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P0200-19
P0200-19
HEAT SINK COMP. SARAN PKG 2GR
Littelfuse Inc.
39
In Stock
1 : $2.76000
Bulk
Bulk
ActiveNon-Silicone Compound2 gram Package----12 Months-
P0200-20
P0200-20
COMPOUND HEAT SINK 2OZ JAR
Littelfuse Inc.
0
In Stock
1 : $32.40000
Bulk
Bulk
ActiveNon-Silicone Compound100 gram Jar----12 Months-
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Thermal - Adhesives, Epoxies, Greases, Pastes


Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.