-Flow 105
Section A
Section B
Section C
Section E
Section D
TYPICAL PROPERTIES OF HI-FLOW 105
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Dark Gray Dark Gray Visual
Reinforcement Carrier Aluminum Aluminum
Thickness (inch) / (mm) 0.0055 0.139 ASTM D374
Continuous Use Temp (°F) / (°C) 266 130
Phase Change Temp (°F) / (°C) 149 65 DSC
ELECTRICAL
Dielectric Constant (1000 (Hz) 3.2 3.2 ASTM D150
Flame Rating 94 V-O 94 V-O U.L.
THERMAL
Thermal Conductivity (W/m-K) (1) 0.9 0.9 ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) 0.95 0.80 0.74 0.69 0.64
Thermal Impedance (°C-in2/W) (2) 0.39 0.37 0.36 0.33 0.30
1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The
Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity
of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is
not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required.
2) The ASTM D5470 (Bergquist modified) test fixture was used and the test sample was conditioned at 70°C prior to test.The
recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is
directly related to the surface roughness, flatness and pressure applied.
Hi-Flow
®
115-AC
Fiberglass-Reinforced, Phase Change Thermal Interface Material
34
Features and Benefits
• Thermal impedance:
0.37°C-in2/W (@25 psi)
• Can be applied directly to a cold heat sink
• One side adhesive coated to aid
in positioning
• Fiberglass reinforced
Bergquist Hi-Flow 115-AC is a thermally con-
ductive fiber reinforced phase change materi-
al.The product consists of a thermally con-
ductive 65°C phase change compound coated
on a fiberglass web, and an adhesive coating
on one side for attachment to cold heat sink.
There is no need to preheat the heat sink to
apply the Hi-Flow 115-AC.
Hi-Flow 115-AC is designed as a thermal
interface material between a computer
processor and a heat sink.The pressure
sensitive adhesive makes it simple to apply in
high volume to heat sinks and the 65°C phase
change temperature eliminates shipping and
handling problems.
Hi-Flow 115-AC requires no protective liner
for shipping or handling.The Hi-Flow coating
is tough at room temperature, and it can
withstand the handling and shipping process
without protection.
Hi-Flow 115-AC handles like a Sil Pad at
room temperature and flows like high-quality
grease at elevated temperatures.
Typical Applications Include:
• Computer and peripherals
As a thermal interface where bare die is exposed and needs to be heat sinked
Configurations Available:
• Sheet form, die-cut parts, and roll form
With pressure sensitive adhesive
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Hi- Flow®:U.S. Patent 5,950,066 and others
HI--FLOW
HF115AC - 0.0055 - AC - 12/250 - NA
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
1212 = 12" X 12" sheets, 12/250 = 12" X 250' rolls,
00 = custom configuration
AC = Adhesive one side, 00 = no adhesive
Standard Thicknesses Available: 0.0055"
HF115AC = Hi-Flow 115AC
Section A
Section B
Section C
Section E
Section D
TYPICAL PROPERTIES OF HI-FLOW 115-AC
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Gray Gray Visual
Reinforcement Carrier Fiberglass Fiberglass
Thickness (inch) / (mm) 0.0055 0.139 ASTM D374
Elongation (%45° to Warp & Fill) 40 40 ASTM D882A
Tensile Strength (psi) / (MPa) 900 6ASTM D882A
Continuous Use Temp (°F) / (°C) 302 150
Phase Change Temp (°F) / (°C) 149 65 DSC
ELECTRICAL
Dielectric Breakdown Voltage (Vac) 300 300 ASTM D149
Dielectric Constant (1000 Hz) 3.5 3.5 ASTM D150
Volume Resistivity (Ohm-meter) 1010 1010 ASTM D257
Flame Rating 94 V-O 94 V-O U.L.
THERMAL
Thermal Conductivity (W/m-K) (1) 0.8 0.8 ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) 1.28 1.16 1.04 0.94 0.85
Thermal Impedance (°C-in2/W) (2) 0.44 0.37 0.35 0.27 0.15
1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The
Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity
of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is
not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required.
2) The ASTM D5470 (Bergquist modified) test fixture was used and the test sample was conditioned at 70°C prior to test.The
recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is
directly related to the surface roughness, flatness and pressure applied.
35
HI--FLOW
Hi-Flow
®
225F-AC
Reinforced Phase Change Thermal Interface Material
Features and Benefits
• Thermal impedance:
0.10°C-in2/W (@25 psi)
• Can be manually or automatically applied
to the surfaces of room-temperature
heat sinks
• Foil reinforced, adhesive coated
• Soft, thermally conductive 55°C phase
change compound
Hi-Flow 225F-AC is a high performance,
thermal interface material for use between a
computer processor and a heat sink. Hi-Flow
225F-AC consists of a soft, thermally
conductive 55°C phase change compound
coated to the top surface of an aluminum
carrier with a soft, thermally conductive
adhesive compound coated to the bottom
surface to improve adhesion to the heat sink.
Above the 55°C phase change temperature,
Hi-Flow 225F-AC wets out the thermal
interface surfaces and flows to produce low
thermal impedance.
Hi-Flow 225F-AC requires pressure from the
assembly to cause material flow.The Hi-Flow
coatings will not drip in vertical orientation.
The material includes a base carrier liner with
differential release properties to facilitate
simplicity in roll form packaging and application
assembly. Please contact Product Management
for applications that are less than 0.07" square.
Typical Applications Include:
• Computer and peripherals
• Power conversion
• High performance computer processors
• Power semiconductors
• Power modules
Configurations Available:
• Roll form, kiss-cut parts, and sheet form
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Hi- Flow®:U.S. Patent 5,950,066 and others
TYPICAL PROPERTIES OF HI-FLOW 225F-AC
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Black Black Visual
Reinforcement Carrier Aluminum Aluminum
Thickness (inch) / (mm) 0.004 0.102 ASTM D374
Carrier Thickness (inch) / (mm) 0.0015 0.038 ASTM D374
Continuous Use Temp (°F) / (°C) 248 120
Phase Change Temp (°F) / (°C) 131 55 DSC
ELECTRICAL
Flame Rating 94 V-O 94 V-O U.L.
THERMAL
Thermal Conductivity (W/m-K) (1) 1.0 1.0 ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) 0.87 0.68 0.57 0.50 0.45
Thermal Impedance (°C-in2/W) (2) 0.12 0.10 0.09 0.08 0.07
1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The
Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity
of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is
not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required.
2) The ASTM D5470 (Bergquist modified) test fixture was used and the test sample was conditioned at 70°C prior to test.The
recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is
directly related to the surface roughness, flatness and pressure applied.
HF225FAC - 0.004 - AC - 11/250 - NA
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
_ _ _ = Std. configuration dash number, 1112 = 11"
X 12" sheets, 11/250 = 11" X 250' rolls,
00 = custom configuration
AC = Adhesive one side
Standard Thicknesses Available: 0.004"
HF225FAC = Hi-Flow 225F-AC
Section A
Section B
Section C
Section E
Section D
36
HI--FLOW
Hi-Flow
®
225FT
Features and Benefits
• Thermal impedance:
0.10°C-in2/W (@25 psi)
• Re-workable pressure sensitive
Tabbed parts for easy application
• Compliant foil allows easy release
and re-work
Bergquist re-workable Hi-Flow 225FT thermal
interface material provides a low thermal
resistance path between hot components
such as high performance processors and
heat sinks.The material consists of a 55°C
phase change compound bonded to one side
of a conformable metal foil.This pressure
sensitive material is easily applied to the heat
sink and securely conforms to many mounting
surfaces. Its compliant foil allows for easy
release and re-working without leaving
residue on CPU surfaces.
Above the 55°C phase change temperature,
Hi-Flow 225FT “wets-out” the heat sink
interface and flows to produce exceptional
thermal performance.The thixotropic design
of Hi-Flow 225FT requires pressure of the
assembly to cause displacement and/or flow.
Application Methods
1. Hi-Flow 225FT pads are easily removed
from the carrier liner and can be hand-
applied to a room temperature heat sink,
foil-side exposed.To re-position the heat
sink assembly, simply lift gently to remove
and re-apply.
Reworkable, Pressure-Sensitive Phase Change Material
Typical Applications Include:
• Computer and peripherals
• High performance computer processors
• Burn-in testing
• Heat pipes
• Mobile processors
Configurations Available:
• Roll form with tabs and kiss-cut parts – no holes
• Custom thicknesses available
Hi-Flow 225FT is limited to a square or rectangle parts design. Dimensional tolerance is
+/- 0.020 inch or 0.5mm.
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Hi- Flow®:U.S. Patent 5,950,066 and others
Clear Polyester
Carrier Liner
HF 225FT
Roll Form,
Kiss-Cut Parts
Compliant Foil
Protects Hi-Flow
Low Adhesion to the Liner
for Ease-of-Removal
HF225FT - 0.004 - 01 - 1112 - NA
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
_ _ _ = Std. configuration dash number, 1112 = 12"
X 12" sheets, 11/100 = 11" X 250' rolls,
00 = custom configuration
01 = Re-workable adhesive one side
Standard Thicknesses Available: 0.004"
HF225FT = Hi-Flow 225FT
Section A
Section B
Section C
Section E
Section D
TYPICAL PROPERTIES OF HI-FLOW 225FT
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Black Black Visual
Reinforcement Carrier Aluminum Aluminum
Thickness (inch) / (mm) 0.004 0.102 ASTM D374
Carrier Thickness (inch) / (mm) 0.001 0.025 ASTM D374
Continuous Use Temp (°F) / (°C) 248 120
Phase Change Temp (°F) / (°C) 131 55 DSC
ELECTRICAL
Flame Rating 94 V-O 94 V-O U.L.
THERMAL
Thermal Conductivity (W/m-K) (1) 0.7 0.7 ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) 0.93 0.74 0.63 0.52 0.42
Thermal Impedance (°C-in2/W) (2) 0.13 0.10 0.09 0.07 0.06
1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The
Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity
of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is
not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required.
2) The ASTM D5470 (Bergquist modified) test fixture was used and the test sample was conditioned at 70°C prior to test.The
recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is
directly related to the surface roughness, flatness and pressure applied.
37
HI--FLOW
Hi-Flow
®
225UF
Features and Benefits
• Thermal impedance:
0.08°C-in2/W (@25 psi)
• Re-workable
• Easy release from CPU
• Easy to handle / assemble
Bergquist’s re-workable Hi-Flow 225UF thermal
interface material provides a low thermal
resistance path between hot components
such as high-performance processors and
heat sinks.
Hi-Flow 225UF consists of a 55°C phase
change compound bonded to one side of a
conformable aluminum foil.This phase change
material is easily applied to a nominal 45°C
heat sink and securely conforms to many
mounting surfaces.The compliant foil allows
for easy release from the CPU / Socket
Assembly, leaving the surface clean and
residue free. Hi-Flow 225UF is supplied in
kiss-cut form with a carrier liner protecting the
phase change material from contaminants.
