Same Sky (Formerly CUI Devices) Heat Sinks

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Mfr Part #	Quantity Available	Price	Tariff Status	Series	Package	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
HSS-B20-NP-06 HEATSINK TO-220 2.9W ALUMINUM Same Sky (Formerly CUI Devices)	1,619 In Stock	1 : $0.39000 Bag	-	HSS	Bag	Active	Board Level	TO-220	Bolt On	Square, Fins	0.748" (19.00mm)	0.748" (19.00mm)	-	0.375" (9.52mm)	2.9W @ 75°C	7.51°C/W @ 200 LFM	26.32°C/W	Aluminum	Black Anodized
HSS-B20-0953H-02 HEATSINK TO-220 2.9W ALUMINUM Same Sky (Formerly CUI Devices)	1,448 In Stock	1 : $0.49000 Bag	-	HSS	Bag	Active	Board Level, Vertical	TO-220	PC Pin	Rectangular, Fins	0.500" (12.70mm)	0.504" (12.80mm)	-	0.748" (19.00mm)	2.9W @ 75°C	7.24°C/W @ 200 LFM	25.92°C/W	Aluminum	Black Anodized
HSS-B20-0635H-01 HEATSINK TO-220 2.7W ALUMINUM Same Sky (Formerly CUI Devices)	9,193 In Stock	1 : $0.52000 Bag	-	HSS	Bag	Active	Board Level, Vertical	TO-220	PC Pin	Rectangular, Fins	0.520" (13.20mm)	0.375" (9.53mm)	-	0.748" (19.00mm)	2.7W @ 75°C	9.51°C/W @ 200 LFM	27.78°C/W	Aluminum	Black Anodized
HSS-B20-0635H-02 HEATSINK TO-220 2.6W ALUMINUM Same Sky (Formerly CUI Devices)	4,188 In Stock	1 : $0.54000 Bag	-	HSS	Bag	Active	Board Level, Vertical	TO-220	PC Pin	Rectangular, Fins	0.520" (13.20mm)	0.500" (12.70mm)	-	0.748" (19.00mm)	2.6W @ 75°C	10.49°C/W @ 200 LFM	29.09°C/W	Aluminum	Black Anodized
HSE-B2111-038 HEAT SINK, EXTRUSION, TO-220, 25 Same Sky (Formerly CUI Devices)	5,488 In Stock	1 : $0.60000 Box	-	HSE	Box	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	0.984" (25.00mm)	0.625" (16.00mm)	-	0.354" (9.00mm)	3.8W @ 75°C	6.12°C/W @ 200 LFM	19.74°C/W	Aluminum Alloy	Black Anodized
HSS-B20-NP-04 HEATSINK TO-220 6.5W ALUMINUM Same Sky (Formerly CUI Devices)	4,743 In Stock	1 : $0.67000 Box	-	HSS	Box	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	1.450" (36.83mm)	1.750" (44.45mm)	-	0.370" (9.40mm)	6.5W @ 75°C	3.76°C/W @ 200 LFM	11.54°C/W	Aluminum	Black Anodized
HSS-B20-NPR-02 HEATSINK TO-220 5.1W ALUMINUM Same Sky (Formerly CUI Devices)	1,235 In Stock	1 : $0.69000 Bag	-	HSS	Bag	Active	Board Level, Vertical	TO-220	Bolt On and Board Mounts	Rectangular, Fins	0.500" (12.70mm)	1.000" (25.40mm)	-	1.180" (29.97mm)	5.1W @ 75°C	4.20°C/W @ 200 LFM	14.71°C/W	Aluminum	Black Anodized
HSS-B20-NP-12 HEATSINK TO-220 6.8W ALUMINUM Same Sky (Formerly CUI Devices)	1,525 In Stock	1 : $0.71000 Bag	-	HSS	Bag	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	1.450" (36.83mm)	0.700" (17.80mm)	-	0.850" (21.60mm)	6.8W @ 75°C	3.47°C/W @ 200 LFM	14.33°C/W	Aluminum	Black Anodized
HSB04-171706 HEAT SINK, BGA, 17 X 17 X 6 MM Same Sky (Formerly CUI Devices)	1,692 In Stock	1 : $0.84000 Box	-	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.669" (17.00mm)	0.669" (17.00mm)	-	0.236" (6.00mm)	2.5W @ 75°C	13.10°C/W @ 200 LFM	29.73°C/W	Aluminum Alloy	Black Anodized
HSB31-212105 HEAT SINK, BGA, 21 X 21 X 5 MM Same Sky (Formerly CUI Devices)	1,553 In Stock	1 : $0.88000 Box	-	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.197" (5.00mm)	3.0W @ 75°C	9.90°C/W @ 200 LFM	25.33°C/W	Aluminum Alloy	Black Anodized
HSB08-212106 HEAT SINK, BGA, 21 X 21 X 6 MM Same Sky (Formerly CUI Devices)	2,275 In Stock	1 : $0.91000 Box	-	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.236" (6.00mm)	3.0W @ 75°C	9.70°C/W @ 200 LFM	25.40°C/W	Aluminum Alloy	Black Anodized
HSE-B20350-NP HEAT SINK, EXTRUSION, TO-220, 35 Same Sky (Formerly CUI Devices)	782 In Stock	1 : $1.02000 Tray	-	HSE	Tray	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	1.378" (35.00mm)	1.142" (29.00mm)	-	0.472" (12.00mm)	6.2W @ 75°C	2.91°C/W @ 200 LFM	12.10°C/W	Aluminum Alloy	Black Anodized
