Heat Sinks

Results: 3
Manufacturer
Cooling SourceCTS Thermal Management ProductsDFRobot
Series
CS266FEXLattePanda
Packaging
BulkTray
Type
Board Level with FanTop MountTop Mount with Fan
Package Cooled
-Assorted (BGA, LGA, CPU, ASIC...)BGA, CPU, PGA
Attachment Method
Clip, TapePush PinThermal Tape, Adhesive (Included)
Shape
RectangularSquare, Fins
Length
0.520" (13.20mm)1.575" (40.00mm)1.988" (50.50mm)
Width
0.480" (12.19mm)1.575" (40.00mm)1.988" (50.50mm)
Fin Height
0.189" (4.80mm)0.827" (21.00mm)0.835" (21.20mm)
Thermal Resistance @ Natural
1.79°C/W-
Material
-Copper
Stocking Options
Environmental Options
Media
Marketplace Product
3Results
Showing
of 3
Compare
Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
386
In Stock
1 : $26.58000
Tray
Tray
Active
Board Level with Fan
-
Clip, Tape
Square, Fins
1.575" (40.00mm)
1.575" (40.00mm)
-
0.835" (21.20mm)
-
-
1.79°C/W
-
-
FIT0506
FIT0506
PURE COPPER HEATSINK PACK OF 5 (
DFRobot
46
In Stock
1 : $4.50000
Bulk
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Rectangular
0.520" (13.20mm)
0.480" (12.19mm)
-
0.189" (4.80mm)
-
-
-
Copper
-
CS266-60-0-1A
CS266-60-0-1A
IU server/ Pentium M, PGA 478/BG
Cooling Source
0
Marketplace
Active
Bulk
Active
Top Mount with Fan
BGA, CPU, PGA
Push Pin
Square, Fins
1.988" (50.50mm)
1.988" (50.50mm)
-
0.827" (21.00mm)
-
-
-
Copper
-
Showing
of 3

Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.