Sockets for ICs, Transistors

Results: 7
Manufacturer
Assmann WSW ComponentsMill-Max Manufacturing Corp.On Shore Technology Inc.
Series
-110917ED
Type
DIP, 0.3" (7.62mm) Row SpacingDIP, 0.6" (15.24mm) Row SpacingTransistor, TO-100
Number of Positions or Pins (Grid)
8 (2 x 4)10 (Round)14 (2 x 7)16 (2 x 8)24 (2 x 12)32 (2 x 16)
Pitch - Mating
0.100" (2.54mm)-
Contact Finish - Mating
GoldTin
Contact Finish Thickness - Mating
60.0µin (1.52µm)100.0µin (2.54µm)-Flash
Contact Material - Mating
Beryllium CopperPhosphor Bronze
Features
Closed FrameOpen Frame
Pitch - Post
0.100" (2.54mm)-
Contact Finish Thickness - Post
60.0µin (1.52µm)200.0µin (5.08µm)
Contact Material - Post
Beryllium CopperBrass AlloyPhosphor Bronze
Housing Material
Polybutylene Terephthalate (PBT), Glass FilledPolycyclohexylenedimethylene Terephthalate (PCT), PolyesterThermoplastic, Polyester
Operating Temperature
-55°C ~ 110°C-55°C ~ 125°C-40°C ~ 105°C
Stocking Options
Environmental Options
Media
Marketplace Product
7Results

Showing
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
AR08-HZL-TT(-R)
AR 08-HZL-TT
CONN IC DIP SOCKET 8POS TIN
Assmann WSW Components
5,393
In Stock
1 : $0.50000
Tube
-
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Beryllium Copper
Thermoplastic, Polyester
-40°C ~ 105°C
ED24DT
ED24DT
CONN IC DIP SOCKET 24POS TIN
On Shore Technology Inc.
7,870
In Stock
1 : $0.36000
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Tin
60.0µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60.0µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 110°C
ED32DT
ED32DT
CONN IC DIP SOCKET 32POS TIN
On Shore Technology Inc.
1,299
In Stock
1 : $0.47000
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Tin
60.0µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60.0µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 110°C
AR14-HZL-TT(-R)
AR 14-HZL-TT
CONN IC DIP SOCKET 14POS TIN
Assmann WSW Components
3,404
In Stock
1 : $1.00000
Tube
-
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Beryllium Copper
Thermoplastic, Polyester
-40°C ~ 105°C
1,179
In Stock
1 : $1.57000
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Tin
100.0µin (2.54µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
214
In Stock
1 : $2.47000
Tube
Tube
Active
Transistor, TO-100
10 (Round)
-
Gold
Flash
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
365
In Stock
1 : $0.84000
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Tin
100.0µin (2.54µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Showing
of 7

Sockets for ICs, Transistors


Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.