HSE-B20380-040H HEAT SINK, EXTRUSION, TO-220, 38 Same Sky (Formerly CUI Devices)	593 In Stock	1 : $1.04000 Tray	-	HSE	Tray	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Angled Fins	1.496" (38.00mm)	1.378" (35.00mm)	-	0.492" (12.50mm)	7.4W @ 75°C	3.94°C/W @ 200 LFM	10.14°C/W	Aluminum Alloy	Black Anodized
HSB18-232310 HEAT SINK, BGA, 23 X 23 X 10 MM Same Sky (Formerly CUI Devices)	3,397 In Stock	1 : $1.06000 Box	-	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.906" (23.00mm)	0.906" (23.00mm)	-	0.394" (10.00mm)	3.7W @ 75°C	6.80°C/W @ 200 LFM	20.41°C/W	Aluminum Alloy	Black Anodized
HSB06-181810 HEAT SINK, BGA, 18 X 18 X 10 MM Same Sky (Formerly CUI Devices)	745 In Stock	1 : $1.08000 Box	-	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.709" (18.00mm)	0.709" (18.00mm)	-	0.394" (10.00mm)	3.2W @ 75°C	18.80°C/W @ 200 LFM	23.68°C/W	Aluminum Alloy	Black Anodized
HSE-B20254-035H-01 HEAT SINK, EXTRUSION, TO-220, 25 Same Sky (Formerly CUI Devices)	3,411 In Stock	1 : $1.12000 Box	-	HSE	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Angled Fins	1.000" (25.40mm)	1.378" (35.00mm)	-	0.500" (12.70mm)	5.2W @ 75°C	4.42°C/W @ 200 LFM	14.42°C/W	Aluminum Alloy	Black Anodized
HSE-B20381-035H HEAT SINK, EXTRUSION, TO-220, 38 Same Sky (Formerly CUI Devices)	519 In Stock	1 : $1.18000 Box	-	HSE	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Angled Fins	1.500" (38.10mm)	1.375" (34.93mm)	-	0.500" (12.70mm)	6.5W @ 75°C	3.66°C/W @ 200 LFM	11.54°C/W	Aluminum Alloy	Black Anodized
HSE-B20254-040H HEAT SINK, EXTRUSION, TO-220, 25 Same Sky (Formerly CUI Devices)	1,381 In Stock	1 : $1.19000 Bag	-	HSE	Bag	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.000" (25.40mm)	1.260" (32.00mm)	-	0.551" (14.00mm)	5.7W @ 75°C	7.74°C/W @ 200 LFM	13.16°C/W	Aluminum Alloy	Black Anodized
HSE-B250-04H HEAT SINK, EXTRUSION, TO-220, 25 Same Sky (Formerly CUI Devices)	776 In Stock	1 : $1.24000 Box	-	HSE	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	0.984" (25.00mm)	1.378" (35.00mm)	-	1.000" (25.40mm)	8.0W @ 75°C	3.26°C/W @ 200 LFM	13.60°C/W	Aluminum Alloy	Black Anodized
HSE-B20250-045H HEAT SINK, EXTRUSION, TO-220, 50 Same Sky (Formerly CUI Devices)	696 In Stock	1 : $1.26000 Box	-	HSE	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.969" (50.00mm)	1.181" (30.00mm)	-	0.472" (12.00mm)	7.7W @ 75°C	4.05°C/W @ 200 LFM	9.74°C/W	Aluminum Alloy	Black Anodized
HSB11-252518 HEAT SINK, BGA, 25 X 25 X 18 MM Same Sky (Formerly CUI Devices)	1,927 In Stock	1 : $1.35000 Box	-	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.709" (18.00mm)	5.5W @ 75°C	4.50°C/W @ 200 LFM	13.70°C/W	Aluminum Alloy	Black Anodized
HSS07-C20-P274 HEAT SINK, STAMPING, TO-220, 21. Same Sky (Formerly CUI Devices)	9,299 In Stock	1 : $1.41000 Box	-	HSS	Box	Active	Board Level, Vertical	TO-220	PC Pin	Rectangular	0.853" (21.66mm)	0.520" (13.21mm)	-	0.515" (13.08mm)	2.5W @ 75°C	12.60°C/W @ 200 LFM	29.57°C/W	Copper Alloy	Tin
HSB25-282810 HEAT SINK, BGA, 28.5 X 28.5 X 10 Same Sky (Formerly CUI Devices)	1,151 In Stock	1 : $1.48000 Box	Tariff may apply if shipping to the United States	HSB	Box	Active	Top Mount	BGA	Push Pin	Square, Pin Fins	1.122" (28.50mm)	1.122" (28.50mm)	-	0.394" (10.00mm)	4.87W @ 75°C	5.10°C/W @ 200 LFM	15.41°C/W	Aluminum Alloy	Black Anodized
HSB23-232325 HEAT SINK, BGA, 23 X 23 X 25 MM Same Sky (Formerly CUI Devices)	345 In Stock	1 : $1.56000 Box	-	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.906" (23.00mm)	0.906" (23.00mm)	-	0.984" (25.00mm)	6.13W @ 75°C	3.80°C/W @ 200 LFM	12.23°C/W	Aluminum Alloy	Black Anodized
HSE02-173213 HEAT SINK, EXTRUSION, 17 X 31.9 Same Sky (Formerly CUI Devices)	2,753 In Stock	1 : $1.60000 Box	-	HSE	Box	Active	Top Mount	-	Thermal Tape, Adhesive (Not Included)	Square, Angled Fins	0.669" (17.00mm)	0.669" (17.00mm)	-	0.492" (12.50mm)	3.5W @ 75°C	6.70°C/W @ 200 LFM	21.44°C/W	Aluminum Alloy	Blue Anodized