Above the 55°C phase change temperature,
Hi-Flow 225UF “wets-out” the heat sink
interface and flows to produce exceptional
thermal performance. Hi-Flow 225UF’s
thixotropic design requires pressure of the
assembly to cause displacement and/or flow.
Unsupported Thermally Conductive Phase Change Material
Typical Applications Include:
• Spring / clip mounted:
- Digital / high power CPU’s
- Power modules
Configurations Available:
• Sheet form, kiss-cut or bulk
- Preferred form: squares / rectangles
• Singulated die-cut parts
- Preferred form: squares / rectangles
• Bulk roll form
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Hi- Flow®:U.S. Patent 5,950,066 and others
HF225UF - 0.0055 - 00 - 11/250 - NA
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
_ _ _ = Std. configuration dash number, 1112 = 11"
X 12" sheets, 11/250 = 11" X 250' rolls,
00 = custom configuration
00 = No adhesive
Standard Thicknesses Available: 0.0045"
HF225UF = Hi-Flow 225UF
Section A
Section B
Section C
Section E
Section D
TYPICAL PROPERTIES OF HI-FLOW 225UF
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Black Black Visual
Reinforcement Carrier Aluminum Aluminum
Thickness (inch) / (mm) 0.0045 0.114 ASTM D374
Carrier Thickness (inch) / (mm) 0.001 0.025 ASTM D374
Continuous Use Temp (°F) / (°C) 248 120
Phase Change Temp (°F) / (°C) 131 55 DSC
THERMAL
Thermal Conductivity (W/m-K) (1) 1.0 1.0 ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) 0.70 0.58 0.52 0.43 0.37
Thermal Impedance (°C-in2/W) (2) 0.10 0.08 0.07 0.06 0.05
1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The
Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity
of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is
not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required.
2) The ASTM D5470 (Bergquist modified) test fixture was used and the test sample was conditioned at 70°C prior to test.The
recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is
directly related to the surface roughness, flatness and pressure applied.
38
HI--FLOW
Hi-Flow
®
225UT
Non-Reinforced, Pressure-Sensitive Phase Change Thermal interface Material
Features and Benefits
• Thermal impedance:
0.08°C-in2/W (@25 psi)
• Inherently tacky, 55°C phase change
composite
• High visibility protective tabs
• Pressure sensitive phase change thermal
interface material
Hi-Flow 225UT is designed as a pressure-
sensitive, thermal interface material for use
between a high performance processor and a
heat sink. Hi-Flow 225UT is a thermally
conductive, inherently tacky, 55°C phase
change composite.The material is supplied on
a polyester carrier liner and is available with
high visibility protective tabs.
Above its phase change temperature, Hi-Flow
225UT wets out the thermal interface surfaces
and flows to produce the lowest thermal
impedance.The material requires pressure of
the assembly to cause flow. Hi-Flow 225UT
coatings will not drip.
Application Methods:
1. Hand-apply Hi-Flow 225UT to a room
temperature heat sink.The Hi-Flow 225UT
pad exhibits inherent tack and can be
hand-applied similar to an adhesive pad.
The tab liner can remain on the heat sink
and pad throughout shipping and handling
until is it is ready for final assembly.
Typical Applications Include:
• Computer and peripherals
• High performance computer processors
• Graphic cards
• Power modules
Configurations Available:
• Roll form with tabs and kiss-cut parts – no holes
Hi-Flow 225UT is limited to a square or rectangle parts design. Dimensional tolerance is
+/- 0.020 inch or 0.5mm.
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Hi- Flow®:U.S. Patent 5,950,066 and others
Clear Polyester
Carrier Liner
HF 225UT
Roll Form,
Kiss-Cut Parts
Clear/Colored
Protective Tab
Adhesive Strip
"Quick-Snap" High Visibility
Tab for Removal
HF225UT-0.0055 - 01 - 1012 - NA
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
_ _ _ = Std. configuration dash number, 1012 = 10"
X 12" sheets, 10/500 = 10" X 500' rolls,
00 = custom configuration
01 = Pressure sensitive adhesive
Standard Thicknesses Available: 0.003"
HF225UT = Hi-Flow 225UT
Section A
Section B
Section C
Section E
Section D
TYPICAL PROPERTIES OF HI-FLOW 225UT
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Black Black Visual
Reinforcement Carrier None None
Thickness (inch) / (mm) 0.003 0.077 ASTM D374
Continuous Use Temp (°F) / (°C) 248 120
Phase Change Temp (°F) / (°C) 131 55 DSC
ELECTRICAL
Flame Rating 94 V-O 94 V-O U.L.
THERMAL
Thermal Conductivity (W/m-K) (1) 0.7 0.7 ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) 0.60 0..53 0.46 0.40 0.35
Thermal Impedance (°C-in2/W) (2) 0.09 0.08 0.07 0.06 0.05
1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The
Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity
of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is
not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required.
2) The ASTM D5470 (Bergquist modified) test fixture was used and the test sample was conditioned at 70°C prior to test.The
recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is
directly related to the surface roughness, flatness and pressure applied.
Hi-Flow
®
225U
39
HI--FLOW
Non-Reinforced Phase Change Thermal Interface Material
Features and Benefits
• Thermal impedance: 0.07°C-in2/W (@25 psi)
• Hi-Flow coating will not drip
Thermally conductive 55°C phase change
compound
Available in roll form with kiss-cut parts
Hi-Flow 225U is designed for use as a thermal
interface material between a computer
processor and a heat sink.The product
consists of a thermally conductive 55°C
phase change compound coated on a red
release liner and supplied on a carrier.
Above its phase change temperature, Hi-Flow
225U wets out the thermal interface surfaces
and flows to produce low thermal impedance.
Hi-Flow 225U requires pressure of the
assembly to cause flow.
Application Methods:
1. Hand-apply to 35 – 45°C heat sink.The heat
sink is heated in an oven or via heat gun to
between 35 – 45°C.The Hi-Flow 225U part
is then applied like an adhesive pad.The heat
sink is cooled to room temperature and
packaged. Protective tab liner remains in
place until unit is it is ready for final assembly.
The protective tab can be readily removed
from the applied Hi-Flow 225U pad at a
maximum temperature of 28°C.
2. Automated equipment with 30-psi pressure.
A pick-and-place automated dispensing unit
can be used to apply the Hi-Flow 225U pad
to a room temperature heat sink.The place-
ment head should have a silicone rubber
pad, and should apply approximately 30-psi
pressure to the pad on transfer to the
25 – 35°C heat sink. Once applied, the
protective tab can be readily removed from
the Hi-Flow 225U pad at a maximum tem-
perature of 28°C.
Typical Applications Include:
• Computer and peripherals
• High performance computer processors
• Graphic cards
• Power modules
Configurations Available:
• Roll form with tabs and kiss-cut parts – no holes
Hi-Flow 225U is limited to a square or rectangle parts design. Dimensional tolerance is
+/- 0.020 inch or 0.5mm.
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Hi- Flow®:U.S. Patent 5,950,066 and others
HF225U - 0.0015 - 00 - 1112 - NA
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
_ _ _ = Std. configuration dash number, 1112 = 11"
X 12" sheets, 11/500 = 11" X 500' rolls,
00 = custom configuration
00 = No adhesive option
Standard Thicknesses Available: 0.0015"
HF225U = Hi-Flow 225U
Section A
Section B
Section C
Section E
Section D
TYPICAL PROPERTIES OF HI-FLOW 225U
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Black Black Visual
Reinforcement Carrier None None
Thickness (inch) / (mm) 0.0015 0.036 ASTM D374
Continuous Use Temp (°F) / (°C) 302 150
Phase Change Temp (°F) / (°C) 131 55 DSC
ELECTRICAL
Flame Rating 94 V-O 94 V-O U.L.
THERMAL
Thermal Conductivity (W/m-K) (1) 1.0 1.0 ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) 0.53 0.47 0.39 0.34 0.32
Thermal Impedance (°C-in2/W) (2) 0.08 0.07 0.06 0.05 0.04
1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The
Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity
of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is
not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required.
2) The ASTM D5470 (Bergquist modified) test fixture was used and the test sample was conditioned at 70°C prior to test.The
recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is
directly related to the surface roughness, flatness and pressure applied.
Hi-Flow
®
625
Electrically Insulating,Thermally Conductive Phase Change Material
40
HI--FLOW
Features and Benefits
• Thermal impedance:
0.71°C-in2/W (@25 psi)
• Electrically isolating
• 65°C phase change compound coated
on PEN film
Tack free and scratch resistant
Hi-Flow 625 is a film-reinforced phase change
material.The product consists of a thermally
conductive 65°C phase change compound
coated on PEN film.Hi-Flow 625 is designed
to be used as a thermal interface material
between electronic power devices that
require electrical isolation and a heat sink.The
reinforcement makes Hi-Flow 625 easy to
handle, and the 65°C phase change
temperature of the coating material eliminates
shipping and handling problems.The PEN film
has a continuous use temperature of 150°C.
Hi-Flow 625 is tack free and scratch resistant at
production temperature and does not require
a protective liner in most shipping situations.
The material has the thermal performance of
2-3 mil mica and grease assemblies.
Typical Applications Include:
• Spring / clip mounted
• Power semiconductors
• Power modules
Configurations Available:
• Sheet form, die-cut parts and roll form
With or without pressure sensitive adhesive
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Hi- Flow®:U.S. Patent 5,950,066 and others
HF625 - 0.005 - AC - 1212 - NA
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
_ _ _ = Std. configuration dash number, 1212 = 12"
X 12" sheets, 12/250 = 12" X 250' rolls, 00 =
custom configuration
AC = Adhesive one side, 00 = no adhesive
Standard Thicknesses Available: 0.005"
HF625 = Hi-Flow 625
Section A
Section B
Section C
Section E
Section D
TYPICAL PROPERTIES OF HI-FLOW 625
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Green Green Visual
Reinforcement Carrier PEN Film PEN Film
Thickness (inch) / (mm) 0.005 0.127 ASTM D374
Elongation (%45° to Warp & Fill) 60 60 ASTM D882A
Tensile Strength (psi) / (MPa) 30,000 206 ASTM D882A
Continuous Use Temp (°F) / (°C) 302 150
Phase Change Temp (°F) / (°C) 149 65 DSC
ELECTRICAL
Dielectric Breakdown Voltage (Vac) 4000 4000 ASTM D149
Dielectric Constant (1000 Hz) 3.5 3.5 ASTM D150
Volume Resistivity (Ohm-meter) 1010 1010 ASTM D257
Flame Rating 94 V-O 94 V-O U.L.
THERMAL
Thermal Conductivity (W/m-K) (1) 0.5 0.5 ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) 2.26 2.10 2.00 1.93 1.87
Thermal Impedance (°C-in2/W) (2) 0.79 0.71 0.70 0.67 0.61
1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The
Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity
of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is
not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required.
