Solder Paste Reflow on Capital Advanced PCB's

This video shows various surface mount packages being reflowed with convection soldering onto Capital Advanced prototyping boards. Using standard SN63/PB37 solder paste and placing the component onto the pcb, the boards are introduced to convection heating until proper reflow is completed. Close-up shots of the reflow process provide good feedback on how placement errors can be corrected at the reflow stage.

5/23/2012 4:29:52 PM