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Newest Products View All (8)
Gap Pad® VO ultra soft for filling air gaps features thermal conductivity of 1.0 W/m-K and is designed for low-stress applications.
Gap Pad® 1500 unreinforced gap-filling material features thermal conductivity of 1.5 W/m-K and conformable, low-hardness.
The Sil-Pad® 900S insulation material features thermal impedance of 0.61°C-in2/W (@50 psi) for applications including power supplies.
Recent PTMs View All (12)
How the insulated metal substrate boards work along with an overview of the T-Clad PA-Bond-Ply 450 thermal interface material.Duration: 5 minutes
View Henkel's Thermal Interface Materials product portfolio. Available to meet all types of applications, including bonding and non-bonding solutions.Duration: 10 minutes
Featured Videos View All (3)
GC 10 solder paste from LOCTITE offers a temperature stable solder paste with improved solderability via improved stability, printing, and reflow.