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Bergquist

- Henkel’s BERGQUIST® brand thermal management materials include a broad range of solutions for reliability-enhancing heat dissipation within modern electronic devices. The company’s BERGQUIST GAP PAD® gap filling thermal interface materials (TIMs) are soft, compliant, pre-cut pads that reduce assembly stress while providing excellent thermal conductivity. Liquid BERGQUIST Gap Filler TIMs, which can be automatically dispensed, are ideal for applications where complex dimensions are the norm and/or high throughput is required. The expansive thermal solutions portfolio also includes SIL PAD® thermally conductive insulators, BOND PLY® thermal adhesives, HI FLOW® phase change materials and TCLAD® Insulated Metal Substrates (IMS®).

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Newest Products View All (6)

Image of Henkel Bergquist's Gap Pad HC 5.0

Gap Pad HC 5.0

A soft and compliant gap filling material, Bergquist's Gap Pad HC 5.0 has a thermal conductivity of 5.0 W/m-K and delivers outstanding thermal performance with very low compression stress.

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Image of Bergquist's Sil-Pad® 900S

Sil-Pad® 900S

The Sil-Pad® 900S insulation material features thermal impedance of 0.61°C-in2/W (@50 psi) for applications including power supplies.

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Image of Bergquist's Q-Pad® 3

Q-Pad® 3

Q-Pad® 3 glass-reinforced grease replacement thermal interface can be installed prior to soldering and cleaning.

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Image of Bergquist's Gap Pad® 1500

Gap Pad® 1500

Gap Pad® 1500 unreinforced gap-filling material features thermal conductivity of 1.5 W/m-K and conformable, low-hardness.

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Image of Bergquist's Sil-Pad® K-10

Sil-Pad® K-10

The Sil-Pad® K-10 Kapton-based insulator offers good cut-through properties and excellent thermal performance.

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Image of Bergquist's Gap Pad® VO Ultra Soft

Gap Pad® VO Ultra Soft

Gap Pad® VO ultra soft for filling air gaps features thermal conductivity of 1.0 W/m-K and is designed for low-stress applications.

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Product Training Modules View All (5)

Gap Pad EMI 1.0

Gap Pad EMI 1

Duration: 15 minutes

Explore potential markets and applications for the Bergquist Gap Pad EMI 1.0 product.

Thermal Interface Material Gap Pad

Thermal Interface Material (TIM), Gap Pad® VO Ultra Soft

Duration: 5 minutes

Gap Pad VO offers a thermally conductive, electrically isolating material with a wide array of secondary benefits.

Thermal Interface Materials Gap Pad Characteristics

Thermal Interface materials (TIM) Gap Pad Key Product Characteristics

Duration: 15 minutes

Thermal interface materials (TIM) Gap Pad characteristics including thermal, electrical, and mechanical.

Thermal Interface Materials

Thermal Interface Materials (TIM) Gap Pad

Duration: 5 minutes

An electrically isolating material which provides protection between heat sinks and high voltage devices.

Featured Videos View All (1)

Liquid Dispensed TIM

This animation demonstrates how to combine your Thermal Clad® IMS with Bergquist Liquid Dispensed TIM for an optimal thermal solution.

Publish Date: 2015-06-19

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