CUI Devices Heat Sinks

Results: 188
Series
-HSBHSEHSS
Packaging
BagBoxBulkCut Tape (CT)Digi-Reel®Tape & Reel (TR)Tray
Product Status
ActiveObsolete
Type
Board LevelBoard Level, VerticalTop Mount
Package Cooled
-BGAHalf Brick DC/DC ConverterTO-218TO-218, TO-220TO-220TO-252 (DPak)TO-263 (D²Pak)
Attachment Method
-AdhesiveAdhesive (Not Included)Bolt OnBolt On and Board MountsBolt On and PC PinClipClip and Board MountsClip and PC PinPC PinPush PinThermal Tape, Adhesive (Included)Thermal Tape, Adhesive (Not Included)
Shape
RectangularRectangular, Angled FinsRectangular, FinsSquareSquare, Angled FinsSquare, FinsSquare, Pin Fins
Length
0.211" (5.35mm)0.279" (7.10mm)0.303" (7.70mm)0.315" (8.00mm)0.335" (8.50mm)0.375" (9.53mm)0.394" (10.00mm)0.441" (11.20mm)0.472" (12.00mm)0.500" (12.70mm)0.512" (13.00mm)0.520" (13.20mm)
Width
0.250" (6.35mm)0.335" (8.50mm)0.375" (9.53mm)0.394" (10.00mm)0.472" (12.00mm)0.500" (12.70mm)0.504" (12.80mm)0.512" (13.00mm)0.520" (13.21mm)0.551" (14.00mm)0.625" (16.00mm)0.650" (16.50mm)
Fin Height
0.157" (4.00mm)0.177" (4.50mm)0.197" (5.00mm)0.211" (5.35mm)0.236" (6.00mm)0.256" (6.50mm)0.275" (7.00mm)0.295" (7.50mm)0.303" (7.70mm)0.315" (8.00mm)0.335" (8.50mm)0.354" (9.00mm)
Power Dissipation @ Temperature Rise
1.9W @ 75°C1.93W @ 75°C1.94W @ 75°C1.95W @ 75°C2.0W @ 75°C2.1W @ 75°C2.3W @ 75°C2.4W @ 75°C2.47W @ 75°C2.5W @ 75°C2.6W @ 75°C2.7W @ 75°C
Thermal Resistance @ Forced Air Flow
1.20°C/W @ 200 LFM1.40°C/W @ 200 LFM2.01°C/W @ 200 LFM2.10°C/W @ 200 LFM2.24°C/W @ 200 LFM2.29°C/W @ 200 LFM2.31°C/W @ 200 LFM2.38°C/W @ 200 LFM2.45°C/W @ 200 LFM2.50°C/W @ 200 LFM2.57°C/W @ 200 LFM2.60°C/W @ 200 LFM
Thermal Resistance @ Natural
3.45°C/W4.49°C/W4.70°C/W4.74°C/W4.85°C/W4.97°C/W5.47°C/W5.66°C/W5.77°C/W5.86°C/W6.25°C/W6.41°C/W
Material
AluminumAluminum AlloyCopperCopper Alloy
Material Finish
Black AnodizedBlue AnodizedClean FinishedTin
Stocking Options
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Media
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
HSB05-171711
HSB05-171711
HEAT SINK, BGA, 17 X 17 X 11.5 M
CUI Devices
1,254
In Stock
1 : $1.08000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
0.669" (17.00mm)
0.669" (17.00mm)
-
0.453" (11.50mm)
3.1W @ 75°C
8.40°C/W @ 200 LFM
23.91°C/W
Aluminum Alloy
Black Anodized
HSS-B20-NP-06
HSS-B20-NP-06
HEATSINK TO-220 2.9W ALUMINUM
CUI Devices
1,067
In Stock
1 : $0.36000
Bag
Bag
Active
Board Level
TO-220
Bolt On
Square, Fins
0.748" (19.00mm)
0.748" (19.00mm)
-
0.375" (9.52mm)
2.9W @ 75°C
7.51°C/W @ 200 LFM
26.32°C/W
Aluminum
Black Anodized
HSS-B20-NP-04
HSS-B20-NP-04
HEATSINK TO-220 6.5W ALUMINUM
CUI Devices
5,583
In Stock
1 : $0.45000
Box
Box
Active
Board Level
TO-220
Bolt On
Rectangular, Fins
1.450" (36.83mm)
1.750" (44.45mm)
-
0.370" (9.40mm)
6.5W @ 75°C
3.76°C/W @ 200 LFM
11.54°C/W
Aluminum
Black Anodized
HSS-B20-NPR-02
HSS-B20-NPR-02
HEATSINK TO-220 5.1W ALUMINUM
CUI Devices
3,028
In Stock
1 : $0.46000
Bag
Bag
Active
Board Level, Vertical
TO-220
Bolt On and Board Mounts
Rectangular, Fins
0.500" (12.70mm)
1.000" (25.40mm)
-
1.180" (29.97mm)
5.1W @ 75°C
4.20°C/W @ 200 LFM
14.71°C/W
Aluminum
Black Anodized
HSS23-B20-NP
HSS23-B20-NP
HEAT SINK, STAMPING, TO-218/TO-2
CUI Devices
2,518
In Stock
1 : $0.55000
Box
Box
Active
Top Mount
