Search / Ordering
- Henkel’s BERGQUIST® brand thermal management materials include a broad range of solutions for reliability-enhancing heat dissipation within modern electronic devices. The company’s BERGQUIST GAP PAD® gap filling thermal interface materials (TIMs) are soft, compliant, pre-cut pads that reduce assembly stress while providing excellent thermal conductivity. Liquid BERGQUIST Gap Filler TIMs, which can be automatically dispensed, are ideal for applications where complex dimensions are the norm and/or high throughput is required. The expansive thermal solutions portfolio also includes SIL PAD® thermally conductive insulators, BOND PLY® thermal adhesives, HI FLOW® phase change materials and TCLAD® Insulated Metal Substrates (IMS®).
Henkel’s acquisition of The Bergquist Company in 2014 effectively expanded Henkel’s leading position in electronic materials development to include state-of-the-art thermal control products. Now covering nearly all phases of semiconductor packaging, electronics assembly, thermal management and structural assembly, Henkel is unmatched in its ability to provide top electronics companies with comprehensive material solutions.
Gap Pad HC 5.0
A soft and compliant gap filling material, Bergquist's Gap Pad HC 5.0 has a thermal conductivity of 5.0 W/m-K and delivers outstanding thermal performance with very low compression stress.
The Sil-Pad® 900S insulation material features thermal impedance of 0.61°C-in2/W (@50 psi) for applications including power supplies.
Q-Pad® 3 glass-reinforced grease replacement thermal interface can be installed prior to soldering and cleaning.
Gap Pad® 1500
Gap Pad® 1500 unreinforced gap-filling material features thermal conductivity of 1.5 W/m-K and conformable, low-hardness.
The Sil-Pad® K-10 Kapton-based insulator offers good cut-through properties and excellent thermal performance.
Gap Pad® VO Ultra Soft
Gap Pad® VO ultra soft for filling air gaps features thermal conductivity of 1.0 W/m-K and is designed for low-stress applications.
Gap Pad EMI 1
Duration: 15 minutes
Explore potential markets and applications for the Bergquist Gap Pad EMI 1.0 product.
Thermal Interface Material (TIM), Gap Pad® VO Ultra Soft
Duration: 5 minutes
Gap Pad VO offers a thermally conductive, electrically isolating material with a wide array of secondary benefits.
Thermal Interface materials (TIM) Gap Pad Key Product Characteristics
Thermal interface materials (TIM) Gap Pad characteristics including thermal, electrical, and mechanical.
Thermal Interface Materials (TIM) Gap Pad
An electrically isolating material which provides protection between heat sinks and high voltage devices.
Liquid Dispensed TIM
This animation demonstrates how to combine your Thermal Clad® IMS with Bergquist Liquid Dispensed TIM for an optimal thermal solution.
Publish Date: 2015-06-19
Keep an eye on your inbox for news and updates from Digi-Key!
Please enter an email address
Terms & Conditions
Blog - TheCircuit
Toll Free: 1-800-344-4539Phone: 218-681-6674Fax: 218-681-3380
Copyright © 1995-2019, Digi-Key Electronics.All Rights Reserved.701 Brooks Avenue South,Thief River Falls, MN 56701 USA