Heat Sinks

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Mfr Part #	Quantity Available	Price	Tariff Status	Series	Package	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
OMNI-UNI-18-25 HEATSINK 18X25MM TO-247 TO-264 Wakefield-Vette	2,416 In Stock	1 : $4.59000 Tray	Tariff may apply if shipping to the United States	OmniKlip™	Tray	Active	Board Level, Vertical	TO-247, TO-264	Clip, Solder Foot	Rectangular, Fins	0.984" (25.00mm)	0.710" (18.03mm)	-	1.500" (38.10mm)	-	-	-	Aluminum	Black Anodized
OMNI-UNI-18-50 HEATSINK 18X50MM TO-247 TO-264 Wakefield-Vette	1,554 In Stock	1 : $7.13000 Tray	Tariff may apply if shipping to the United States	OmniKlip™	Tray	Active	Board Level, Vertical	TO-247, TO-264	Clip, Solder Foot	Rectangular, Fins	1.969" (50.00mm)	0.710" (18.03mm)	-	1.500" (38.10mm)	-	-	-	Aluminum	Black Anodized
OMNI-UNI-32-58 UNIVERSAL TO HEATSINK 32X58MM Wakefield-Vette	103 In Stock	1 : $10.49000 Tray	Tariff may apply if shipping to the United States	OmniKlip™	Tray	Active	Board Level, Vertical	TO-247, TO-264	Clip, Solder Foot	Rectangular, Fins	2.280" (57.90mm)	1.250" (31.75mm)	-	1.823" (46.30mm)	-	-	-	Aluminum	Black Anodized
OMNI-UNI-41-75 UNIVERSAL TO HEATSINK 41X75MM Wakefield-Vette	499 In Stock	1 : $16.88000 Tray	Tariff may apply if shipping to the United States	OmniKlip™	Tray	Active	Board Level, Vertical	TO-247, TO-264	Clip (Not Included), Solder Foot	Rectangular, Fins	2.953" (75.00mm)	1.614" (41.00mm)	-	2.480" (62.99mm)	-	-	-	Aluminum	Black Anodized
OMNI-UNI-18-75 HEATSINK 18X75MM TO-247 TO-264 Wakefield-Vette	0 In Stock Check Lead Time	1,000 : $6.53764 Tray	Tariff may apply if shipping to the United States	OmniKlip™	Tray	Active	Board Level, Vertical	TO-247, TO-264	Clip, Solder Foot	Rectangular, Fins	2.953" (75.00mm)	0.710" (18.03mm)	-	1.500" (38.10mm)	-	-	-	Aluminum	Black Anodized

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Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.