TO-218, TO-220
Bolt On
Rectangular, Fins
1.654" (42.00mm)
1.496" (38.00mm)
-
0.787" (20.00mm)
7.36W @ 75°C
5.00°C/W @ 200 LFM
10.19°C/W
Aluminum Alloy
Black Anodized
HSE-B2111-038
HSE-B2111-038
HEAT SINK, EXTRUSION, TO-220, 25
CUI Devices
14,288
In Stock
1 : $0.57000
Box
Box
Active
Board Level
TO-220
Bolt On
Rectangular, Fins
0.984" (25.00mm)
0.625" (16.00mm)
-
0.354" (9.00mm)
3.8W @ 75°C
6.12°C/W @ 200 LFM
19.74°C/W
Aluminum Alloy
Black Anodized
HSB02-101007
HSB02-101007
HEAT SINK, BGA, 10 X 10 X 7 MM
CUI Devices
5,743
In Stock
1 : $0.67000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.394" (10.00mm)
0.394" (10.00mm)
-
0.275" (7.00mm)
2.0W @ 75°C
16.50°C/W @ 200 LFM
37.90°C/W
Aluminum Alloy
Black Anodized
HSS-B20-NP-12
HSS-B20-NP-12
HEATSINK TO-220 6.8W ALUMINUM
CUI Devices
1,928
In Stock
1 : $0.68000
Bag
Bag
Active
Board Level
TO-220
Bolt On
Rectangular, Fins
1.450" (36.83mm)
0.700" (17.80mm)
-
0.850" (21.60mm)
6.8W @ 75°C
3.47°C/W @ 200 LFM
14.33°C/W
Aluminum
Black Anodized
HSB18-232310
HSB18-232310
HEAT SINK, BGA, 23 X 23 X 10 MM
CUI Devices
4,575
In Stock
1 : $0.73000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
0.906" (23.00mm)
0.906" (23.00mm)
-
0.394" (10.00mm)
3.7W @ 75°C
6.80°C/W @ 200 LFM
20.41°C/W
Aluminum Alloy
Black Anodized
HSB01-080808
HSB01-080808
HEAT SINK, BGA, 8.5 X 8.5 X 8 MM
CUI Devices
4,436
In Stock
1 : $0.73000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.335" (8.50mm)
0.335" (8.50mm)
-
0.315" (8.00mm)
1.9W @ 75°C
16.00°C/W @ 200 LFM
39.10°C/W
Aluminum Alloy
Black Anodized
HSB04-171706
HSB04-171706
HEAT SINK, BGA, 17 X 17 X 6 MM
CUI Devices
1,839
In Stock
1 : $0.81000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
0.669" (17.00mm)
0.669" (17.00mm)
-
0.236" (6.00mm)
2.5W @ 75°C
13.10°C/W @ 200 LFM
29.73°C/W
Aluminum Alloy
Black Anodized
HSB07-202009
HSB07-202009
HEAT SINK, BGA, 20 X 20 X 9 MM
CUI Devices
1,768
In Stock
1 : $0.84000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
0.787" (20.00mm)
0.787" (20.00mm)
-
0.354" (9.00mm)
3.1W @ 75°C
8.60°C/W @ 200 LFM
24.08°C/W
Aluminum Alloy
Black Anodized
HSS-B20-061H
HSS-B20-061H
HEATSINK TO-220 4W ALUMINUM
CUI Devices
1,986
In Stock
1 : $0.85000
Box
Box
Active
Board Level
TO-220
PC Pin
Rectangular, Fins
1.500" (38.10mm)
0.504" (12.80mm)
-
0.500" (12.70mm)
4.0W @ 75°C
5.01°C/W @ 200 LFM
18.63°C/W
Aluminum
Black Anodized
HSE04-251265-1
HSE04-251265-2
HEAT SINK, EXTRUSION, TO-218/TO-
CUI Devices
1,562
In Stock
1 : $0.87000
Bag
Bag
Active
Top Mount
TO-218, TO-220
Bolt On
Rectangular, Fins
0.984" (25.00mm)
0.472" (12.00mm)
-
0.256" (6.50mm)
2.47W @ 75°C
16.60°C/W @ 200 LFM
30.38°C/W
Aluminum Alloy
Black Anodized
HSB12-272706
HSB12-272706
HEAT SINK, BGA, 27 X 27 X 6 MM
CUI Devices
1,255
In Stock
1 : $0.89000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
1.063" (27.00mm)
1.063" (27.00mm)
-
0.236" (6.00mm)
3.8W @ 75°C
7.80°C/W @ 200 LFM
19.59°C/W
Aluminum Alloy
Black Anodized
HSB09-212115
HSB09-212115
HEAT SINK, BGA, 21 X 21 X 15 MM
CUI Devices
1,936
In Stock
1 : $0.93000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
0.827" (21.00mm)
0.827" (21.00mm)
-
0.591" (15.00mm)
4.3W @ 75°C
6.00°C/W @ 200 LFM
17.39°C/W
Aluminum Alloy
Black Anodized
HSE-BX-02
HSE-B20254-035H
HEAT SINK, EXTRUSION, TO-220,25.
