- Henkel Adhesive Electronics, a division of global materials innovator, Henkel Corporation, is focused on developing next-generation materials for a variety of applications in the industrial, consumer, handheld, wearables, display and emerging electronics market sectors.

Henkel’s leading electronics brands of LOCTITE, Multicore (now sold under the LOCTITE brand) and Bergquist have long been recognized as the product brands to trust for printed circuit board assembly applications. With a broad portfolio of materials including surface mount adhesives, advanced flux chemistries, encapsulants, high performance solder solutions, conductive adhesives, thermal management materials as well as CSP underfills and board protection materials, Henkel’s advanced formulations ensure maximum processability and reliable in-field performance.


Thermally Conductive Epoxy

Image of LOCTITE/STYCAST's Thermally Conductive Epoxy

LOCTITE STYCAST 2850FT is a two-part, thermally conductive epoxy potting material that provides electrical insulation, thermal-shock resistance, low CTE and is available with multiple catalysts. Learn More

LOCTITE / Multicore Solder Wires

Image of LOCTITE/Multicore's Solder Wire

The LOCTITE / Multicore cored solder wire portfolio features multiple flux core technology that ensures even and consistent distribution of flux throughout the solder wire, and is available in multiple alloys and diameters. Learn More

Thermal Gap Pads

Image of Henkel/Bergquist's Thermal Gap Pads

Henkel / Bergquist’s extensive GAP PAD family provides an effective thermal interface between heat sinks and electronic devices, improving an assembly’s thermal performance and reliability. Learn More

Newest Products View All (8)

Gap Pad® VO Ultra Soft Publish Date: 2013-10-07

Gap Pad® VO ultra soft for filling air gaps features thermal conductivity of 1.0 W/m-K and is designed for low-stress applications.

Sil-Pad® K-10 Publish Date: 2013-10-07

The Sil-Pad® K-10 Kapton-based insulator offers good cut-through properties and excellent thermal performance.

Gap Pad® 1500 Publish Date: 2013-10-07

Gap Pad® 1500 unreinforced gap-filling material features thermal conductivity of 1.5 W/m-K and conformable, low-hardness.

Q-Pad® 3 Publish Date: 2013-10-07

Q-Pad® 3 glass-reinforced grease replacement thermal interface can be installed prior to soldering and cleaning.

Sil-Pad® 900S Publish Date: 2013-10-07

The Sil-Pad® 900S insulation material features thermal impedance of 0.61°C-in2/W (@50 psi) for applications including power supplies.

GC 10 Solder Paste Publish Date: 2015-04-03

The first-ever temperature stable solder paste, Henkel LOCTITE’s GC 10 solder paste is stable at 26.5°C for one year and at temperatures of up to 40°C for one month.

Recent PTMs View All (12)

LED Thermal Management Publish Date: 2011-10-19

How the insulated metal substrate boards work along with an overview of the T-Clad PA-Bond-Ply 450 thermal interface material.

Duration: 5 minutes
Introduction to Solder Paste Publish Date: 2013-05-16

An introduction to soldering, the role solder paste plays in the process as well as how and where it would be used.

Duration: 10 minutes
Thermal Interface Materials (TIM) Publish Date: 2013-06-03

View Henkel's Thermal Interface Materials product portfolio. Available to meet all types of applications, including bonding and non-bonding solutions.

Duration: 10 minutes
Circuit Board Protection Introduction Publish Date: 2013-07-09

Discuss different needs and methods of circuit board protection as well as the process considerations and suggestions of best possible solutions for use.

Duration: 10 minutes

Featured Videos View All (3)

Loctite GC 10

Loctite GC 10 is not only a game changer in its performance capabilities, but it will redefine the way you ship, store and handle solder paste.

GC10 Solder Paste - LOCTITE │Another Geek Moment Product Preview

GC 10 solder paste from LOCTITE offers a temperature stable solder paste with improved solderability via improved stability, printing, and reflow.

Liquid Dispensed TIM

This animation demonstrates how to combine your Thermal Clad® IMS with Bergquist Liquid Dispensed TIM for an optimal thermal solution.

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