Samtec Inc.

is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed).

To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

+More

The Samtec Story

Image of Samtech's Story

Samtec offers a broad line of electronic interconnect solution blocks, including IC-to-Board/Ultra Micro, High Speed Board-to-Board, High Speed Cables, Future-Proof/Active Optics, Flexible Stacking, and Micro/Rugged components and cables. Learn More

Product Listing View All

Newest Products View All (11)

Edge Rate® High-Speed Contact System

Samtec’s Edge Rate® contact system featuring the ERM8 and ERF8 series is designed for high speeds up to 56 Gbps PAM4 as well as high-cycle applications. Learn More

MMSD Series Flexible Power Cable Assembly

Samtec’s Mini Mate® series is a discrete wire cable assembly on 0.100” (2.54 mm) pitch with 20 AWG to 30 AWG wire with contacts rated up to 4.8 A per pin. Learn More

SFSD Series Double Row Discrete Wire Cable Assembly

Samtec's Tiger Eye™ assemblies are shrouded, polarized, keyed, offer a variety of pin counts, single or double row, optional retention latches, and screw downs. Learn More

Q Strip® High-Speed Board-to-Board Connectors

Samtec’s Q Strip® connectors have surface mount signal contacts and a surface mount ground plane between the signal rows for improved electrical performance. Learn More

SEARAY™ High-Density Open Pin Field Arrays

Samtec's SEARAY™ open pin field arrays feature a 0.050" x 0.050" (1.27 mm x 1.27 mm) pitch grid for maximum grounding and routing flexibility. Learn More

HSEC8 High-Speed Edge Card Connectors

Samtec’s high-speed edge card connectors are available in a variety of pitches and orientations and feature Edge Rate® contacts for increased cycle life. Learn More

Recent PTMs View All (2)

Board-to-Board Connectors Publish Date: 2011-11-16

Summary of Samtec's board-to-board interconnect solutions, discussion of the various types of contact systems available and their features and benefits.

Duration: 5 minutes
Rugged/Power Connectors Publish Date: 2011-11-16

Samtec’s micro rugged connectors features include rugged Tiger Eye and Edge Rate contacts, IP68 waterproofed cables, and high speed, signal integrity Q series.

Duration: 10 minutes

Featured Videos View All (12)

Samtec Product Overview

From standard products to unique high-performance designs, Samtec’s offering is designed to support any interconnectivity need, regardless of application, performance requirements or environment.

XCede® HD - Samtec’s High-Density Backplane System

XCede® HD features a form factor that is significantly smaller than traditional backplane solutions and has incredible design flexibility for high-density backplane applications. Visit samtec.com/XCedeHD for more information.

ExaMAX

This brief video showcases our emerging backplane technology in our new ExaMax system capable of 28+ Gbps while providing reliable contacts and low mating force. Visit samtec.com/ExaMax for more information.

Jack Screw Standoffs for High-Normal-Force Applications (JSO & JSOM)

Mitigating damage to components, boards and solder joints in high-normal-force applications, our jack screw standoffs can be applied to 15.24 mm board stack heights.

Manufacturer Web site