2) The ASTM D5470 (Bergquist modified) test fixture was used and the test sample was conditioned at 70°C prior to test.The
recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is
directly related to the surface roughness, flatness and pressure applied.
Hi-Flow
®
300P
41
HI--FLOW
Electrically Insulating,Thermally Conductive Phase Change Material
Features and Benefits
• Thermal impedance:
0.13°C-in2/W (@25 psi)
• Field-proven polyimide film
- excellent dielectric performance
- excellent cut-through resistance
• Outstanding thermal performance in an
insulated pad
Hi-Flow 300P consists of a thermally
conductive 55°C phase change compound
coated on a thermally conductive polyimide
film.The Polyimide reinforcement makes the
material easy to handle, and the 55°C phase
change temperature minimizes shipping and
handling problems.
Hi-Flow 300P achieves superior values in
voltage breakdown and thermal perform-
ance when compared to its competition.The
product is supplied on a easy release liner
for exceptional handling in high volume
manual assemblies. Hi-Flow 300P is designed
for use as a thermal interface material
between electronic power devices requiring
electrical isolation to the heat sink.
Bergquist suggests the use of spring clips to
assure constant pressure with the interface
and power source. Please refer to thermal
performance data to determine nominal
spring pressure for your application.
Typical Applications Include:
• Spring / clip mounted
• Discrete power semiconductors and modules
Configurations Available:
• Roll form, die-cut parts, and sheet form, with or without pressure sensitive adhesive
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Hi- Flow®:U.S. Patent 5,950,066 and others
HF300P - 001 - 00 - 00 - ACME10256 Rev. a
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
_ _ _ = Std. configuration dash number, 1112 = 11"
X 12" sheets, 11/250 = 11" X 250' rolls,
00 = custom configuration
AC = Adhesive one side, 00 = no adhesive
Standard polyimide thickness: 001 = 0.001", 0015 =
0.0015", 002 = 0.002"
HF300P = Hi-Flow 300P
Section A
Section B
Section C
Section E
Section D
We produce thousands of specials.Tooling charges vary
depending on tolerances and complexity of the part.
Hi- Flow®:U.S. Patent 4,950,066 and others
TYPICAL PROPERTIES OF HI-FLOW 300P
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Green Green Visual
Reinforcement Carrier Polyimide Polyimide
Thickness (inch) / (mm) 0.004 - 0.005 0.102 - 0.127 ASTM D374
Film Thickness (inch) / (mm) 0.001 - 0.002 0.025 - 0.050 ASTM D374
Elongation (%45° to Warp & Fill) 40 40 ASTM D882A
Tensile Strength (psi) / (MPa) 7000 48 ASTM D882A
Continuous Use Temp (°F) / (°C) 302 150
Phase Change Temp (°F) / (°C) 131 55 DSC
ELECTRICAL
Dielectric Breakdown Voltage (Vac) 5000 5000 ASTM D149
Dielectric Constant (1000 Hz) 4.5 4.5 ASTM D150
Volume Resistivity (Ohm-meter) 7 x 1012 7 x 1012 ASTM D257
Flame Rating 94 V-O 94 V-O U.L.
THERMAL
Thermal Conductivity (W/m-K) (1) 1.6 1.6 ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) 0.0010" 0.95 0.94 0.92 0.91 0.90
TO-220 Thermal Performance (°C/W) 0.0015" 1.19 1.17 1.16 1.14 1.12
TO-220 Thermal Performance (°C/W) 0.0020" 1.38 1.37 1.35 1.33 1.32
Thermal Impedance (°C-in2/W) 0.0010" (2) 0.13 0.13 0.12 0.12 0.12
Thermal Impedance (°C-in2/W) 0.0015" (2) 0.17 0.16 0.16 0.16 0.15
Thermal Impedance (°C-in2/W) 0.0020" (2) 0.19 0.19 0.19 0.18 0.18
1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The
Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity
of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is
not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required.
2) The ASTM D5470 (Bergquist modified) test fixture was used and the test sample was conditioned at 70°C prior to test.The
recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is
directly related to the surface roughness, flatness and pressure applied.
Hi-Flow
®
300G
42
HI--FLOW
Features and Benefits
• Thermal impedance:
0.16°C-in2/W (@25 psi)
Will not drip or run like grease
• Phase change compound coated on
a fiberglass carrier
Hi-Flow 300G consists of a thermally conductive
55°C phase change compound coated on a
fiberglass web. Hi-Flow 300G is designed as a
thermal interface material between a computer
processor and a heat sink.
Above the phase change temperature,
Hi-Flow 300G wets out the thermal interface
surfaces and flows to produce low thermal
impedance.The material requires pressure of
the assembly to cause flow. Hi-Flow 300G will
not drip or run like grease.
Application Methods
1. Hand-apply to 40-50°C heat sink.The heat
sink is heated in an oven or by a heat gun
to between 40-50°C allowing the Hi-Flow
300G pad to be applied like an adhesive
pad.The heat sink is cooled to room tem-
perature and packaged.
2. Hand-apply to 20-35°C heat sink. Hi-Flow
300G can be applied to a room tempera-
ture heat sink with the assistance of a foam
roller.The pad is positioned on the heat
sink and a hand roller is used to apply pres-
sure of 30 psi.
3. Automated equipment with 30 psi pressure.
A pick-and-place automated dispensing unit
can be used to apply Hi-Flow 300G to a
room temperature heat sink.The place-
ment head should have a soft silicone rub-
ber pad, and apply 30 psi pressure to the
pad on transfer to the 20-35°C heat sink.
Fiberglass-Reinforced, Phase Change Thermal Interface Material
Typical Applications Include:
• Computer and peripherals
As a thermal interface where bare die is exposed and needs to be heat sinked
Configurations Available:
• Sheet form, die-cut parts, and roll form
With or without pressure sensitive adhesive
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Hi- Flow®:U.S. Patent 5,950,066 and others
HF300G - 0.005 - 00 - 1012 - NA
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
_ _ _ = Std. configuration dash number, 1012 = 10"
X 12" sheets, 10/250 = 10" X 250' rolls,
00 = custom configuration
AC = Adhesive one side, 00 = no adhesive
Standard Thicknesses Available: 0.005"
HF300G = Hi-Flow 300G
Section A
Section B
Section C
Section E
Section D
TYPICAL PROPERTIES OF HI-FLOW 300G
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Green Green Visual
Reinforcement Carrier Fiberglass Fiberglass
Thickness (inch) / (mm) 0.005 0.127 ASTM D374
Elongation (%45° to Warp & Fill) 40 40 ASTM D882A
Tensile Strength (psi) / (MPa) 400 3ASTM D882A
Continuous Use Temp (°F) / (°C) 212 100
Phase Change Temp (°F) / (°C) 131 55 DSC
ELECTRICAL
Dielectric Breakdown Voltage (Vac) 300 300 ASTM D149
Dielectric Constant (1000 Hz) 3.5 3.5 ASTM D150
Volume Resistivity (Ohm-meter) 108108ASTM D257
Flame Rating 94 V-O 94 V-O U.L.
THERMAL
Thermal Conductivity (W/m-K) (1) 1.6 1.6 ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) 0.96 0.92 0.88 0.85 0.84
Thermal Impedance (°C-in2/W) (2) 0.27 0.20 0.16 0.15 0.14
1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The
Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity
of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is
not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required.
2) The ASTM D5470 (Bergquist modified) test fixture was used and the test sample was conditioned at 70°C prior to test.The
recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is
directly related to the surface roughness, flatness and pressure applied.
43
SIL-PAD
Sil-Pad
®
Thermally Conductive Insulators
More than 20 years ago, Bergquist set the standard for elastomeric
thermal interface materials with the introduction of Sil-Pad.Today,
Bergquist is a world leader with a complete family of Sil-Pad materials
to meet the critical needs of a rapidly changing electronics industry.
Sil-Pad thermally conductive insulators, in their many forms, continue
to be a clean and efficient alternative to mica, ceramics or grease for a
wide range of electronic applications. Bergquist application specialists
work closely with customers to specify the proper Sil-Pad material for
each unique thermal management requirement.
Comprehensive choices for a cleaner and more efficient thermal interface
Solutions-Driven Thermal Management Products for Electronic Devices
Features
The Sil-Pad family encompasses
dozens of products, each with its
own unique construction, prop-
erties and performance. Here are
some of the important features
offered by the Sil-Pad family:
• Proven silicone rubber binders
• Fiberglass, dielectric film or
polyester film carriers
• Special fillers to achieve specific
performance characteristics
• Flexible and conformable
• Reinforcements to resist
cut-through
Variety of thicknesses
Wide range of thermal
conductivities and dielectric
strengths
Benefits
Choosing Sil-Pad thermal products
saves time and money while maxi-
mizing an assembly’s performance
and reliability. Specifically:
• Excellent thermal performance
• Eliminates the mess of grease
• More durable than mica
• Less costly than ceramic
• Resistant to electrical shorting
• Easier and cleaner to apply
• Under time and pressure,
thermal resistance will decrease
• Better performance for today’s
high-heat compacted assemblies
A specific interfacial performance
that matches the need
• Efficient “total applied cost” that
compares favorably with other
alternatives
Options
Some Sil-Pad products have special
features for particular applications.
Options include:
Available with or without
adhesive
Aluminum foil or imbedded
graphite construction for
applications not requiring
electrical insulation
• Copper shield layer
• Polyester binder material for
silicone sensitive applications
• Polyester film carrier for
increased voltage breakdown
• Materials with reduced moisture
sensitivity
Available in rolls, sheets, tubes
and custom die-cut parts
• Custom thicknesses and
constructions
We produce thousands of specials.
Tooling charges vary depending
on the complexity of the part.
Applications
The large family of Sil-Pad
thermally conductive insulators is
extremely versatile. In today’s
marketplace, Sil-Pads are used in
virtually every component of the
electronics industry, including:
• Interface between a power
transistor, CPU or other heat-
generating component and a
heat sink or rail
• Isolate electrical components
and power sources from heat
sink and/or mounting bracket
• Interface for discrete semicon-
ductors requiring low pressure
spring clamp mounting
• Consumer electronics
• Automotive systems
• Telecommunications
• Aerospace
• Military
• Medical devices
• Industrial controls
Sil-Pad
®
Comparison Data
44
SIL-PAD
TO-220 Thermal Performance
Thermal Performance (°C/W)
Interface Pressure (psi)
Sil-Pad High Performance Materials
050100 150 200
3.25
3.05
2.85
2.65
2.45
2.25
2.05
1.85
1.65
1.45
1.25
Sil-Pad 1750
Sil-Pad A1500, 10 mil
Sil-Pad 2000, 10 mil
Sil-Pad A2000, 20 mil
Sil-Pad 1500ST, 12 mil
Sil-Pad A2000, 15 mil
Sil-Pad 1500ST, 8 mil
0.00
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
2.25
2.50
2.75
050100 150 200
Thermal Performance (°C/W)
Interface Pressure (psi)
Q-Pad Materials
Non-Electrically Isolating
Q-Pad II
Q-Pad 3
1.25
2.25
3.25
4.25
5.25
6.25
7.25
8.25
9.25
050100 150 200
Thermal Performance (°C/W)
Interface Pressure (psi)
Sil-Pad High Value Materials
Sil-Pad 400, 9 mil
Sil-Pad 400, 7 mil
Sil-Pad 980
Sil-Pad 900S
Sil-Pad 800
Sil-Pad Polyimide-Based Materials
4.25
4.00
3.75
3.50
3.25
3.00
2.75
2.50
2.25
2.00
1.75
1.50
1.25
Thermal Performance (°C/W)
Interface Pressure (psi)
050100 150 200
Sil-Pad K-4
Sil-Pad K-6
Sil-Pad K-10
Frequently Asked Questions
45
SIL-PAD
Q: What is the primary difference between Sil-Pad A2000
and Sil-Pad 2000 products?
