Heat Sinks

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish

303N HEATSINK COMPACT Wakefield-Vette	0 In Stock Check Lead Time	1 : $35.08000 Bulk	303	Bulk	Active	Board Level, Vertical	Stud Mounted Semiconductor Cases	Press Fit	Rectangular, Fins	2.000" (50.80mm)	3.000" (76.20mm)	-	2.000" (50.80mm)	15.0W @ 37°C	1.30°C/W @ 250 LFM	-	Aluminum Alloy	Black Anodized
303M HEATSINK COMPACT Wakefield-Vette	0 In Stock	Active	303	Bulk	Active	Board Level, Vertical	Stud Mounted Semiconductor Cases	Press Fit	Rectangular, Fins	2.000" (50.80mm)	3.000" (76.20mm)	-	2.000" (50.80mm)	15.0W @ 37°C	1.30°C/W @ 250 LFM	-	Aluminum Alloy	Black Anodized
303MM HEATSINK COMPACT Wakefield-Vette	0 In Stock	Active	303	Bulk	Active	Board Level, Vertical	Stud Mounted Semiconductor Cases	Press Fit	Rectangular, Fins	2.000" (50.80mm)	3.000" (76.20mm)	-	2.000" (50.80mm)	15.0W @ 37°C	1.30°C/W @ 250 LFM	-	Aluminum Alloy	Black Anodized

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Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.