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Heat Sinks

Heat sinks are thermal management components designed to dissipate heat from high-power electronic devices and prevent overheating. Their core function is based on the principles of conduction, and convection, transferring heat from a heat source—such as a CPU, power transistor, or BGA package—to the surrounding air or a coolant. By increasing the surface area in contact with cooling media, heat sinks help maintain safe temperature levels and protect component reliability and performance.

Most heat sinks are made of aluminum or copper, materials known for their high thermal conductivity. Aluminum heat sinks are lightweight and cost-effective, ideal for general-purpose cooling solutions, while copper heat sinks offer better conductivity for high-performance or space-constrained applications. Finned and extrusion-style heat sinks use strategically shaped surfaces to maximize exposure to air, enhancing natural or forced convection. Cross-cut designs further improve airflow and thermal dispersion. In advanced applications, heat pipes, liquid cooling, or graphite spreaders may be used to rapidly move heat away from the source. For compact or passive systems, passive heat exchangers rely entirely on natural airflow without the use of fans.

Proper thermal contact between the heat sink and device is critical—thermal interface materials (TIMs) such as thermal paste, pads, or solder are used to fill microscopic gaps and reduce thermal resistance. When selecting a heat sink, consider the thermal output of the component, available space, airflow conditions, and the thermal resistance of the system.

Heat Sinks

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