A: Sil-Pad A2000 utilizes a different filler package than Sil-Pad 2000.
This change results in a more compliant Sil-Pad A2000 material
that inherently lowers interfacial resistance losses.This reduction
in interfacial resistance results in improved overall thermal
performance when measured at lower pressures in standard
ASTM D5470 and TO-220 testing.
Q: When should I choose Sil-Pad A2000 vs. Sil-Pad 2000
for my application?
A: The answer is based on the assumption that the primary design
intent is to increase thermal performance. If your application
utilizes lower clamping pressures (i.e. 10 to 75 psi) you will find
the Sil-Pad A2000 to provide excellent thermal performance. In
contrast, if you are designing for higher clamping pressures (i.e.
100psi or greater), it is likely that you will require the thermal
performance characteristics of the Sil-Pad 2000.
Q: Are there differences in electrical characteristics
between Sil-Pad A2000 and Sil-Pad 2000?
A: Yes. Bergquist evaluates and publishes voltage breakdown, dielectric
constant and volume resistivity data per ASTM standards for
these materials. Due to differences between ASTM lab testing
and actual application performance, for best results, these charac-
teristics should be evaluated within the actual customer system.
Q: Can I get Sil-Pad A2000 in sheet form?
A: Yes.With the new environmentally “green” process improvements
added with the introduction of Sil-Pad A2000 products, the
materials are now available in roll form.The original Sil-Pad 2000
material cannot be produced in continuous roll form.
Q: When should I choose Sil-Pad 800 versus Sil-Pad 900
for my application?
A: Sil-Pad 800 is specifically formulated to provide excellent thermal
performance for discrete semiconductor applications that utilize
low clamping pressures (i.e. spring clips at 10 to 50 psi). In contrast,
if you are designing for higher clamping pressure applications
using discrete semi-conductors (i.e. 50 to 100 psi), it is likely that
you will prefer the combination of high thermal performance and
cut-thru resistance inherent in Sil-Pad 900 material.
Q: When should I choose Sil-Pad 980 versus Sil-Pad P900
for my application?
A: Sil-Pad 980 is specifically formulated to provide superior cut-thru
and crush resistance in combination with excellent heat transfer
and dielectric properties. Sil-Pad 980 has a proven history of
reliability in high-pressure applications where surface imperfections
such as burrs and dents are inherently common.These applications
often include heavily machined metal surfaces manufactured from
extrusions or castings. Sil-Pad 900 carries a high level of crush
resistance and is more likely to be used in burr-free or controlled
surface finish applications.
Q: Is there an adhesive available for the Sil-Pad 1500ST?
A: Sil-Pad 1500ST has an inherent tack on both side of the material.
This inherent tack is used instead of an adhesive.The tack
provides sufficient adhesive for dispensing from the carrier liner
and placement on the component. Sil-Pad 1500ST can be
repositioned after the initial placement.
Q: Why is the thermal performance curve of the Sil-Pad
1500ST so flat when compared to other Sil-Pads?
A: Sil-Pad 1500ST wets out the application surfaces at a very low
pressure. Optimal thermal performance is achieved at pressures
as low as 50 psi.
Q: How do I know which Sil-Pad is right for my specific
application?
A: Each application has specific characteristics (e.g. surface finish,
flatness tolerances, high pressure requirements, potential burrs,
etc.) that determine which Sil-Pad will optimize thermal
performance. Select a minimum of two pads that best fit the
application and then conduct testing to determine which
material performs the best.
Q: What is QS 9000?
A: QS9000 defines the fundamental quality system expectations of
North American Automotive Manufacturers and other subscribing
companies for internal and external suppliers of production and
service parts and materials.These companies are committed to
working with suppliers to ensure customer satisfaction beginning
with conformance to quality requirements, and continuing with
reduction of variation and waste of benefit to the final customer,
the supply base, and themselves.
Polyimide Films
Polyimide films can also be used as insulators and are often combined
with wax or grease to achieve a low thermal impedance.These polyimide
films are especially tough and have high dielectric strength. Sil-Pad K-4,
K-6 and K-10 incorporate polyimide film as the carrier material.
Ceramic Insulators
Other insulation materials include ceramic wafer insulators which have
higher thermal conductivity than mica.They are often used thicker
(20-60 mils), (.5 to 1.5 mm) to reduce capacitive coupling while
maintaining a low thermal impedance.
Drawbacks to ceramic insulators are high cost and they are rigid like
mica and crack easily. Also, ceramic beryllia use requires careful handling
since inhalation of beryllia dust can cause lung inflammation (berylliosis).
Why Choose Sil-Pad Thermally Conductive Insulators?
46
SIL-PAD
Overview
The Bergquist Company established the standard for elastomeric
thermally conductive insulation materials with the development of
Sil-Pad over 20 years ago. Sil-Pad was developed as a clean, grease-
free alternative to mica and grease. Now, a complete family of materials
is available to meet the diverse and changing requirements of today’s
design engineer.
Mica and Grease
Mica insulators have been in use for over 30 years and are still
commonly used as an insulator. Mica is inexpensive and has excellent
dielectric strength, but it is brittle and is easily cracked or broken.
Because mica used by itself has high thermal impedance, thermal
grease is commonly applied to it.The grease flows easily and excludes
air from the interface to reduce the interfacial thermal resistance. If
the mica is also thin (2-3 mils [50-80 µm]), a low thermal impedance
can be achieved.
However, thermal
grease introduces a
number of problems to
the assembly process. It
is time-consuming to
apply, messy, and difficult
to clean. Once thermal
grease has been applied
to an electronic assem-
bly, solder processes
must be avoided to
prevent contamination
of the solder. Cleaning
baths must also be avoided to prevent wash-out of the interface
grease, causing a dry joint and contamination of the bath. Assembly,
soldering and cleaning processes must be performed in one process
while the greased insulators are installed off-line in a secondary
process. If the grease is silicone based, migration of silicone molecules
occurs over time, drying out the grease and contaminating the assembly.
Silicone migration onto electrical contacts can result in the loss of
electrical conductance. For this reason, silicone based thermal grease
has not been used in telecommunications systems.
47
SIL-PAD
Carriers
The carrier provides physical reinforcement and contributes to dielectric
strength. High dielectric and physical strength is obtained by using a
heavy, tight mesh, but thermal resistance will suffer. A light, open mesh
reduces thermal resistance, dielectric strength and cut-through resistance.
The carrier materials used in Sil-Pad materials include fiberglass, dielectric
film and polyester film which is used in Poly-Pad materials.
Fillers
The thermal conductivity of Sil-Pad products is improved by filling
them with ingredients of high thermal conductivity.The fillers change
the characteristics of the silicone rubber to enhance thermal and/or
physical characteristics.
For instance, some fillers make the silicone rubber hard and tough
while still retaining the ability to flow under pressure. A harder silicone
helps the material resist cut-through. In other applications a filler is
used to make the silicone rubber softer and more conformable to
rough surfaces.While the range in thermal resistance of greased mica
is quite large, the average is comparable to elastomeric insulators filled
with a blend of the appropriate ingredients.
Fiberglass-based insulators (Sil-Pad 400 and Sil-Pad 1500) have a rough
surface texture and will show a 15-20% decrease in thermal resistance
over a 24 hour period. Film based insulators (Sil-Pad K-4, Sil-Pad K-6 and
Sil-Pad K-10) are smoother initially and show a 5% decrease over the
same period of time.
Sil-Pad Materials
Sil-Pad thermally conductive insulators are designed to be clean,
grease-free and flexible.The combination of a tough carrier material
such as fiberglass and silicone rubber which is conformable, provides
the engineer with a more versatile material than mica or ceramics
and grease. Sil-Pad products minimize the thermal resistance from the
case of a power semiconductor to the heat sink. Sil-Pad materials
electrically isolate the semiconductor from the heat sink and have
sufficient dielectric strength to withstand high voltage.They are also
tough enough to resist puncture by the facing metal surface.With
more than 30 different Sil-Pad materials available, there is a Sil-Pad
matched to almost any application.
Sil-Pad Construction
Sil-Pad products are constructed with a variety of different materials
including fiberglass, silicone rubber, polyimide film, polyester film and
fillers used to enhance performance. Sil-Pad materials are typically
constructed with an elastomeric binder compounded with a thermally
conductive filler coated on a carrier.The characteristics of your
application often determine which Sil-Pad construction will produce
the best performance.
Binders
Most Sil-Pad products use silicone rubber as the binder. Silicone rubber
has a low dielectric constant, high dielectric strength, good chemical
resistance and high thermal stability.
Silicone rubber also exhibits cold flow, which excludes air from the
interface as it conforms to the mating surfaces.This flow eliminates
the need for thermal grease. A rough surface textured insulator needs
to flow more to exclude air than a smooth one.The smoother pads
also need less pressure to wet out the surfaces and obtain optimum
thermal contact.
Mechanical,Electrical and Thermal Properties
48
SIL-PAD
Devices with larger surface areas need more pressure to get the
insulator to conform to the interface than smaller devices. In most
screw mount applications, the torque required to tighten the fastener is
sufficient to generate the pressure needed for optimum thermal resist-
ance.There are exceptions where the specified torque on the fastener
does not yield the optimum thermal resistance for the insulator being
used and either a different insulator or a different
mounting scheme should be used.
Interfacial thermal resistance decreases as time
under pressure increases. In applications where
high clamping forces cannot be used, time can be
substituted for pressure to achieve lower thermal
resistance.The only way to know precisely what the
thermal resistance of an insulator will be in an
application is to measure it in that application.
Electrical Properties
If your application does not require electrical insulation, Q-Pad II or
Q-Pad 3 are ideal grease replacement materials.These materials do
not provide electrical isolation but have excellent thermal properties.
Hi-Flow phase change materials should also be considered for these
applications. (Reference pages 30-42 of this guide.)
The most important electrical property in a typical assembly where a
Sil-Pad insulator is used is dielectric strength. In many cases the dielectric
strength of a Sil-Pad will be the determining factor in the design of
the apparatus in which it is to be used.
