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Samtec Inc.

is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed).

To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.


The Samtec Story

Image of Samtech's Story

Samtec offers a broad line of electronic interconnect solution blocks, including IC-to-Board/Ultra Micro, High Speed Board-to-Board, High Speed Cables, Future-Proof/Active Optics, Flexible Stacking, and Micro/Rugged components and cables. Learn More

Product Listing View All

Newest Products View All (4)

Image of Samtec's Board-To-Board Interconnect Systems

Board-To-Board Interconnect Systems

Samtec has more ways to connect two or more PC boards than any of the other connector companies.

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Image of Samtec's Hi Reliability Rugged Tiger Eye™ System

Hi Reliability Rugged Tiger Eye™ System

Samtec's Tiger Eye is available in surface mount and through-hole pins.

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Image of Samtec's Edge Rate™ Rugged High Speed System

Edge Rate™ Rugged High Speed System

Samtec's Edge Rate contact system is designed for high speed and high cycle apps.

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Image of Samtec's Q Strip® High Speed Mezzanine

Q Strip® High Speed Mezzanine

Samtec Q Strip mezzanine connectors are designed for high speed board-to-board apps. Q Strip connectors are available on .5mm, .635mm and .8mm pin pitches.

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Product Training Modules View All (2)

Board to Board Connectors

Board-to-Board Connectors

Duration: 5 minutes

Summary of Samtec's board-to-board interconnect solutions, discussion of the various types of contact systems available and their features and benefits.


Rugged/Power Connectors

Duration: 10 minutes

Samtec’s micro rugged connectors features include rugged Tiger Eye and Edge Rate contacts, IP68 waterproofed cables, and high speed, signal integrity Q series.

Featured Videos View All (11)

XCede® HD - Samtec’s High-Density Backplane System

XCede® HD features a form factor that is significantly smaller than traditional backplane solutions and has incredible design flexibility for high-density backplane applications. Visit for more information.

Publish Date: 2018-10-19


This brief video showcases our emerging backplane technology in our new ExaMax system capable of 28+ Gbps while providing reliable contacts and low mating force. Visit for more information.

Publish Date: 2018-10-19

Jack Screw Standoffs for High-Normal-Force Applications (JSO & JSOM)

Mitigating damage to components, boards and solder joints in high-normal-force applications, our jack screw standoffs can be applied to 15.24 mm board stack heights.

Publish Date: 2018-10-19


As an interposer, Z-Ray® is a cost-saving removable interface between the IC package and main board. Z-Ray® is ideal for the demands of military/defense, aerospace and R&D applications including radar, radio, navigation and sensors.

Publish Date: 2018-07-30

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