CUI Devices
1,351
In Stock
1 : $0.95000
Box
Box
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Angled Fins
1.000" (25.40mm)
1.375" (34.93mm)
-
0.500" (12.70mm)
5.8W @ 75°C
3.28°C/W @ 200 LFM
12.93°C/W
Aluminum Alloy
Black Anodized
HSE-B254-04H
HSE-B254-04H
HEAT SINK, EXTRUSION, TO-220/TO-
CUI Devices
1,048
In Stock
1 : $1.01000
Box
Box
Active
Board Level, Vertical
TO-218, TO-220
Bolt On and PC Pin
Rectangular, Fins
1.000" (25.40mm)
0.650" (16.50mm)
-
0.630" (16.00mm)
4.7W @ 75°C
4.93°C/W @ 200 LFM
15.96°C/W
Aluminum Alloy
Black Anodized
HSB06-181810
HSB06-181810
HEAT SINK, BGA, 18 X 18 X 10 MM
CUI Devices
1,875
In Stock
1 : $1.02000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
0.709" (18.00mm)
0.709" (18.00mm)
-
0.394" (10.00mm)
3.2W @ 75°C
18.80°C/W @ 200 LFM
23.68°C/W
Aluminum Alloy
Black Anodized
HSE-BX-035H-0x
HSE-B20254-035H-01
HEAT SINK, EXTRUSION, TO-220, 25
CUI Devices
361
In Stock
1 : $1.05000
Box
Box
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Angled Fins
1.000" (25.40mm)
1.378" (35.00mm)
-
0.500" (12.70mm)
5.2W @ 75°C
4.42°C/W @ 200 LFM
14.42°C/W
Aluminum Alloy
Black Anodized
HSB15-404010
HSB15-404010
HEAT SINK, BGA, 40 X 40 X 10 MM
CUI Devices
828
In Stock
1 : $1.11000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
1.575" (40.00mm)
1.575" (40.00mm)
-
0.394" (10.00mm)
6.3W @ 75°C
3.90°C/W @ 200 LFM
11.84°C/W
Aluminum Alloy
Black Anodized
HSE-BX-040H
HSE-B20254-040H
HEAT SINK, EXTRUSION, TO-220, 25
CUI Devices
3,577
In Stock
1 : $1.12000
Bag
Bag
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
1.000" (25.40mm)
1.260" (32.00mm)
-
0.551" (14.00mm)
5.7W @ 75°C
7.74°C/W @ 200 LFM
13.16°C/W
Aluminum Alloy
Black Anodized
HSS01-B20-CP
HSS01-B20-CP
HEAT SINK, STAMPING, TO-220, 49.
CUI Devices
1,067
In Stock
1 : $1.13000
Box
Box
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular
1.941" (49.31mm)
1.900" (48.26mm)
-
0.950" (24.13mm)
9.9W @ 75°C
3.70°C/W @ 200 LFM
7.59°C/W
Aluminum Alloy
Black Anodized
HSB26-343408
HSB26-343408
HEAT SINK, BGA, 33.5 X 33.5 X 8
CUI Devices
750
In Stock
1 : $1.14000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
1.319" (33.50mm)
1.319" (33.50mm)
-
0.315" (8.00mm)
4.94W @ 75°C
5.30°C/W @ 200 LFM
15.19°C/W
Aluminum Alloy
Black Anodized
HSB14-353518
HSB14-353518
HEAT SINK, BGA, 35 X 35 X 18 MM
CUI Devices
806
In Stock
1 : $1.16000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
1.378" (35.00mm)
1.378" (35.00mm)
-
0.709" (18.00mm)
8.4W @ 75°C
3.60°C/W @ 200 LFM
8.97°C/W
Aluminum Alloy
Black Anodized
Showing
of 188

CUI Devices Heat Sinks


Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.