Here are some general guidelines regarding electrical properties to
consider when selecting a Sil-Pad material:
• Q-Pad II and Q-Pad 3 are used when electrical isolation is not
required.
• Dielectric breakdown voltage is the total voltage that a dielectric
material can withstand.When insulating electrical components from
each other and ground, it is desirable to use an insulator with a high
breakdown voltage.
Mechanical Properties
Woven fiberglass and films are used in Sil-Pad products to provide
mechanical reinforcement.The most important mechanical property
in Sil-Pad applications is resistance to cut-through to avoid electrical
shorting from the device to the heat sink.
Cut-Through Resistance - Bergquist introduced its TO-220 cut-through test
to help customers better understand typical application performance.
Mounting Techniques & Mounting Pressure
Typical mounting techniques include:
A spring clip, which exerts a centralized clamping force on the body
of the transistor.The greater the mounting force of the spring, the
lower the thermal resistance of the insulator.
A screw in the mounting tab.With a screw-mounted TO-220, the
force on the transistor is determined by the torque applied to the
fastener.
In extremely low pressure applications, an insulator with pressure
sensitive adhesive on each side may give the lowest thermal resistance
since the adhesive wets out the interface easier than the dry rubber.
This decreases the interfacial thermal resistance.
SIL-PAD TYPICAL ELECTRICAL PROPERTIES
BREAKDOWN
VOLTAGE
DIELECTRIC
STRENGTH
DIELECTRIC
CONSTANT
VOLUME
RESISTIVITY
Material (kV) (Volts/mil) (kV/mm) (Ohm-Meter)
Sil-Pad 400 - 0.007 5700 18 5.5 1011
Sil-Pad 400 - 0.009 7800 20 5.5 1011
Sil-Pad A1500 6700 18 7.0 1011
Sil-Pad 2000 12 800 20 4.0 1011
Sil-Pad K-4 71200 30 5.0 1012
Sil-Pad K-6 71200 30 4.0 1012
Sil-Pad K-10 71200 30 3.7 1012
Test Method ASTM D149*
* Method A,Type 3
Electrodes
ASTM D149*
* Method A,Type 3 Electrodes
ASTM D150 ASTM D257
49
SIL-PAD
• Breakdown voltage decreases as the area of the electrodes
increases.This area effect is more pronounced as the thickness of
the insulator decreases.
• Breakdown voltage decreases as temperature increases.
• Breakdown voltage decreases as humidity increases (Sil-Pad 1750 is
less sensitive to moisture).
• Breakdown voltage decreases in the presence of partial discharge.
• Breakdown voltage decreases as the size of the voltage source (kVA
rating) increases.
• Breakdown voltage can be decreased by excessive mechanical stress
on the insulator.
Dielectric strength, dielectric constant and volume resistivity should
all be taken into consideration when selecting a Sil-Pad material.
If your application requires specific electrical performance please
contact a Bergquist sales representative for more detailed
testing information.
Thermal Properties
The thermal properties of a Sil-Pad material and your requirements for
thermal performance probably have more to do with your selection of a
Sil-Pad than any other factor.
Discrete semiconductors, under normal operating conditions, dissipate
waste power which raises the junction temperature of the device. Unless
sufficient heat is conducted out of the device, its electrical performance
and parameters are changed. A 10°C rise in junction temperature can
reduce the mean-time-to-failure of a device by a factor of two. Also,
above 25°C, the semiconductor's total power handling capability will be
reduced by a derating factor inherent to the device.
The thermal properties of Sil-Pad products are thermal impedance,
thermal conductivity and thermal resistance. The thermal resistance
and conductivity of Sil-Pad products are inherent to the material and
do not change.Thermal resistance and thermal conductivity are
measured per ASTM D5470 and do not include the interfacial thermal
resistance effects.Thermal impedance applies to the thermal transfer in
an application and includes the effects of interfacial thermal resistance.
As the material is applied in different ways the thermal impedance values
will vary from application to application.
The original Sil-Pad material, Sil-Pad 400 continues to be Bergquist's
most popular material for many applications.
• Sil-Pad A1500 is chosen when greater thermal performance is
required. Sil-Pad A2000 is ideal for high performance, high reliability
applications.
Beyond these standard materials many things can contribute to the
selection of the correct material for a particular application. Questions
regarding the amount of torque and clamping pressure are often
asked when selecting a Sil-Pad material. Here are some guidelines:
• Interfacial thermal resistance decreases as clamping pressure increases.
The clamping pressure required to minimize interfacial thermal
resistance can vary with each type of insulator.
• Sil-Pad products with smooth surface finishes (Sil-Pad A1500, Sil-Pad
A2000, Sil-Pad K-4, Sil-Pad K-6 and Sil-Pad K-10) are less sensitive to
clamping pressure than Sil-Pads with rough surface finishes (Sil-Pad 400).
Sil-Pad
®
Thermally Conductive
50
SIL-PAD
Sil-Pad 400
.007 in. Sil-Pad 400
0.009 in. Sil-Pad
800 Sil-Pad
900S Sil-Pad
980 Sil-Pad
A1500
Color Gray Gray Gold Pink Mauve Green
Thickness (in/mm) .007 ± .001
(.18 ± .025) .009 ± .001
(.23 ± .025) .005 ± .001
(.13 ± .025) .0097 ± .001
(.23 ± .025) .009 ± .001
(.23 ± .025) .010 ± .001
(.25 ± .025)
Thermal Performance
TO-220 Test @ 50 psi °C/W 5.14 6.61 2.45 2.90 4.52 2.21
Thermal Impedance (°C-in2/W) 1.13 1.45 0.45 0.61 1.07 0.42
Thermal Conductivity (W/m-K nominal) 0.9 0.9 1.6 1.6 1.2 2.0
Voltage Breakdown (Vac) 3500 4500 1700 5500 4000 6000
Continuous Use Temperature (°C) -60 to 180 -60 to 180 -60 to 180 -60 to 180 -40 to 180 -60 to 180
Construction Silicone/
Fiberglass Silicone/
Fiberglass Silicone/
Fiberglass Silicone/
Fiberglass Silicone/
Fiberglass Silicone/
Fiberglass
Sil-Pad Applications
Here, Sil-Pad 900 enhances the
thermal transfer from this FR-4
circuit board with thermal vias to
the metal base plate.
Sil-Pad is available in over one
hundred standard configurations
for common JEDEC package
outlines.
The circuit board above shows
punched parts interfacing screw-
mounted transistors to a finned
heat sink.
This application uses Sil-Pad to
isolate the mounting brackets from
the assembly frame.
A common Sil-Pad application
includes TO-220 transistors
mounted in a row on a heat rail.
These Sil-Pad applications show
clip mounting of transistors on the
left and screw mounting to an alu-
minum bracket on the right.
Choose a Sil-Pad that optimizes
thermal performance for our
mounting method — screw, clip,
spring, bar, and so on.
Sil-Pad 980 is used extensively in
industrial applications having
excellent cut-through and abrasion
resistance.
Insulator Selection Guide
51
SIL-PAD
Sil-Pad
1500ST Sil-Pad
A2000 Sil-Pad
K-4 Sil-Pad
K-6 Sil-Pad
K-10 Poly-Pad
1000 Poly-Pad
K-4 Poly-Pad
K-10 Test
Method
Blue White Gray Bluegreen Beige Yellow Mauve Yellow Visual
.008 — .001
(.20 ± .025) .015 ± .001
(.38 ± .025) .006 ± .001
(.15 ± .025) .006 ± .001
(.15 ± .025) .006 ± .001
(.15 ± .025) .009 ± .001
(.23 ± .025) .006 ± .001
(.15 ± .025) .006 ± .001
(.15 ± .025) ASTM D374
1.51 1.86 3.13 2.76 2.01 3.74 4.34 2.75 ASTM D5470
0.23 0.32 0.48 0.49 0.41 0.82 0.95 0.60 ASTM D5470
1.8 3.0 0.9 1.1 1.3 1.2 0.9 1.3 ASTM D5470
3000 4000 6000 6000 6000 2500 6000 6000 ASTM D149
-60 to 180 -60 to 200 -60 to 180 -60 to 180 -60 to 180 -20 to 150 -20 to 150 -30 to 120
Silicone/
Fiberglass Silicone/
Fiberglass Silicone/
Film Silicone/
Film Silicone/
Film Polyester/
Fiberglass Polyester/
Film Polyester/
Film
Sil-Pad Comparison Made Simple!
Comparing thermally conductive
interface materials has never been
easier. Simply go to the “Thermal
Materials” section of the Bergquist
website (www.bergquistcompany.com),
and select “Compare Material
Properties.Then select up to three
separate products and this handy
comparison tool will automatically
chart thermal resistance values and
display a material properties table of
selected materials.
The materials comparison tool can
be used for most Bergquist thermal
materials, including Sil-Pad, Hi-Flow,
Gap Pad, Q-Pad, Bond-Ply and
Liqui-Bond products.
Sil-Pad
®
400
The Original Sil-Pad Material
52
Features and Benefits
• Thermal impedance:
1.13°C-in2/W (@50 psi)
• Original Sil-Pad material
• Excellent mechanical and physical
characteristics
• Flame retardant
Sil-Pad 400 is a composite of silicone rubber
and fiberglass. It is flame retardant and is
specially formulated for use as a thermally
conductive insulator. Primary use is to electri-
cally isolate power sources from heat sinks.
Sil-Pad 400 has excellent mechanical and
physical characteristics. Surfaces are pliable
and allow complete surface contact with
excellent heat dissipation. Sil-Pad 400 actually
improves its thermal resistance with age.The
reinforcing fiberglass gives excellent cut-through
resistance and Sil-Pad 400 is non-toxic and
resists damage from cleaning agents.
Typical Applications Include:
• Power supplies Automotive electronics • Motor controls
• Power semiconductors • U.L. File Number E59150 • FSCM Number 55285
• Military Specifications:
- MIL-M-38527/8A - MIL-M-38527C - MIL-I-49456 - MIL-M-87111
Configurations Available:
• Sheet form, die-cut parts, and roll form; with or without pressure sensitive adhesive
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Sil-Pad®U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others
SIL-PAD
SP400 - 0.007 - AC - 12/250 - NA
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
_ _ _ = Std. configuration dash number, 1212 = 12"
X 12" sheets, 12/250 = 12" X 250' rolls,
00 = custom configuration
AC = Adhesive one side, AC2 = Adhesive both
sides, 00 = no adhesive
Standard Thicknesses Available: 0.007", 0.009"
SP400 = Sil-Pad 400
Section A
Section B
Section C
Section E
Section D
TYPICAL PROPERTIES OF SIL-PAD 400
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Gray Gray Visual
Reinforcement Carrier Fiberglass Fiberglass
Thickness (inch) / (mm) 0.007, 0.009 0.178, 0.229 ASTM D374
Hardness (Shore A) 85 85 ASTM D2240
Breaking Strength (lbs/inch) / (kN/m) 100 18 ASTM D1458
Elongation (%45° to Warp & Fill) 40 40 ASTM D412
Tensile Strength (psi) / (MPa) 3000 20 ASTM D412
Continuous Use Temp (°F) / (°C) -76 to 356 -60 to 180
ELECTRICAL
Dielectric Breakdown Voltage (Vac) 3500, 4500 3500, 4500 ASTM D149
Dielectric Constant (1000 Hz) 5.5 5.5 ASTM D150
Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257
Flame Rating 94 V-O 94 V-O U.L.
