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Featured Videos

Liquid Dispensed TIM
GC10 Solder Paste - LOCTITE │Another Geek Moment Product Preview
Loctite GC 10
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Recent PTMs

10 minutes
Phase Change Thermal Interface Materials (PCTIM)
A comparison of the features and benefits of thermal grease and phase change as well as an review of the applications they are used for.
5 minutes
Water Washable Solder Paste Loctite GC 3W
Introducing Henkel's innovative game changer water washable solder paste.
15 minutes
Gap Pad EMI 1
Explore potential markets and applications for the Bergquist Gap Pad EMI 1.0 product.
15 minutes
GC 10 Solder Paste
The Loctite GC 10 Game Changer paste provides a new benchmark for the industry and addresses the performance and property advances vs. current paste technology.
5 minutes
Thermal Interface Material (TIM), Gap Pad® VO Ultra Soft
Gap Pad VO offers a thermally conductive, electrically isolating material with a wide array of secondary benefits.
15 minutes
Thermal Interface materials (TIM) Gap Pad Key Product Characteristics
Thermal interface materials (TIM) Gap Pad characteristics including thermal, electrical, and mechanical.
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About Henkel/Loctite

Henkel Adhesive Electronics, a division of global materials innovator, Henkel Corporation, is focused on developing next-generation materials for a variety of applications in the industrial, consumer, handheld, wearables, display and emerging electronics market sectors. Henkel’s leading electronics brands of LOCTITE, Multicore (now sold under the LOCTITE brand) and Bergquist have long been recognized as the product brands to trust for printed circuit board assembly applications. With a broad portfolio of materials including surface mount adhesives, advanced flux chemistries, encapsulants, high performance solder solutions, conductive adhesives, thermal management materials as well as CSP underfills and board protection materials, Henkel’s advanced formulations ensure maximum processability and reliable in-field performance.

LOCTITE - The LOCTITE brand is synonymous with quality, reliability and high performance. Within the electronics sector, LOCTITE is the premier brand for Henkel’s solder, flux, underfill, surface mount adhesive, printed ink, potting, display adhesive, structural adhesive and conformal coating product lines.

Bergquist - Now part of Henkel, the Bergquist line of thermal management materials delivers superior heat control for a variety of challenging applications. Known under the well-respected brands of Gap Pad®, Gap Filler, Thermal Clad®, Sil-Pad®, Liqui-Form®and Bond-Ply®, Henkel’s comprehensive thermal materials portfolio encompasses solutions that enable effective heat management from the substrate level through to final assembly.

Multicore - Formerly Multicore and now marketed as LOCTITE, LOCTITE solder products are among the industry’s most trusted and respected interconnect materials. Decades of solder formulation innovation have earned LOCTITE solder materials numerous industry awards and have enabled the electronics market’s move to lead-free, halogen-free, high-reliability solder processes. Game-changing formulations like temperature-stable LOCTITE GC 10 and LOCTITE GC 3W solder pastes help reduce costs, improve yield and provide more stable and reliable assembly processes. The LOCTITE line of solder products includes advanced flux formulations, leaded, lead-free and halogen-free solder pastes, high-reliability alloys, solder bar, preforms, and cored and solid wire.