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Bergquist / Henkel

Image of Bergquist Liquid Gap Fillers

Liquid Gap Fillers

Henkel / Bergquist’s GAP FILLER materials are two-component, thermally conductive, form-in-place elastomers that provide virtually zero stress on components.

Image of Bergquist's Thermal Gap Pads

Thermal Gap Pads

Henkel / Bergquist’s extensive GAP PAD family provides an effective thermal interface between heat sinks and electronic devices, improving an assembly’s thermal performance and reliability.

Image of Bergquist's Thermal Sil-Pads

Thermal Sil-Pads

Henkel / Bergquist’s line of SIL-PAD materials offer excellent thermal performance, are more durable than mica, create less mess than grease and are highly cost efficient.

Featured Videos

Liquid Dispensed TIM
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Recent PTMs

15 minutes
Gap Pad EMI 1
Explore potential markets and applications for the Bergquist Gap Pad EMI 1.0 product.
5 minutes
Thermal Interface Material (TIM), Gap Pad® VO Ultra Soft
Gap Pad VO offers a thermally conductive, electrically isolating material with a wide array of secondary benefits.
15 minutes
Thermal Interface materials (TIM) Gap Pad Key Product Characteristics
Thermal interface materials (TIM) Gap Pad characteristics including thermal, electrical, and mechanical.
5 minutes
Thermal Interface Materials (TIM) Gap Pad
An electrically isolating material which provides protection between heat sinks and high voltage devices.
5 minutes
LED Thermal Management
How the insulated metal substrate boards work along with an overview of the T-Clad PA-Bond-Ply 450 thermal interface material.
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About Bergquist / Henkel

Henkel’s BERGQUIST® brand thermal management materials include a broad range of solutions for reliability-enhancing heat dissipation within modern electronic devices. The company’s BERGQUIST GAP PAD® gap filling thermal interface materials (TIMs) are soft, compliant, pre-cut pads that reduce assembly stress while providing excellent thermal conductivity. Liquid BERGQUIST Gap Filler TIMs, which can be automatically dispensed, are ideal for applications where complex dimensions are the norm and/or high throughput is required. The expansive thermal solutions portfolio also includes SIL PAD® thermally conductive insulators, BOND PLY® thermal adhesives, HI FLOW® phase change materials and TCLAD® Insulated Metal Substrates (IMS®).

Henkel’s acquisition of The Bergquist Company in 2014 effectively expanded Henkel’s leading position in electronic materials development to include state-of-the-art thermal control products. Now covering nearly all phases of semiconductor packaging, electronics assembly, thermal management and structural assembly, Henkel is unmatched in its ability to provide top electronics companies with comprehensive material solutions.