THERMAL
Thermal Conductivity (W/m-K) 0.9 0.9 ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) 0.007" 6.62 5.93 5.14 4.38 3.61
TO-220 Thermal Performance (°C/W) 0.009" 8.51 7.62 6.61 5.63 4.64
Thermal Impedance (°C-in2/W) 0.007" (1) 1.82 1.42 1.13 0.82 0.54
Thermal Impedance (°C-in2/W) 0.009" (1) 2.34 1.83 1.45 1.05 0.69
1) The ASTM D5470 (Bergquist modified) test fixture was used and the test sample was conditioned at 70°C prior to test.The
recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is
directly related to the surface roughness, flatness and pressure applied.
Sil-Pad
®
800
Features and Benefits
• Thermal impedance:
0.45°C-in2/W (@50 psi)
• Low mounting pressures
• Smooth and highly compliant surface
• Electrically isolating
The Sil-Pad 800 family of thermally conductive
insulation materials is designed for applications
requiring high thermal performance and
electrical isolation.These applications also
typically have low mounting pressures for
component clamping.
Sil-Pad 800 material combines a smooth and
highly compliant surface characteristic with high
thermal conductivity.These features optimize the
thermal resistance properties at low pressure.
Applications requiring low component clamping
forces include discrete semiconductors
(TO-220,TO-247 and TO-218) mounted with
spring clips. Spring clips assist with quick assembly
but apply a limited amount of force to the
semiconductor.The smooth surface texture
of Sil-Pad 800 minimizes interfacial thermal
resistance and maximizes thermal performance.
High Performance Insulator for Low Pressure Applications
53
Typical Applications Include:
• Power supplies
• Automotive electronics
• Motor controls
• Power semiconductors
Configurations Available:
• Sheet form, die-cut parts, and roll form
With or without pressure sensitive adhesive
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Sil-Pad®:U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others
SIL-PAD
SP800 - 0.005 - AC - 1212 - NA
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
_ _ _ = Std. configuration dash number, 1212 = 12"
X 12" sheets, 12/250 = 12" X 250' rolls,
00 = custom configuration
AC = Adhesive one side, 00 = no adhesive
Standard Thicknesses Available: 0.005"
SP800 = Sil-Pad 800
Section A
Section B
Section C
Section E
Section D
TYPICAL PROPERTIES OF SIL-PAD 800
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Gold Gold Visual
Reinforcement Carrier Fiberglass Fiberglass
Thickness (inch) / (mm) 0.005 0.127 ASTM D374
Hardness (Shore A) 91 91 ASTM D2240
Elongation (%45° to Warp & Fill) 20 20 ASTM D412
Tensile Strength (psi) / (MPa) 1700 12 ASTM D412
Continuous Use Temp (°F) / (°C) -76 to 356 -60 to 180
ELECTRICAL
Dielectric Breakdown Voltage (Vac) 1700 1700 ASTM D149
Typ e 3 Electrodes 3000 3000 ASTM D149
Dielectric Constant (1000 Hz) 6.0 6.0 ASTM D150
Volume Resistivity (Ohm-meter) 1010 1010 ASTM D257
Flame Rating 94 V-O 94 V-O U.L.
THERMAL
Thermal Conductivity (W/m-K) 1.6 1.6 ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) 3.56 3.01 2.45 2.05 1.74
Thermal Impedance (°C-in2/W) (1) 0.92 0.60 0.45 0.36 0.29
1) The ASTM D5470 (Bergquist modified) test fixture was used and the test sample was conditioned at 70°C prior to test.The
recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is
directly related to the surface roughness, flatness and pressure applied.
Sil-Pad
®
900S
High Performance Insulator for Low Pressure Applications
54
Features and Benefits
• Thermal impedance:
0.61°C-in2/W (@50 psi)
• Low mounting pressures
• Smooth and highly compliant surface
• Electrically isolating
The Sil-Pad 900S family of thermally conductive
insulation materials is designed for applications
requiring high thermal performance and
electrical isolation.These applications also
typically have low mounting pressures for
component clamping.
Sil-Pad 900S material combines a smooth
and highly compliant surface characteristic
with high thermal conductivity.These
features optimize the thermal resistance
properties at low pressure.
Applications requiring low component clamping
forces include discrete semiconductors
(TO-220,TO-247 and TO-218) mounted with
spring clips. Spring clips assist with quick
assembly but apply a limited amount of force
to the semiconductor.The smooth surface
texture of Sil-Pad 900S minimizes interfacial
thermal resistance and maximizes thermal
performance.
Typical Applications Include:
• Power supplies
• Automotive electronics
• Motor controls
• Power semiconductors
Configurations Available:
• Sheet form, die-cut parts, and roll form
With or without pressure sensitive adhesive
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Sil-Pad®:U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others
SIL-PAD
SP900S - 0.009 - AC - 00 - Acme 951753 Rev. B
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
_ _ _ = Std. configuration dash number, 1212 = 12"
X 12" sheets, 12/250 = 12" X 250' rolls,
00 = custom configuration
AC = Adhesive one side, 00 = no adhesive
Standard Thicknesses Available: 0.009"
SP900S = Sil-Pad 900S
Section A
Section B
Section C
Section E
Section D
TYPICAL PROPERTIES OF SIL-PAD 900S
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Pink Pink Visual
Reinforcement Carrier Fiberglass Fiberglass
Thickness (inch) / (mm) 0.009 0.229 ASTM D374
Hardness (Shore A) 92 92 ASTM D2240
Elongation (%45° to Warp & Fill) 20 20 ASTM D412
Tensile Strength (psi) / (MPa) 1300 9ASTM D412
Continuous Use Temp (°F) / (°C) -76 to 356 -60 to 180
ELECTRICAL
Dielectric Breakdown Voltage (Vac) 5500 5500 ASTM D149
Type 3 Electrodes 8300 8300 ASTM D149
Dielectric Constant (1000 Hz) 6.0 6.0 ASTM D150
Volume Resistivity (Ohm-meter) 1010 1010 ASTM D257
Flame Rating 94 V-O 94 V-O U.L.
THERMAL
Thermal Conductivity (W/m-K) 1.6 a1.60.61 ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) 3.96 3.41 2.90 2.53 2.32
Thermal Impedance (°C-in2/W) (1) 0.95 0.75 0.61 0.47 0.41
1) The ASTM D5470 (Bergquist modified) test fixture was used and the test sample was conditioned at 70°C prior to test.The
recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is
directly related to the surface roughness, flatness and pressure applied.
Sil-Pad
®
980
Features and Benefits
• Thermal impedance:
1.07°C-in2/W (@50 psi)
• Excellent cut-through resistance
• Use in screw mounted applications with
cut-through problems
Bergquist Sil-Pad 980 is a specially formulated
material with high crush resistance to prevent
cut through.This material provides thermal
conductivity and electrical insulation.
Use Sil-Pad 980 material in screw mounted
application with cut through problems.The
Sil-Pad 980 is Bergquist’s best material for cut
through resistance.
High Cut-Through Resistant, Electrically Insulative,Thermally Conductive Material
55
SIL-PAD
Typical Applications Include:
• Silicone sensitive assemblies
• Telecommunications
• Automotive electronics
Configurations Available:
• Sheet form, die-cut parts, and roll form
With or without pressure sensitive adhesive
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Sil-Pad®:U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others
SP980 - 0.009 - AC - 00 - Acme 951753 Rev. B
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
_ _ _ = Std. configuration dash number, 1212 = 12"
X 12" sheets, 12/250 = 12" X 250' rolls,
00 = custom configuration
AC = Adhesive one side, 00 = no adhesive
Standard Thicknesses Available: 0.009"
SP980 = Sil-Pad 980
Section A
Section B
Section C
Section E
Section D
TYPICAL PROPERTIES OF SIL-PAD 980
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Mauve Mauve Visual
Reinforcement Carrier Fiberglass Fiberglass
Thickness (inch) / (mm) 0.009 0.229 ASTM D374
Hardness (Shore A) 95 95 ASTM D2240
Breaking Strength (lbs/inch) / (kN/m) 140 26 ASTM D1458
Elongation (%45° to Warp & Fill) 10 10 ASTM D412
Cut-Through (lbs) / (kg) 750 340 ASTM D412
Continuous Use Temp (°F) / (°C) -40 to 302 -40 to 150
ELECTRICAL
Dielectric Breakdown Voltage (Vac) 4000 4000 ASTM D149
Dielectric Constant (1000 Hz) 3.5 3.5 ASTM D150
Volume Resistivity (Ohm-meter) 1010 1010 ASTM D257
THERMAL
Thermal Conductivity (W/m-K) (1) 1.2 1.2 ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) 5.48 5.07 4.52 4.04 3.56
Thermal Impedance (°C-in2/W) (2) 1.51 1.22 1.07 0.89 0.53
1) The ASTM D5470 (Bergquist modified) test fixture was used and the test sample was conditioned at 70°C prior to test.The
recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is
directly related to the surface roughness, flatness and pressure applied.
Sil-Pad
®
A1500
Electrically Insulating,Thermally Conductive Elastomeric Material
56
Features and Benefits
• Thermal impedance:
0.42°C-in2/W (@50 psi)
• Solvent-free process
• Elastomeric compound coated on
both sides
Bergquist Sil-Pad A1500 is a silicone-based
thermally conductive and electrically insulating
material. It consists of a cured silicone
elastomeric compound coated on both sides
of a fiberglass reinforcement layer.
Sil-Pad A1500 is a product of similar perform-
ance to the Sil-Pad 1500 manufactured with
a more environmentally friendly, solvent-free
process.
Typical Applications Include:
• Power supplies
• Automotive electronics
• Motor controls
• Power semiconductors
Configurations Available:
• Sheet form, die-cut parts, and roll form (maximum recommended roll width is 10 inches)
With or without pressure sensitive adhesive
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Sil-Pad®:U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others
SIL-PAD
SPA1500 - 0.010 - AC - 12/250 - NA
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
_ _ _ = Std. configuration dash number, 1212 = 12"
X 12" sheets, 12/250 = 12" X 250' rolls,
00 = custom configuration
AC = Adhesive one side, 00 = no adhesive
Standard Thicknesses Available: 0.010"
SPA1500 = Sil-Pad A1500
Section A
Section B
Section C
Section E
Section D
TYPICAL PROPERTIES OF SIL-PAD A1500
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Green Green Visual
Reinforcement Carrier Fiberglass Fiberglass
Thickness (inch) / (mm) 0.010 0.254 ASTM D374
Hardness (Shore A) 80 80 ASTM D2240
Breaking Strength (lbs/inch) / (kN/m) 65 12 ASTM D1458
Elongation (%45° to Warp & Fill) 40 40 ASTM D412
Continuous Use Temp (°F) / (°C) -76 to 356 -60 to 180
ELECTRICAL
Dielectric Breakdown Voltage (Vac) 6000 6000 ASTM D149
Dielectric Constant (1000 Hz) 7.0 7.0 ASTM D150
Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257
Flame Rating 94 V-O 94 V-O U.L.
