Henkel/LOCTITE

- Henkel Adhesive Electronics, a division of global materials innovator, Henkel Corporation, is focused on developing next-generation materials for a variety of applications in the industrial, consumer, handheld, wearables, display and emerging electronics market sectors.

Henkel’s leading electronics brands of LOCTITE, Multicore (now sold under the LOCTITE brand) and Bergquist have long been recognized as the product brands to trust for printed circuit board assembly applications. With a broad portfolio of materials including surface mount adhesives, advanced flux chemistries, encapsulants, high performance solder solutions, conductive adhesives, thermal management materials as well as CSP underfills and board protection materials, Henkel’s advanced formulations ensure maximum processability and reliable in-field performance.

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Thermally Conductive Epoxy

Image of LOCTITE/STYCAST's Thermally Conductive Epoxy

LOCTITE STYCAST 2850FT is a two-part, thermally conductive epoxy potting material that provides electrical insulation, thermal-shock resistance, low CTE and is available with multiple catalysts. Learn More

LOCTITE / Multicore Solder Wires

Image of LOCTITE/Multicore's Solder Wire

The LOCTITE / Multicore cored solder wire portfolio features multiple flux core technology that ensures even and consistent distribution of flux throughout the solder wire, and is available in multiple alloys and diameters. Learn More

Thermal Gap Pads

Image of Henkel/Bergquist's Thermal Gap Pads

Henkel / Bergquist’s extensive GAP PAD family provides an effective thermal interface between heat sinks and electronic devices, improving an assembly’s thermal performance and reliability. Learn More

Image of LOTITE's Solder Wire Banner

Newest Products View All (8)

Gap Pad HC 5.0

A soft and compliant gap filling material, Bergquist's Gap Pad HC 5.0 has a thermal conductivity of 5.0 W/m-K and delivers outstanding thermal performance with very low compression stress. Learn More

GC 3W Solder Paste

Henkel Loctitie introduces their GC 3W solder paste that provides exceptional results in aqueous cleaning systems without the addition of saponifiers or co-solvents. Learn More

GC 10 Solder Paste

The first-ever temperature stable solder paste, Henkel LOCTITE’s GC 10 solder paste is stable at 26.5°C for one year and at temperatures of up to 40°C for one month. Learn More

Sil-Pad® 900S

The Sil-Pad® 900S insulation material features thermal impedance of 0.61°C-in2/W (@50 psi) for applications including power supplies. Learn More

Q-Pad® 3

Q-Pad® 3 glass-reinforced grease replacement thermal interface can be installed prior to soldering and cleaning. Learn More

Gap Pad® 1500

Gap Pad® 1500 unreinforced gap-filling material features thermal conductivity of 1.5 W/m-K and conformable, low-hardness. Learn More

Recent PTMs View All (12)

Phase Change Thermal Interface Materials (PCTIM) Updated: 2017-06-14

A comparison of the features and benefits of thermal grease and phase change as well as an review of the applications they are used for.

Duration: 10 minutes
Water Washable Solder Paste Loctite GC 3W Publish Date: 2017-06-01

Introducing Henkel's innovative game changer water washable solder paste.

Duration: 5 minutes
Gap Pad EMI 1 Publish Date: 2015-11-16

Explore potential markets and applications for the Bergquist Gap Pad EMI 1.0 product.

Duration: 15 minutes
GC 10 Solder Paste Publish Date: 2015-04-22

The Loctite GC 10 Game Changer paste provides a new benchmark for the industry and addresses the performance and property advances vs. current paste technology.

Duration: 15 minutes

Featured Videos View All (3)

Liquid Dispensed TIM

This animation demonstrates how to combine your Thermal Clad® IMS with Bergquist Liquid Dispensed TIM for an optimal thermal solution.

GC10 Solder Paste - LOCTITE │Another Geek Moment Product Preview

GC 10 solder paste from LOCTITE offers a temperature stable solder paste with improved solderability via improved stability, printing, and reflow.

Loctite GC 10

Loctite GC 10 is not only a game changer in its performance capabilities, but it will redefine the way you ship, store and handle solder paste.

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