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- Established in 1957, Wakefield Engineering designs efficient, affordable and reliable thermal management solutions for a diverse range of commercial, industrial, and military markets. Recognized as a worldwide leader, Wakefield Engineering has grown with the market while expanding into others, responding to technological advances and anticipating industry demands. Wakefield Engineering is a wholly owned subsidiary of Alpha Technologies Group, Inc.

Featured Products

Image of Wakefield's Liquid Cold Plates 180 Series

Liquid Cold Plates

Wakefield's liquid cooling is a natural evolution beyond air cooling where either due to thermal or footprint requirements, the desired performance can no longer be economically met by air cooling. Learn More

Image of Wakefield-Vette's Individual Heat Pipes

Individual Heat Pipes

Wakefield-Vette's grooved, mesh, powder, and hybrid heat pipes move heat from the source to an area where the heat can be dissipated. Learn More

Newest Products View All (20)

Image of Wakefield-Vette's ulTIMiFlux Dielectric Phase Change Thermal Material

ulTIMiFlux™ Dielectric Phase-Change Thermal Material

Wakefield-Vette's ulTIMiFlux high performance dielectric phase-change material which utilizes a substrate to act as a thermally conductive carrier in order to deliver you uniform thickness coating of phase-change compound on both sides.

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Image of Wakefield-Vette's High Performance Re-Circulating Liquid Chillers

High-Performance Recirculating Liquid Chillers

Wakefield-Vette's high performance HPLC series compact liquid chiller has both air cooled and water-cooled options available.

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Image of Wakefield Vette's HiBay LED Heat Sink

HiBay LED Heat Sink

Wakefield-Vette's HiBay LED heat sink series is available in varying lengths for warehousing, industrial settings, residential, and sporting arena environments.

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Image of Wakefield-Vette’s Vapor Chambers

Vapor Chambers

Wakefield-Vette’s vapor chambers can provide extended life and reliability for components and applied products.

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Image of Wakefield-Vette's Wave Series Heat Sink

Wave Series™ Heat Sink

Wakefield-Vette’s Wave Series heat sink series are a superior choice for cooling BGA.

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Image of Wakefield-Vette's ulTIMiFlux Thermal Interface Material

ulTIMiFlux Thermal Interface Material

Wakefield-Vette's ulTIMiFlux line of thermal interface materials offer high performance, low cost, configurability, and custom sizes for your thermal system needs.

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Product Training Modules View All (6)

Image of Wakefield Vette vapor chamber

Utilizing Vapor Chambers, A Practical Guide to Design

Duration: 5 minutes

An introduction on utilizing and designing with Wakefield-Vette vapor chambers, as well as a comparison of vapor chambers to heat pipes

Heat Pipe - SM

Heat Pipe Overview

Duration: 5 minutes

This presentation will discuss the what is a heat pipe, the types of heat pipes, and heat pipe assemblies.

Ripac ECO

Intro to the EPS Heitec Sub-rack System

Duration: 5 minutes

Overview of the EPS Heitec Sub-rack enclosure series.

Liquid Cold Plate Technology

Liquid Cold Plate Technologies

Duration: 5 minutes

Liquid cold plate cooling from Wakefield is a natural evolution beyond air cooling where the desired performance can no longer be economically met by air cooling.

Featured Videos View All (14)

Bonded Fin Heat Sinks: Wakefield-Vette

Bonded fins are a good high power solution for either natural or forced convection. Individual straight fins are cut and bonded into a grooved base plate.

Publish Date: 2016-04-12

Heat Pipe Overview: Wakefield-Vette

Fluid Phase Change applications, often referred to as “re-circulating,” use closed loop heat pipes to transfer heat quickly through evaporation and condensation within the heat pipe.

Publish Date: 2016-04-12

Liquid Cooling, Practical Guidelines to Design and Manufacture with Q&A- Thermal Live 2015

Overview: Industry trends continue to produce smaller footprints with higher power densities. In some cases, Liquid Cooling is the answer for cooling your application.

Publish Date: 2016-04-12

Wakefield Vette Minute: 900 Series Chipset Heat Sink Attachment

Wakefield-Vette’s 900 Series Heat Sinks for BGA Chipsets can match up to devices from Intel, Broadcom, Xilinx, TI, Motorola, ATI, AMD, Nvidia, Vishay, Powerex, Infineon, Microsemi, and many more.

Publish Date: 2016-04-12

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