THERMAL
Thermal Conductivity (W/m-K) 2.0 2.0 ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) 3.03 2.62 2.21 1.92 1.78
Thermal Impedance (°C-in2/W) (1) 0.59 0.50 0.42 0.34 0.31
1) The ASTM D5470 (Bergquist modified) test fixture was used and the test sample was conditioned at 70°C prior to test.The
recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is
directly related to the surface roughness, flatness and pressure applied.
Sil-Pad
®
1500ST
Features and Benefits
• Thermal impedance:
0.30°C-in2/W (@50 psi)
• Inherent surface tack on both sides
• Pad is re-positionable
• Excellent thermal performance
Auto-placement and dispensable
Bergquist Sil-Pad 1500ST (Soft Tack) is a fiber-
glass reinforced thermal interface material
that has an inherent tack on both sides.
Sil-Pad 1500ST exhibits superior thermal
performance when compared to the
competitors’ thermal interface materials.
Sil-Pad 1500ST is supplied in roll form for
exceptional auto-dispensing and auto-
placement in high volume assemblies. Sil-Pad
1500ST is intended for placement between
electronic power devices and its heat sink.
Electrically Insulating,Thermally Conductive, Soft-Tack Elastomeric Material
57
Typical Applications Include:
• Power supplies
• Automotive electronics
• Motor controls
Configurations Available:
• Die-cut parts and slit-to-width, roll form
Also available in 12 mil thickness
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Sil-Pad®:U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others
SIL-PAD
SP1500ST - 0.010 - AC - 1012 - ACME10256 Rev. a
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
_ _ _ = Std. configuration dash number, 1012 = 10"
X 12" sheets, 10/250 = 10" X 250' rolls,
00 = custom configuration
AC = Adhesive one side, 00 = no adhesive
Standard Thicknesses Available: 0.010"
SP1500ST = Sil-Pad 1500ST
Section A
Section B
Section C
Section E
Section D
TYPICAL PROPERTIES OF SIL-PAD 1500ST
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Blue Blue Visual
Reinforcement Carrier Fiberglass Fiberglass
Thickness (inch) / (mm) 0.008 0.203 ASTM D374
Hardness (Shore 00) 71 71 ASTM D2240
Breaking Strength (lbs/inch) / (kN/m) 1.9 0.34 ASTM D1458
Elongation (%45° to Warp & Fill) 22 22 ASTM D412
Tensile Strength (psi) / (MPa) 238 1.64 ASTM D412
Continuous Use Temp (°F) / (°C) -76 to 356 -60 to 180
ELECTRICAL
Dielectric Breakdown Voltage (Vac) 3000 3000 ASTM D149
Dielectric Constant (1000 Hz) 6.1 6.1 ASTM D150
Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257
Flame Rating 94 V-O 94 V-O U.L.
THERMAL
Thermal Conductivity (W/m-K) 1.8 1.8 ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) 1.54 1.52 1.51 1.49 1.46
Thermal Impedance (°C-in2/W) (1) 0.37 0.28 0.23 0.21 0.20
1) The ASTM D5470 (Bergquist modified) test fixture was used and the test sample was conditioned at 70°C prior to test.The
recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is
directly related to the surface roughness, flatness and pressure applied.
58
SIL-PAD
Features and Benefits
• Thermal impedance:
0.53°C-in2/W (@50 psi)
• Excellent dielectric strength retention after
humidity exposure
• Elastomeric pad
The combination of high thermal conductivity
and excellent dielectric strength retention
after humidity exposure is formulated into
the Sil-Pad 1750 elastomeric pad.
Sil-Pad 1750 relies on processes that minimize
the effect of high humidity on the electrical
properties of finished material.Therefore,
exposure to humid environments during
assembly, or over long term operating
conditions, will not severely affect the ability
of the material to perform.
Sil-Pad
®
1750
Typical Applications Include:
• High voltage power supplies
• Motor controls
• High “hi-pot” requirements
Configurations Available:
• Sheet form and die-cut parts
With or without pressure sensitive adhesive
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Sil-Pad®:U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others
For High Humidity, High Dielectric (U.L. 1950, IEC 950) Requirements
SP1750 - 0.012 - AC - 12/250 - NA
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
_ _ _ = Std. configuration dash number, 1212 = 12"
X 12" sheets, 12/250 = 12" X 250' rolls,
00 = custom configuration
AC = Adhesive one side, 00 = no adhesive
Standard Thicknesses Available: 0.012"
SP1750 = Sil-Pad 1750
Section A
Section B
Section C
Section E
Section D
TYPICAL PROPERTIES OF SIL-PAD 1750
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Green Green Visual
Reinforcement Carrier Fiberglass Fiberglass
Thickness (inch) / (mm) 0.012 0.305 ASTM D374
Hardness (Shore A) 85 85 ASTM D2240
Breaking Strength (lbs/inch) / (kN/m) 65 12 ASTM D1458
Elongation (%45° to Warp & Fill) 23 23 ASTM D412
Tensile Strength (psi) / (MPa) 1509 10 ASTM D412
Continuous Use Temp (°F) / (°C) -76 to 356 -60 to 180
ELECTRICAL
Dielectric Breakdown Voltage (Vac) 6000 6000 ASTM D149
Dielectric Constant (1000 Hz) 1509 10 ASTM D150
Volume Resistivity (Ohm-meter) 1012 1012 ASTM D257
Flame Rating 94 V-O 94 V-O U.L.
THERMAL
Thermal Conductivity (W/m-K) 2.2 2.2 ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) 3.11 2.87 2.42 2.08 1.90
Thermal Impedance (°C-in2/W) (1) 0.86 0.68 0.53 0.39 0.28
1) The ASTM D5470 (Bergquist modified) test fixture was used and the test sample was conditioned at 70°C prior to test.The
recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is
directly related to the surface roughness, flatness and pressure applied.
59
SIL-PAD
Sil-Pad
®
2000
Higher Performance, High Reliability Insulator
Features and Benefits
• Thermal impedance:
0.33°C-in2/W (@50 psi)
• Complies with military standards
• Optimal heat transfer
• High thermal conductivity 3.5 W/m-K
Sil-Pad 2000 is a high performance thermally
conductive insulator designed for demanding
military / aerospace and commercial applica-
tions. In these applications, Sil-Pad 2000
complies with military standards.
Sil-Pad 2000 is a silicone elastomer formulated
to maximize the thermal and dielectric
performance of the filler/binder matrix.The
result is a grease-free, conformable material,
capable of meeting or exceeding the thermal
and electrical requirements of high reliability
electronic packaging applications.
Typical Applications Include:
• Aerospace
• FSCM Number 55285
• Commercial
• U.L. File Number E59150
• Military Specifications:
- MIL-M-38527/8A
- MIL-M-38527C
- MIL-I-49456
Configurations Available:
• Sheet form and die-cut parts, with or without pressure sensitive adhesive.
Variety of thickness gages to meet customer requirements
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Sil-Pad®:U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others
Outgassing Data for
Spacecraft Materials
Post Cure
Conditions
% TML
(1.0% Max.
Acceptable)
%CVCM
(0.1% Max.
Acceptable)
24 hrs. @ 175°C
No Post Cure 0.07
0.26 0.03
0.10
SP2000 - 0.015 - AC - 00 - NA
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
_ _ _ = Std. configuration dash number, 1212 = 12"
X 12" sheets, 00 = custom configuration
AC = Adhesive one side, 00 = no adhesive
Standard Thicknesses Available: 0.010", 0.015", 0.020"
SP2000 = Sil-Pad 2000
Section A
Section B
Section C
Section E
Section D
TYPICAL PROPERTIES OF SIL-PAD 2000
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color White White Visual
Reinforcement Carrier Fiberglass Fiberglass
Thickness (inch) / (mm) 0.010 0.254 ASTM D374
Hardness (Shore A) 90 90 ASTM D2240
Continuous Use Temp (°F) / (°C) -76 to 392 -60 to 200
ELECTRICAL
Dielectric Breakdown Voltage (Vac) 4000 4000 ASTM D149
Dielectric Constant (1000 Hz) 4.0 4.0 ASTM D150
Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257
Flame Rating 94 V-O 94 V-O U.L.
THERMAL
Thermal Conductivity (W/m-K) 3.5 3.5 ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) 2.61 2.32 2.02 1.65 1.37
Thermal Impedance (°C-in2/W) (1) 0.57 0.43 0.33 0.25 0.20
1) The ASTM D5470 (Bergquist modified) test fixture was used and the test sample was conditioned at 70°C prior to test. The
recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is
directly related to the surface roughness, flatness and pressure applied.
60
SIL-PAD
Features and Benefits
• Thermal impedance:
0.32°C-in2/W (@50 psi)
• Optimal heat transfer
• High thermal conductivity: 3.0 W/m-K
Sil-Pad A2000 is a conformable elastomer
with very high thermal conductivity that acts
as a thermal interface between electrical
components and heat sinks. Sil-Pad A2000 is
for applications where optimal heat transfer is
a requirement.
This thermally conductive silicone elastomer is
formulated to maximize the thermal and
dielectric performance of the filler/binder
matrix.The result is a “grease-free, conform-
able material capable of meeting or exceeding
the thermal and electrical requirements of high
reliability electronic packaging applications.
Sil-Pad
®
A2000
Higher Performance, High Reliability Insulator
Typical Applications Include:
• Motor drive controls
• Avionics
• High voltage power supplies
• Power transistor / heat sink interface
Configurations Available:
• Sheet form and die-cut parts
With or without pressure sensitive adhesive
Variety of thickness gages to meet customer requirements
Preferred thickness includes 0.015" and 0.020"
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Sil-Pad®:U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others
SPA2000 - 0.015 - 00 - 1212 - NA
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
_ _ _ = Std. configuration dash number, 1212 = 12"
X 12" sheets, 00 = custom configuration
AC = Adhesive one side, 00 = no adhesive
Standard Thicknesses Available: 0.015", 0.020"
SPA2000 = Sil-Pad A2000
Section A
Section B
Section C
Section E
Section D
TYPICAL PROPERTIES OF SIL-PAD A2000
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color White White Visual
Reinforcement Carrier Fiberglass Fiberglass
Thickness (inch) / (mm) 0.015 to 0.020 0.381 to 0.508 ASTM D374
Hardness (Shore A) 90 90 ASTM D2240
Heat Capacity (J/g-K) 1.0 1.0 ASTM C351
Continuous Use Temp (°F) / (°C) -76 to 392 -60 to 200
ELECTRICAL
Dielectric Breakdown Voltage (Vac) 4000 4000 ASTM D149
Dielectric Constant (1000 Hz) 7.0 7.0 ASTM D150
Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257
Flame Rating 94 V-O 94 V-O U.L.
THERMAL
Thermal Conductivity (W/m-K) 3.0 3.0 ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) 0.015" 2.05 1.94 1.86 1.79 1.72
Thermal Impedance (°C-in2/W) 0.015" (1) 0.53 0.40 0.32 0.28 0.26
1) The ASTM D5470 (Bergquist modified) test fixture was used and the test sample was conditioned at 70°C prior to test.The
recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is
directly related to the surface roughness, flatness and pressure applied.
61
SIL-PAD
Sil-Pad
®
K-4
The Original Kapton
®
-Based Insulator
Features and Benefits
• Thermal impedance:
0.48°C-in2/W (@50 psi)
Withstands high voltages
• High dielectric strength
• Very durable
Sil-Pad K-4 uses a specially developed film
which has high thermal conductivity, high
dielectric strength and is very durable. Sil-Pad
K-4 combines the thermal transfer properties
of well-known Sil-Pad rubber with the physical
properties of a film.
Sil-Pad K-4 is a durable insulator that with-
stands high voltages and requires no thermal
grease to transfer heat. Sil-Pad K-4 is available
in customized shapes and sizes.
Typical Applications Include:
• Power supplies • Motor controls
• Power semiconductors • UL FILE NUMBER E59150
• FSCM NUMBER 55285
• Military Specifications
- MIL SPEC. MIL-M-38527/8A - MIL-M-38527C
- MIL-I-49456 - MIL-M-87111
Configurations Available:
• Sheet form, die-cut parts and roll form, with or without pressure sensitive adhesive
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Sil-Pad®:U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others.
Kapton®is a registered trademark of DuPont.
SPK4-0.006" - 00 - 12/250 - NA
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
_ _ _ = Std. configuration dash number, 1212 = 12"
X 12" sheets, 12/250 = 12" X 250' rolls,
00 = custom configuration
AC = Adhesive one side, 00 = no adhesive
Standard Thicknesses Available: 0.006"
SPK4 = Sil-Pad K-4
Section A
Section B
Section C
Section E
SectionD
TYPICAL PROPERTIES OF SIL-PAD K-4
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Gray Gray Visual
Reinforcement Carrier Kapton Kapton
Thickness (inch) / (mm) 0.006 0.152 ASTM D374
Hardness (Shore A) 90 90 ASTM D2240
Breaking Strength (lbs/inch) / (kN/m) 30 5 ASTM D1458
Elongation (%45° to Warp & Fill) 40 40 ASTM D412
Tensile Strength (psi) / (MPa) 5000 34 ASTM D412
Continuous Use Temp (°F) / (°C) -76 to 356 -60 to 180
ELECTRICAL
Dielectric Breakdown Voltage (Vac) 6000 6000 ASTM D149
Dielectric Constant (1000 Hz) 5.0 5.0 ASTM D150
Volume Resistivity (Ohm-meter) 1012 1012 ASTM D257
Flame Rating 94 V-O 94 V-O U.L.
THERMAL
Thermal Conductivity (W/m-K) 0.9 0.9 ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) 3.66 3.43 3.13 2.74 2.42
Thermal Impedance (°C-in2/W) (1) 1.07 0.68 0.48 0.42 0.38
1) The ASTM D5470 (Bergquist modified) test fixture was used and the test sample was conditioned at 70°C prior to test.The
recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is
directly related to the surface roughness, flatness and pressure applied.
62
SIL-PAD
Features and Benefits
• Thermal impedance:
0.49°C-in2/W (@50 psi)
Tough dielectric barrier against cut-through
• Medium performance film
Sil-Pad K-6 is a medium performance film-
based thermally conductive insulator.The film
is coated with a silicone elastomer to deliver
high performance and provides a continuous
physically tough dielectric barrier against
“cut-through” and resultant assembly failures.
Sil-Pad
®
K-6
The Medium Performance Kapton
®
-Based Insulator
Typical Applications Include:
• Power supplies • Motor controls
• Power semiconductors • UL FILE NUMBER E59150
• FSCM NUMBER 55285
• Military Specifications
- MIL SPEC. MIL-M-38527/8A - MIL-M-38527C
- MIL-I-49456 - MIL-M-87111
Configurations Available:
• Sheet form, die-cut parts, and roll form, with or without pressure sensitive adhesive
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Sil-Pad®:U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others
Kapton®is a registered trademark of DuPont.
SPK6 - 0.006 - AC - 12/250 - NA
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
_ _ _ = Std. configuration dash number, 1212 = 12"
X 12" sheets, 12/250 = 12" X 250' rolls,
00 = custom configuration
AC = Adhesive one side, 00 = no adhesive
Standard Thicknesses Available: 0.006"
SPK6 = Sil-Pad K-6
Section A
Section B
Section C
Section E
Section D
TYPICAL PROPERTIES OF SIL-PAD K-6
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Bluegreen Bluegreen Visual
Reinforcement Carrier Kapton Kapton
Thickness (inch) / (mm) 0.006 0.152 ASTM D374
Hardness (Shore A) 90 90 ASTM D2240
Breaking Strength (lbs/inch) / (kN/m) 30 5 ASTM D1458
Elongation (%45° to Warp & Fill) 40 40 ASTM D412
Tensile Strength (psi) / (MPa) 5000 34 ASTM D412
Continuous Use Temp (°F) / (°C) -76 to 356 -60 to 180
ELECTRICAL
Dielectric Breakdown Voltage (Vac) 6000 6000 ASTM D149
Dielectric Constant (1000 Hz) 4.0 4.0 ASTM D150
Volume Resistivity (Ohm-meter) 1012 1012 ASTM D257
Flame Rating VTM-O VTM-O U.L.
THERMAL
Thermal Conductivity (W/m-K) 1.1 1.1 ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) 3.24 3.03 2.76 2.45 2.24
Thermal Impedance (°C-in2/W) (1) 0.82 0.62 0.49 0.41 0.36
1) The ASTM D5470 (Bergquist modified) test fixture was used and the test sample was conditioned at 70°C prior to test.The
recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is
directly related to the surface roughness, flatness and pressure applied.
63
SIL-PAD
Sil-Pad
®
K-10
The High Performance Kapton
®
-Based Insulator
Features and Benefits
• Thermal impedance:
0.41°C-in2/W (@50 psi)
Tough dielectric barrier against cut-through
• High performance film
• Designed to replace ceramic insulators
Sil-Pad K-10 is a high performance insulator. It
combines special film with a filled silicone rubber.
The result is a product with good cut-through
properties and excellent thermal performance.
Sil-Pad K-10 is designed to replace ceramic insu-
lators such as Beryllium Oxide, Boron Nitride,
and Alumina. Ceramic insulators are expensive
and they break easily. Sil-Pad K-10 eliminates
breakage and costs much less than ceramics.
Typical Applications Include:
• Power supplies • Motor controls
• Power semiconductors • UL FILE NUMBER E59150
• FSCM NUMBER 55285
• Military Specifications
- MIL-M-38527/8A - MIL-M-38527C
- MIL-I-49456 - MIL-M-87111
Configurations Available:
• Sheet form, die-cut parts, and roll form, with or without pressure sensitive adhesive
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Sil-Pad®:U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others.
Kapton®is a registered trademark of DuPont.
SPK10 -0.006 - AC - 1212 - NA
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
_ _ _ = Std. configuration dash number, 1212 = 12"
X 12" sheets, 12/250 = 12" X 250' rolls,
00 = custom configuration
AC = Adhesive one side, 00 = no adhesive
Standard Thicknesses Available: 0.006"
SPK10 = Sil-Pad K-10
Section A
Section B
Section C
Section E
Section D
TYPICAL PROPERTIES OF SIL-PAD K-10
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Yellow Yellow Visual
Reinforcement Carrier Kapton Kapton
Thickness (inch) / (mm) 0.005 0.127 ASTM D374
Hardness (Shore A) 90 90 ASTM D2240
Breaking Strength (lbs/inch) / (kN/m) 30 5 ASTM D1458
Elongation (%45° to Warp & Fill) 40 40 ASTM D412
Tensile Strength (psi) / (MPa) 5000 34 ASTM D412
Continuous Use Temp (°F) / (°C) -4 to 302 -20 to 150
ELECTRICAL
Dielectric Breakdown Voltage (Vac) 6000 6000 ASTM D149
Dielectric Constant (1000 Hz) 3.7 3.7 ASTM D150
Volume Resistivity (Ohm-meter) 1012 1012 ASTM D257
Flame Rating 94 V-O 94 V-O U.L.
THERMAL
Thermal Conductivity (W/m-K) 1.3 1.3 ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) 3.76 3.35 2.75 2.30 2.03
Thermal Impedance (°C-in2/W) (1) 0.86 0.56 0.41 0.29 0.24
1) The ASTM D5470 (Bergquist modified) test fixture was used and the test sample was conditioned at 70°C prior to test.The
recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is
directly related to the surface roughness, flatness and pressure applied.
64
SIL-PAD
Features and Benefits
• Thermal impedance:
0.22°C-in2/W (@50 psi)
• Maximum heat transfer
Aluminum foil coated both sides
• Designed to replace thermal grease
Q-Pad II is a composite of .0015" aluminum foil
coated on both sides with .0025" thermally /
electrically conductive Sil-Pad rubber.The
materialisdesigned for those applications in
whichmaximum heat transfer is needed and
electrical isolation is not required. Q-Pad II is
the ideal thermal interface material to replace
messy thermal grease compounds.
Q-Pad II eliminates problems associated with
grease such as contamination of reflow solder
or cleaning operations. Q-Pad II can be used
prior to these operations unlike grease. Q-Pad II
also eliminates dust collection which can cause
possible surface shorting or heat buildup.
Q-Pad
®
II
Foil-Format Grease Replacement for Maximum Heat Transfer
Typical Applications Include:
• Between a transistor and a heat sink
• Between two large surfaces such as an L-bracket and the chassis of an assembly
• Between a heat sink and a chassis
• Under electrically isolated power modules or devices such as resistors,
transformers and solid state relays
• U.L. File Number E59150
Configurations Available:
• Sheet form, die-cut parts, and roll form
With or without pressure sensitive adhesive
Building a Part Number Standard Options
Note: To build a part number, visit our website at www.bergquistcompany.com.
Sil-Pad®:U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others
QII - 0.006 - AC - 1212 - NA
example
NA = Selected standard option. If not selecting a
standard option, insert company name, drawing
number, and revision level.
_ _ _ = Std. configuration dash number, 1212 = 12"
X 12" sheets, 12/250 = 12" X 250' rolls,
00 = custom configuration
AC = Adhesive one side, 00 = no adhesive
Standard Thicknesses Available: 0.006"
QII = Q-Pad II
Section A
Section B